Substrate assembly and optical module

Abstract

The utility model discloses a substrate assembly and an optical module, the substrate assembly comprises a substrate unit, the substrate unit comprises a plurality of first substrates arranged in an array, a hollow groove is arranged between adjacent first substrates, and a part of the inner wall surface of the hollow groove forms a special-shaped section of the side surface of the first substrate, the connecting parts of the adjacent first substrates can be cut to form straight sections on the side surfaces of the first substrates; the light insulation unit is formed through a mold sealing process, the light insulation unit comprises a plurality of first light insulation covers corresponding to the first substrates, each first light insulation cover comprises a first part, the first parts are connected to the upper surfaces of the corresponding first substrates, and the first parts of the first light insulation covers define a first cavity and a second cavity which are open at the upper ends and are isolated from each other. According to the utility model, the first substrates can be separated after the connection part is linearly cut by a traditional cutter, and a special-shaped section does not need to be formed by a laser cutting process, so that the defects and defects caused by laser cutting can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of laser distance measurement, in particular to a substrate assembly and an optical module. Background Art

[0002] The optical modules currently used in consumer electronics mainly include a substrate, a light emitting chip, a light receiving chip, and a light isolation structure. The light isolation structure forms multiple open and mutually spaced cavities, and the light emitting chip and the light receiving chip are respectively arranged in different cavities to avoid mutual interference. In the related art, there is a method of forming a light isolation structure through a molding process. Specifically, a molding body is first molded on the entire substrate, and then the entire substrate is cut to obtain a single substrate covered with the molding body. However, this method is usually only applicable to conventional rectangular sensors. For special-shaped sensors with rectangular curved edges, conventional cutting tools cannot cut out the curved edges, so laser cutting is required. However, laser cutting also has defects, such as low cutting efficiency for relatively thick products, rough cutting surface, and inapplicability to heat-sensitive chips, which limits its application range. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems in the prior art. To this end, the present invention provides a substrate assembly that can separate special-shaped substrates with curved sides using a conventional cutting tool.

[0004] The utility model also provides an optical module.

[0005] According to the first embodiment of the present invention, the substrate assembly includes:

[0006] A substrate unit comprising a plurality of first substrates arranged in an array, wherein connecting portions of adjacent first substrates can be cut to form straight sections on the side surfaces of the first substrates, and hollow grooves are provided between adjacent first substrates, wherein portions of inner wall surfaces of the hollow grooves form shaped sections on the side surfaces of the first substrates that are different from the straight sections;

[0007] The light isolation unit is formed by a molding process, and the light isolation unit includes a plurality of first light isolation covers corresponding to each of the first substrates. The first light isolation covers include a first portion, and the first portion is connected to the upper surface of the corresponding first substrate. The first portion of each of the first light isolation covers defines a cavity.

[0008] The substrate assembly according to the first embodiment of the present invention has at least the following beneficial effects:

[0009] Parts of adjacent first substrates remain connected, so that the substrate unit forms a whole, which is convenient for the transfer of the substrate unit and the subsequent overall molding. Parts of adjacent first substrates are separated from each other through the hollow groove, and part of the inner wall surface of the hollow groove is the special-shaped segment of the side of the first substrate. In this way, the first substrates can be separated after a straight line cutting is performed on the connection part by a traditional tool, without the need to form a special-shaped segment through a laser cutting process, thereby avoiding the shortcomings and defects brought about by the application of laser cutting.

[0010] In other embodiments of the present invention, the first light-isolating cover further includes a second portion, and the second portion extends into the hollow groove and is connected to the special-shaped section corresponding to the first substrate.

[0011] In other embodiments of the present invention, the lower end surface of the second portion is flush with the corresponding lower end surface of the first substrate, and / or the upper end surface of the second portion is flush with the corresponding upper end surface of the first portion.

[0012] In other embodiments of the present invention, the first substrate is configured to be rectangular, and the special-shaped segments are provided on at least two oppositely disposed corners of the first substrate.

[0013] In other embodiments of the present invention, the substrate assembly further includes a bottom film, which is attached to the lower surface of the substrate unit and covers each of the hollow grooves.

[0014] In other embodiments of the present invention, the substrate unit further includes an annular side frame, the side frame surrounding and forming an accommodating space, and the plurality of first substrates are located in the accommodating space and connected to the side frame.

