Square cutting machine

Abstract

The utility model discloses a square cutting machine which comprises a silicon rod bearing device, the silicon rod bearing device comprises a seat body, the square cutting machine further comprises a cut-through detection mechanism used for detecting vibration of a cut silicon rod and / or the position of a cutting line, and the cut-through detection mechanism is arranged on the seat body. In the embodiment of the utility model, whether the silicon rod is cut through or not can be automatically judged through the cut-through detection mechanism in the square cutting process of the silicon rod, so as to ensure that the edge peeling is performed after the silicon rod is cut through, and the conditions of equipment failure shutdown, silicon rod collision, equipment hardware deformation and the like caused by continuous edge peeling execution when the silicon rod is not cut through can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon rod cutting, in particular to a square cutting machine. Background Art

[0002] After the silicon rod is drawn, it needs to go through processes such as cutting, squaring, and slicing. The squaring process is to remove the edges and skin, leaving a square or rectangular silicon rod for subsequent slicing.

[0003] Currently, silicon ingots are typically squared using a squarer. After the squarer finishes cutting, some ingots may not be completely cut through, or may have already been cut through. Continuing to trim the lower edge of the ingot when the ingot is not completely cut through can cause equipment downtime, and in severe cases, can cause the ingot to collide and the equipment hardware to deform. If the ingot is already completely cut through, but the squarer fails to recognize this and continues to operate, effectively wasting processing time, increasing wire usage, and increasing the cost of the squaring process.

[0004] Therefore, how to automatically determine whether the silicon rod is cut through during the squaring process is an urgent problem that needs to be solved. Utility Model Content

[0005] The utility model provides a square cutting machine, aiming to solve the technical problem of how to automatically judge whether a silicon rod is cut through during the square cutting process in the prior art.

[0006] An embodiment of the present utility model provides a square cutting machine, which includes a silicon rod supporting device, the silicon rod supporting device includes a base body, and the square cutting machine also includes a cutting-through detection mechanism for detecting the vibration of the cut silicon rod and / or the position of the cutting line, and the cutting-through detection mechanism is arranged on the base body.

[0007] Optionally, the base includes an intermediate base for supporting the silicon rod, and the intermediate base has a top surface and side walls.

[0008] Optionally, the cut-through detection mechanism includes a vibration sensor, and the vibration sensor is provided with a probe for contacting the bottom end surface of the silicon rod.

[0009] Optionally, the vibration sensor is mounted on a side wall of the intermediate base, and / or a mounting groove is provided on a top surface of the intermediate base, and the vibration sensor is mounted in the mounting groove.

[0010] Optionally, the minimum distance between the mounting groove and the edge of the top surface of the intermediate base is greater than or equal to 5 mm.

[0011] Optionally, the cut-through detection mechanism includes a proximity sensor for detecting the position of the cutting line.

[0012] Optionally, the proximity sensor is mounted on the side wall;

[0013] The distance between the center of the proximity sensor and the top surface of the intermediate base is greater than or equal to 20 mm and less than or equal to 60 mm.

[0014] Optionally, the square cutting machine further includes a switch for controlling whether the cut-through detection mechanism is turned on, and the switch is electrically connected to the cut-through detection mechanism.

[0015] Optionally, the square cutting machine further comprises a control module for controlling whether the cutting line moves, and the control module is electrically connected to the cutting-through detection mechanism.

[0016] Optionally, the cut-through detection mechanism includes a vibration sensor and a proximity sensor, and the control module is electrically connected to both the vibration sensor and the proximity sensor.

[0017] In the embodiment of the present invention, the vibration of the silicon rod being cut and / or the position of the cutting line can be detected in real time by the cut-through detection mechanism, so as to determine whether the silicon rod is being cut by the cutting line and / or whether the cutting line is located at a set position below the silicon rod based on the vibration of the silicon rod, and further determine whether the silicon rod is cut through. In summary, the cut-through detection mechanism can automatically determine whether the silicon rod is cut through during the silicon rod squaring process, so as to ensure that the lower edge peeling is performed only after the silicon rod is cut through, and can avoid equipment failure shutdown, silicon rod collision and equipment hardware deformation caused by continuing to perform the lower edge peeling when the silicon rod is not cut through. In addition, after the cut-through detection mechanism determines that the silicon rod is cut through, the cutting operation will be stopped immediately to avoid over-cutting, reduce the line consumption and time consumption caused by not stopping the machine after the silicon rod has been cut through, and further reduce the cutting time on the basis of ensuring the cut-through, improve the cutting efficiency, and thus improve the processing efficiency of the squaring machine.

