Heat dissipation structure and water pump frequency converter

Abstract

The embodiment of the utility model provides a heat dissipation structure and a water pump frequency converter. The heat dissipation structure comprises a main body piece, wherein the main body piece comprises a first plate surface and a second plate surface; wherein the first board surface is provided with a capacitor groove, a transformer groove, a plurality of circuit board fixing bosses and a heat dissipation surface, the circuit board is fixedly connected to the first board surface through the circuit board fixing bosses, the capacitor groove is arranged close to the edge of one side of the first board surface, and the transformer groove is arranged close to the edge of the other side of the first board surface. The heat dissipation surface is arranged between the capacitor groove and the transformer groove, and the heat dissipation surface is closer to the capacitor groove relative to the transformer groove; and the second plate surface is opposite to the first plate surface, and cooling fins are mounted on the second plate surface. The heat dissipation structure is installed on the frequency converter, so that the heat dissipation efficiency of the frequency converter is improved.

Description

Technical Field

[0001] This application relates to the technical field of frequency converter heat dissipation, and particularly relates to a heat dissipation structure and a water pump frequency converter. Background Art

[0002] With the intensification of the global energy crisis and the improvement of environmental protection awareness, energy-saving technologies are increasingly widely used in various industries. As a commonly used device in industrial and civil fields, the energy consumption of water pumps accounts for a relatively large proportion. Therefore, the energy-saving technology of water pumps has become a research hotspot. The variable frequency energy-saving technology adjusts the frequency of the water pump by the frequency conversion of the frequency converter, so as to achieve the effect of energy-saving use.

[0003] Currently, the variable frequency energy-saving technology mainly relies on the frequency converter. The stronger the heat dissipation ability of the frequency converter, the smaller the impact on the inside of the fuselage, so the stronger the stability of the device and the longer the service life of the device, which can reduce the potential safety hazards in use.

[0004] However, in the prior art, there is a problem of low heat dissipation efficiency for the heat dissipation of the frequency converter. Summary of the Utility Model

[0005] The embodiments of this application provide a heat dissipation structure and a water pump frequency converter to achieve the effect of improving the heat dissipation efficiency of the frequency converter.

[0006] In a first aspect, the embodiments of this application provide a heat dissipation structure and a water pump frequency converter, including a main body part, and the main body part includes:

[0007] A first board surface, which is provided with a capacitor groove, a transformer groove, a circuit board fixing boss and a heat dissipation surface. Among them, there are multiple circuit board fixing bosses, and the circuit board is fixedly connected to the first board surface through the circuit board fixing bosses. The capacitor groove is arranged near one side edge of the first board surface, the transformer groove is arranged near the other side edge of the first board surface, the heat dissipation surface is arranged between the capacitor groove and the transformer groove, and the heat dissipation surface is closer to the capacitor groove than the transformer groove;

[0008] A second board surface, which is arranged opposite to the first board surface, and a heat sink is installed on the second board surface.

[0009] In the embodiments of this application, an axial flow fan is provided on the second board surface, and the gap between the axial flow fan and the heat sink is arranged oppositely.

[0010] In the embodiments of this application, a baffle is further provided on the second board surface, and the axial flow fan is located between the heat sink and the baffle.

[0011] In the embodiments of this application, heat dissipation enclosures are provided at both the first edge and the second edge of the second board surface, and the second board surface and the baffle form a heat dissipation groove through the heat dissipation enclosures, and the heat sink is located in the heat dissipation groove.

[0012] In an embodiment of the present application, a fixing mount is provided on the outer side of the heat dissipation shroud. An installation hole is formed in the fixing mount, and a heat dissipation rib plate is provided between the fixing mount and the heat dissipation shroud.

[0013] In an embodiment of the present application, the capacitor groove includes a first groove and a second groove. The first groove is disposed closer to the first edge of the first plate surface than the second groove, and the first groove is also in communication with the second groove. The groove depth of the first groove is greater than the groove depth of the second groove.

[0014] In an embodiment of the present application, the first side edge of the heat dissipation surface is disposed close to the first groove, and the second side edge of the heat dissipation surface is disposed close to the second groove. Among them, the shortest distance between the first side edge and the first groove is less than the shortest distance between the second side edge and the second groove.

[0015] In an embodiment of the present application, positioning posts are provided on the first plate surface. The positioning posts are disposed close to the heat dissipation surface, and there are multiple positioning posts.

[0016] In an embodiment of the present application, the circuit board fixing boss passes through the first plate surface and is connected to the heat sink on the second plate surface.

