Heat dissipation device and power conversion equipment

Abstract

The utility model discloses a heat dissipation device and power conversion equipment, and belongs to the technical field of heat dissipation. The heat dissipation device comprises an evaporator, wherein a power device is mounted at one end of the evaporator; the condenser comprises multiple layers of condensation structures, the condenser is communicated with the evaporator, and the multiple layers of condensation structures are distributed in the first direction. By arranging the multi-layer condensation structure, the heated cooling medium can be distributed into the multi-layer condensation structure for heat dissipation so as to improve the heat dissipation efficiency of the heat dissipation device, meanwhile, the multi-layer condensation structure is arranged to be distributed in the first direction, the overall vertical height of the heat dissipation device can be reduced, and the heat dissipation efficiency of the heat dissipation device is improved. Therefore, the heat dissipation device can be applied to a scene with a high requirement for the vertical height, and installation of the heat dissipation device is facilitated.

Description

Technical Field

[0001] This application belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device and a power conversion device. Background Art

[0002] In practical applications, the condenser in the phase change radiator occupies too much space, especially in the usage scenarios with limited height space, and it is difficult to install the phase change radiator. Summary of the Utility Model

[0003] This application aims to solve at least one of the technical problems existing in the prior art. For this purpose, this application provides a heat dissipation device and a power conversion device. By arranging a plurality of condensers distributed in the horizontal direction, the heated cooling medium can be distributed to multiple layers of condensation structures for heat dissipation, thereby reducing the vertical height of the heat dissipation device while improving the heat dissipation effect of the heat dissipation device and facilitating the installation of the heat dissipation device.

[0004] In a first aspect, this application provides a heat dissipation device, including:

[0005] An evaporator, with a power device installed at one end of the evaporator;

[0006] A condenser, the condenser includes multiple layers of condensation structures, the condenser is communicated with the evaporator, and the multiple layers of condensation structures are distributed in a first direction.

[0007] According to the heat dissipation device provided by the embodiments of this application, by arranging multiple layers of condensation structures, the heated cooling medium can be distributed to multiple layers of condensation structures for heat dissipation to improve the heat dissipation efficiency of the heat dissipation device. At the same time, by arranging the multiple layers of condensation structures in the first direction, the overall vertical height of the heat dissipation device can be reduced, so that the heat dissipation device can be applied to scenarios with high requirements for vertical height and is convenient for the installation of the heat dissipation device.

[0008] According to an embodiment of this application, the multiple layers of condensation structures are arranged in parallel.

[0009] According to an embodiment of this application, there are at least two layers with different heat dissipation areas in the multiple layers of condensation structures.

[0010] According to an embodiment of this application, the lengths of the flat tubes of each layer of the condensation structure in a second direction are different, the second direction is the arrangement direction of the evaporator and the condenser, and the second direction intersects with the first direction.

[0011] According to an embodiment of this application, the lengths of the flat tubes of each layer of the condensation structure in the first direction are different.

[0012] According to an embodiment of this application, the distances between the flat tubes of adjacent condensation structures are different.

[0013] According to an embodiment of the present application, the spacing between multiple flat tubes of the condensation structure on the same layer is different.

[0014] According to an embodiment of the present application, the condensation structure further includes:

[0015] Multiple heat dissipation teeth, the multiple heat dissipation teeth are installed between two adjacent flat tubes of the condensation structure, and the multiple heat dissipation teeth are spaced apart; wherein the spacing between the multiple heat dissipation teeth of the condensation structures on different layers is different.

[0016] According to an embodiment of the present application, the condensation structure further includes:

[0017] Multiple heat dissipation teeth, the multiple heat dissipation teeth are installed between two adjacent flat tubes of the condensation structure, and the multiple heat dissipation teeth are spaced apart; the spacing between the multiple heat dissipation teeth of the condensation structure on the same layer is different.

[0018] According to an embodiment of the present application, the diameters of the inlet manifolds of the multi-layer condensation structure are different;

[0019] And / or,

[0020] The diameters of the outlet manifolds of the multi-layer condensation structure are different.

[0021] According to an embodiment of the present application, the heat dissipation device further includes:

[0022] An air pipe, both ends of the air pipe are respectively connected to the inlet of the condenser and the outlet of the evaporator;

[0023] A liquid pipe, both ends of the liquid pipe are respectively connected to the outlet of the condenser and the inlet of the evaporator.

[0024] In a second aspect, the present application provides a power conversion device, and the power conversion device includes:

[0025] A heat dissipation device as described in any one of the above;

[0026] A power device, the power device is installed on the evaporator of the heat dissipation device.

