Heat dissipation assembly and power conversion equipment

Abstract

The utility model discloses a heat dissipation assembly and power conversion equipment, and relates to the technical field of heat dissipation, the heat dissipation assembly comprises a case shell, a flow distribution component and a heat dissipation fan, the flow distribution component is arranged in the case shell and is provided with an air inlet hole and a plurality of flow distribution holes, the flow distribution holes are communicated with the air inlet hole, and the heat dissipation fan is arranged in the case shell. The flow distribution hole is used for being arranged towards a heating device in the case shell, and the cooling fan is arranged in the case shell and used for blowing air into the air inlet hole. When the cooling fan is started, air flow enters the flow distribution component from the air inlet hole, finally flows out from the flow distribution hole and is blown to a heating device. The flow distribution holes can be flexibly arranged according to the actual positions and the number of the heating devices, and therefore heat dissipation of the heating devices can be considered. The flow distribution component collects the airflow generated by the cooling fan and then distributes the airflow to a reasonable position through the flow distribution holes, so that the heat dissipation effect of the cooling fan in the heat dissipation assembly on each electronic device can be ensured.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation, and more specifically, to a heat dissipation component and a power conversion device. Background Art

[0002] A power conversion device contains numerous electronic components. To ensure the long-term stable and reliable operation of these electronic components, they are usually placed in an enclosed space (a chassis) to achieve a high level of waterproof and dustproof protection. During the operation of electronic components, heat is generated due to the existence of resistance. This heat accumulates in the enclosed cavity. If it cannot be discharged to the external environment in time, the temperature in the cavity will rise rapidly. Once the temperature exceeds the limit that the electronic components can withstand, it will accelerate the aging of the electronic components and even cause the failure of the electronic components.

[0003] Currently, the common heat dissipation method for power conversion devices is to install a turbulent flow fan in the enclosed cavity. By accelerating the flow of internal hot air, the heat is transferred to the chassis, and then the chassis dissipates the heat to the outside through heat radiation and natural convection. Although this heat dissipation method can ensure that the ambient temperature in the cavity meets the requirements, since the turbulent flow fan cannot dissipate heat to each electronic component specifically, it will cause poor heat dissipation for some electronic components.

[0004] Therefore, how to ensure the heat dissipation effect of each electronic component inside the power conversion device has become a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Utility Model

[0005] In view of this, the purpose of the present application is to provide a heat dissipation component to ensure the heat dissipation effect of each electronic component inside the power conversion device.

[0006] Another purpose of the present application is to provide a power conversion device including the above heat dissipation component.

[0007] To achieve the above purpose, the present application provides the following technical solutions:

[0008] A heat dissipation component, comprising:

[0009] A chassis housing;

[0010] A flow distribution component, disposed inside the chassis housing, and provided with an air inlet hole and a plurality of flow distribution holes, the flow distribution holes being communicated with the air inlet hole, and the flow distribution holes being used for facing heat generating components;

[0011] A heat dissipation fan, disposed on the chassis housing, for blowing air into the air inlet hole.

[0012] Optionally, in the above heat dissipation component, the area of the air inlet hole is greater than the sum of the areas of all the flow distribution holes.

[0013] Optionally, in the above heat dissipation component, the flow distribution component is a flow distribution box body formed by enclosing with multiple mounting plates, and the air inlet hole and the flow distribution holes are both opened on the mounting plates, and at least one of the mounting plates is connected to the chassis housing.

[0014] Optionally, in the above heat dissipation component, the flow distribution component is a flow distribution box body formed by jointly enclosing with multiple mounting plates and the side wall of the housing of the chassis housing, and the air inlet hole and the flow distribution holes are both opened on the mounting plates.

[0015] Optionally, in the above heat dissipation component, there is one or more flow distribution box bodies, and multiple flow distribution box bodies are arranged on the same or different side walls of the chassis housing;

[0016] The heat dissipation fan is arranged on the flow distribution component or the chassis housing.