[0018] In addition, by using two different types of sensors, a vibration sensor and a proximity sensor, to jointly determine whether the silicon rod has been cut through, inaccurate detection or even misjudgment caused by a single sensor can be avoided, thereby improving the accuracy of detection. Moreover, when one of the sensors fails, the other sensor can still continue to operate, ensuring the operational reliability of the cut-through detection mechanism.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic structural diagram of a cut-through detection mechanism and a base provided in an embodiment of the present utility model;

[0021] Figure 2A schematic structural diagram of a seat body of another cut-through detection mechanism provided in an embodiment of the present utility model.

[0022] Reference numerals:

[0023] 1-vibration sensor, 2-proximity sensor, 3-base, 31-middle base, 311-top surface, 312-side wall, 313-installation groove, 32-side skin support rod, 4-silicon rod, 41-bottom end surface, 5-cutting line. DETAILED DESCRIPTION

[0024] The following describes exemplary embodiments of the present invention in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0025] After the square cutting machine finishes cutting, there are situations where the steel wire is not cut through, the steel wire is already cut through, and the steel wire is just cut through. The above three situations all exist objectively in actual production. The main influencing factors include: different batches of steel wire, steel wire from different manufacturers, differences in different equipment, differences in different procedures, differences in the sizes of silicon rods processed, etc. These influencing factors are completely unavoidable.

[0026] If the cutting is not complete, continuing to perform the lower edge peeling operation will cause the equipment to malfunction and shut down. In severe cases, it will cause the silicon rod to collide and the equipment hardware to deform. If the cutting has already been completed, since the square cutting machine does not recognize that the cutting has been completed, the equipment continues to run, which will waste effective processing time, increase the amount of cutting wire used, and increase the cost of the square cutting process.

[0027] Therefore, how to automatically determine whether a silicon ingot has been cut through during the silicon ingot squaring process is an urgent problem that needs to be solved. To address this problem, the present invention provides a cut-through detection mechanism, a silicon ingot support device, and a square cutter. The following describes these cut-through detection mechanisms, silicon ingot support device, and square cutter in detail.

[0028] Reference Figure 1 and Figure 2 An embodiment of the utility model discloses a square cutting machine, including a silicon rod supporting device, the silicon rod supporting device including a base body 3, and the square cutting machine also includes a cutting-through detection mechanism for detecting the vibration of the cut silicon rod 4 and / or the position of the cutting line 5, and the cutting-through detection mechanism is arranged on the base body 3.

[0029] The square cutter is used to cut silicon rods 4, and the square cutter includes a cutting line 5. The base 3 is used to support the silicon rods 4 to be cut. The square cutter has a cutting position and a loading position. The cutting position is a specific position that supports the silicon rods when being cut by the cutting line 5. The loading position is the placement position of the silicon rods 4 to be cut. The loading position can detect the edge line and adjust the angle of the silicon rods. The square cutter includes a base 3 located at the cutting position and a base 3 located at the loading position. The cut-through detection mechanism can be set on the base 3 at the cutting position, and the cut-through detection mechanism can also be set on the base 3 at the loading position. The base 3 at the loading position can move to the cutting position. The cut-through detection mechanism can also be set on both the base 3 at the cutting position and the base 3 at the loading position. The cut-through detection mechanism can be set on the surface of the base 3 or embedded in the base 3.

[0030] The cut-through detection mechanism may include a first sensor and / or a second sensor, wherein the first sensor is used to detect the vibration of the cut silicon rod 4, and the second sensor is used to detect the position of the cutting line 5. In one embodiment, the cut-through detection mechanism includes only at least one first sensor. In one embodiment, the cut-through detection mechanism includes only at least one second sensor. In one embodiment, the cut-through detection mechanism includes at least one first sensor and at least one second sensor. The number of first sensors may be one, two, etc. The number of second sensors may be one, two, three, four, etc.