[0015] In other embodiments of the present invention, the side frame and the plurality of first substrates are connected to form an integral structure.

[0016] In other embodiments of the present invention, the plurality of first substrates are divided into at least two columns along the length direction of the substrate assembly, and each column includes at least two first substrates.

[0017] According to the second embodiment of the present invention, the optical module includes a second substrate, a second light-isolating cover, and an optical element:

[0018] The second substrate is configured as the first substrate separated by cutting the aforementioned substrate assembly along a straight line;

[0019] The second light-isolating cover is configured as the first light-isolating cover separated by cutting the aforementioned substrate assembly along a straight line;

[0020] The optical element is connected to the upper surface of the second substrate and is located in the cavity of the second light-isolating cover.

[0021] According to the third embodiment of the present invention, the optical module includes a second substrate, a second light-isolating cover, and an optical element:

[0022] The side surface of the second substrate includes a straight section and a special-shaped section;

[0023] The second light-isolating cover is formed by a molding process, and includes a third portion and a fourth portion, wherein the third portion is connected to the upper surface of the second substrate, the fourth portion is connected to the special-shaped segment, and the third portion defines a cavity;

[0024] The optical element is connected to the upper surface of the second substrate and is located in the cavity of the second light-isolating cover.

[0025] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0027] Figure 1 Schematic diagram of a substrate assembly in an embodiment of the present utility model;

[0028] Figure 2 for Figure 1 A partial schematic diagram of the middle baseboard assembly;

[0029] Figure 3 A schematic diagram of an optical module in an embodiment of the present invention;

[0030] Figure 4 for Figure 3 A sectional view taken along the double-dashed line;

[0031] Figure 5 A schematic diagram of forming a first light shielding cover by a mold in a conventional solution;

[0032] Figure 6 FIG. 1 is a schematic diagram of forming a first light shielding cover by a mold in this embodiment.

[0033] Reference numerals:

[0034] Substrate assembly 100, hollow groove 101, first substrate 110, straight section 111, special-shaped section 112, first light-isolating cover 120, first portion 121, first cavity 121a, second cavity 121b, second portion 122, bottom film 130, side frame 140;

[0035] Optical module 200, second substrate 210, second light-isolating cover 220, third portion 221, third cavity 221a, fourth cavity 221b, fourth portion 222, light-emitting element 230, light-receiving element 240;

[0036] Mold 300 , upper mold 310 , lower mold 320 . DETAILED DESCRIPTION

[0037] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0038] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0039] In the description of this utility model, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0040] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0041] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0042] Currently, there is a relatively efficient manufacturing process for conventional rectangular sensors, which mainly includes the following steps: ① Whole board material, with multiple substrate sub-sections on the whole board; ② Molding, directly molding the whole board to form light-isolating sub-sections corresponding to each substrate sub-section; ③ Cutting, cutting the molded whole board to obtain multiple substrate units, each substrate unit including a substrate sub-section and a light-isolating sub-section; ④ Mounting the chip. In the aforementioned process, the whole board is usually cut by a tool. However, since the tool can only move in a straight line, it is not applicable to special-shaped sensors with special-shaped sections. Therefore, laser cutting is currently usually used for cutting. However, laser cutting has the disadvantages of low cutting efficiency for relatively thick products, rough cutting surface, and unsuitability for heat-sensitive chips, which also limits its application in the processing of special-shaped sensors. Based on this, the present invention proposes a substrate assembly 100 that can be cut using traditional tools.

[0043] Reference Figures 1 to 4 , shows an embodiment of the present invention, as shown in the figure, the substrate assembly 100 includes a substrate unit and a light isolation unit.

[0044] The substrate unit includes a plurality of first substrates 110, which are connected to each other. That is, the substrate unit is an integral structure, and different regions thereof constitute different first substrates 110. The first substrates 110 can be arranged in a rectangular array, for example.