[0017] Optionally, in the above heat dissipation component, the flow distribution component is a tubular flow distribution pipe, the first end opening of the flow distribution pipe serves as the air inlet hole, the second end is blocked or arranged towards the heat generating device, and the flow distribution holes are opened on the side wall of the flow distribution pipe.

[0018] Optionally, in the above heat dissipation component, one heat dissipation fan is communicated with the air inlet hole of one flow distribution pipe; or,

[0019] One heat dissipation fan is communicated with the air inlet holes of multiple flow distribution pipes through a pipe adapter.

[0020] Optionally, in the above heat dissipation component, a part of the flow distribution holes is arranged towards the end face of the heat generating component in the heat generating device, and the other part is arranged towards the gap between adjacent heat generating components in the heat generating device.

[0021] Optionally, in the above heat dissipation component, a radiator is arranged at the air outlet of the heat dissipation fan.

[0022] Optionally, in the above heat dissipation component, it further includes a direct blowing fan, and the air outlet of the direct blowing fan is arranged towards the heat generating device.

[0023] A power conversion device includes a heat generating device and the above heat dissipation component, the heat generating device is arranged inside the chassis housing, and the flow distribution holes are arranged towards the heat generating device.

[0024] The heat dissipation component provided by the present application includes a chassis housing, a flow distribution component, and a heat dissipation fan. The flow distribution component is disposed within the chassis housing and is provided with an air inlet hole and a plurality of flow distribution holes. The flow distribution holes communicate with the air inlet hole and are arranged to face the heat generating devices within the chassis housing. The heat dissipation fan is disposed within the chassis housing and is used to blow air into the air inlet hole. When the heat dissipation fan is started, the air flow enters the flow distribution component through the air inlet hole and finally flows out from the flow distribution holes and blows towards the heat generating devices. Among them, the flow distribution holes can be flexibly arranged according to the actual positions and quantities of the heat generating devices, so as to take into account the heat dissipation of each heat generating device.

[0025] Compared with the prior art, the heat dissipation component provided by the present application is provided with a flow distribution component between the heat dissipation fan and the heat generating devices. After collecting the air flow generated by the heat dissipation fan, the flow distribution component distributes it to reasonable positions through the flow distribution holes, which can ensure the heat dissipation effect of the heat dissipation fan inside the heat dissipation component on each electronic device.

[0026] The power conversion device provided by the present application includes a heat generating device and the above-mentioned heat dissipation component. The heat generating device is disposed within the chassis housing, and the flow distribution holes are arranged to face the heat generating device. Due to having the above-mentioned heat dissipation component, it also has the above-mentioned structure and beneficial effects. Other structures refer to the prior art and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 It is a three-dimensional view of the power conversion device disclosed in the embodiment of the present application;

[0029] Figure 2 It is a schematic structural diagram of the power conversion device disclosed in the embodiment of the present application with the flow distribution component hidden;

[0030] Figure 3 It is a front view of the power conversion device disclosed in the embodiment of the present application;

[0031] Figure 4 It is Figure 3 a cross-sectional view taken along line A-A in

[0032] Figure 5 It is Figure 3 a cross-sectional view taken along line B-B in

[0033] Figure 63D transparent view of the power conversion device disclosed in the embodiments of the present application;

[0034] Figure 7 Schematic diagram of the installation of the first flow distribution component and the cooling fan disclosed in the embodiments of the present application;

[0035] Figure 8 Schematic diagram of the installation of the second flow distribution component and the cooling fan disclosed in the embodiments of the present application;

[0036] Figure 9 Schematic diagram of the installation of the third flow distribution component and the cooling fan disclosed in the embodiments of the present application;

[0037] Figure 10 Schematic diagram of the installation of the fourth flow distribution component and the cooling fan disclosed in the embodiments of the present application;

[0038] Figure 11 Schematic diagram of the first installation of the flow distribution component and the cooling fan on the chassis housing in the embodiments of the present application;

[0039] Figure 12 Schematic diagram of the second installation of the flow distribution component and the cooling fan on the chassis housing in the embodiments of the present application;

[0040] Figure 13 Schematic diagram of the third installation of the flow distribution component and the cooling fan on the chassis housing in the embodiments of the present application.