[0017] In a second aspect, an embodiment of the present application provides a water pump frequency converter, including the heat dissipation structure in the embodiment of the present application.

[0018] A heat dissipation structure and a water pump frequency converter provided by an embodiment of the present application include a main body member. By providing the first plate surface and the second plate surface on the main body member, and providing a capacitor groove, a transformer groove, a circuit board fixing boss, and a heat dissipation surface on the first plate surface, the capacitor and the transformer can be placed in the heat dissipation structure for heat dissipation. The circuit board is fixedly connected to the first plate surface through the circuit board fixing boss, so that the circuit board fits against the first plate surface to increase the heat dissipation efficiency. In addition, the transformer groove and the capacitor groove are provided at the edge of the heat dissipation device, and the heat dissipation surface is disposed closer to the capacitor groove than the transformer groove, so that the voltage and the transformer can dissipate heat from the edge and also enhance the voltage heat dissipation efficiency; the second plate surface is disposed opposite to the first plate surface, and a heat sink is installed on the second plate surface to dissipate the heat of the components on the first plate surface, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present application and used together with the specification to explain the principles of the present application.

[0020] Figure 1 It is a schematic structural diagram of the first plate surface of the heat dissipation structure of the water pump frequency converter provided by an embodiment of the present application;

[0021] Figure 2 It is a schematic structural diagram of the second plate surface of the heat dissipation structure of the water pump frequency converter provided by an embodiment of the present application.

[0022] Through the above-mentioned drawings, specific embodiments of the present application have been shown, and more detailed descriptions will be provided hereinafter. These drawings and written descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments.

[0023] Reference numerals:

[0024] 100 - main body; 110 - first plate surface; 1101 - first edge of the first plate surface; 111 - heat dissipation surface; 1111 - first side of the heat dissipation surface 111; 1112 - second side of the heat dissipation surface 111; 112 - second groove; 113 - first groove; 114 - circuit board fixing boss; 115 - threaded hole; 116 - transformer groove; 117 - positioning post; 120 - second plate surface; 1201 - at the first edge of the second plate surface; 1202 - at the second edge of the second plate surface 120; 121 - baffle; 122 - heat dissipation enclosure; 123 - fixed mounting member; 1231 - mounting hole; 1232 - heat dissipation rib plate; 124 - heat sink; 125 - heat dissipation groove. Detailed Description of the Embodiments

[0025] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0026] In the prior art, as a key device in the industrial water supply system, the water pump frequency converter can achieve precise speed regulation of the water pump through frequency conversion control technology, thereby achieving the purpose of energy conservation and consumption reduction. However, in the actual application process, the heat dissipation problem has always been a difficult problem in the water pump frequency converter technology. The existing heat dissipation technology mainly relies on additional fans for heat dissipation. Although this method is simple, it increases the complexity and cost of the system. Especially when the water pump is installed underwater, the extension of the motor cable not only increases the electromagnetic compatibility problem but also reduces the heat dissipation efficiency. In addition, various faults may occur during the operation of the water pump frequency converter, and the occurrence of these problems is related to poor heat dissipation.

[0027] To solve the problem of insufficient heat dissipation efficiency in existing inverter heat dissipation devices, the embodiments of the present application provide a heat dissipation structure and a water pump inverter. Capacitors and transformers are placed in the capacitor grooves and transformer grooves to reduce the distance from the heat sink, thereby enhancing the heat dissipation efficiency. The circuit board is placed by the circuit board fixing bosses, and the heat sink transfers heat to the heat sinks on the first board surface and the second board surface. In order to dissipate heat from the edge, the capacitor groove is arranged near one edge of the first board surface, and the transformer groove is arranged near the other edge of the first board surface. At the same time, the heat dissipation efficiency is improved by using different depths of the first groove and the second groove, and an axial flow fan is used to dissipate heat, achieving the effect of efficient heat dissipation.

[0028] A heat dissipation structure and a water pump inverter provided by the present application aim to solve the above technical problems in the prior art.

[0029] The technical solutions of the present application and how the technical solutions of the present application solve the above technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below with reference to the drawings.

[0030] Figure 1 It is a schematic structural diagram of the first board surface of the heat dissipation structure of the water pump inverter provided by the embodiment of the present application. As Figure 1 shown, the heat dissipation mechanism includes a main body member 100. The main body member 100 includes a first board surface 110. A capacitor groove, a transformer groove 116, a circuit board fixing boss 114, and a heat dissipation surface 111 are respectively arranged on the first board surface 110, where

[0031] The main body member 100 may refer to the main body of the heat dissipation structure of the water pump inverter. The main body member 100 may be made of a material with high thermal conductivity, such as aluminum or copper. The main body member 100 can conduct and dissipate heat more effectively, thereby ensuring the heat dissipation effect of the entire heat dissipation structure and the water pump inverter equipped with the heat dissipation structure.

