LED lamp strip reflow soldering equipment

Abstract

The utility model discloses an LED lamp strip reflow soldering device which comprises a device body, a traction mechanism and a vacuum mechanism, the device body is provided with a heating temperature area and a feeding channel penetrating through the heating temperature area, the heating temperature area is provided with an upper heating mechanism, a lower heating mechanism and a heat insulation mechanism, the upper heating mechanism is located above the feeding channel, and the lower heating mechanism is located above the heat insulation mechanism. The heat insulation mechanism is arranged on the equipment body and located between the upper heating mechanism and the feeding channel and can shield the feeding channel so as to isolate high temperature generated by the upper heating mechanism from the feeding channel, the lower heating mechanism is located below the feeding channel and comprises a telescopic mechanism and a plurality of soaking copper plates, and the telescopic mechanism drives the soaking copper plates to be away from the LED lamp strip. The traction mechanism is arranged at the end, close to the heating temperature area, of the support, and the vacuum mechanism is arranged at the end, away from the traction mechanism, of the equipment body and adsorbs the LED lamp strip so as to be matched with the traction mechanism to straighten the LED lamp strip, and continuous high-temperature damage to the LED lamp strip in a stagnant state is avoided.

Description

Technical Field

[0001] The utility model relates to the field of LED circuit board welding equipment, in particular to an LED light strip reflow soldering equipment. Background Art

[0002] An LED light is a semiconductor chip with an electrode that emits light. The PCB and chip of an LED light strip are typically soldered using a reflow oven. A reflow oven is a type of soldering equipment used in the SMT industry. It provides an automatic and stable heating environment, melting the solder paste within the furnace chamber. This allows the pre-mounted electrical components on the LED light's PCB to be securely bonded to the PCB through the solder alloy. After soldering, the PCB needs to be cooled before removal.

[0003] However, in actual use of the existing technology, the LED light strip material is long and is a continuous flexible board in a roll, and the flexible board is continuous throughout the entire production line. Once a node on the line fails and needs to be shut down for maintenance, the reflow soldering machine must be shut down, and the reflow soldering furnace is difficult to cool down quickly, causing the LED light strip inside the reflow soldering equipment to stagnate in a high-temperature environment for too long, resulting in excessive melting of the solder joints, making the solder joints fragile and greatly reducing the welding quality. Electronic components are prone to surface oxidation in a long-term high-temperature environment, and may even react with oxides to produce welding defects such as tin exposure and red-hot welding, which seriously affect the reliability of the product and may also cause the electronic components to deteriorate and be damaged, directly causing component failure and affecting the quality of the LED light strip. Utility Model Content

[0004] The main purpose of the utility model is to provide an LED light strip reflow soldering device, which aims to solve the technical problem that the LED light strip inside the existing reflow soldering equipment may cause component failure due to stagnation in a high-temperature environment for too long, thereby affecting the quality of the LED light strip.

[0005] In order to achieve the above-mentioned purpose, the utility model proposes an LED light strip reflow soldering device, which includes an equipment body, a traction mechanism and a vacuum mechanism. The equipment body is respectively formed with a heating temperature zone and a feeding channel passing through the heating temperature zone. The heating temperature zone is provided with an upper heating mechanism, a lower heating mechanism and a heat insulation mechanism. The upper heating mechanism is located above the feeding channel. The heat insulation mechanism is arranged on the equipment body and between the upper heating mechanism and the feeding channel, and can movably block or expose the feeding channel to isolate or release the high temperature generated by the upper heating mechanism to the feeding channel. The lower heating mechanism It is located below the feeding channel and includes a telescopic mechanism and several soaking copper plates. The telescopic mechanism can movably drive the several soaking copper plates to approach or away from the LED light strip. The several soaking copper plates are used to heat the LED light strip. The traction mechanism is arranged at one end of the bracket adjacent to the heating temperature zone and is used to pull the LED light strip through the feeding channel. The vacuum mechanism is arranged at one end of the equipment body away from the traction mechanism. A plurality of vacuum orifice plates are provided on the equipment body. The vacuum mechanism absorbs the LED light strip through the holes on the vacuum orifice plate to cooperate with the traction mechanism to straighten the LED light strip.