[0041] Wherein, 11 is the chassis housing; 12 is the sealed cavity;

[0042] 111 is the chassis side wall, 112 is the chassis top wall, 113 is the chassis bottom wall;

[0043] 131 is the third fan; 132 is the second fan; 133 is the first fan, 134 is the fourth fan;

[0044] 141 is the second heating device; 142 is the first heating device; 143 is the third heating device;

[0045] 151 is the first distribution box; 152 is the first distribution hole, 153 is the mounting plate;

[0046] 161 is the second distribution box; 162 is the second distribution hole;

[0047] 171 is the flow distribution pipe, 172 is the pipe distribution hole, 173 is the pipe adapter;

[0048] 180 is the radiator. Detailed implementation manners

[0049] The core of this application is to disclose a heat dissipation component to ensure the heat dissipation effect of each electronic component inside the power conversion device.

[0050] Another core of this application is to disclose a power conversion device including the above heat dissipation component.

[0051] Hereinafter, embodiments will be described with reference to the drawings. In addition, the embodiments shown below do not impose any limitation on the utility model content recorded in the claims. Further, all the contents of the configurations shown in the following embodiments are not necessarily essential for the solution of the utility model recorded in the claims. It should be noted that, for ease of description, only parts related to the utility model are shown in the drawings. Without conflict, the embodiments and features in the embodiments in the present disclosure can be combined with each other.

[0052] Combined Figure 1 and Figure 3 , the heat dissipation component of the present disclosure includes a chassis housing 11, a flow distribution component, and a heat dissipation fan. The flow distribution component is disposed inside the chassis housing 11 and is provided with an air inlet hole and a plurality of flow distribution holes. The flow distribution holes communicate with the air inlet hole, and the flow distribution holes are used to be arranged toward the heat generating components inside the chassis housing 11. The heat dissipation fan is disposed on the chassis housing 11 and is used to blow air into the air inlet hole.

[0053] When the heat dissipation fan is started, the air flow enters the flow distribution component through the air inlet hole and finally flows out from the flow distribution holes and blows toward the heat generating components. Among them, the plurality of flow distribution holes means that the number of flow distribution holes is at least two, so that a single heat dissipation fan can simultaneously perform targeted heat dissipation on the heat generating components at at least two positions. Specifically, the flow distribution holes can be flexibly arranged according to the actual positions and quantities of the heat generating components, so as to take into account the heat dissipation of each heat generating component, or only perform targeted heat dissipation on the heat generating components with relatively high operating temperatures.

[0054] Those skilled in the art can understand that the heat dissipation fan can be specifically disposed inside or outside the chassis housing 11, can be directly fixed on the chassis housing 11, or can be disposed on the chassis housing 11 through fixing members such as brackets. In some embodiments, the chassis housing 11 is a closed cavity. At this time, the heat dissipation fan is disposed inside the chassis housing 11 to promote the air flow inside the chassis housing 11 and make full use of the cold in the air inside the chassis housing 11 to dissipate heat from the heat generating components inside the chassis housing 11. The heat inside the chassis housing 11 can finally be dissipated to the external environment through one or more of the chassis housing 11, heat exchanger, and cold plate.

[0055] Compared with the prior art, the present disclosure distributes the flow rate of the cooling fan through the setting of the flow rate distribution component, and the flow rate distribution holes are arranged corresponding to the heat generating devices, so that the cooling fan can achieve precise heat dissipation for the heat generating devices in the chassis housing 11, thereby ensuring the heat dissipation effect of each electronic device inside the heat dissipation component.

[0056] Exemplarily, the heat generating devices may be relay devices (the first heat generating device 142), capacitor devices (the second heat generating device 141), other heat generating devices (the third heat generating device 143), etc.

[0057] In a further optimized solution, the area of the air inlet holes on the flow rate distribution component is larger than the sum of the areas of each flow rate distribution hole, so that the wind speed at the flow rate distribution holes is greater than the wind speed at the air outlet of the cooling fan. The air flow blown out by the cooling fan can flow towards the heat generating devices at a faster speed after passing through the flow rate distribution component, enhancing the convective heat transfer effect with the heat generating devices.