[0045] In this embodiment, there is a hollow groove 101 between adjacent first substrates 110, and part of the inner wall surface of the hollow groove 101 forms a special-shaped section 112 on the side of the first substrate 110 (refer to Figure 2 , Figure 2In the figure, the shaped segment 112 covered by the second portion 122 of the first light-blocking cover 120 is indicated by relatively dense dotted lines, and the cutting trajectory of the tool, or the straight segment 111 formed on the side of the first substrate 110 after cutting, is indicated by relatively sparse dotted lines. That is, when the multiple first substrates 110 are still in the form of a substrate unit, part of the side of each first substrate 110 is already exposed, and the exposed side is a shaped structure. On the other hand, the connection parts of adjacent first substrates 110 are configured to extend in a straight line direction so that they can be cut to form the straight segment 111 on the side of the first substrate 110. That is, the other side surfaces of the first substrate 110 need to be exposed after cutting. In this way, portions of adjacent first substrates 110 (which, after cutting, will form straight sections 111 on the sides of the first substrates 110) remain connected, allowing the substrate unit to form a single entity, facilitating transfer of the substrate unit and subsequent overall molding. Portions of adjacent first substrates 110 are separated from each other by the hollow grooves 101. Therefore, the first substrates 110 can be separated by linearly cutting the connecting portions with a conventional tool, eliminating the need to form the shaped sections 120 through a laser cutting process. This avoids the shortcomings and defects associated with laser cutting. It should be noted that when preparing the substrate unit, the manufacturer of the substrate unit can use processes such as milling to form the hollow grooves 101, thereby forming the shaped sections 120, while retaining the connecting portions between adjacent first substrates 110, thereby connecting the first substrates 110 together to form the substrate unit. For example, a portion of material can be removed from the entire substrate to form the hollow grooves 101, with the remaining portion serving as the connecting portion between the first substrate 110 and the adjacent first substrates 110.

[0046] It should be noted that the special-shaped segment 112 referred to in the present invention refers to any shape different from the straight segment 111, including but not limited to an arc segment (e.g. Figure 2 arc segments in the substrate unit), broken line segments (composed of at least two non-parallel straight line segments. Although it has straight line segments, the tool can only move along the length direction or width direction of the substrate unit, and the size of the tool is usually larger than the size of the first substrate 110, so it cannot be cut and formed), wave segments, sawtooth segments and various combinations of the foregoing.

[0047] Reference Figures 2 to 4 , the light isolation unit includes a plurality of first light isolation covers 120 corresponding to each first substrate 110. For ease of understanding, Figure 2 Only the first light-isolating cover 120 corresponding to the first substrate 110 in the upper left corner is shown. For example, adjacent first light-isolating covers 120 are connected to each other, and the connection parts match the connection parts between the corresponding first substrates 110. In this way, when the tool cuts the connection parts between the first substrates 110, the connection parts between the adjacent first light-isolating covers 120 can be cut simultaneously.

[0048] Each first light-isolating cover 120 includes a first portion 121, and the first portion 121 is connected to the upper surface of the corresponding first substrate 110 (or it can be understood that the portion of the first light-isolating cover 120 located on the upper surface of the first substrate 110 is the first portion 121). Figure 3 、 Figure 4 The first portion 121 of each first light-isolating cover 120 defines a cavity with an open upper end, which is used to accommodate an optical element. In some specific embodiments, the cavity of the first portion 121 is used to accommodate an optical element, such as a light-emitting element or a light-receiving element. The optical module including the first light-isolating cover 120 is an optical module only for emitting light or an optical module only for receiving light. In other specific embodiments, the cavity of the first portion 121 is used to accommodate two optical elements, such as a light-emitting element and a light-receiving element. The optical module including the first light-isolating cover 120 can both emit light and receive light. The following mainly uses this example for explanation. Specifically, refer to Figure 2 The first portion 121 includes a first cavity 121a and a second cavity 121b, each isolated from the other. The first cavity 121a and the second cavity 121b are used to accommodate the light emitting element 230 and the light receiving element 240, respectively. The first light-blocking cover 120 is made of an opaque material, preventing the light emitting element 230 and the light receiving element 240, respectively, disposed within the first cavity 121a and the second cavity 121b, from interfering with each other. It should be noted that the number of first cavities 121a and second cavities 121b is not limited to one as shown in the figure; two or more cavities may also be provided.

