Feeding device for carrying chips in front-back mounting mode
By introducing structures such as transplanting platforms, electric sliding tables and rotary suction nozzles into the chip loading device, the problems of large space and long transportation time in the prior art are solved, and efficient integrated transportation of chip formal and inverted chips are realized.
Patent Information
- Application Number
- CN202422398918.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-09-30
AI Technical Summary
After the existing chip loading device integrates flip-fitting and formal work, it takes up a large space and has a long chip transportation working time during formal work.
The transplanting platform, electric sliding table, first loading mechanism and second loading mechanism are adopted, combined with the rotary suction nozzle and the flip motor to realize the formal and flip transportation of the chip. Through the rotation of the rotary suction nozzle and the driving of the electric sliding table, the chip is transferred and replaced, reducing the equipment space and transportation time.
It realizes a high degree of integration between chip formal and flip-fitting tooling, reduces equipment space, shortens chip transportation time, and improves production efficiency.
Smart Images
Figure CN223193789U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip loading equipment, in particular to a loading device for carrying chips in the forward and reverse directions. Background Art
[0002] Chips can be mounted in two ways: face-up and flip-up. Face-up placement involves placing the chip with its front side facing up and its back side pressed onto the substrate for bonding. Flip-up placement involves placing the chip with its back side facing up and its front side pressed onto the substrate for bonding. The chip loading device is used for transfer and transport of chips. After retrieving the chip from the chip retrieving station, the loading device transports the chip to the bottom of the placement head, allowing the placement head to descend to retrieve the chip and proceed with subsequent placement operations.
[0003] The chips at the chip picking station are placed on the tray. The multiple chips placed on the tray are generally placed with the front side (electrical side) facing up to better protect the chip circuit. The suction nozzle of the existing chip loading device first rises and falls to absorb the chip to pick up the material, and then flips the nozzle 180° to make the front side of the chip face down. After the chip is transported to the bottom of the patch head, the patch head descends to pick up the material for flip-chip mounting. When the chip needs to be mounted upright, a transfer mechanism needs to be added. Under this working condition, the suction nozzle does not flip after picking up the material. The transfer mechanism picks up the material directly from under the suction nozzle. After the transfer mechanism is lifted, the patch head picks up the material for mounting the chip upright. Under this working condition, the front side of the chip always faces upward.
[0004] Therefore, the integration of the flip-chip tooling and the upright tooling of existing chip loading equipment is low. When the two toolings are integrated on the same machine tool, the device occupies a large space. Moreover, after the two toolings are integrated, the process steps for upright tooling are more complicated, and the chip transportation time is longer. Utility Model Content
[0005] (1) Technical issues to be resolved
[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a loading device for flip-chip handling, which solves the technical problems that the existing chip loading device occupies a large space after integrating flip-chip tooling and upright tooling, and the transportation time of chips during upright operation is long.
[0007] (2) Technical solution
[0008] In order to achieve the above-mentioned purpose, the chip loading device for flip-chip transport of the present invention includes a transfer platform, an electric slide, a first loading mechanism and a second loading mechanism;
[0009] The electric slide and the first loading mechanism are both mounted on the transplanting platform; the transplanting platform is capable of driving the electric slide and the first loading mechanism to slide laterally;
[0010] The second feeding mechanism is installed on the electric slide;
[0011] The first feeding mechanism is provided with a first rotary suction nozzle; the second feeding mechanism is provided with a second rotary suction nozzle;
[0012] The first rotary suction nozzle and the second rotary suction nozzle can rotate in a first direction, and the electric slide can drive the second feeding mechanism to slide along the transverse direction so that the first rotary suction nozzle and the second rotary suction nozzle abut against each other.
[0013] Optionally, the first feeding mechanism and the second feeding mechanism each include a flip motor and a flip head, wherein the flip head is connected to a rotating shaft of the flip motor; the first rotary suction nozzle and the second rotary suction nozzle are correspondingly provided on a pair of the flip heads;
[0014] The turning motor of the first feeding mechanism is arranged on the transplanting platform; the turning motor of the second feeding mechanism is arranged on the electric slide.