[0058] In some embodiments, in combination with Figures 11 - 13 , the chassis top wall 112 and the chassis bottom wall 113 of the chassis housing 11 are arranged opposite to each other, the chassis side wall 111 is connected between the chassis top wall 112 and the chassis bottom wall 113, and the chassis top wall 112, the chassis bottom wall 113 and the chassis side wall 111 jointly enclose a cavity of the chassis housing 11. The flow rate distribution component is a flow rate distribution box body formed by jointly enclosing a plurality of mounting plates 153, and both the air inlet holes and the flow rate distribution holes are opened on (the same or different) mounting plates 153. At least one mounting plate 153 is connected to the chassis housing 11. The flow rate distribution box body can be specifically suspended on the chassis top wall 112 or the chassis side wall 111 of the chassis housing 11, or placed on the chassis bottom wall 113 of the chassis housing 11, and the position arrangement is flexible.

[0059] In combination with Figure 3 and Figure 5 , flow rate distribution holes can be opened on each of the mounting plates 153 of the flow rate distribution box body formed by jointly enclosing a plurality of mounting plates 153, so that the direction of the air flow blown out by the cooling fan can be arranged more freely. And since the mounting plate 153 is a planar structure, correspondingly, the flow rate distribution holes on a certain mounting plate 153 are all in the same plane, which can be suitable for heat dissipation of a plurality of heat generating devices array-mounted on the same mounting plane. During assembly, the mounting surface of the flow rate distribution box body with the flow rate distribution holes can be arranged facing the heat generating devices and set parallel to the plane where the heat generating devices are located. The solution of opening flow rate distribution holes on the planar mounting plate 153 is simple to process and has low cost.

[0060] In combination with Figure 6, according to the actual layout of the functional components (including heat-generating devices) inside the chassis housing 11, the flow distribution component can also be formed by a plurality of mounting plates 153 and the side walls of the housing of the chassis housing 11 together, and the air inlet holes and the flow distribution holes are both opened on the (same or different) mounting plates 153, that is, the side walls of the chassis housing 11 can be used to form the flow distribution space inside the flow distribution component, so as to reduce the structural part cost of the flow distribution component. In addition, the air flow in the internal air duct of the flow distribution component formed by the mounting plate 153 and the side walls of the housing of the chassis housing 11 together can directly contact the chassis housing 11, shortening the heat transfer path between the air flow in the air duct and the outside, and being more conducive to heat dissipation. Exemplarily, Figures 11 - 13 In Figures 11 - 13 , the flow distribution component is formed by a plurality of mounting plates 153 respectively enclosing with the chassis side wall 111, the chassis bottom wall 113 and the chassis top wall 112 of the chassis housing 11 together.

[0061] The above-mentioned mounting plate 153 can specifically be a sheet metal part.

[0062] In addition, according to the model parameters of the actual cooling fan, the size of the flow distribution component, and the actual heat dissipation air volume requirement of the heat-generating device, combined with Figure 7 and Figure 8 , one or more cooling fans can be configured on a flow distribution box body. When there are multiple cooling fans, it is preferred to arrange the cooling fans on the same outer wall of the flow distribution box body for easy layout.

[0063] Furthermore, combined with Figure 5 In the above embodiment, in addition to directly facing the end face of the heat-generating component (a heat-generating device can include multiple heat-generating components) in the heat-generating device, the flow distribution holes (the second distribution holes 162) can also face the gap between adjacent heat-generating components in the heat-generating device, so as to be able to perform air-cooled heat dissipation on the side walls of the heat-generating components, and further enable the air flow blown to the heat-generating components to more effectively cover the heat-generating components and improve the heat dissipation efficiency.

[0064] According to the actual space layout inside the chassis housing 11, the number of flow distribution box bodies is one or more, and different flow distribution box bodies can be arranged on the same or different side walls of the chassis housing 11. Combined with Figure 1 and Figure 2 , the cooling fan can be arranged on the chassis housing 11. When the flow distribution component is the above-mentioned flow distribution box body, the cooling fan can also be directly installed on the side wall of the flow distribution box body where the air inlet hole is opened. The position of the cooling fan is arranged flexibly, which is convenient for adapting to different space layouts inside the chassis housing 11.