[0031] When the cutting line 5 cuts the silicon rod 4, the silicon rod 4 is placed vertically. The first sensor can be used to contact the cut silicon rod 4, and the first sensor is preferably used to contact the bottom end surface 41 of the cut silicon rod 4. The first sensor can detect the vibration of the cut silicon rod 4. The vibration of the silicon rod 4 when it is cut by the cutting line 5 is different from the vibration of the silicon rod 4 when it is not cut. Therefore, by detecting the vibration of the silicon rod 4, it is possible to detect whether the silicon rod 4 is being cut by the cutting line 5. If it is detected that the silicon rod 4 is not cut by the cutting line 5, it means that the cutting line 5 has been separated from the silicon rod 4 and the silicon rod 4 has been cut through. If it is detected that the silicon rod 4 is being cut by the cutting line 5, it means that the silicon rod 4 has not been cut through. Therefore, by detecting the vibration of the cut silicon rod 4 by the first sensor, it can be determined whether the silicon rod 4 has been cut through.

[0032] When the cutting line 5 cuts the silicon rod 4, the cutting line 5 enters from the upper end of the silicon rod 4 and gradually cuts downward until the cutting line 5 detaches from the silicon rod 4 from the lower end of the silicon rod 4. The second sensor is located below the silicon rod 4 being cut, and the second sensor can detect the position of the cutting line 5. The position of the cutting line 5 detected by the second sensor can determine whether the cutting line 5 is located at the set position below the silicon rod 4. If the cutting line 5 is located at the set position below the silicon rod 4, it means that the silicon rod 4 has been cut through. If the cutting line 5 has not reached the set position below the silicon rod 4, it means that the silicon rod 4 has not been cut through. Among them, the set position can be set according to actual needs, and the set position can be 20mm-60mm below the silicon rod 4.

[0033] In summary, the cut-through detection mechanism can determine whether the silicon rod 4 has been cut through. If the silicon rod 4 is cut through, a signal is sent to the square cutter to stop the cutting operation and proceed to the next step. If the silicon rod 4 is not cut through, the cutting operation will continue until the silicon rod 4 is cut through.

[0034] In the embodiment of the present invention, the vibration of the silicon rod 4 being cut and / or the position of the cutting line 5 can be detected in real time by the cut-through detection mechanism, so as to determine whether the silicon rod 4 is being cut by the cutting line 5 and / or whether the cutting line 5 is located at a set position below the silicon rod 4 based on the vibration of the silicon rod 4, and further determine whether the silicon rod 4 is cut through. In summary, the cut-through detection mechanism can automatically determine whether the silicon rod 4 is cut through during the squaring process, so as to ensure that the lower edge peeling is performed only after the silicon rod 4 is cut through, and can avoid the equipment failure shutdown, silicon rod collision and equipment hardware deformation caused by continuing to perform the lower edge peeling when the silicon rod 4 is not cut through.

[0035] Currently, factors that affect the efficiency of square cutting machines include: the need to manually stop the machine for incomplete cutting or simply cutting material directly; and the need to waste time by continuing to operate the machine when the silicon ingot 4 is actually cut through but the program is not completed. In the present embodiment, the cutting operation is immediately stopped after the cut-through detection mechanism determines that the silicon ingot 4 is cut through, avoiding overcutting and reducing the wire and time consumption caused by not stopping the machine after the cut-through has been made. This reduces the cutting time while ensuring the cut-through, improves cutting efficiency, and thus improves the processing efficiency of the square cutting machine.

[0036] In a preferred embodiment of the present invention, detecting the vibration of the cut silicon rod includes detecting the vibration displacement and / or vibration velocity and / or vibration acceleration of the silicon rod 4 .

[0037] In one embodiment, detecting the vibration of the cut silicon rod includes detecting the vibration displacement of the silicon rod 4. In one embodiment, detecting the vibration of the cut silicon rod includes detecting the vibration velocity of the silicon rod 4. In one embodiment, detecting the vibration of the cut silicon rod includes detecting the vibration acceleration of the silicon rod 4. Preferably, detecting the vibration of the cut silicon rod includes detecting the vibration displacement, vibration velocity and vibration acceleration of the silicon rod 4. The vibration displacement, vibration velocity and vibration acceleration respectively reflect the vibration conditions of the silicon rod 4 from different angles. By comprehensively analyzing multiple parameters such as vibration displacement, vibration velocity and vibration acceleration, the accuracy of judging whether the silicon rod 4 is cut through can be improved.