[0015] Optionally, the flip head is provided with a buffer assembly; the buffer assembly includes a linear guide rail, an elastic member and a stopper;
[0016] The linear guide rail and the stopper are correspondingly provided on the flip head; the linear guide rail can move axially along the elastic member on the flip head;
[0017] One end of the elastic member is connected to the linear guide rail, and the other end is connected to the stop block.
[0018] Optionally, a first vent hole is provided in the flip motor; a first air pipe joint is provided at one end of the flip motor away from the flip head;
[0019] One end of the first vent hole is communicated with the first air pipe joint, and the other end is communicated with the first rotary suction nozzle or the second rotary suction nozzle.
[0020] Optionally, a second air pipe joint is provided on the flip head; a third air pipe joint is provided on both the first rotary suction nozzle and the second rotary suction nozzle; a second vent hole is provided in the flip head;
[0021] On the first feeding mechanism and the second feeding mechanism, the first vent hole, the second vent hole, the second air pipe joint and the third air pipe joint are connected in sequence.
[0022] Optionally, a manual slide is provided on the electric slide;
[0023] The manual slide is a cross roller slide; the manual slide can drive the second feeding mechanism to move in the longitudinal direction and the transverse direction.
[0024] Optionally, the transplanting platform and the electric slide are linear motor modules.
[0025] Optionally, the top surfaces of the first rotary suction nozzle and the second rotary suction nozzle are adsorption surfaces; and adsorption holes are provided on the adsorption surfaces.
[0026] (3) Beneficial effects
[0027] The beneficial effects of the utility model are:
[0028] The first rotary suction nozzle and the second rotary suction nozzle can rotate in the first direction, so that the adsorption surface of the first rotary suction nozzle and the adsorption surface of the second rotary suction nozzle can be adjusted in direction. Combined with the driving mode of the electric slide and the second loading mechanism, the first rotary suction nozzle and the second rotary suction nozzle can be abutted, and the chip is clamped between a pair of adsorption surfaces, thereby realizing the transfer and face changing of the chip, and realizing the upright or inverted transportation of the chip on a small-volume and highly integrated loading device.
[0029] The loading device achieves a high degree of integration between upright and flip-chip tooling, taking up minimal space and improving its adaptability to smaller machine tools. Both upright and flip-chip tooling require the same operating time as the platform's sliding motion, minimizing chip transport time and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 This is a schematic structural diagram of a loading device for flip-chip chip handling from one perspective of the present invention;
[0031] Figure 2 This is a schematic structural diagram of the chip loading device for flip-chip transport from another perspective;
[0032] Figure 3 This is a schematic diagram of the connection between the flip head and the buffer assembly of the present invention.
[0033] [Description of Reference Numerals]
[0034] 1: Transplanting platform;
[0035] 2: Electric slide;
[0036] 3: First feeding mechanism; 31: First rotary suction nozzle; 311: Third air pipe joint; 32: Flip motor; 33: Flip head; 331: Second air pipe joint; 34: Buffer assembly; 341: Linear guide rail; 342: Stopper; 35: First air pipe joint;
[0037] 4: Second feeding mechanism; 41: Second rotary suction nozzle;
[0038] 5: Manual slide. DETAILED DESCRIPTION
[0039] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation methods in conjunction with the accompanying drawings.
[0040] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0041] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0042] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can refer to fixed connection, detachable connection, or integration; "connection" can refer to mechanical connection or electrical connection; it can refer to direct connection or indirect connection through an intermediate medium; it can refer to internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0043] See also Figures 1 to 3 The utility model provides a loading device for flip-chip transport, which includes a transplanting platform 1, an electric slide 2, a first loading mechanism 3 and a second loading mechanism 4; the electric slide 2 and the first loading mechanism 3 are both installed on the transplanting platform 1; the transplanting platform 1 can drive the electric slide 2 and the first loading mechanism 3 to slide horizontally, and the horizontal direction is the sliding direction of the transplanting platform 1; the second loading mechanism 4 is installed on the electric slide 2; the first loading mechanism 3 is provided with a first rotary suction nozzle 31; the second loading mechanism 4 is provided with a second rotary suction nozzle 41; wherein the first rotary suction nozzle 31 and the second rotary suction nozzle 41 can rotate in a first direction, and the first direction is the rotation direction of the rotating shaft of the flip motor 32; the electric slide 2 can drive the second loading mechanism 4 to slide horizontally so that the first rotary suction nozzle 31 and the second rotary suction nozzle 41 abut against each other.