[0049] It should be noted that the light-isolating unit is a molded body formed through a molding process, specifically, a thermosetting material such as epoxy resin. For example, a sensor manufacturer can mold an incoming substrate unit to obtain the substrate assembly 100 of this application, and then cut the molded substrate assembly 100 to obtain a single first substrate 110 with a first light-isolating cover 120. In other words, the straight section 111 and the shaped section 112 will be formed in the production processes of different manufacturers.

[0050] On the basis of the first embodiment, in some embodiments of the present invention, referring to Figure 2 、 Figure 4 、 Figure 6 The first light-isolating cover 120 further includes a second portion 122 connected to the first portion 121. For example, the second portion 122 and the first portion 121 are connected as an integral structure. For ease of understanding, Figure 2 、 Figure 4 In the figure, the approximate ranges of the first part 121 and the second part 122 are distinguished by dotted lines.

[0051] Among them, the second part 122 extends into the hollow groove 101 and is connected to the special-shaped segment 112 corresponding to the first substrate 110, that is, in addition to the first part 121 connected to the upper surface of the first substrate 110, the first light-isolating cover 120 in this embodiment also includes the second part 122 of the special-shaped segment 112 covering the side of the first substrate 110. It can be understood that since the straight section 111 of the first substrate 110 is formed by cutting after molding, the tool cuts the first substrate 110 and the molding body at the same time, so the straight section 111 and the edge of the corresponding part on the first light-isolating cover 120 can naturally remain consistent. However, the special-shaped segment 112 in this embodiment does not involve a cutting step. If it is necessary to make the edge of the first light-isolating cover 120 completely consistent with the special-shaped segment 112 of the first substrate 110, the corresponding mold and the first substrate 110 need to have a high matching accuracy, for example Figure 5 As shown, by injecting liquid molding material into the inner cavity of the mold 300 composed of the upper mold 310 and the lower mold 320, the first light-isolating cover 120 can be obtained after the molding material is cured (only the partial structure of the mold 300 and the first light-isolating cover 120 is shown in the figure). If the second part 122 is not provided, the upper mold 310 and the first substrate 110 need to maintain a high positioning accuracy, otherwise when the first substrate 110 is Figure 5 If the light shielding cover 120 is offset to the left, it will interfere with the mold 300. The first light shielding cover 120 of this embodiment includes a first portion 121 and a second portion 122, thereby reducing the positioning requirements between the mold 300 and the first substrate 110. For example, Figure 6 Based on the basis shown, the first substrate 110 will not cause interference problems when it is offset within the allowable range. In this way, products with arbitrary anisotropic edge segments can be efficiently and flexibly packaged and manufactured using only conventional cutting tools, which not only ensures the quality of the product, but also reduces the expenses of purchasing customized cover plates or laser cutting equipment, thereby greatly reducing production costs.

[0052] When the first light-isolating cover 120 further includes the second portion 122, in some embodiments of the present invention, Figure 6 The upper end surface of the second part 122 is flush with the upper end surface of the corresponding first part 121, so that the inner top surface of the upper mold 310 can be set to a plane, which helps to simplify the structure of the upper mold 310.

[0053] When the first light-isolating cover 120 further includes the second portion 122, in some embodiments of the present invention, Figure 6The lower end surface of the second part 122 is flush with the lower end surface of the corresponding first substrate 110. In this way, on the one hand, the upper surface of the lower mold 320 can be set to a plane, which helps to simplify the structure of the lower mold 320. On the other hand, it can increase the connection area between the second part 122 and the first substrate 110 and improve the connection strength.

[0054] On the basis of the first embodiment, in some embodiments of the present invention, referring to Figures 1 to 3 The first substrate 110 is configured to be rectangular, and at least two oppositely disposed corners of the first substrate 110 are provided with special-shaped segments 112. For example, Figure 2 Special-shaped sections 112 are provided at the upper left corner and the lower right corner of the first substrate 110 .

[0055] On the basis of the first embodiment, in some embodiments of the present invention, referring to Figure 6 The substrate assembly 100 further includes a bottom film 130, which is attached to the bottom surface of the substrate unit. For example, the bottom film 130 is attached to the bottom surface of each first substrate 110. Furthermore, the bottom film 130 can also cover each hollow groove 101, thereby preventing the molding material from leaking through the hollow groove 101 to the bottom surface of the substrate unit during the molding process. The bottom film 130 is a high-temperature resistant film to accommodate the high temperature environment during the molding process.

