Semiconductor processing equipment

Abstract

The utility model provides semiconductor processing equipment. The semiconductor processing equipment comprises a process chamber, a base, an isolation gate and a particle absorption device, the device further comprises a first air exhaust pipeline and an air exhaust dry pump. When the isolation gate is closed, the process chamber is sealed through a sealing piece; the particle absorption device is arranged in the process chamber, and the air suction port faces the doorway; the particle absorption device is communicated to the air exhaust dry pump through a second air exhaust pipeline provided with an electromagnetic switch by virtue of an opening in the lower part of the process chamber, and pollution particles caused by aging or corrosion of the sealing element are absorbed in time by utilizing an air exhaust principle; when the wafer is being processed, the particle absorption device does not work; after the production is finished, the particle absorption device is controlled by a computer program, and starts to operate when the isolation gate is opened and closed, so that pollution particles escaping from the reaction of the sealing element are downwards pulled away from the process chamber, and the particles are prevented from being subsequently attached to the chip, thereby ensuring the yield of the chip.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing equipment, and in particular relates to semiconductor processing equipment. Background Art

[0002] The semiconductor wafer production process takes place within a process chamber, which houses a susceptor on which the wafer is placed. Chemical vapor deposition (CVD) forms a thin film on the wafer surface. During the production process, a gate mechanism separates the process chamber from the transfer chamber. This gate remains closed while the process chamber is filled with special gases used in production. These gases react with heat to form a thin film on the wafer, completing the process. After a certain period of time, the special gases are used to remove any unwanted film adhering to the chamber. Because the special gases contain fluorine, they react with the seals on the isolation gates during use, eroding them. These eroded seals can then flake off, forming contaminants. These particles can fall onto the wafer surface and adhere to the chips, impacting chip yield. Therefore, effectively cleaning these contaminants from the seals is a pressing issue. Utility Model Content

[0003] The present invention aims to solve all or part of the problems of the above-mentioned prior art and provides a semiconductor processing equipment. Through improved design, a particle absorption device is set in the process chamber next to the isolation gate to remove the contamination particles generated by the reaction between special gases and seals during the wafer production process, so as to prevent them from falling onto the wafer surface and affecting the chip yield.

[0004] The present invention provides a semiconductor processing device comprising at least a process chamber, a base, an isolation gate, and a particle absorption device. The process chamber is provided with an air inlet on the side for introducing special gases used in production into the process chamber, and an air outlet below for gas circulation within the process chamber. The process chamber is also provided with a doorway for wafer entry and exit. The base is located within the process chamber for placing wafers. The isolation gate and the doorway are sealed by a sealing member when closed. The particle absorption device is provided on the inside of the process chamber, with the air intake facing the doorway, to facilitate the removal of contaminant particles generated by the sealing member on the isolation gate during the production process.

[0005] The semiconductor processing equipment also includes a first exhaust pipeline and an exhaust dry pump. The first exhaust pipeline is connected to the exhaust outlet below the process chamber and is connected to the exhaust dry pump. The first exhaust pipeline can use the exhaust dry pump as a power source to extract gas downward from the process chamber to achieve gas circulation in the process chamber.

[0006] The particle absorption device includes an absorption box and a second exhaust pipeline, and the second exhaust pipeline is connected to the exhaust dry pump through the opening below the process chamber; the first exhaust pipeline and the second exhaust pipeline use the same exhaust dry pump as a power source, which can reduce the number of equipment and reduce costs; the particle absorption device uses the exhaust dry pump as a power source, has a strong suction force, can efficiently exhaust the process chamber, effectively remove contaminated particles, and help improve the cleaning efficiency of the process chamber.

[0007] The isolation gate includes a door and a lifter. The door is installed at the upper end of the lifter. A sealing member is provided on the door for sealing the process chamber when the isolation gate is closed.

[0008] An air inlet is provided above the absorption box body, and an opening is provided below the absorption box body to connect to a second air extraction pipeline. A ventilation duct is provided inside the absorption box body and is connected to the air inlet and the opening below for particles to pass through.

[0009] An electromagnetic switch is provided on the second exhaust pipe connected to the particle absorption device. The opening and closing of the electromagnetic switch is used to control the operation of the particle absorption device, and the pollution particles caused by aging or corrosion of the seal on the isolation gate are sucked away by the exhaust principle; the particle absorption device is program-controlled by connecting to a computer.

[0010] The pipeline used for the second exhaust pipeline is a 2-inch pipe, and the air intake of the particle absorption device is not higher than the lower end of the corresponding door, so as to fully absorb the contamination particles peeled off from the seal when the isolation gate is opened and closed, prevent the contamination particles from falling onto the wafer, and ensure the production quality of the chip.