[0032] The first board surface 110 is the board surface on the main body member 100 for fixedly installing the circuit board in the water pump inverter. Among them, the shape of the first board surface 110 can be set arbitrarily according to needs. In the embodiment of the present application, the shape of the first board surface 110 can be square, and anodic oxidation treatment or thermal conductive coating can also be performed on the first board surface 110, so as to improve the anti-corrosion ability while ensuring the thermal conductivity.

[0033] The capacitor groove can be a groove for placing capacitor components on the circuit board. The capacitor groove is arranged close to one side edge of the first board surface. That is, in the embodiment of the present application, the groove edge of the capacitor groove along the length direction is close to the left side edge of the first board surface, and the groove edge along the width direction is close to the upper side edge of the first board surface. Thus, due to the relatively slender shape of the capacitor groove resulting in a smaller heat dissipation area of the heat sink connected to the second board surface, heat dissipation of the groove in the capacitor groove can be better achieved by being close to the edge.

[0034] In some embodiments, the capacitor groove can include a first groove 113 and a second groove 112 that are interconnected. Among them, since the capacitor assembled in the first groove 113 has a larger volume, the first groove 113 is arranged closer to the first edge 1101 of the first board surface relative to the second groove 112, so that heat can be dissipated from the edge. In addition, in order to further increase the heat dissipation area of the heat sink connected to the second board surface of the capacitor groove, the groove depth of the second groove 112 with a smaller assembled capacitor volume is adjusted, so that the groove depth of the second groove 112 is less than the groove depth of the first groove 113, thereby improving the heat dissipation efficiency.

[0035] The transformer groove 116 can be a groove for placing a transformer on the circuit board. The transformer groove 116 is arranged close to the other side edge of the first board surface. That is, in the embodiment of the present application, one groove edge of the transformer groove 116 is close to the right side edge of the first board surface, and the other is close to the upper side edge of the first board surface. Thus, the heat dissipation effect can be improved. In the embodiment of the present application, a threaded hole 115 can be opened on the transformer groove 116, and the transformer is fixedly installed in the transformer groove 116 through the assembly of screws and the threaded hole 115.

[0036] The heat dissipation surface 111 is used to dissipate heat from the circuit board, so that heat can be better transferred from the circuit board to the heat sink on the second board surface. That is, the heat dissipation surface 111 is a heat conduction patch for heat dissipation. Among them, when setting the position of the heat dissipation surface 111, since the capacitor is more sensitive to heat than the transformer, the heat dissipation surface 111 is arranged in the middle of the first board surface 110 and is closer to the capacitor groove relative to the transformer groove 116, so that the heat received by the capacitor can be better dissipated through the heat sink in the middle of the second board surface, thereby protecting the groove in the capacitor groove.

[0037] In some embodiments, the first side edge 1111 of the heat dissipation surface 111 is close to the first groove 113, the second side edge 1112 of the heat dissipation surface 111 is close to the second groove 112, and the shortest distance between the first side edge 1111 and the first groove 113 is less than the shortest distance between the second side edge 1112 of the heat dissipation surface 111 and the second groove 112.

[0038] The circuit board fixing bosses 114 are used to fix the installation of the first board surface 110 and the circuit board. Among them, there are multiple circuit board fixing bosses 114, which respectively surround the capacitor groove, the transformer groove 116 and the heat dissipation surface 111. Thus, the stable assembly of each structure on the circuit board with the capacitor groove, the transformer groove 116 and the heat dissipation surface 111 can be ensured. In the embodiment of the present application, threaded holes can be opened on the circuit board fixing bosses 114, and the circuit board is fixedly installed on the first board surface 110 through the assembly of screws and threaded holes.

[0039] Among them, in the embodiment of the present application, in order to facilitate the installation of the circuit board, positioning posts 117 can also be provided on the first board surface 110. The positioning posts 117 are arranged close to the heat dissipation surface 111, and there are multiple positioning posts 117. The positioning posts 117 can be used to accurately position the circuit board on the circuit board fixing bosses 114, so that the heating elements on the circuit board are in full contact with the heat dissipation surface 111, further improving the heat dissipation effect.