[0038] The vibration displacement, vibration velocity, and / or vibration acceleration of the silicon rod 4 when it is cut by the cutting line 5 are different from the vibration displacement, vibration velocity, and / or vibration acceleration of the silicon rod 4 when it is not cut. Therefore, by detecting the vibration displacement, vibration velocity, and / or vibration acceleration of the silicon rod 4, it is possible to detect whether the silicon rod 4 is being cut by the cutting line 5. It should be noted that as long as the silicon rod 4 is periodically cut by the cutting line 5, the vibration value will show periodic regular changes. Once the silicon rod is cut through, this periodic vibration will gradually disappear. The vibration value includes the vibration displacement, vibration velocity, and / or vibration acceleration.

[0039] In a preferred embodiment of the present invention, the base 3 includes a central base 31 for supporting the silicon rods 4. The central base 31 has a top surface 311 and sidewalls 312. The top surface 311 is configured to contact the bottom end of the cut silicon rods 4. The base 3 also includes a plurality of side skin support rods 32 surrounding the central base 31, with the central base 31 located between the side skin support rods 32.

[0040] In a preferred embodiment of the present invention, the first sensor is a vibration sensor 1 , that is, the cut-through detection mechanism includes the vibration sensor 1 , and the vibration sensor 1 is provided with a probe for contacting the bottom end surface 41 of the silicon rod 4 .

[0041] The vibration sensor 1 is a sensor used to monitor real-time vibration magnitude. In one embodiment, the vibration sensor 1 is used to detect the vibration displacement of the silicon rod 4. In one embodiment, the vibration sensor 1 is used to detect the vibration velocity of the silicon rod 4. In one embodiment, the vibration sensor 1 is used to detect the vibration acceleration of the silicon rod 4. Preferably, the vibration sensor 1 is used to detect the vibration displacement, vibration velocity, and vibration acceleration of the silicon rod 4.

[0042] The process of using the vibration sensor 1 to detect whether the silicon rod is cut through may include:

[0043] The square cutting machine is normally loaded and cut. When the cutting depth reaches a first preset depth, the vibration sensor 1 is controlled to start vibration measurement. After that, the vibration value detected by the vibration sensor 1 is obtained every first preset time. When the detected vibration value is very small or disappears, a comprehensive judgment is made in combination with the real-time cutting depth to conclude whether the silicon rod 4 is cut through. After the silicon rod 4 is cut through, a signal is promptly sent to stop cutting.

[0044] When the vibration value detected by the vibration sensor 1 is very small or disappears, and the real-time cutting depth is greater than the second preset depth, it is determined that the silicon rod 4 has been cut through. The second preset depth is greater than the first preset depth. The first preset depth, the first preset time, and the second preset depth can be set according to actual needs. The first preset depth can be 90% of the total length of the silicon rod, the first preset time can be 10 seconds, and the second preset depth can be 98% of the total length of the silicon rod.

[0045] Preferably, after the vibration value detected by the vibration sensor 1 is very small or disappears, a second preset time passes and the vibration value detected by the vibration sensor 1 remains very small or disappears before the determination of cut-through is made. This avoids misjudgment caused by a sudden slowdown or momentary pause in cutting speed, thereby reducing detection errors and improving detection accuracy. The second preset time can be set according to actual needs and can be 10 seconds.

[0046] When the probe contacts the bottom end surface 41 of the silicon rod 4, it can avoid affecting the cutting line 5, ensuring a smooth cutting process. Furthermore, the vertical vibration amplitude of the silicon rod 4 is typically large, so when the probe contacts the bottom end surface 41 of the silicon rod 4, it is more conducive to detecting the vibration of the silicon rod 4. Furthermore, the direct contact of the probe with the bottom end surface of the silicon rod 4 in the vibration sensor 1 can reduce signal attenuation and detection errors caused by indirect detection, thereby improving detection accuracy.