[0044] In this embodiment, the chips in the tray are picked up by an external material removal tool and unloaded onto the adsorption surface of the first rotary suction nozzle 31, with the front of the chip facing downward. The top surfaces of the first rotary suction nozzle 31 and the second rotary suction nozzle 41 are adsorption surfaces, and adsorption holes are provided on the adsorption surfaces to adsorb the chips through negative pressure. Compared with traditional suction nozzles, the adsorption method of the flat adsorption surface can effectively improve the stability of chip adsorption, that is, improve the position accuracy of the chip on the rotary suction nozzle during the movement of the transplanting platform 1 and the flipping of the rotary suction nozzle, reduce the position error during the movement and interaction of the chip, and thus improve the patch accuracy with the substrate and improve product quality.
[0045] The first rotary suction nozzle 31 and the second rotary suction nozzle 41 can rotate in the first direction, so that the adsorption surface of the first rotary suction nozzle 31 and the adsorption surface of the second rotary suction nozzle 41 can be adjusted in orientation. In conjunction with the driving mode of the electric slide 2 and the second loading mechanism 4, the first rotary suction nozzle 31 and the second rotary suction nozzle 41 can be abutted, and the chip is clamped between a pair of adsorption surfaces, thereby realizing the transfer and face changing of the chip, and realizing the upright or inverted transportation of the chip on a small-volume and highly integrated loading device.
[0046] When the chip needs to be mounted upright, the transfer platform 1 can be moved directly under the placement head, and the placement head directly picks up the material from the suction surface of the first rotating suction nozzle 31. Compared with the existing upright operation, the transportation time is greatly shortened, and there is no need to add a transfer mechanism, which effectively reduces the space occupied by the equipment.
[0047] When the chip needs to be flipped, the adsorption surface of the first rotary suction nozzle 31 rotates 90° counterclockwise, and the adsorption surface of the second rotary suction nozzle 41 rotates 90° clockwise, so that the pair of adsorption surfaces rotate to a face-to-face parallel state; the electric slide 2 drives the second rotary suction nozzle 41 to move horizontally, so that the adsorption surface of the second rotary suction nozzle 41 moves toward the adsorption surface of the first rotary suction nozzle 31 until it moves to the preset position, and the chip is clamped between the pair of adsorption surfaces; the first rotary suction nozzle 31 releases the negative pressure, and the second rotary suction nozzle 41 opens the negative pressure, and the chip is adsorbed onto the second rotary suction nozzle 41; the electric slide 2 resets; the first rotary suction nozzle 31 and the second rotary suction nozzle 41 reset; the transfer platform 1 moves to the bottom of the patch head, and the patch head picks up the material. The interaction between the electric slide 2, the first loading mechanism 3 and the second loading mechanism 4 is completed within the sliding working time of the transfer platform 1, and does not take up additional transportation working time.
[0048] The loading device achieves a high degree of integration between upright and flip-chip tooling, taking up minimal space and improving its adaptability to smaller machine tools. Both upright and flip-chip tooling require the same operating time as the sliding movement of the transfer platform 1, minimizing chip transport time and improving production efficiency.
[0049] Furthermore, both the first loading mechanism 3 and the second loading mechanism 4 include a flipping motor 32 and a flipping head 33, with the flipping head 33 connected to the rotating shaft of the flipping motor 32. The first rotary suction nozzle 31 and the second rotary suction nozzle 41 are correspondingly arranged on the pair of flipping heads 33. The flipping motor 32 of the first loading mechanism 3 is arranged on the transplanting platform 1; the flipping motor 32 of the second loading mechanism 4 is arranged on the electric slide 2. Specifically, the flipping motor 32 is preferably a hollow stepper motor to accurately locate the adjustment position of the suction surface and provide real-time feedback to the control center. The control center monitors the rotation angle of the rotary suction nozzle to ensure the accuracy of the chip interaction between the first rotary suction nozzle 31 and the second rotary suction nozzle 41, and improve the interaction stability. The transplanting platform 1 is preferably equipped with a linear motor. During the lateral movement of the transplanting platform 1, the adsorption surfaces corresponding to the first rotary suction nozzle 31 and the second rotary suction nozzle 41 are flipped to a face-to-face parallel state. The electric slide 2 drives the second loading mechanism 4 laterally toward the first loading mechanism 3 to complete the interaction of the chip on a pair of rotary suction nozzles. After the second rotary suction nozzle 41 is reset, that is, the adsorption surface of the second rotary suction nozzle 41 faces upward, the flipping of the front of the chip is completed, and then the flip-chip is realized in conjunction with the patch head.