[0040] Figure 2 It is a schematic structural diagram of the second board surface of the water pump frequency converter heat dissipation structure provided by the embodiment of the present application. As Figure 2 shown, the main body 100 further includes a second board surface 120, and heat sinks 124 are installed on the second board surface 120. Among them,

[0041] The second board surface 120 can be a board surface for heat dissipation. The second board surface 120 is disposed opposite to the first board surface, that is, when the first board surface is the front surface of the main body 100, the second board surface 120 is the back surface.

[0042] The heat sinks 124 can be a kind of passive heat dissipation device used in electronic devices and mechanical systems. Its main function is to improve the heat dissipation efficiency by increasing the contact area with the surrounding air, thereby helping the circuit board to dissipate heat and keeping the circuit board within a safe operating temperature range. In the embodiment of the present application, there are multiple heat sinks 124, which are arranged from the upper side edge to the lower side edge of the second board surface 120, so as to increase the heat dissipation area, and the air flow is enhanced by adjusting the gaps between the heat sinks 124, thereby improving the heat exchange efficiency, ensuring that the device maintains an ideal temperature state during continuous operation, and extending its service life.

[0043] Among them, in the embodiment of the present application, in order to improve the heat dissipation efficiency of the heat sink 124, an axial flow fan is provided on the second plate surface 120. The axial flow fan can be installed on the second plate surface 120 through screws and threaded holes, and is arranged closer to the lower side edge of the second plate surface 120 relative to the heat sink 124. Among them, the suction port or the exhaust port of the axial flow fan can also be arranged opposite to the gap between the heat sink 124. Thus, when the axial flow fan works, it can take away the heat on the heat sink 124 and quickly discharge it, realizing the rapid transfer and dissipation of heat, so as to maintain the appropriate temperature of the frequency converter during operation.

[0044] Among them, in order to avoid the problem of the axial flow fan falling off after long-term use and to ensure the working efficiency of the axial flow fan, a baffle 121 is also provided on the second plate surface 120. The axial flow fan is located between the heat sink 124 and the baffle 121. Through the function of the baffle 121, problems such as the axial flow fan falling off can be avoided, and the setting of the baffle 121 enables the heat of the heat sink 124 to be taken away by the axial flow fan more concentratedly, thereby improving the heat dissipation effect.

[0045] In the embodiment of the present application, the heat sinks 124 near the left and right edges of the second plate surface 120 are offset towards the axial flow fan, optimizing the air flow path, improving the heat conduction efficiency, enhancing the heat dissipation effect, and ensuring that the device can maintain stable and efficient cooling performance under high-load working conditions.

[0046] Among them, in the embodiment of the present application, in order to protect the heat sink 124, heat dissipation enclosures 122 are provided at both the first edge 1201 of the second plate surface and the second edge 1202 of the second plate surface 120. Among them, the first edge 1201 can refer to Figure 2 the left edge of the second plate surface, and the second edge 1202 can refer to Figure 2 the right edge of the second plate surface. Since the heat dissipation enclosures 122 have high strength and certain heat dissipation effects, they can increase the heat dissipation area of the first plate surface and the second plate surface 120, thereby improving the heat dissipation effect while avoiding the influence of the outside on the heat sink 124. At the same time, the second plate surface 120 forms a heat dissipation groove 125 through the heat dissipation enclosures 122 and the baffle 121. The heat sink 124 is located in the heat dissipation groove 125, which can also enable the heat of the heat sink 124 to be taken away by the axial flow fan more concentratedly, thereby improving the heat dissipation effect.

[0047] Among them, in the embodiment of the present application, to facilitate the installation of the main body 100, a fixed mounting member 123 is provided on the outer side of the heat dissipation enclosure 122. An installation hole 1231 is formed in the fixed mounting member 123. A heat dissipation rib plate 1232 is provided between the fixed mounting member 123 and the heat dissipation enclosure 122. The heat dissipation rib plate 1232 can ensure the installation strength of the main body 100, and further enhance the heat dissipation performance through the heat conduction characteristics of the heat dissipation rib plate 1232, so as to ensure that the main body 100 can obtain uniform and efficient cooling under various working conditions, and the overall stability of the water pump frequency converter is enhanced.

[0048] Among them, in the embodiment of the present application, the circuit board fixing boss can also be connected to the heat sink 124, that is, the circuit board fixing boss can pass through the first board surface 110 and be connected to the heat sink 124 on the second board surface 120. Thus, in addition to dissipating heat through the heat dissipation surface, the circuit board can also improve the heat dissipation efficiency through the circuit board fixing boss.