[0047] The vibration sensor 1 is mounted on the side wall 312 of the intermediate base 31 , and / or a mounting groove 313 is defined on the top surface 311 of the intermediate base 31 , and the vibration sensor 1 is mounted in the mounting groove 313 .

[0048] The middle base 31 preferably has four side walls 312. When there is only one vibration sensor 1, one vibration sensor 1 is installed on one of the side walls 312. At this time, the vibration sensor 1 is located between the side support rod 32 and the middle base 31. The shape of the mounting groove 313 can be circular, square, etc. When installing the vibration sensor 1, different installation methods can be used, such as screw fixing, adhesive installation, magnetic adsorption, etc. The setting of the mounting groove 313 can prevent the vibration sensor 1 from being affected by the external environment, such as dust, liquid and mechanical shock, which is beneficial to improving the reliability and detection accuracy of the vibration sensor 1.

[0049] In a preferred embodiment of the present invention, the minimum distance between the mounting groove 313 and the edge of the top surface 311 of the intermediate base 31 is greater than or equal to 5 mm. The minimum distance between the mounting groove 313 and the edge of the top surface 311 of the intermediate base 31 is less than half of the width or length of the intermediate base 31. The minimum distance between the mounting groove 313 and the edge of the top surface 311 of the intermediate base 31 can be 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc. When the minimum distance between the mounting groove 313 and the edge of the top surface 311 of the intermediate base 31 is within the above range, the mounting groove 313 will not be too close to the edge of the top surface 311, which is conducive to the opening of the mounting groove 313, and the vibration sensor 1 will not be too close to the edge of the top surface 311, thereby preventing the vibration sensor 1 from being affected by the external environment.

[0050] In a preferred embodiment of the present invention, the second sensor is a proximity sensor 2 , that is, the cut-through detection mechanism includes a proximity sensor 2 for detecting the position of the cutting line 5 .

[0051] The proximity sensor 2 is used to detect the distance between the cutting line 5 and the proximity sensor, and outputs a first signal when the distance between the cutting line 5 and the proximity sensor is less than or equal to a first preset distance value. The proximity sensor 2 can be a photoelectric proximity sensor, a capacitive proximity sensor, an inductive proximity sensor, an electromagnetic proximity sensor, an eddy current proximity sensor, etc. The proximity sensor is preferably an eddy current proximity sensor. When the distance between the cutting line 5 and the proximity sensor 2 is less than or equal to the first preset distance value, it indicates that the cutting line 5 is approaching the proximity sensor 2. The first preset distance value can be determined according to different cutting conditions, and this embodiment does not limit this. When the cutting line 5 approaches the proximity sensor 2, it indicates that the cutting line 5 has separated from the silicon rod 4 and the silicon rod 4 has been cut through. When the proximity sensor 2 detects that the cutting line 5 is approaching the proximity sensor, it will output a first signal to the control system of the square cutter. The control system of the square cutter will stop cutting after receiving the first signal. The first signal can be a high-level signal.

[0052] Proximity sensor 2 is located below silicon rod 4 and near the path of cutting line 5. It should be noted that when cutting line 5 approaches the proximity sensor, the minimum distance between the cutting line 5 and proximity sensor 2 is greater than zero. Proximity sensor 2 detects whether silicon rod 4 has been cut through using a non-contact method. Proximity sensor 2 does not contact silicon rod 4 or cutting line 5, and does not affect the cutting line or silicon rod, thereby ensuring a smooth cutting process. Furthermore, the proximity sensor responds promptly.

[0053] The number of proximity sensors 2 can be set according to actual needs, such as one, two, three, or four. Preferably, there are two proximity sensors 2. Parameters of the proximity sensor 2, such as detection range, sensitivity, and response time, can be adjusted according to different cutting requirements, and this embodiment does not impose any restrictions thereon.