[0056] On the basis of the first embodiment, in some embodiments of the present invention, referring to Figure 1 、 Figure 2 The substrate unit further includes an annular side frame 140. For example, the side frame 140 is configured as a rectangle. The side frame 140 surrounds and forms a receiving space. Multiple first substrates 110 are located in the receiving space and are connected to the side frame 140. This can increase the strength of the substrate unit. It should be noted that the aforementioned connection between the first substrate 110 and the side frame 140 includes both direct and indirect connections. For example, the outermost first substrate 110 is directly connected to the side frame 140, and a hollow groove 101 is formed between the outermost first substrate 110 and the side frame 140. The inner first substrate 110 is indirectly connected to the side frame 140 through other first substrates 110.

[0057] When the substrate unit further includes an annular side frame 140 , in some embodiments of the present invention, the side frame 140 and the plurality of first substrates 110 are connected to form an integral structure.

[0058] On the basis of the first embodiment, in the embodiment of the present utility model, referring to Figure 1, multiple first substrates 110 are arranged in a rectangular array. Specifically, the multiple first substrates 110 are divided into at least two columns along the width direction of the substrate assembly 100, and each column includes at least two first substrates 110. In this way, on the one hand, it is convenient for the tool to cut along a straight line to separate each first substrate 110, and at the same time, it also enables the substrate unit to contain as many first substrates 110 as possible.

[0059] The second embodiment of the present invention further proposes an optical module 200, referring to Figure 3 、 Figure 4 , which includes a second substrate 210, a second light-isolating cover 220 and an optical element.

[0060] The second substrate 210 is configured as a first substrate 110 separated from the substrate assembly 100 of the first embodiment by cutting along a straight line along the connection portion of the adjacent first substrates 110. For example, in this embodiment, the substrate assembly 100 can be cut using a cutter. The second substrate 210 of this embodiment can be understood with reference to the first substrate 110.

[0061] Accordingly, the second light-blocking cover 220 is configured as a first light-blocking cover 120 separated by cutting the substrate assembly 100 in the first embodiment along a straight line along the connection portion of the adjacent first light-blocking cover 120. The second light-blocking cover 220 of this embodiment and the connection relationship between the second light-blocking cover 220 and the second substrate 210 can be understood with reference to the second light-blocking cover 220.

[0062] The optical elements are located within the cavity of the second light-isolating cover 220. Exemplarily, the optical elements include a light-emitting element 230 and a light-receiving element 240. The cavity of the second light-isolating cover 220 includes a third cavity 221a and a fourth cavity 221b, which are isolated from each other. The light-emitting element 230 is connected to the upper surface of the second substrate 210 and located within the third cavity 221a of the second light-isolating cover 220. The light-receiving element 240 is connected to the upper surface of the second substrate 210 and located within the fourth cavity 221b of the second light-isolating cover 220. The light-emitting element 230 can emit laser light for detection (for ease of description, referred to as outgoing light), and the light-receiving element 240 can receive laser light reflected by the object being measured (for ease of description, referred to as incident light). In this way, the substrate assembly can determine the distance to the object being measured based on relevant parameters (e.g., time difference, phase difference) between the outgoing and incident light.

[0063] The third embodiment of the present invention further proposes an optical module 200, referring to Figure 3 、 Figure 4 , which includes a second substrate 210, a second light-isolating cover 220 and an optical element.

[0064] The side surface of the second substrate 210 includes a straight section 111 and a special-shaped section 112. The special-shaped section 112 can be further an arc section. In some specific embodiments, the straight section 111 and the special-shaped section 112 are alternately arranged, such as Figure 3 As shown, the first substrate 110 is configured to be rectangular, and two oppositely disposed corners of the first substrate 110 are provided with special-shaped sections 112 , and other positions are provided with straight sections 111 .

[0065] The second light-isolating cover 220 includes a third part 221 and a fourth part 222, the third part 221 is connected to the upper surface of the second substrate 210, and the third part 221 defines a cavity with an open upper end. Exemplarily, the cavity of the third part 221 includes a third cavity 221a and a fourth cavity 221b that are isolated from each other, wherein the second light-isolating cover 220 is made of an opaque material so that the light-emitting element 230 and the light-receiving element 240 respectively arranged in the third cavity 221a and the fourth cavity 221b will not interfere with each other.