[0006] In one embodiment of the present invention, the heat insulation mechanism includes a driving motor, a sprocket, a chain, a guide wheel, a guide rail and a first heat insulation plate. The sprocket is rotatably connected to the equipment body through a bearing, the surface of the sprocket is engaged with the chain, and the chain is fixedly connected to the first heat insulation plate. A plurality of guide wheels are fixedly connected to the middle of the first heat insulation plate, and the top of the equipment body corresponding to the position of the guide wheel is fixedly connected to the guide rail. The guide rail guides the rolling of the guide wheel. The driving motor drives the sprocket, thereby driving the chain to drive the first heat insulation plate to be movably extended and retracted between the upper heating mechanism and the equalizing copper plate, thereby movably blocking or exposing the feed channel to isolate or release the high temperature generated by the upper heating mechanism to the feed channel.

[0007] In one embodiment of the present invention, the guide wheel includes an inverted T-frame and rollers, and the rollers are rotatably connected to the two ends of the bottom of the T-frame, the T-frame is fixedly embedded in the middle of the first insulation board, and the width between the rollers is adapted to the width of the guide rail.

[0008] In one embodiment of the present invention, the lower heating mechanism includes a cylinder and a fixed frame, the fixed frame is arranged on the top of the cylinder, a second heat insulation plate is fixedly provided on the top of the fixed frame, the soaking copper plate is fixedly provided on the top of the second heat insulation plate, and an electric heating plate for generating high temperature is provided between the second heat insulation plate and the soaking copper plate, and a fixed plate is fixedly connected to the surface of the cylinder, and the bottom of the fixed plate is fixedly connected to the equipment body.

[0009] In one embodiment of the present invention, the device body is provided with a plurality of round rods for supporting the LED light strips, and the plurality of round rods are rotatably connected to the device body.

[0010] In one embodiment of the present invention, there are several soaking copper plates, and the soaking copper plates are divided into two groups and arranged side by side inside the equipment body to form two reflow soldering production lines, and the number of the soaking copper plates increases sequentially along the moving direction of the LED light strip.

[0011] In one embodiment of the present invention, the equipment body is further formed with a preheating temperature zone, the feeding channel sequentially passes through the preheating temperature zone and the heating temperature zone, the preheating temperature zone is provided with a plurality of preheating copper plates, and the preheating copper plates are used to heat the LED light strip to preheat the LED light strip.

[0012] In one embodiment of the present invention, the upper heating mechanism includes a reflow soldering table cover hinged to one end of the top of the device body, and the inner wall of the reflow soldering table cover is provided with a heating box that generates high temperature to the device body.

[0013] In one embodiment of the present utility model, the traction mechanism includes a liftable pressure rod and a first movable mechanism, the pressure rod can movably tighten or loosen the LED light strip, the first movable mechanism is slidably connected to the equipment body, and is arranged along the extension direction of the feed channel, the first movable mechanism is fixedly connected to the pressure rod, and can drive the pressure rod to slide in the feed channel, thereby driving the LED light strip to slide in the feed channel.

[0014] In one embodiment of the present invention, two positioning pieces are further provided opposite to the feeding channel, and the positioning pieces can movably press or loosen the LED light strip.

[0015] In the technical solution of this utility model, when the LED light strip reflow soldering equipment is shut down for maintenance, the traction mechanism stops pulling the LED light strip through the feed channel. The upper heating mechanism and the lower heating mechanism are always in a heating state, and the heat insulation mechanism blocks the feed channel to isolate or release the high temperature generated by the heating mechanism to the feed channel. The telescopic mechanism drives several soaking copper plates away from the LED light strip in the feed channel, reducing the temperature of the LED light strip heated by the soaking copper plates, thereby avoiding the situation where the stagnant LED light strip is damaged by continuous high temperature.

[0016] At the same time, the LED light strip material is long and is a continuous flexible plate in a roll. The vacuum mechanism is arranged at the end of the equipment body away from the traction mechanism. The vacuum mechanism absorbs the LED light strip through the holes on the vacuum orifice plate. The vacuum mechanism and the traction mechanism respectively exert force on the LED light strip, thereby straightening the LED light strip and preventing the LED light strip from contacting the descending soaking copper plate under the action of gravity.