[0027] According to the power conversion device provided by the embodiment of the present application, by adopting the heat dissipation device of any one of the above embodiments, the heated cooling medium can be distributed to the multi-layer condensation structure for heat dissipation, so as to improve the heat dissipation effect of the heat dissipation device while reducing the vertical height of the heat dissipation device, and facilitate the installation of the heat dissipation device.

[0028] The additional aspects and advantages of the present application will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0030] Figure 1 is one of the schematic structural diagrams of the heat dissipation device provided by an embodiment of the present application;

[0031] Figure 2 is another schematic structural diagram of the heat dissipation device provided by an embodiment of the present application;

[0032] Figure 3 is one of the schematic partial structural diagrams of the heat dissipation device provided by an embodiment of the present application;

[0033] Figure 4 is another schematic partial structural diagram of the heat dissipation device provided by an embodiment of the present application;

[0034] Figure 5 is a third schematic partial structural diagram of the heat dissipation device provided by an embodiment of the present application;

[0035] Figure 6 is a fourth schematic partial structural diagram of the heat dissipation device provided by an embodiment of the present application;

[0036] Figure 7 is one of the schematic assembly diagrams of the heat dissipation device and the power device provided by an embodiment of the present application;

[0037] Figure 8 is another schematic assembly diagram of the heat dissipation device and the power device provided by an embodiment of the present application.

[0038] Reference Signs:

[0039] Evaporator 100, gas pipe 110, liquid pipe 120;

[0040] Condenser 200, inlet manifold 210, outlet manifold 220, flat tube 230, heat dissipation teeth 240, condensation structure 250;

[0041] Power device 300. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described by referring to the drawings are exemplary only for explaining the present application and should not be construed as a limitation to the present application.

[0043] Reference is made below to Figures 1 - 8Describe a heat dissipation device and a power conversion device according to an embodiment of the present application. Among them, the power conversion device can be an inverter, a transformer, or other power conversion devices.

[0044] An embodiment of the present application provides a heat dissipation device. As Figure 1 and Figure 2 shown, the heat dissipation device includes an evaporator 100 and a condenser 200.

[0045] One end of the evaporator 100 is installed with a power device 300; the condenser 200 includes a multi-layer condensation structure 250. The condenser 200 is communicated with the evaporator 100, and the multi-layer condensation structure 250 is distributed along the first direction X.

[0046] The evaporator 100 is used to dissipate heat from the power device 300. Among them, the evaporator 100 can be a plate-like structure, a columnar structure, or other shaped structures. For example, as Figure 1 and Figure 2 shown, the evaporator 100 is a plate-like structure.

[0047] The condenser 200 and the power device 300 are connected to the same side or different sides of the evaporator 100.

[0048] In some embodiments, as Figure 7 shown, the condenser 200 and the power device 300 can be connected to the same side of the evaporator 100 along the first direction X. Specifically, the condenser 200 can be connected to the first side of the evaporator 100 along the first direction X through an air pipe 110 and a liquid pipe 120, and the power device 300 can also be installed on the first side of the evaporator 100 along the first direction X.

[0049] In other embodiments, as Figure 8 shown, the condenser 200 and the power device 300 can be connected to different sides of the evaporator 100 along the first direction X. Specifically, the condenser 200 can be connected to the first side of the evaporator 100 along the first direction X through an air pipe 110 and a liquid pipe 120, and the power device 300 can be installed on the second side of the evaporator 100 along the first direction X.

[0050] As Figure 1 and Figure 2 shown, the evaporator 100 is internally provided with a cooling medium. The interior of the evaporator 100 is a hollow structure, and the cooling medium is stored in the hollow part of the evaporator 100.

[0051] The evaporator 100 is spaced apart from the multi-layer condensation structure 250 along the second direction Y. The multi-layer condensation structure 250 is distributed along the first direction X, and the second direction Y intersects the first direction X.

[0052] Exemplarily, as Figure 1 and Figure 2As shown, the second direction Y can be perpendicular to the first direction X. The second direction can be the width direction of the evaporator 100 and the condensation structure 250, the first direction X can be the thickness direction of the evaporator 100 and the condensation structure 250, the second direction Y can be the vertical direction, and the first direction X can be the horizontal direction.

[0053] In addition, the second direction Y and the first direction X can form an acute angle or an obtuse angle, and there is no limitation here.

[0054] The multiple layers of the condensation structure 250 can be distributed at intervals or can be arranged in a fitting manner. For example, as Figure 1 and Figure 2 shown, the multiple layers of the condensation structure 250 are distributed at intervals to increase the heat dissipation space of each condenser 200.

[0055] The heat dissipation device can further include a fan, which is installed on one side of the multiple layers of the condensation structure 250 and is arranged in line with the multiple layers of the condensation structure 250.