[0054] The process of using the proximity sensor 2 to detect whether the silicon rod is cut through may include:

[0055] The square cutter is normally loaded and cut. The cutting line 5 slowly descends to cut the silicon rod 4. When the cutting line 5 descends to the end position, the wire bow is pulled. During the whole process, the proximity sensor 2 is used to determine whether the cutting line 5 has reached the set position, that is, to determine whether the cutting line 5 has reached the sensing range of the proximity sensor 2. If the cutting line 5 has reached the sensing range of the proximity sensor 2, it is determined that the silicon rod 4 has been cut through at this time, and a first signal is sent to the square cutter to stop cutting and proceed to the next step. If the cutting line 5 has not descended to the sensing range of the proximity sensor 2, the cutting will not stop, and the wire bow will continue to be pulled for the first set time or the feed will be increased by a preset length based on the end position. During the execution process, when the proximity sensor 2 senses that the cutting line 5 has reached the sensing range, the proximity sensor 2 sends a first signal to the square cutter to stop cutting and proceed to the next step. The first set time can be 0min-5min, and the preset length can be 0mm-10mm.

[0056] The vibration of the cut silicon rod 4 can be affected by external factors, such as interference from environmental vibrations, resulting in inaccurate detection of the vibration of the cut silicon rod 4. The detection accuracy of the proximity sensor is limited, and environmental interference may affect the performance of the proximity sensor. In this embodiment, two different types of detectors, a vibration sensor and a proximity sensor, are used to jointly determine whether the silicon rod 4 is cut through. This avoids inaccurate detection or even misjudgment caused by a single detector, thereby improving detection accuracy. Furthermore, if one detector fails, the other detector can continue to operate, ensuring the operational reliability of the cut-through detection mechanism.

[0057] In a preferred embodiment of the present invention, the proximity sensor 2 is mounted on the side wall 312; along the height direction of the base 3, the distance between the center of the proximity sensor 2 and the top surface 311 of the middle base 31 is greater than or equal to 20 mm and less than or equal to 60 mm.

[0058] The intermediate base 31 preferably has four sidewalls 312. When there is one proximity sensor 2, one proximity sensor 2 is mounted on one of the sidewalls 312. When there are two proximity sensors 2, two proximity sensors 2 are mounted on two of the sidewalls 312, respectively, with the two proximity sensors 2 positioned opposite each other. The distance between the center of the proximity sensor 2 and the top surface 311 of the intermediate base 31 can be 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, etc. When the distance between the center of the proximity sensor 2 and the top surface 311 of the intermediate base 31 is within the above range, the cutting line 5 can be completely separated from the silicon rod 4 when it reaches the sensing range of the proximity sensor, and excessive downward movement of the cutting line 5, resulting in overcutting, can be avoided.

[0059] In a preferred embodiment of the present invention, the squarer further includes a switch for controlling whether the cut-through detection mechanism is activated, the switch being electrically connected to the cut-through detection mechanism. The squarer further includes a control module for controlling whether the cutting line is in motion, the control module being electrically connected to the cut-through detection mechanism. The cut-through detection mechanism includes a vibration sensor 1 and a proximity sensor 2, the control module being electrically connected to both the vibration sensor 1 and the proximity sensor 2.

[0060] Among them, the control module can be a controller in the control system of the square cutting machine. The control module can be electrically connected to the switch to control the on and off of the switch, thereby controlling whether the cut-through detection mechanism is turned on. When the cut-through detection mechanism includes a vibration sensor 1 and a proximity sensor 2, when the cutting depth reaches a first preset depth, the control module can control the switch to close to control the vibration sensor 1 and the proximity sensor 2 to turn on. At this time, the vibration sensor 1 and the proximity sensor 2 start working and transmit the vibration value or signal detected by them to the control module respectively. After determining that the silicon rod 4 has been cut through, the control module can control the switch to be disconnected. At this time, the vibration sensor 1 and the proximity sensor 2 do not work. Through the setting of the switch, the working time of the cut-through detection mechanism can be controlled so that the cut-through detection mechanism only works at the end of the cutting process, eliminating unnecessary working time of the cut-through detection mechanism, thereby extending the service life of the cut-through detection mechanism.

[0061] The control module responds to the signal received by the cut-through detection mechanism to control whether the cutting line moves. When the cut-through detection mechanism includes a vibration sensor 1 and a proximity sensor 2, the control module responds to the signals received by the vibration sensor 1 and the proximity sensor 2 to control whether the cutting line moves. The control module is specifically configured to receive the vibration value detected by the vibration sensor 1 and the first signal output by the proximity sensor 2. The control module is configured to control the cutting line to stop moving when the vibration value detected by the vibration sensor 1 is very small or disappears, and the real-time cutting depth is greater than a second preset depth. The control module is configured to control the cutting line to stop moving when it receives the first signal output by the proximity sensor 2.