[0049] The embodiment of the present application also provides a water pump frequency converter, which can include the water pump frequency converter heat dissipation structure in the embodiment of the present application. Thus, when heat is generated in key components such as capacitors and transformers on the circuit board and the frequency converter main body, the precisely designed heat dissipation device can be used for rapid and effective heat dissipation. This heat dissipation device not only improves the heat conduction efficiency, but also promotes the convective heat dissipation of heat by optimizing the air flow path, thereby reducing heat at the source. In addition, the design of this heat dissipation structure particularly focuses on the balance between heat dissipation efficiency and equipment stability. Through precise calculation and layout, it ensures high-efficiency heat dissipation performance under different working conditions. This design not only helps to reduce the decline in equipment performance caused by overheating, but also effectively extends the service life of the frequency converter by reducing the thermal stress of the equipment, reducing maintenance costs and potential failure rates. More importantly, the efficient heat dissipation system reduces the safety hazards caused by overheating, ensuring the safety of operators and the stable operation of the equipment. Generally speaking, the introduction of this heat dissipation structure not only improves the performance and reliability of the water pump frequency converter, but also brings a safer, more economical and more environmentally friendly use experience to users.

[0050] In the description of the embodiment of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the internal connection of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiment of the present application can be understood according to specific circumstances.

[0051] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representations of the above terms in this specification do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0052] It can be understood that in the embodiments of the present application, the various numerical numbers involved are only for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0053] It can be understood that in the embodiments of the present application, the magnitudes of the serial numbers of the above processes do not mean the sequence of execution. The execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0054] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principle of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A heat dissipation structure, characterized in that, Comprising a main body member (100), the main body member (100) includes: A first board surface (110), on which there are provided a capacitor groove, a transformer groove (116), a circuit board fixing boss (114) and a heat dissipation surface (111). Among them, there are multiple circuit board fixing bosses (114), and the circuit board is fixedly connected to the first board surface (110) through the circuit board fixing bosses (114). The capacitor groove is arranged close to one side edge of the first board surface (110), the transformer groove (116) is arranged close to the other side edge of the first board surface (110), the heat dissipation surface (111) is arranged between the capacitor groove and the transformer groove (116), and the heat dissipation surface (111) is closer to the capacitor groove than to the transformer groove (116); A second board surface (120), which is arranged opposite to the first board surface (110), and a heat sink (124) is installed on the second board surface (120).

2. The heat dissipation structure according to claim 1, wherein An axial flow fan is provided on the second board surface (120), and the gap between the axial flow fan and the heat sink (124) is arranged oppositely.

3. The heat dissipation structure according to claim 2, wherein A baffle (121) is further provided on the second board surface (120), and the axial flow fan is located between the heat sink (124) and the baffle (121).

4. The heat dissipation structure according to claim 3, wherein Heat dissipation enclosures (122) are provided at both the first edge (1201) and the second edge (1202) of the second board surface. The second board surface (120) forms a heat dissipation groove (125) through the heat dissipation enclosures (122) and the baffle (121), and the heat sink (124) is located in the heat dissipation groove (125).

5. The heat dissipation structure according to claim 4, characterized in that, A fixed mounting member (123) is provided on the outer side surface of the heat dissipation enclosure (122), a mounting hole (1231) is provided on the fixed mounting member (123), and a heat dissipation rib plate (1232) is provided between the fixed mounting member (123) and the heat dissipation enclosure (122).

6. The heat dissipation structure according to claim 1, wherein, The capacitor groove includes a first groove (113) and a second groove (112). The first groove (113) is arranged closer to the first edge (1101) of the first board surface than the second groove (112). The first groove (113) is also communicated with the second groove (112), and the groove depth of the first groove (113) is greater than the groove depth of the second groove (112).

7. The heat dissipation structure according to claim 6, wherein The first side edge (1111) of the heat dissipation surface (111) is arranged close to the first groove (113), and the second side edge (1112) of the heat dissipation surface (111) is arranged close to the second groove (112). Among them, the shortest distance between the first side edge (1111) and the first groove (113) is less than the shortest distance between the second side edge (1112) of the heat dissipation surface (111) and the second groove (112).

8. The heat dissipation structure according to claim 1, wherein Positioning posts (117) are provided on the first board surface (110), the positioning posts (117) are arranged close to the heat dissipation surface (111), and there are multiple positioning posts (117).

9. The heat dissipation structure according to claim 1, characterized in that, The circuit board fixing boss (114) penetrates through the first board surface (110) and is connected to the heat sink (124) on the second board surface (120).

10. A water pump frequency converter, characterized in that, It includes the heat dissipation structure according to any one of claims 1-9.

Images