[0056] During the actual implementation process, as Figure 1 and Figure 2 shown, the evaporator 100 absorbs the heat generated by the heat source. The temperature of the cooling medium located in the evaporator 100 rises and evaporates into a gaseous cooling medium. The gaseous cooling medium flows into the multiple condensers 200 and dissipates heat and cools down through the action of the fan in the multiple layers of the condensation structure 250. The cooled cooling medium condenses from the gaseous state into the liquid state and flows back to the evaporator 100 to complete the heat dissipation cycle.

[0057] By providing the multiple layers of the condensation structure 250, the heated cooling medium can be distributed into the multiple layers of the condensation structure 250 for heat dissipation, so as to improve the heat dissipation efficiency of the heat dissipation device. At the same time, by arranging the multiple layers of the condensation structure 250 along the first direction X, the overall vertical height of the heat dissipation device can be reduced, so that the heat dissipation device can be applied to scenarios with relatively high requirements for the vertical height and is convenient for the installation of the heat dissipation device.

[0058] According to the heat dissipation device provided by the embodiment of the present application, by providing a plurality of condensers 200 distributed along the first direction X, the heated cooling medium can be distributed into the plurality of condensers 200 for heat dissipation, so as to improve the heat dissipation effect of the heat dissipation device while reducing the vertical height of the heat dissipation device and facilitating the installation of the heat dissipation device.

[0059] In some embodiments, as Figure 1 and Figure 2 shown, the heat dissipation device further includes: an air pipe and a liquid pipe.

[0060] Two ends of the air pipe are respectively connected to the inlet of the condenser and the outlet of the evaporator; two ends of the liquid pipe are respectively connected to the outlet of the condenser and the inlet of the evaporator.

[0061] As Figure 1 and Figure 2 shown, one end of the trachea 110 and one end of the liquid pipe 120 are both connected to the evaporator 100. The trachea 110 and the liquid pipe 120 are both connected to the hollow part of the evaporator 100, so that the cooling medium can flow between the hollow part of the evaporator 100, the trachea 110 and the liquid pipe 120.

[0062] The trachea 110 can be one or multiple. For example, as Figure 1 and Figure 2 shown, the trachea 110 is four. The four tracheas 110 are spaced apart along the length direction of the evaporator 100, so that the cooling medium in the evaporator 100 can flow evenly into the multiple tracheas 110 and improve the flow rate of the cooling medium.

[0063] The liquid pipe 120 can be one or multiple. For example, as Figure 1 and Figure 2 shown, the liquid pipe 120 is three. The three liquid pipes 120 are cross-distributed with the four tracheas 110, that is, the liquid pipe 120 is located between two adjacent tracheas 110.

[0064] As Figure 1 and Figure 2 shown, multiple condensers 200 are all connected to the evaporator 100 through the other ends of the trachea 110 and the liquid pipe 120 to form a cooling circuit for the cooling medium to flow. Each condenser 200 can be individually connected to the trachea 110 and the liquid pipe 120, or can be connected to the trachea 110 and the liquid pipe 120 in other ways. At this time, the trachea 110, the condenser 200, the liquid pipe 120 and the evaporator 100 are interconnected to form a cooling circuit, and the cooling medium can flow in the cooling circuit.

[0065] According to the heat dissipation device provided by the embodiment of the present application, through the above settings of the trachea 110 and the liquid pipe 120, the transportation process of the high-temperature gaseous cooling medium and the reflux process of the low-temperature liquid cooling medium are realized, making the entire heat dissipation cycle more complete. At the same time, the overall design of the heat dissipation device is simplified, avoiding the layout of the trachea 110 and the liquid pipe 120 occupying too much space and making the overall layout more reasonable and smooth.

[0066] In some embodiments, as Figure 1 and Figure 2 shown, each condensation structure 250 includes an inlet manifold 210, an outlet manifold 220 and a plurality of flat tubes 230.

[0067] Among them, as Figure 1 and Figure 2As shown, the inlet manifold 210 and the outlet manifold 220 are spaced apart. The inlet manifold 210 and the outlet manifold 220 can be spaced apart vertically, and the inlet manifold 210 is located above the outlet manifold 220. The inlet manifold 210 is connected to the air pipe 110, and the outlet manifold 220 is connected to the liquid pipe 120.

[0068] As Figure 3 shown, a plurality of flat tubes 230 are spaced apart along the axial direction of the inlet manifold 210. The plurality of flat tubes 230 are connected to both the inlet manifold 210 and the outlet manifold 220. The flat tubes 230 are installed between the inlet manifold 210 and the outlet manifold 220. The interior of the flat tubes 230 is a hollow structure, and the hollow part of the flat tubes 230 is connected to both the inlet manifold 210 and the outlet manifold 220.