[0017] In general, it can prevent the electronic components on the LED light strip from deteriorating and being damaged in a high temperature environment for a long time, which will directly cause component failure, affect the quality of the LED light strip, seriously affect the reliability of the product, and may also cause the electronic components to fail. At the same time, there is no need to cut the damaged LED light strip so that the LED light strip can be produced to the set length. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of the structure of the LED light strip reflow soldering equipment in the present invention;

[0020] Figure 2 This is another structural schematic diagram of the LED light strip reflow soldering equipment in the present invention;

[0021] Figure 3 This is a top view of the reflow soldering equipment for some LED lights in the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of some LED light strip reflow soldering equipment in this utility model;

[0023] Figure 5 This is a schematic structural diagram of the partial insulation mechanism of the utility model;

[0024] Figure 6This is another structural schematic diagram of the reflow soldering equipment for some LED light strips in the present invention;

[0025] Figure 7 It is an exploded schematic diagram of the lower heating mechanism in the utility model.

[0026] Description of Figure Numbers:

[0027]

[0028] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0031] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0032] In addition, in the present utility model, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text is to include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or solutions that meet both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0033] Please refer to Figures 1 to 7 The present invention proposes an LED light strip reflow soldering device 100. The LED light strip reflow soldering device 100 provided in an embodiment of the present application is now described.

[0034] The LED light strip reflow soldering device 100 includes a device body 1 , a traction mechanism 2 and a vacuum mechanism.

[0035] Specifically, the equipment body 1 is formed with a heating temperature zone 11 and a material feeding channel passing through the heating temperature zone 11 , and the heating temperature zone 11 is provided with an upper heating mechanism 111 , a lower heating mechanism 112 and a heat insulation mechanism 113 .

[0036] The upper heating mechanism 111 is located above the feeding channel. Specifically, the upper heating mechanism includes a reflow soldering table cover 1111 hinged at one end of the top of the equipment body 1. The inner wall of the reflow soldering table cover 1111 is provided with a heating box 1112 that generates high temperature to the equipment body 1.

[0037] It can be understood that the heating method of the heating box 1112 is to use a heater and a fan to continuously heat and circulate the air in the furnace. The welded parts are heated by the hot gas in the furnace, thereby achieving welding, and the heating is uniform and the temperature is stable.

[0038] The heat insulating mechanism 113 is provided in the equipment body 1 and is located between the upper heating mechanism 111 and the feed channel, and can movably block or expose the feed channel to isolate or release the high temperature generated by the upper heating mechanism 111 to the feed channel.

[0039] Specifically, the heat insulation mechanism 113 includes a driving motor, a sprocket, a chain 1133, a guide wheel 1134, a guide rail 1135 and a first heat insulation plate 1136. The sprocket is rotatably connected to the equipment body 1 through a bearing. The surface of the sprocket is engaged with the chain 1133, and the chain 1133 is fixedly connected to the first heat insulation plate 1136. A plurality of guide wheels 1134 are fixedly connected to the middle of the first heat insulation plate 1136. A guide rail 1135 is fixedly connected to the top of the equipment body 1 corresponding to the position of the guide wheel 1134. The guide rail 1135 guides the rolling of the guide wheel 1134. The driving motor drives the sprocket, thereby driving the chain 1133 to drive the first heat insulation plate 1136 to be movably extended and retracted between the upper heating mechanism 111 and the heat-averaging copper plate 1122, thereby movably blocking or exposing the feed channel to isolate or release the high temperature generated by the upper heating mechanism 111 to the feed channel.

[0040] Furthermore, the guide wheel 1134 includes an inverted T-frame and rollers, and the rollers are rotatably connected to the two ends of the bottom of the T-frame. The T-frame is fixedly embedded in the middle of the first insulation board 1136, and the width between the rollers is adapted to the width of the guide rail 1135.

[0041] It can be understood that by setting the guide wheel 1134 and the guide rail 1135, the first heat insulation board 1136 can be smoothly moved between the heating box 1112 and the heat-saturating copper plate 1122, thereby effectively isolating the high temperature generated by the heating box 1112 from the LED light strip.

[0042] In the present invention, the lower heating mechanism 112 is located below the feeding channel and includes a telescopic mechanism and a plurality of soaking copper plates 1122. The telescopic mechanism can movably drive the plurality of soaking copper plates 1122 toward or away from the LED light strip, and the plurality of soaking copper plates 1122 are used to heat the LED light strip.