[0062] In other embodiments, it should be noted that those skilled in the art may also select a distance sensor to detect the distance to be detected based on the actual situation of detecting the distance between the cutting line and the sensor, and this application does not limit this.

[0063] The second sensor may also be a distance sensor, which is specifically used to detect the distance between the cutting line 5 and the distance sensor along the axial direction of the silicon rod 4 .

[0064] The number of distance sensors can be set according to actual needs, such as one, two, three, or four. The number of distance sensors is preferably two. The distance between the cutting line 5 and the distance sensor detected by the distance sensor is transmitted to the control system of the squarer. When the distance between the cutting line 5 and the distance sensor is less than or equal to a second preset distance value, it indicates that the cutting line 5 has separated from the silicon rod 4 and the silicon rod 4 has been cut through. At this time, cutting is stopped and the next step is executed. The second preset distance value is determined according to different cutting situations and is not limited in this embodiment.

[0065] The distance sensor can be a point laser sensor, which offers the advantage of high precision and is suitable for detecting fine-diameter cutting lines 5. The distance sensor detects whether the silicon rod 4 has been cut through using a non-contact method. The distance sensor does not come into contact with the silicon rod 4 or the cutting line 5, and does not affect the cutting line or the silicon rod, thereby ensuring a smooth cutting process. Furthermore, when determining whether the silicon rod 4 has been cut through based on the distance between the cutting line 5 and the distance sensor and a second preset distance value, the second preset distance value can be adjusted according to different cutting conditions, thereby adapting to different cutting situations without adjusting the distance sensor's installation position.

[0066] The process of using a distance sensor to detect whether a silicon rod is cut through may include:

[0067] The square cutter is loaded and cut normally. The cutting line 5 slowly descends to cut the silicon rod 4. The distance sensor detects the distance between the cutting line 5 and the distance sensor. The control system of the square cutter determines whether the distance between the cutting line 5 and the distance sensor is less than or equal to a second preset distance value. If so, it is determined that the silicon rod 4 has been cut through, and cutting is stopped to proceed to the next step.

[0068] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0069] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the purpose of the present invention and the claims, which are all within the protection of the present invention.

Claims

1. A square cutting machine, characterized in that: The square cutter includes a silicon rod supporting device, which includes a base body. The square cutter also includes a cut-through detection mechanism for detecting the vibration of the cut silicon rod and / or the position of the cutting line, and the cut-through detection mechanism is arranged on the base body.

2. The square cutting machine according to claim 1, characterized in that: The base body includes a middle base for supporting the silicon rods, and the middle base has a top surface and side walls.

3. The square cutting machine according to claim 2, characterized in that: The cut-through detection mechanism includes a vibration sensor, and the vibration sensor is provided with a probe for contacting the bottom end surface of the silicon rod.

4. The square cutting machine according to claim 3, characterized in that: The vibration sensor is mounted on a side wall of the intermediate base, and / or a mounting groove is provided on a top surface of the intermediate base, and the vibration sensor is mounted in the mounting groove.

5. The square cutting machine according to claim 4, characterized in that: The minimum distance between the mounting groove and the edge of the top surface of the intermediate base is greater than or equal to 5 mm.

6. The square cutting machine according to claim 2, characterized in that: The cut-through detection mechanism includes a proximity sensor for detecting the position of the cutting line.

7. The square cutting machine according to claim 6, characterized in that The proximity sensor is mounted on the side wall; The distance between the center of the proximity sensor and the top surface of the intermediate base is greater than or equal to 20 mm and less than or equal to 60 mm.

8. The square cutting machine according to claim 1, characterized in that: The square cutting machine further includes a switch for controlling whether the cut-through detection mechanism is turned on, and the switch is electrically connected to the cut-through detection mechanism.

9. The square cutting machine according to claim 1, characterized in that: The square cutting machine further comprises a control module for controlling whether the cutting line moves, and the control module is electrically connected to the cutting-through detection mechanism.

10. The square cutting machine according to claim 9, characterized in that The cut-through detection mechanism includes a vibration sensor and a proximity sensor, and the control module is electrically connected to both the vibration sensor and the proximity sensor.

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