[0069] During actual implementation, the heated cooling medium enters the inlet manifold 210 of the condensation structure 250 through the air pipe 110, and enters the flat tubes 230 through the inlet manifold 210. In the inlet manifold 210 and the flat tubes 230, the gaseous cooling medium condenses into a liquid under the heat dissipation of the fan. Since the weight of the liquid cooling medium is heavier than that of the gaseous cooling medium, the condensed cooling medium flows to the outlet manifold 220 under the action of gravity, and returns to the evaporator 100 through the liquid pipe 120.

[0070] Since there are gaps between the plurality of flat tubes 230, the fan can turbulize the air between two adjacent flat tubes 230, thereby increasing the heat dissipation effect of the cooling medium.

[0071] In some embodiments, as Figure 1 and Figure 2 shown, multiple condensation structures 250 are arranged in parallel.

[0072] Among them, the inlet manifolds 210 of two adjacent condensation structures 250 are connected, the outlet manifolds 220 of two adjacent condensation structures 250 are connected, and the inlet manifold 210 of one of the condensation structures 250 is connected to the air pipe 110, and the outlet manifold 220 of one of the condensation structures 250 is connected to the liquid pipe 120. For example, as Figure 1 and Figure 2 shown, the condensation structure 250 at the end is connected to both the air pipe 110 and the liquid pipe 120.

[0073] During the actual implementation process, the heated cooling medium enters the inlet manifold 210 of the condensation structure 250 that is connected to the gas pipe 110 and the liquid pipe 120 through the gas pipe 110. Since it takes a certain amount of time for the gaseous cooling medium to condense into a liquid cooling medium, during this process, the subsequent cooling medium entering the condensation structure 250 connected to the gas pipe 110 and the liquid pipe 120 can flow along the cooling circuit to the next condensation structure 250, and so on. When the heat is large, the cooling medium is distributed in multiple layers of the condensation structure 250. After the gaseous cooling medium condenses, it flows into the outlet manifolds 220 of each condensation structure 250, and can be converged to the outlet manifold 220 of the condensation structure 250 near the evaporator 100 through the driving pump, and then flows back to the evaporator 100 through the liquid pipe 120.

[0074] By arranging multiple layers of the condensation structure 250 in parallel, and connecting one of the condensation structures 250 to both the gas pipe 110 and the liquid pipe 120, the overall volume and occupied space of the multiple layers of the condensation structure 250 can be reduced.

[0075] In some embodiments, such as Figure 1 and Figure 2 shown, there are at least two layers in the multiple layers of the condensation structure 250 with different heat dissipation areas.

[0076] In some embodiments, there can be two layers of the condensation structure 250 in the multiple layers of the condensation structure 250 with different heat dissipation areas; or, in other embodiments, there can be four layers of the condensation structure 250 in the multiple layers of the condensation structure 250 with different heat dissipation areas; or, in still other embodiments, the heat dissipation areas of each layer of the condensation structure 250 are all different from each other.

[0077] Among them, in some embodiments, the heat dissipation area of the multiple layers of the condensation structure 250 is negatively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100. As Figure 1 and Figure 2 shown, the volume of the multiple layers of the condensation structure 250 can gradually decrease in the arrangement direction of the condenser 200 in the direction away from the gas pipe 110 and the liquid pipe 120, or the heat dissipation area of the multiple layers of the condensation structure 250 can be gradually decreased in the arrangement direction of the condenser 200 in the direction away from the gas pipe 110 and the liquid pipe 120 by other means.

[0078] In other embodiments, the heat dissipation area of the multiple layers of the condensation structure 250 is positively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100.

[0079] In still other embodiments, the heat dissipation area of the condensation structures 250 at both ends along the first direction X can be smaller than the heat dissipation area of the condensation structures 250 in the middle.

[0080] In some other embodiments, the heat dissipation area of the condensation structures 250 at both ends along the first direction X may be larger than that of the condensation structures 250 in the middle.

[0081] Since the cooling medium that needs to be cooled by the condensation structures 250 communicating with the gas pipe 110 and the liquid pipe 120 is in the state of the highest temperature, and the cooling medium that the subsequent condensation structures 250 need to cool may have dissipated part of the heat in the condensation structures 250 communicating with the gas pipe 110 and the liquid pipe 120, the heat of the cooling medium that the condensation structures 250 farther away from the gas pipe 110 and the liquid pipe 120 need to cool is lower. Therefore, setting the heat dissipation area of the multi-layer condensation structures 250 to be negatively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100 can further reduce the overall volume of the heat dissipation device while ensuring the heat dissipation effect.

