High-temperature-aging-resistant PCB (Printed Circuit Board)

Abstract

The utility model discloses a high temperature aging resistant PCB, comprising a cooling plate which is arranged in a horizontal plate shape and is internally provided with a snakelike cooling channel, and two ends of the cooling plate are respectively provided with a water inlet pipe and a water outlet pipe which are communicated with the cooling channel; the circuit board body is arranged on the surface of the cooling plate; and the locking mechanism is arranged on the cooling plate and is used for fixing the circuit board body. Compared with the prior art, the PCB has the following advantages and effects that the cooling plate is arranged, heat generated by a semiconductor product on the circuit board body is taken away in time in a water cooling mode, the loading capacity of water is large, heat dissipation and cooling of the circuit board body can be achieved in time, the high-temperature aging resistance of the PCB is improved, and meanwhile the service life of the PCB is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a PCB board with high temperature aging resistance. Background Art

[0002] The PCB circuit board is also called a printed circuit board. The PCB circuit board is an important electronic component in electrical components. It is also a support for electronic components and a carrier for electrical connection of electronic components. Therefore, the PCB circuit board is an important component.

[0003] When the traditional PCB circuit board is in use, it only dissipates heat through its own heat radiation principle, and the heat dissipation effect is poor, resulting in poor high temperature aging resistance of the PCB circuit board. It is easy to burn out, which affects the service life of the PCB circuit board and needs to be improved. Summary of the Utility Model

[0004] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a PCB board with high temperature aging resistance, which has the effect of improving the high temperature aging resistance.

[0005] The above technical purpose of the utility model is realized by the following technical solutions: A PCB board with high temperature aging resistance, comprising:

[0006] A cooling plate, which is arranged in a horizontal plate shape and has a serpentine cooling channel inside. Water inlet and outlet pipes communicating with the cooling channel are respectively arranged at both ends of the cooling plate;

[0007] A circuit board body, which is arranged on the surface of the cooling plate;

[0008] A locking mechanism, which is arranged on the cooling plate and is used to fix the circuit board body.

[0009] In a preferred example of the utility model, it can be further configured as: The locking mechanism includes a locking rod and a hook. The locking rod is vertically arranged on the cooling plate and is used to penetrate the four corners of the circuit board body. The hook is arranged on the locking rod and is used to press the upper end surface of the circuit board body.

[0010] In a preferred example of the utility model, it can be further configured as: A heat conducting pad is arranged between the circuit board body and the cooling plate.

[0011] In a preferred example of the utility model, it can be further configured as: Both the cooling plate and the circuit board body are arranged in a ring shape. A fan that blows upward is arranged on the inner side wall of the cooling plate. A support frame is vertically arranged on the fan. A baffle that is horizontally arranged above the circuit board body is arranged on the support frame, and the baffle horizontally extends to directly above the circuit board body at its four surrounding positions.

[0012] In a preferred example, the present utility model can be further configured as follows: the cooling plate includes a bottom shell, a top shell, a baffle plate, and a fixing member. The bottom shell and the top shell are arranged to be buckled with each other. The baffle plate is vertically arranged inside the bottom shell and the top shell, and the upper and lower layers of the baffle plates are arranged in a staggered manner. The fixing member is used to fix the bottom shell and the top shell.

[0013] In a preferred example, the present utility model can be further configured as follows: the fixing member includes a fixing ring and a clamping ring. The fixing ring is arranged on the lower end surface of the top shell. A fixing groove for the fixing ring to be embedded is arranged on the bottom shell. The clamping ring is arranged on the outer wall of the fixing ring. A clamping groove for the clamping ring to be embedded is arranged in the fixing groove.

[0014] In a preferred example, the present utility model can be further configured as follows: a sealing rubber strip is wound around the connection position of the bottom shell and the top shell.

[0015] In a preferred example, the present utility model can be further configured as follows: a pair of shock-absorbing strips are arranged on the lower end surface of the bottom shell.

[0016] In summary, the present utility model has the following beneficial effects:

[0017] 1. By providing a cooling plate and adopting the water-cooling method to timely take away the heat generated by the semiconductor products on the circuit board body, the heat-carrying capacity of water is relatively large, which can realize the timely heat dissipation and temperature reduction of the circuit board body, improve the high-temperature aging resistance of the PCB circuit board, and at the same time improve the service life of the PCB circuit board;

[0018] 2. By providing the cooperation of a fan and a baffle, the cold air can directly blow on the surface of the semiconductor products on the circuit board body, realizing the air-cooling of the circuit board body. Thus, by combining water-cooling and air-cooling, the full heat dissipation and temperature reduction of the circuit board body are realized, and the high-temperature aging resistance of the PCB circuit board is improved;

[0019] 3. By providing a split-combined cooling plate, the convenient production and processing and the rapid assembly and use of the cooling plate can be realized, making the production process of the cooling plate more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic structural diagram of the embodiment;

[0021] Figure 2 is a schematic connection relationship diagram of the embodiment;

[0022] Figure 3 is a schematic structural diagram of the cooling plate of the embodiment;

[0023] Figure 4Schematic structural diagram of the fixing member of the embodiment.