[0065] In some embodiments, combined with Figure 9, the flow distribution component is a tubular flow distribution pipe 171. The first end opening of the flow distribution pipe 171 can be used as the above-mentioned air inlet hole and is communicated with the air outlet of the cooling fan. The second end is arranged towards the heat generating device or blocked, and flow distribution holes (pipe distribution holes 172) are provided on the side wall of the flow distribution pipe 171.

[0066] After the cooling fan is started, the air flow enters the flow distribution pipe 171 and flows out from the flow distribution holes on the side wall of the flow distribution pipe 171, blowing towards the heat generating device. In addition, when the second end of the flow distribution pipe 171 is not blocked, the second end of the flow distribution pipe 171 can also blow air towards the heat generating device.

[0067] The flow distribution component of this type of flow distribution pipe 171 can be bent according to the actual space layout inside the chassis housing 11, with a higher degree of freedom and more flexible arrangement.

[0068] Those skilled in the art can understand that the above-mentioned flow distribution pipe 171 can be either a rigid pipe or a flexible pipe, and the flexible pipe has a higher degree of flexibility in arrangement than the rigid pipe. The cross-sectional shape of the flow distribution pipe 171 can be circular or square, etc.

[0069] Combined with Figure 9 , according to the pipe diameter of the flow distribution pipe 171 and the actual size of the air outlet of the cooling fan, one cooling fan can blow air towards one or more flow distribution pipes 171, and multiple flow distribution pipes 171 can be docked with the air outlet of one cooling fan through a pipe adapter 173. Specifically, for the flow distribution pipe 171 with a longer extension length, the air outlet effect of the end far from the cooling fan is weaker than that of the end close to the cooling fan. Therefore, in the case where there are more heat dissipation sites, it is preferable to adopt an arrangement scheme in which multiple flow distribution pipes 171 with shorter extension lengths are docked with the air outlet of one cooling fan to ensure the consistency of the heat dissipation effect on each heat generating device.

[0070] According to the arrangement structure of the components inside the chassis housing 11, the above-mentioned flow distribution pipe 171 and the flow distribution box can be selected alternatively or configured together.

[0071] For a further optimized solution, combined with Figure 10 , a radiator 180 (such as a liquid cooling component / liquid cooling fin radiator, a semiconductor refrigeration sheet, etc.) can also be provided at the air outlet of the cooling fan to make the air flow blown out by the cooling fan be cold air and enhance the heat dissipation effect.

[0072] For some heat-generating devices that cannot be covered (directly blown) by the flow distribution holes of the flow distribution component inside the chassis housing 11, a direct-blowing fan can be separately provided inside the chassis housing 11, and the direct-blowing fan can directly dissipate heat from the heat-generating devices that cannot be covered by the flow distribution component.

[0073] In a specific embodiment of the present disclosure, in combination with Figures 3 - 6 , the chassis housing 11 is formed by enclosing one or more sealed cavities 12 by a plurality of side plates (the chassis housing 11 is usually formed by enclosing a sealed cavity 12 by six side plates). A plurality of fans are provided inside the sealed cavity 12 to dissipate heat from different heat-generating devices inside the chassis housing 11. Two flow distribution components, a first distribution box body 151 and a second distribution box body 161, are provided inside the sealed cavity 12. Among them, the first distribution box body 151 is formed by enclosing a flow distribution space by a sheet metal housing and the chassis housing 11, and a first air inlet hole and a plurality of first distribution holes 152 are opened on the sheet metal housing. The plurality of first distribution holes 152 are respectively arranged facing the first heat-generating device 142 and the third heat-generating device 134. The first fan 133 is arranged at the first air inlet hole and can blow cold air into the flow distribution space of the first distribution box body 151, and finally flows to the first heat-generating device 142 and the third heat-generating device 134 through the first distribution holes 152 for heat dissipation. The second distribution box body 161 is independently enclosed by a plurality of sheet metal housings to form a flow distribution space, and a second air inlet hole and a plurality of second distribution holes 162 are opened on the sheet metal housing. The second distribution holes 162 are arranged facing the second heat-generating device 141. The second fan 132 is arranged at the second air inlet hole and can blow cold air into the flow distribution space of the second distribution box body 161, and finally flows to the second heat-generating device 141 through the second distribution holes 162 for heat dissipation. In combination with Figure 2 , the third fan 131 serves as a direct-blowing fan and can directly blow and dissipate heat from other heat-generating devices inside the sealed cavity 12.