[0082] It should be noted that the heat dissipation area of each condensation structure 250 can be formulated according to the actual situation. For example, if there are electronic devices arranged in front of a layer of condensation structures 250, the heat dissipation area of the condensation structures 250 in this layer is smaller to reduce the wind resistance and improve the heat dissipation efficiency; when it is necessary to improve the heat dissipation effect of a layer of condensation structures 250, the heat dissipation area of the condensation structures 250 in this layer can be increased.

[0083] By setting the heat dissipation areas of the multi-layer condensation structures 250 to be different, the wind resistance of the heat dissipation device can be reduced according to the actual use situation, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0084] In some other embodiments, the heat dissipation areas of the multi-layer condensation structures 250 may also be the same.

[0085] In some embodiments, as Figure 1 and Figure 2 shown, the lengths of the flat tubes 230 of each layer of condensation structures 250 in the second direction Y are different. The second direction Y is the arrangement direction of the evaporator and the condenser, and the second direction Y intersects with the first direction X.

[0086] Among them, in some embodiments, as Figure 1 and Figure 2As shown, the length of the flat tube 230 of the multi-layer condensation structure 250 in the second direction Y is negatively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100. The length of the flat tube 230 of each layer of the condensation structure 250 in the second direction Y is shorter than that of the flat tube 230 of the previous layer of the condensation structure 250 in the second direction Y. That is, the length of the flat tube 230 of each layer of the condensation structure 250 in the vertical direction is shorter than that of the flat tube 230 of the previous layer of the condensation structure 250 in the vertical direction. Since the cooling medium can exchange heat with the air between two adjacent flat tubes 230 through the wall surface of the flat tube 230 during the heat dissipation process, the smaller the length of the flat tube 230 in the second direction Y, the smaller the heat dissipation area of the flat tube 230.

[0087] In some other embodiments, the lengths of the flat tubes 230 of the multi-layer condensation structure 250 in the second direction Y can also be arranged in other ways.

[0088] By setting the length of the flat tube 230 of the multi-layer condensation structure 250 in the second direction Y to be negatively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100, the structure is simple, and the heat dissipation areas of the multi-layer condensation structures 250 can be gradually reduced one by one, further reducing the overall volume of the heat dissipation device while ensuring the heat dissipation effect.

[0089] By setting the lengths of the flat tubes 230 of the multi-layer condensation structure 250 in the second direction Y to be different, the wind resistance of the heat dissipation device can be reduced according to the actual use situation, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0090] In some embodiments, as Figure 1 and Figure 2 shown, the lengths of the flat tubes 230 of each layer of the condensation structure 250 in the first direction X are different.

[0091] Among them, in some embodiments, as Figure 1 and Figure 2 shown, the length of the flat tube 230 of the multi-layer condensation structure 250 in the first direction X is negatively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100. The length of the flat tube 230 of each layer of the condensation structure 250 in the first direction X is shorter than that of the flat tube 230 of the previous layer of the condensation structure 250 in the first direction X. That is, the length of the flat tube 230 of each layer of the condensation structure 250 in the horizontal direction is shorter than that of the flat tube 230 of the previous layer of the condensation structure 250 in the horizontal direction. Since the cooling medium can exchange heat with the air between two adjacent flat tubes 230 through the wall surface of the flat tube 230 during the heat dissipation process, the smaller the length of the flat tube 230 in the first direction X, the smaller the heat dissipation area of the flat tube 230.

[0092] In some other embodiments, the lengths of the flat tubes 230 of the multi-layer condensation structure 250 in the first direction X can also be arranged in other ways.

[0093] By setting the lengths of the flat tubes 230 of the multi-layer condensation structure 250 in the first direction X to be negatively correlated with the distances from the medium flow paths of the respective condensation structures 250 to the medium flow path of the evaporator 100, the structure is simple, and while ensuring the heat dissipation effect, the overall volume of the heat dissipation device is further reduced.

[0094] By setting the lengths of the flat tubes 230 of the multi-layer condensation structure 250 in the first direction X to be different, the air resistance of the heat dissipation device can be reduced according to the actual usage situation, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0095] In some embodiments, as Figure 3 shown, the distances between the flat tubes 230 of adjacent condensation structures 250 are different.

[0096] Among them, the distances between multiple flat tubes 230 of the same condensation structure 250 can be the same, and the distances between multiple flat tubes 230 of different condensation structures 250 are different.

[0097] In some embodiments, the distance between multiple flat tubes 230 of the condensation structure 250 located at the first end in the first direction X is greater than the distance between multiple flat tubes 230 of the condensation structure 250 located at the second end in the first direction X.