[0011] The side of the particle absorption device is attached to the inner wall of the process chamber, and the width of the absorption box of the particle absorption device is not less than the width of the opening below the process chamber, which facilitates the efficient absorption of pollutant particles generated in the reaction process and reduces the adhesion of particles to the inner wall of the process chamber.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] The utility model provides a semiconductor processing equipment provided with a particle absorption device, which is installed in a process chamber, and the position of the air intake port corresponds to the door. The device is connected to the air extraction dry pump through an opening below the process chamber via a second air extraction pipeline, and an electromagnetic switch is provided on the second air extraction pipeline for controlling the operation of the particle absorption device; when production is carried out in the process chamber, the isolation gate remains closed, the electromagnetic switch is in an off state, and the air extraction mechanism of the particle absorption device does not work, so as to avoid affecting the production process; after the production process is completed, when the isolation gate is switched, the particle absorption device starts to operate, and air is extracted by the suction force of the air extraction dry pump, and the air extraction principle is used to timely absorb and remove the polluted particles emitted by the reaction of special gases and seals during the production process, clean the process chamber, avoid contamination of the wafer by subsequent processes, and ensure the production quality of the chip, and the working pump and the cleaning pump use the same air extraction dry pump as the power source, which can reduce the number of equipment used and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a structural schematic diagram of a semiconductor processing equipment in an embodiment of the present utility model. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] This utility model is based on traditional semiconductor processing equipment and sets a particle absorption device in the process chamber to solve the problem of contamination particles generated by the sealing parts during wafer processing. Figure 1As shown, a semiconductor processing apparatus includes a process chamber, a susceptor, an isolation gate, and a particle absorption device, further comprising a first exhaust pipeline and an exhaust dry pump. In this embodiment, the process chamber has an air inlet on the side for introducing special gases used in the process reaction, and an exhaust outlet at the bottom for gas circulation within the process chamber. The process chamber also has a door for wafer entry and exit. The susceptor is located within the process chamber and is used to place wafers. The isolation gate includes a door and an elevator, with the door mounted at the upper end of the elevator and a seal provided on the door for sealing the process chamber when the isolation gate is closed. The first exhaust pipeline is connected to the exhaust outlet of the process chamber and can be used to extract gas from the process chamber to the outside via the exhaust dry pump, thereby achieving gas circulation within the process chamber. The particle absorption device includes an absorption box and a second exhaust pipeline. The first and second exhaust pipelines use the same exhaust dry pump as a power source. The second exhaust pipeline is provided with an electromagnetic switch connected to a computer for program control. The second exhaust pipeline of the particle absorption device uses a 2-inch pipe.

[0017] The side of the absorption box body is fixed to the inner wall of the process chamber, and the lower side is fixed to the bottom of the process chamber; the absorption box body is provided with an air intake port on the top, which is not higher than the lower end of the corresponding doorway and is used to inhale the contaminated particles generated by the reaction of the seal during the process; a ventilation duct is provided in the absorption box body that passes through the air intake port and the lower opening, and is connected to the second exhaust pipe through the lower opening of the absorption box body; the particle absorption device can use the suction force of the vacuum dry pump to inhale the contaminated particles generated by the seal during the reaction from the air intake port, and the contaminated particles are discharged from the process chamber through the opening at the bottom of the particle absorption device, thereby avoiding the influence of the contaminated particles on the chip quality.

[0018] In this embodiment, a production process of metal tungsten chemical vapor deposition (CVD) is performed on the wafer. The wafer is placed on a susceptor, the isolation gate is closed, and a fluorine-containing special gas used for the wafer reaction process is introduced into the process chamber through an air inlet provided on the side of the process chamber, so that the process chamber is filled with the special gas used for production. The wafer is processed under certain conditions. During the process, the electromagnetic switch remains closed, the particle absorption device does not work, and the first exhaust pipeline uses the exhaust dry pump as the power to exhaust gas from the process chamber to the outside, thereby realizing gas circulation in the process chamber; after the processing of the wafer is completed, the isolation gate is opened, the particle absorption device is controlled by a computer program to start working, the electromagnetic switch is turned on, and the contaminated particles are sucked into the particle absorption device through the suction port by the suction force of the exhaust dry pump, and discharged through the bottom opening of the particle absorption device, thereby cleaning the process chamber, preventing contaminated particles from falling on the wafer surface, and improving the chip yield.

[0019] The above embodiments are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor processing device, characterized in that: The invention comprises a process chamber (1), a base (2), an isolation gate (3) and a particle absorption device (4), wherein the process chamber (1) is provided with an air inlet on the side for introducing special gas used for process reaction, and an air outlet is provided at the bottom for realizing gas circulation, and the process chamber (1) is also provided with a door for wafers to enter and exit; the base (2) is located in the process chamber (1) and is used to place wafers; the isolation gate (3) and the door are sealed by a sealing member when they are closed; the particle absorption device (4) is arranged on the inner side of the process chamber (1), and the air inlet of the particle absorption device (4) faces the door.

2. The semiconductor processing equipment according to claim 1, wherein It also includes a first air extraction pipeline (5) and an air extraction dry pump (6), wherein the first air extraction pipeline (5) is connected to the air outlet below the process chamber (1) and is connected to the air extraction dry pump (6).

3. The semiconductor processing equipment according to claim 2, wherein: The particle absorption device (4) comprises an absorption box and a second air extraction pipeline (7), wherein the second air extraction pipeline (7) is connected to the air extraction dry pump (6) through an opening below the process chamber (1).

4. The semiconductor processing equipment according to claim 1, wherein The isolation gate (3) comprises a door and a lifter, the door is mounted on the upper end of the lifter, and a sealing member is provided on the door.

5. The semiconductor processing equipment according to claim 3, wherein An air intake port is provided above the absorption box body, and an opening is provided below the absorption box body to connect to a second air extraction pipeline (7). A ventilation duct is provided inside the absorption box body to communicate with the air intake port and the opening below.

6. The semiconductor processing equipment according to claim 3, wherein: An electromagnetic switch is provided on the second air extraction pipeline (7).

7. The semiconductor processing equipment according to claim 3, wherein: The second air extraction pipeline (7) uses a 2-inch pipe.

8. The semiconductor processing equipment according to claim 5, wherein The air intake of the particle absorption device (4) is not higher than the lower end of the corresponding doorway.

9. The semiconductor processing equipment according to claim 1, wherein: The particle absorption device (4) is attached to the inner wall of the process chamber (1).

10. The semiconductor processing equipment according to claim 5, wherein The width of the absorption box body is not less than the width of the lower opening of the process chamber (1).

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