[0043] Specifically, the lower heating mechanism 112 includes a cylinder 1123 and a fixed frame 1124. The fixed frame 1124 is arranged at the top of the cylinder 1123. A second heat insulation plate 1125 is fixedly provided on the top of the fixed frame 1124. A heat-equalizing copper plate 1122 is fixedly provided on the top of the second heat insulation plate 1125. An electric heating plate 1126 for generating high temperature is provided between the second heat insulation plate 1125 and the heat-equalizing copper plate 1122. A fixed plate 1127 is fixedly connected to the surface of the cylinder 1123, and the bottom of the fixed plate 1127 is fixedly connected to the equipment body 1.

[0044] It can be understood that when in use, the utility model first passes the LED light strip through the upper heating mechanism and the lower heating mechanism 112, and then the LED light strip is pulled, and at the same time the heating box 1112 and the electric heating plate 1126 are powered on, the heating box 1112 is located at the top of the LED light strip to heat the surface of the LED light strip, and at the same time the electric heating plate 1126 is located at the bottom of the LED light strip, and the heat-averaging copper plate 1122 is heated by the electric heating plate 1126, and the temperature is evenly distributed through the heat-averaging copper plate 1122, so that the heat-averaging copper plate 1122 can evenly transfer heat to the bottom of the LED light strip, thereby performing a welding operation on the LED light strip.

[0045] It is understandable that the second heat insulating plate 1125 and the fixing frame 1124 can be provided to prevent the temperature from being transferred downwards and causing damage to the cylinder 1123 .

[0046] Furthermore, a second support frame is fixedly connected to the top of the cylinder 1123, and a support plate is fixedly connected to the surface of the second support frame. The second support frame and the support plate are both fixedly connected to the bottom of the fixed frame 1124. The middle parts of both ends of the fixed plate 1127 are respectively fixedly connected to support vertical rods to support the support plate when the support plate is in the lowest position.

[0047] When the machine needs to be shut down for maintenance, the driving motor drives the sprocket to rotate, and the sprocket drives the first heat insulation plate 1136 to transmit through the chain 1133, so that the first heat insulation plate 1136 moves from the unheated area to the heated welding area, that is, the first heat insulation plate 1136 moves to the position between the heating box 1112 and the heat-equalizing copper plate 1122, thereby isolating the high temperature generated by the heating box 1112, and at the same time, the cylinder 1123 drives the fixing frame 1124 to move downward through the second support frame and the support plate, and then the fixing frame 1124 drives the electric heating plate 1126 and the heat-equalizing copper plate 1122 to move downward through the second heat insulation plate 1125, changing the distance between the heat-equalizing copper plate 1122 and the LED light strip, that is, reducing the temperature of the LED light strip heated by the heat-equalizing copper plate 1122, thereby avoiding the situation where the stagnant LED light strip is damaged by continuous high temperature.

[0048] Specifically, the traction mechanism 2 is arranged at one end of the bracket adjacent to the heating temperature zone 11, and is used to pull the LED light strip through the feeding channel. The vacuum mechanism is arranged at the end of the equipment body 1 away from the traction mechanism 2. A plurality of vacuum orifice plates 31 are provided on the equipment body 1. The vacuum mechanism absorbs the LED light strip through the holes on the vacuum orifice plates 31 to cooperate with the traction mechanism 2 to straighten the LED light strip.

[0049] Furthermore, the traction mechanism 2 includes a liftable pressure rod 21 and a first movable mechanism 22. The pressure rod 21 can movably tighten or loosen the LED light strip. The first movable mechanism 22 is slidably connected to the equipment body 1 and is arranged along the extension direction of the feed channel. The first movable mechanism 22 is fixedly connected to the pressure rod 21 and can drive the pressure rod 21 to slide in the feed channel, thereby driving the LED light strip to slide in the feed channel.

[0050] Furthermore, the LED light strip reflow soldering device 100 further includes two positioning pieces 5 arranged relative to the feeding channel, and the positioning pieces 5 can movably press or loosen the LED light strip.