[0098] In some other embodiments, the distance between multiple flat tubes 230 of the condensation structure 250 located at the first end in the first direction X is less than the distance between multiple flat tubes 230 of the condensation structure 250 located at the second end in the first direction X. For example, as Figure 3 shown, the distance between multiple flat tubes 230 of the first condensation structure 250 is b1, the distance between multiple flat tubes 230 of the second condensation structure 250 is b2, and the distance between multiple flat tubes 230 of the third condensation structure 250 is b3, and b1 < b2 < b3.

[0099] In still some other embodiments, the distance between multiple flat tubes 230 of the condensation structure 250 located in the middle of the first direction X is greater than the distances between multiple flat tubes 230 of the condensation structures 250 on both sides.

[0100] In yet some other embodiments, the distances between multiple flat tubes 230 of the condensation structures 250 located on both sides of the first direction X are greater than the distance between multiple flat tubes 230 of the condensation structure 250 in the middle.

[0101] It should be noted that the spacing between the flat tubes 230 can be determined according to actual conditions. For example, if electronic devices are arranged in front of a layer of condensation structure 250, the spacing between the multiple flat tubes 230 of the condensation structure 250 of this layer can be set to be larger to reduce wind resistance and improve heat dissipation efficiency; when it is necessary to improve the heat dissipation effect of a layer of condenser 200, the spacing between the multiple flat tubes 230 of the condensation structure 250 of this layer can be reduced.

[0102] By setting the spacing between the multiple flat tubes 230 of the multi-layer condensation structure 250 to be different, the wind resistance of the heat dissipation device can be reduced according to actual usage conditions, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0103] In some embodiments, as Figure 4 As shown, the distances between the plurality of flat tubes 230 located in the same layer of the condensation structure 250 are different.

[0104] Among them, such as Figure 4 As shown, the spacing between the multiple flat tubes 230 located on the first side of the condensation structure 250 can be set to be greater than the spacing between the multiple flat tubes 230 located on the second side of the condensation structure 250; the spacing between the multiple flat tubes 230 located on the second side of the condensation structure 250 can also be set to be greater than the spacing between the multiple flat tubes 230 located on the first side of the condensation structure 250; the spacing between the multiple flat tubes 230 located in the middle of the condensation structure 250 can also be set to be greater than the spacing between the multiple flat tubes 230 located on both sides of the condensation structure 250; and the spacing between the multiple flat tubes 230 located on both sides of the condensation structure 250 can also be set to be greater than the spacing between the multiple flat tubes 230 located in the middle of the condensation structure 250.

[0105] For example, Figure 4 As shown, the spacing between the plurality of flat tubes 230 located on the left side of the condensation structure 250 is d1, and the spacing between the plurality of flat tubes 230 located on the right side of the condensation structure 250 is d2, and d1 is smaller than d2.

[0106] It should be noted that the spacing between the flat tubes 230 can be determined according to actual conditions. For example, an electronic device is provided in front of the first side of the condensation structure 250, and the electronic device blocks part of the air duct. At this time, the spacing between the multiple flat tubes 230 located on the first side of the condensation structure 250 can be set to be larger to reduce wind resistance and improve heat dissipation efficiency.

[0107] By setting the spacing between the multiple flat tubes 230 located in the same condensation structure 250 to be different, the wind resistance of the heat dissipation device can be reduced according to actual usage conditions, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0108] In some embodiments, as Figure 5As shown, the condensation structure 250 further includes a plurality of heat dissipation teeth 240. The plurality of heat dissipation teeth 240 are installed between two adjacent flat tubes 230 of the condensation structure 250. The plurality of heat dissipation teeth 240 are spaced apart, and the spacing between the plurality of heat dissipation teeth 240 of the same layer of the condensation structure 250 is different.

[0109] Among them, the spacing between the plurality of heat dissipation teeth 240 located at the upper end of the condensation structure 250 can be set to be greater than the spacing between the plurality of heat dissipation teeth 240 located at the lower end of the condensation structure 250; alternatively, the spacing between the plurality of flat tubes 230 located at the lower end of the condensation structure 250 can be set to be greater than the spacing between the plurality of flat tubes 230 located at the upper end of the condensation structure 250; further, the spacing between the plurality of heat dissipation teeth 240 located in the middle of the condensation structure 250 in the vertical direction can be set to be greater than the spacing between the plurality of heat dissipation teeth 240 located at both ends of the condensation structure 250; or the spacing between the plurality of heat dissipation teeth 240 located at both ends of the condensation structure 250 in the vertical direction can be set to be greater than the spacing between the plurality of heat dissipation teeth 240 located in the middle of the condensation structure 250.

[0110] For example, as Figure 5 shown, the spacing between the plurality of heat dissipation teeth 240 located on the left side of the condensation structure 250 is c1, and the spacing between the plurality of heat dissipation teeth 240 located on the right side of the condensation structure 250 is c2, and c1 < c2.