[0024] Reference numerals: 1, cooling plate; 11, cooling channel; 12, water inlet pipe; 13, water outlet pipe; 14, bottom case; 15, top case; 16, baffle plate; 17, sealing strip; 18, shock-absorbing strip; 2, circuit board body; 3, locking mechanism; 31, locking rod; 32, hook; 4, heat-conducting pad; 5, fan; 51, support frame; 52, baffle; 6, fixing member; 61, fixing ring; 62, snap ring; 63, fixing groove; 64, clamping groove. Detailed implementation manners

[0025] The following further elaborates on the present utility model in conjunction with the accompanying drawings.

[0026] As Figure 1 , Figure 2 shown, a PCB board resistant to high-temperature aging includes a cooling plate 1, a circuit board body 2, and a locking mechanism 3.

[0027] As Figure 2 , Figure 3 shown, the cooling plate 1 is arranged in a horizontal plate shape and has a serpentine cooling channel 11 inside. The two ends of the cooling plate 1 are respectively provided with a water inlet pipe 12 and a water outlet pipe 13 communicating with the cooling channel 11.

[0028] As Figure 2 shown, the circuit board body 2 is arranged on the cooling plate 1. A heat-conducting pad 4 is arranged between the circuit board body 2 and the cooling plate 1 to fill the gap between the circuit board body 2 and the cooling plate 1. On the one hand, it can timely transfer the heat generated on the circuit board body 2 to the cooling plate 1, and on the other hand, it can also achieve the shock-absorbing effect to protect the circuit board body 2 from being damaged.

[0029] As Figure 2 shown, the locking mechanism 3 is arranged on the cooling plate 1 and is used to fix the circuit board body 2. The locking mechanism 3 includes a locking rod 31 and a hook 32. The locking rod 31 is vertically arranged on the cooling plate 1 and is used to penetrate through the four corners of the circuit board body 2. The hook 32 is arranged on the locking rod 31 and is used to press the upper end surface of the circuit board body 2.

[0030] When the PCB board is working, cold water is introduced into the cooling channel 11 inside the cooling plate 1 along the water inlet pipe 12, and then the cold water is discharged outside along the water outlet pipe 13. At this time, the heat-conducting pad 4 timely transfers the heat generated on the circuit board body 2 to the cooling plate 1, and the heat generated by the semiconductor products on the circuit board body 2 is timely taken away by the water-cooling method. The heat-carrying capacity of water is relatively large, which can realize the timely heat dissipation and cooling of the circuit board body 2, improve the high-temperature aging resistance performance of the PCB circuit board, and at the same time improve the service life of the PCB circuit board.

[0031] During the initial assembly process of the circuit board body 2, the locking rod 31 and the hook 32 are passed through the circuit board body 2, and the hook 32 is used to tightly hook the circuit board body 2, so as to realize the quick installation and fixation of the circuit board body 2, improving the convenience and assembly efficiency of the assembly process.

[0032] As Figure 2 shown, both the cooling plate 1 and the circuit board body 2 are arranged in a ring shape. An upward-blowing fan 5 is provided on the inner side wall at the inner ring position of the cooling plate 1. A support frame 51 is vertically arranged on the fan 5, and a baffle 52 located above the circuit board body 2 is horizontally arranged on the support frame 51, and the four surrounding positions of the baffle 52 horizontally extend to directly above the circuit board body 2.

[0033] When the PCB board is working, the fan 5 is started to make the fan 5 blow upward. At this time, the cold air blows to the lower end surface of the baffle 52, and the cold air is blown in all directions and directly blows on the surface of the semiconductor product on the circuit board body 2, realizing the air cooling of the circuit board body 2. Thus, through the cooperation of water cooling and air cooling, the sufficient heat dissipation and temperature reduction of the circuit board body 2 are achieved, improving the high-temperature aging resistance of the PCB circuit board.

[0034] As Figure 3 、 Figure 4 shown, the cooling plate 1 includes a bottom shell 14, a top shell 15, a baffle plate 16 and a fixing member 6. The bottom shell 14 and the top shell 15 are buckled together, and a sealing rubber strip 17 is wound at the connection position of the bottom shell 14 and the top shell 15 to increase the sealing performance of the connection position between the two. A pair of shock-absorbing strips 18 are provided on the lower end surface of the bottom shell 14 to improve the shock-absorbing performance of the entire cooling plate 1.