[0074] The power conversion device disclosed in the present application includes a heat-generating device and the above-mentioned heat dissipation component. The heat-generating device is arranged inside the chassis housing 11, and the flow distribution holes are arranged facing the heat-generating device. Due to the above-mentioned heat dissipation component, it also has the above-mentioned structure and beneficial effects. Other structures refer to the prior art and will not be elaborated here.

[0075] Specifically, the power conversion device can be a PCS (Power Conversion System), a wind power converter, an inverter, a rectifier, etc. Correspondingly, there are differences in the heat-generating devices of different types of power conversion devices, which will not be elaborated here.

[0076] The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Specific technical means in some embodiments can be combined, in part or in whole, into another embodiment on the premise that they are not explicitly excluded by another embodiment. Therefore, the present disclosure will not be limited to the embodiments shown herein, but rather should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation component, characterized in that, Comprising: A chassis housing (11); A flow distribution component, disposed within the chassis housing (11), having an air inlet hole and a plurality of flow distribution holes, the flow distribution holes being in communication with the air inlet hole, and the flow distribution holes being configured to face heat generating devices; A cooling fan, disposed on the chassis housing (11), for blowing air into the air inlet hole.

2. The heat dissipation component according to claim 1, wherein The area of the air inlet hole is greater than the sum of the areas of each of the flow distribution holes.

3. The heat dissipation component according to claim 1, wherein, The flow distribution component is a flow distribution box body formed by enclosing a plurality of mounting plates (153), and the air inlet hole and the flow distribution holes are both formed on the mounting plates (153), and at least one of the mounting plates (153) is connected to the chassis housing (11).

4. The heat dissipation component according to claim 1, characterized in that, The flow distribution component is a flow distribution box body formed by jointly enclosing a plurality of mounting plates (153) and the side wall of the housing of the chassis housing (11), and the air inlet hole and the flow distribution holes are both formed on the mounting plates (153).

5. The heat dissipation component according to claim 3 or 4, characterized in that, There is one or more of the flow distribution box bodies, and the plurality of flow distribution box bodies are disposed on the same or different side walls of the chassis housing (11); The cooling fan is disposed on the flow distribution component or on the chassis housing (11).

6. The heat dissipation component according to claim 1, wherein The flow distribution component is a tubular flow distribution pipe (171), a first end opening of the flow distribution pipe (171) serves as the air inlet hole, a second end is blocked or arranged to face a heat generating device, and the flow distribution holes are formed on the side wall of the flow distribution pipe (171).

7. The heat dissipation component according to claim 6, wherein, One cooling fan is in communication with the air inlet hole of one flow distribution pipe (171); or, One cooling fan is in communication with the air inlet holes of a plurality of flow distribution pipes (171) through a pipe adapter (173).

8. The heat dissipation component according to claim 1, wherein, A part of the flow distribution holes is arranged to face the end face of a heat generating component in the heat generating device, and another part is arranged to face the gap between adjacent heat generating components in the heat generating device.

9. The heat dissipation component according to claim 1, wherein, A radiator (180) is disposed at the air outlet of the cooling fan; or, It further includes a direct-blowing fan, and the air outlet of the direct-blowing fan is arranged to face the heat generating device.

10. A power conversion device, characterized in that, Comprising a heat generating device and a heat dissipation assembly according to any one of claims 1-9, the heat generating device is disposed within the chassis housing (11), and the flow distribution holes are arranged to face the heat generating device.

Images