[0051] It can be understood that the LED light strip material is long and is a flexible plate in a continuous roll. The vacuum mechanism is arranged at the end of the equipment body 1 away from the traction mechanism 2. The vacuum mechanism adsorbs the LED light strip through the holes on the vacuum orifice plate 31. The vacuum mechanism and the traction mechanism 2 respectively apply force to the LED light strip, thereby cooperating to straighten the LED light strip and prevent the LED light strip from contacting the descending heat-absorbing copper plate 1122 under the action of gravity. In addition, by providing a positioning piece 5, the LED light strip can be temporarily pressed each time the traction mechanism 2 pulls the LED light strip to the discharge port.

[0052] Specifically, the vacuum mechanism may be a high-pressure blower.

[0053] In summary, when the LED light strip reflow soldering equipment 100 is shut down for maintenance, the traction mechanism 2 stops pulling the LED light strip through the feed channel. The upper heating mechanism 111 and the lower heating mechanism 112 are always in a heating state. The heat insulation mechanism 113 blocks the feed channel to isolate or release the high temperature generated by the heating mechanism into the feed channel. The telescopic mechanism drives the plurality of soaking copper plates 1122 away from the LED light strip in the feed channel, reducing the temperature of the LED light strip heated by the soaking copper plates 1122, thereby preventing the stagnant LED light strip from being damaged by continuous high temperature.

[0054] In general, it can prevent the electronic components on the LED light strip from deteriorating and being damaged in a high temperature environment for a long time, which will directly cause component failure, affect the quality of the LED light strip, seriously affect the reliability of the product, and may also cause the electronic components to fail. At the same time, there is no need to cut the damaged LED light strip so that the LED light strip can be produced to the set length.

[0055] Furthermore, the device body 1 is provided with a plurality of round rods 4 for supporting the LED light strips, and the plurality of round rods 4 are rotatably connected to the device body 1 .

[0056] It is understandable that the round rod 4 can further assist the LED light strip to be located in the feeding channel, thereby preventing the LED light strip from contacting the descending soaking copper plate 1122 under the action of gravity.

[0057] In the present invention, there are several soaking copper plates 1122, and the several soaking copper plates 1122 are divided into two groups and arranged side by side inside the equipment body 1 to form two reflow soldering production lines. The power of the several soaking copper plates 1122 increases successively along the moving direction of the LED light strip.

[0058] It can be understood that the two reflow soldering production lines are arranged in parallel in the same device body 1 and can be operated independently, so that the overall energy consumption of the LED light strip reflow soldering device 100 is reduced and more energy-efficient.

[0059] In the present invention, the equipment body 1 is also formed with a preheating temperature zone 13, and the feeding channel passes through the preheating temperature zone 13 and the heating temperature zone 11 in sequence. The preheating temperature zone 13 is provided with several preheating copper plates, which are used to heat the LED light strip to preheat the LED light strip.

[0060] It is understandable that the LED light strip is preheated to a set temperature in the preheating temperature zone 13 to reduce thermal stress caused by temperature difference and activate the flux in the solder paste so that the solid solder particles in the solder paste melt evenly.

[0061] The above are only preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An LED light strip reflow soldering device (100), used for soldering LED light strips, characterized in that: The LED light strip reflow soldering device (100) comprises: The device body (1) is provided with a heating temperature zone (11) and a feeding channel (12) passing through the heating temperature zone (11), the heating temperature zone (11) is provided with an upper heating mechanism (111), a lower heating mechanism (112) and a heat insulating mechanism (113), the upper heating mechanism (111) is located above the feeding channel (12), and the heat insulating mechanism (113) is provided on the device body (1) and is located between the upper heating mechanism (111) and the feeding channel (12). The lower heating mechanism (112) is located below the feeding channel (12) and comprises a telescopic mechanism and a plurality of soaking copper plates (1122). The telescopic mechanism can movably drive the plurality of soaking copper plates (1122) to move closer to or away from the LED light strip. The plurality of soaking copper plates (1122) are used to heat the LED light strip. A traction mechanism (2), the traction mechanism (2) being arranged at one end of the bracket adjacent to the heating temperature zone (11) and being used for traction of the LED light strip through the feeding channel (12); and A vacuum mechanism (3) is provided at one end of the device body (1) away from the traction mechanism (2), and a plurality of vacuum orifice plates (31) are provided on the device body (1). The vacuum mechanism (3) absorbs the LED light strip through the holes (32) on the vacuum orifice plates (31) to cooperate with the traction mechanism (2) to straighten the LED light strip.