[0111] In the actual implementation process, during the heat dissipation process, both ends of the heat dissipation tooth 240 are respectively connected to two adjacent flat tubes 230. The wall surface of the flat tube 230 absorbs the heat of the cooling medium and transfers the heat to the heat dissipation tooth 240. The heat dissipation tooth 240 transfers the heat to the air in the condensation structure 250 under the turbulent flow action of the fan, thereby achieving heat dissipation.

[0112] It should be noted that the spacing between the heat dissipation teeth 240 can be determined according to the actual situation. For example, there are electronic devices arranged in front of the upper end of the condenser 200, and the electronic devices block part of the air duct. At this time, the spacing between the plurality of heat dissipation teeth 240 located at the upper end of the condensation structure 250 can be set to be larger to reduce the wind resistance and improve the heat dissipation efficiency.

[0113] Through the above setting of the heat dissipation teeth 240, the heat dissipation area of the condensation structure 250 can be increased, the heat dissipation efficiency can be improved, and at the same time, according to the actual use situation, the wind resistance of the heat dissipation device can be reduced, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0114] In some embodiments, as Figure 6 shown, the condensation structure 250 further includes a plurality of heat dissipation teeth 240. The plurality of heat dissipation teeth 240 are installed between two adjacent flat tubes 230 of the condensation structure 250. The plurality of heat dissipation teeth 240 are spaced apart; the spacing between the plurality of heat dissipation teeth 240 of the same layer of the condensation structure 250 is different.

[0115] Among them, the spacing between multiple heat dissipation teeth 240 of the same condensation structure 250 can be the same, and the spacing between multiple heat dissipation teeth 240 of different condensation structures 250 is different.

[0116] In some embodiments, the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 located at the first end along the first direction X is greater than the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 located at the second end along the first direction X.

[0117] In some other embodiments, the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 located at the first end along the first direction X is less than the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 located at the second end along the first direction X. For example, as Figure 6 shown, the spacing between multiple heat dissipation teeth 240 of the first condensation structure 250 is s1, the spacing between multiple heat dissipation teeth 240 of the second condensation structure 250 is s2, and the spacing between multiple heat dissipation teeth 240 of the third condensation structure 250 is s3, where s1 < s2 < s3.

[0118] In still some other embodiments, the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 located in the middle of the first direction X is greater than the spacing between multiple heat dissipation teeth 240 of the condensation structures 250 on both sides.

[0119] In yet some other embodiments, the spacing between multiple heat dissipation teeth 240 of the condensation structures 250 on both sides of the first direction X is greater than the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 in the middle.

[0120] It should be noted that the spacing between the heat dissipation teeth 240 can be determined according to the actual situation. For example, if there are electronic devices in front of a layer of the condensation structure 250, the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 of this layer can be set to be larger to reduce the wind resistance and improve the heat dissipation efficiency; when it is necessary to improve the heat dissipation effect of a layer of the condensation structure 250, the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 of this layer can be reduced.

[0121] By setting the spacing between multiple heat dissipation teeth 240 of the condensation structure 250 of the same layer to be different, the wind resistance of the heat dissipation device can be reduced and the overall heat dissipation effect of the heat dissipation device can be improved according to the actual use situation.

[0122] In some embodiments, as Figure 1 and Figure 2 shown, the diameters of the inlet manifolds 210 of multiple layers of the condensation structure 250 are different.

[0123] Among them, in some embodiments, as Figure 1 andFigure As shown, the diameter of the inlet manifold 210 of each layer of the condensation structure 250 is smaller than that of the inlet manifold 210 of the previous layer of the condensation structure 250.

[0124] Since the cooling medium can also dissipate heat in the inlet manifold 210, the smaller the diameter of the inlet manifold 210, the smaller the heat dissipation area of the inlet manifold 210. Therefore, by setting the diameters of the inlet manifolds 210 of the multi-layer condensation structures 250 to be negatively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100, the structure is simple, and the overall volume of the heat dissipation device can be further reduced while ensuring the heat dissipation effect.

[0125] In some other embodiments, the diameters of the inlet manifolds 210 of the multi-layer condensation structures 250 can also be arranged in other ways.

[0126] By setting the diameters of the inlet manifolds 210 of the multi-layer condensation structures 250 to be different, the wind resistance of the heat dissipation device can be reduced according to the actual use situation, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0127] In still some other embodiments, as ​ and ​ shown, the diameters of the outlet manifolds 220 of the multi-layer condensation structures 250 are different.

[0128] Among them, in some embodiments, as ​ and ​ shown, the diameter of the outlet manifold 220 of each layer of the condensation structure 250 is smaller than that of the outlet manifold 220 of the previous layer of the condensation structure 250.