[0066] The fourth portion 222 is connected to the third portion 221. Exemplarily, the fourth portion 222 and the third portion 221 are connected to form a single integral structure through a molding process. The fourth portion 222 is connected to the shaped segment 112 of the second substrate 210. That is, in this embodiment, the second light-blocking cover 220, in addition to the third portion 221 connected to the top surface of the second substrate 210, also includes a portion covering the shaped segment 112 on the side of the second substrate 210. With reference to the foregoing, it can be understood that, by providing the fourth portion 222 covering the shaped segment 112, the positioning requirements between the mold and the second substrate 210 can be reduced during the molding process.

[0067] The optical elements are located within the cavity of the third portion 221. Exemplarily, the optical elements include a light emitting element 230 and a light receiving element 240. The light emitting element 230 is connected to the upper surface of the second substrate 210 and located within the third cavity 221a of the second light-isolating cover 220. The light receiving element 240 is connected to the upper surface of the second substrate 210 and located within the fourth cavity 221b of the second light-isolating cover 220. The light emitting element 230 can emit laser light for detection (for ease of description, referred to as outgoing light), and the light receiving element 240 can receive laser light reflected by the object being measured (for ease of description, referred to as incident light). In this way, the substrate assembly can determine the distance to the object being measured based on relevant parameters (e.g., time difference, phase difference) between the outgoing and incident light.

[0068] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A substrate assembly, characterized in that include: A substrate unit comprising a plurality of first substrates arranged in an array, wherein connecting portions of adjacent first substrates can be cut to form straight sections on the side surfaces of the first substrates, and hollow grooves are provided between adjacent first substrates, wherein portions of inner wall surfaces of the hollow grooves form shaped sections on the side surfaces of the first substrates that are different from the straight sections; The light isolation unit is formed by a molding process, and the light isolation unit includes a plurality of first light isolation covers corresponding to each of the first substrates. The first light isolation covers include a first portion, and the first portion is connected to the upper surface of the corresponding first substrate. The first portion of each of the first light isolation covers defines a cavity.

2. The substrate assembly according to claim 1, wherein: The first light-isolating cover further includes a second portion, which extends into the hollow groove and is connected to the special-shaped section corresponding to the first substrate.

3. The substrate assembly according to claim 2, wherein: The lower end surface of the second portion is flush with the corresponding lower end surface of the first substrate, and / or the upper end surface of the second portion is flush with the corresponding upper end surface of the first portion.

4. The substrate assembly according to claim 1, wherein: The first substrate is configured to be rectangular, and the special-shaped segments are provided at at least two opposite corners of the first substrate.

5. The substrate assembly according to claim 1, wherein: The substrate assembly further includes a bottom film, which is attached to the lower surface of the substrate unit and covers each of the hollow grooves.

6. The substrate assembly according to claim 1, wherein: The substrate unit further includes an annular side frame. The side frame surrounds and forms an accommodating space. The plurality of first substrates are located in the accommodating space and are connected to the side frame.

7. The substrate assembly according to claim 6, wherein: The side frame and the plurality of first substrates are connected to form an integral structure.

8. The substrate assembly according to claim 1, wherein: The plurality of first substrates are divided into at least two columns along a length direction of the substrate assembly, and each column includes at least two first substrates.

9. An optical module, characterized in that: It includes a second substrate, a second light-isolating cover and an optical element: The second substrate is configured as the first substrate separated by cutting the substrate assembly according to any one of claims 1 to 8 along a straight line; The second light-blocking cover is configured as the first light-blocking cover separated by cutting the substrate assembly according to any one of claims 1 to 8 along a straight line; The optical element is connected to the upper surface of the second substrate and is located in the cavity of the second light-isolating cover.

10. An optical module, characterized in that: It includes a second substrate, a second light-isolating cover and an optical element: The side surface of the second substrate includes a straight section and a shaped section different from the straight section; The second light-isolating cover is formed by a molding process, and includes a third portion and a fourth portion, wherein the third portion is connected to the upper surface of the second substrate, the fourth portion is connected to the special-shaped segment, and the third portion defines a cavity; The optical element is connected to the upper surface of the second substrate and is located in the cavity of the second light-isolating cover.

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