2. The LED light strip reflow soldering device (100) according to claim 1, characterized in that: The heat insulation mechanism (113) includes a driving motor, a sprocket, a chain (1133), a guide wheel (1134), a guide rail (1135) and a first heat insulation board (1136). The sprocket is rotatably connected to the device body (1) through a bearing. The surface of the sprocket is engaged with the chain (1133), and the chain (1133) is fixedly connected to the first heat insulation board (1136). A plurality of guide wheels (1134) are fixedly connected to the middle of the first heat insulation board (1136). The device body (1) corresponds to the guide wheel (11 The guide rail (1135) is fixedly connected to the top of the position 34), and the guide rail (1135) guides the rolling of the guide wheel (1134). The drive motor drives the sprocket, thereby driving the chain (1133) to drive the first heat insulation plate (1136) to be movably extended and retracted between the upper heating mechanism (111) and the heat-equalizing copper plate (1122), thereby movably covering or exposing the feed channel (12) to isolate or release the high temperature generated by the upper heating mechanism (111) to the feed channel (12).

3. The LED light strip reflow soldering device (100) according to claim 2, characterized in that: The guide wheel (1134) includes an inverted T-shaped frame and rollers, and the rollers are rotatably connected to the two ends of the bottom of the T-shaped frame. The T-shaped frame is fixedly embedded in the middle of the first heat insulation board (1136), and the width between the rollers is adapted to the width of the guide rail (1135).

4. The LED light strip reflow soldering device (100) according to claim 1, characterized in that: The lower heating mechanism (112) comprises a cylinder (1123) and a fixing frame (1124), wherein the fixing frame (1124) is arranged on the top of the cylinder (1123), a second heat insulation plate (1125) is fixedly provided on the top of the fixing frame (1124), the top of the second heat insulation plate (1125) is fixedly provided with the heat-equalizing copper plate (1122), and an electric heating plate (1126) for generating high temperature is provided between the second heat insulation plate (1125) and the heat-equalizing copper plate (1122), and a fixing plate (1127) is fixedly connected to the surface of the cylinder (1123), and the bottom of the fixing plate (1127) is fixedly connected to the device body (1).

5. The LED light strip reflow soldering device (100) according to claim 4, characterized in that: The device body (1) is provided with a plurality of round rods (4) for supporting the LED light strips, and the plurality of round rods (4) are rotatably connected to the device body (1).

6. The LED light strip reflow soldering device (100) according to any one of claims 1 to 5, characterized in that: The number of the soaking copper plates (1122) is several, and the several soaking copper plates (1122) are divided into two groups and arranged side by side inside the device body (1) to form two reflow soldering production lines, and the several soaking copper plates (1122) are increased in sequence along the moving direction of the LED light strip.

7. The LED light strip reflow soldering device (100) according to any one of claims 1 to 5, characterized in that: The device body (1) is further formed with a preheating temperature zone (13), the feeding channel (12) sequentially passes through the preheating temperature zone (13) and the heating temperature zone (11), and the preheating temperature zone (13) is provided with a plurality of preheating copper plates, which are used to heat the LED light strip to preheat the LED light strip.

8. The LED light strip reflow soldering device (100) according to any one of claims 1 to 5, characterized in that: The upper heating mechanism (111) comprises a reflow soldering platform cover (1111) hinged to one end of the top of the device body (1), and an inner wall of the reflow soldering platform cover (1111) is provided with a heating box (1112) for generating high temperature to the device body (1).

9. The LED light strip reflow soldering device (100) according to any one of claims 1 to 5, characterized in that: The traction mechanism (2) includes a liftable pressure rod (21) and a first movable mechanism (22), wherein the pressure rod (21) can movably press or release the LED light strip, and the first movable mechanism (22) is slidably connected to the device body (1) and is arranged along the extension direction of the feed channel (12). The first movable mechanism (22) is fixedly connected to the pressure rod (21) and can drive the pressure rod (21) to slide in the feed channel (12), thereby driving the LED light strip to slide in the feed channel (12).

10. The LED light strip reflow soldering device (100) according to any one of claims 1 to 5, characterized in that: It also includes two positioning pieces (5) arranged relative to the feeding channel (12), and the positioning pieces (5) can movably press or release the LED light strip.

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