[0035] As Figure 3 、 Figure 4 shown, the baffle plate 16 is vertically arranged inside the bottom shell 14 and the top shell 15, and the upper and lower layers of baffle plates 16 are arranged in a staggered manner. The fixing member 6 is used to fix the bottom shell 14 and the top shell 15, and the fixing member 6 includes a fixing ring 61 and a clamping ring 62.

[0036] As Figure 3 、 Figure 4 shown, the fixing ring 61 is arranged on the lower end surface of the top shell 15, and a fixing groove 63 for the fixing ring 61 to be embedded is provided on the bottom shell 14. The clamping ring 62 is arranged on the outer wall of the fixing ring 61, and a clamping groove 64 for the clamping ring 62 to be embedded is provided in the fixing groove 63.

[0037] Therefore, when assembling the cooling plate 1, the bottom shell 14 and the top shell 15 are buckled together, then the fixing ring 61 is inserted into the fixing groove 63, and under the cooperation of the clamping ring 62 and the clamping groove 64, their connection and fixation are realized. Subsequently, the sealing rubber strip 17 is wound between the outer walls of the bottom shell 14 and the top shell 15 to realize their tight connection and fixation.

[0038] Therefore, by setting the split combined cooling plate 1 and adopting the fixed manner of snap connection, the convenient production and processing and the rapid assembly and use of the cooling plate 1 can be realized, making the production process of the cooling plate 1 more convenient and improving the production efficiency and convenience.

[0039] The specific embodiments are only explanations of the present invention, and they do not limit the present invention. After reading this specification, those skilled in the art can make modifications to the embodiments without creative contributions as needed, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A PCB board resistant to high-temperature aging, characterized in that: Including: A cooling plate (1), which is arranged in a horizontal plate shape and has a serpentine cooling channel (11) inside. An inlet water pipe (12) and an outlet water pipe (13) communicating with the cooling channel (11) are respectively arranged at both ends of the cooling plate (1); A circuit board body (2), which is arranged on the surface of the cooling plate (1); A locking mechanism (3), which is arranged on the cooling plate (1) and is used to fix the circuit board body (2).

2. The heat-resistant aging PCB board according to claim 1, characterized in that: The locking mechanism (3) includes a locking rod (31) and a hook (32). The locking rod (31) is vertically arranged on the cooling plate (1) and is used to penetrate through the four corner positions of the circuit board body (2). The hook (32) is arranged on the locking rod (31) and is used to press the upper end surface of the circuit board body (2).

3. A heat-resistant aging PCB board according to claim 1, characterized in that: A heat-conducting pad (4) is arranged between the circuit board body (2) and the cooling plate (1).

4. A heat-resistant aging PCB board according to claim 1, characterized in that: Both the cooling plate (1) and the circuit board body (2) are arranged in a ring shape. A fan (5) that blows upward is arranged on the inner side wall of the cooling plate (1). A support frame (51) is vertically arranged on the fan (5). A baffle (52) located above the circuit board body (2) is horizontally arranged on the support frame (51), and the baffle (52) horizontally extends to directly above the circuit board body (2) at its four surrounding positions.

5. A high-temperature aging-resistant PCB board according to claim 1, characterized in that: The cooling plate (1) includes a bottom shell (14), a top shell (15), a baffle plate (16) and a fixing member (6). The bottom shell (14) and the top shell (15) are buckled with each other. The baffle plate (16) is vertically arranged inside the bottom shell (14) and the top shell (15), and the upper and lower two layers of the baffle plates (16) are arranged in a staggered manner. The fixing member (6) is used to fix the bottom shell (14) and the top shell (15).

6. The PCB board with high temperature aging resistance according to claim 5, characterized in that: The fixing member (6) includes a fixing ring (61) and a clamping ring (62). The fixing ring (61) is arranged on the lower end surface of the top shell (15). A fixing groove (63) for the fixing ring (61) to be embedded is arranged on the bottom shell (14). The clamping ring (62) is arranged on the outer wall of the fixing ring (61). A clamping groove (64) for the clamping ring (62) to be embedded is arranged in the fixing groove (63).

7. The high temperature aging resistant PCB board according to claim 6, characterized in that: A sealing rubber strip (17) is wound around the connection position of the bottom shell (14) and the top shell (15).

8. A heat-resistant aging PCB board according to claim 5, characterized in that: A pair of shock-absorbing strips (18) are arranged on the lower end surface of the bottom shell (14).

Images