[0129] By setting the diameters of the outlet manifolds 220 of the multi-layer condensation structures 250 to be negatively correlated with the distance from the medium flow path of each condensation structure 250 to the medium flow path of the evaporator 100, the structure is simple, and the overall volume of the heat dissipation device can be further reduced while ensuring the heat dissipation effect.

[0130] In some other embodiments, the diameters of the outlet manifolds 210 of the multi-layer condensation structures 250 can also be arranged in other ways.

[0131] By setting the diameters of the outlet manifolds 210 of the multi-layer condensation structures 250 to be different, the wind resistance of the heat dissipation device can be reduced according to the actual use situation, and the overall heat dissipation effect of the heat dissipation device can be improved.

[0132] The embodiment of the present application also provides a power conversion device, which includes a power device 300 and a heat dissipation device as described in any one of the above embodiments.

[0133] The power device 300 is installed on the evaporator 100 of the heat dissipation device.

[0134] The power device 300 may include, but is not limited to, MOSFET (Metal Oxide Semiconductor Field Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), etc., and there is no limitation here.

[0135] In some embodiments, the power device 300 can be installed on the evaporator 100 by means of bolt connection, welding or snap connection, etc., and materials such as thermal pads, thermal greases or thermal silicone greases can also be used between the power device 300 and the evaporator 100 to improve the heat conduction efficiency.

[0136] In other embodiments, the power device 300 and the evaporator 100 can also be combined together by means of integral casting or forging.

[0137] According to the power conversion device provided by the embodiments of the present application, by adopting the heat dissipation device of any of the above embodiments, the heated cooling medium can be distributed to the multi-layer condensation structure 250 for heat dissipation, so as to improve the heat dissipation effect of the heat dissipation device while reducing the vertical height of the heat dissipation device, and facilitate the installation of the heat dissipation device.

[0138] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and do not limit the number of objects. For example, the first object can be one or multiple. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0139] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0140] In the description of the present application, the "first feature", "second feature" may include one or more of such features.

[0141] In the description of the present application, "a plurality of" means two or more.

[0142] In the description of the present application, that the first feature is "above" or "below" the second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but in contact through additional features therebetween.

[0143] In the description of the present application, that the first feature is "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. <https: / / www.wipo.int / patentscope / en / help / glossary.html#

[0144] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0145] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat dissipation device, characterized in that, Comprising: An evaporator, with a power device installed at one end of the evaporator; A condenser, the condenser comprising a multi-layer condensation structure, the condenser being in communication with the evaporator, and the multi-layer condensation structure being distributed in a first direction.

2. The heat dissipation device according to claim 1, wherein, The multi-layer condensation structures are arranged in parallel.

3. The heat dissipation device according to claim 1, wherein Among the multi-layer condensation structures, at least two layers have different heat dissipation areas.

4. The heat dissipation device according to claim 3, wherein The flat tubes of each layer of the condensation structure have different lengths in a second direction, the second direction being the arrangement direction of the evaporator and the condenser, and the second direction intersects with the first direction.

5. The heat dissipation device according to claim 3, wherein The flat tubes of each layer of the condensation structure have different lengths in the first direction.

6. The heat dissipation device according to claim 3, wherein The spacing between multiple flat tubes of the condensation structure on the same layer is different.

7. The heat dissipation device according to claim 3, characterized in that, The condensation structure further comprises: A plurality of heat dissipation teeth, the plurality of heat dissipation teeth being installed between two adjacent flat tubes of the condensation structure, and the plurality of heat dissipation teeth being spaced apart; wherein the spacing between the plurality of heat dissipation teeth of different layers of the condensation structure is different.

8. The heat dissipation device according to claim 3, characterized in that, The condensation structure further comprises: A plurality of heat dissipation teeth, the plurality of heat dissipation teeth being installed between two adjacent flat tubes of the condensation structure, and the plurality of heat dissipation teeth being spaced apart; the spacing between the plurality of heat dissipation teeth of the condensation structure on the same layer is different.

9. The heat dissipation device according to claim 3, wherein: The diameters of the inlet manifolds of the multi-layer condensation structures are different; And / or, The diameters of the outlet manifolds of the multi-layer condensation structures are different.

10. The heat dissipation device according to any one of claims 1-9, characterized in that, Further comprising: An air pipe, with both ends of the air pipe respectively connected to the inlet of the condenser and the outlet of the evaporator; A liquid pipe, with both ends of the liquid pipe respectively connected to the outlet of the condenser and the inlet of the evaporator.

11. A power conversion device, characterized in that, Comprising: The heat dissipation device according to any one of claims 1-10; A power device, the power device being installed on the evaporator of the heat dissipation device.

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