[0050] The working hours of the flip-chip process of the present invention do not exceed the working hours of the lateral transfer of the transfer platform 1, that is, the process of flipping the chip from the front does not take up additional working hours. In addition, in this embodiment, the flip head 33 is a block and the rotating suction nozzle is a plate. Both occupy a small space. During the lateral transfer of the transfer platform 1, the flipping is not easy to interfere with external equipment. At the same time, the adsorption surface of the plate is a plane, which has strong adsorption stability for the chip, thereby improving the adaptability of flipping the chip while the chip is being transferred laterally. The existing suction nozzle is a rod type. To avoid interference, the nozzle usually adsorbs the chip and completes a 180° flip before performing lateral transfer. The 180° flip process takes up additional working hours. Therefore, the working hours of the present application are shorter than those of the existing rod-type suction nozzle transportation process.
[0051] Furthermore, the flip head 33 is provided with a buffer assembly 34; the buffer assembly 34 includes a linear guide rail 341, an elastic member (not shown) and a stopper 342; the flip head 33 is provided with a linear guide rail 341 and a stopper 342 correspondingly; the linear guide rail 341 can move along the axial direction of the elastic member on the flip head 33; one end of the elastic member is connected to the linear guide rail 341, and the other end is connected to the stopper 342. Specifically, the linear guide rail 341 includes a guide rail and a slider; the guide rail is provided on the end face of the flip head 33; the slider is slidably provided on the guide rail; the stopper 342 can limit the sliding of the slider; one end of the elastic member is connected to the linear guide rail 34, and the other end is connected to the stopper 342. Figure 1Taking the shown orientation as an example, in this state, the first loading mechanism 3 is in its original position, and the linear guide 341 is affected by its own gravity to press down the elastic member. The elastic member is a pressure-bearing elastic member and can be a spring or a rubber block. When the first rotary suction nozzle 31 rotates 90° counterclockwise and the second rotary suction nozzle 41 squeezes the first rotary suction nozzle 31 laterally, the first rotary suction nozzle 31 moves laterally and squeezes the elastic member. The elastic member can effectively play a buffering role, buffering the collision force of the second rotary suction nozzle 41 on the first rotary suction nozzle 31, thereby effectively protecting the chip, avoiding the situation where the chip is damaged by collision, and improving the reliability of the loading device. Of course, the elastic member can also be set as a tensile elastic member, and the buffer assembly 34 can also be set on the flip head 33 of the second loading mechanism 4; or the elastic member can be set as other structures, as long as the collision buffering between the second rotary suction nozzle 41 and the first rotary suction nozzle 31 can be achieved.
[0052] In the first embodiment, a first vent is provided in the flip motor 32; a first air pipe connector 35 is provided at one end of the flip motor 32 facing away from the flip head 33; one end of the first vent is connected to the first air pipe connector 35, and the other end is connected to the first rotary suction nozzle 31 or the second rotary suction nozzle 41. Specifically, the first vent is a countersunk hole extending along the axis of the rotating shaft of the flip motor 32. A connecting hole is provided on the flip motor 32, one end of the air pipe is connected to the connecting hole, and the other end of the air pipe is connected to the rotary suction nozzle. Taking the first rotary suction nozzle 31 as an example, the air flow can be discharged in sequence through the adsorption hole of the first rotary suction nozzle 31, the first vent of the first feeding mechanism 3, and the air pipe connector of the first feeding mechanism 3 to form a negative pressure adsorption chip. By providing the first vent inside the flip motor 32, the use of air pipes can be saved and costs can be reduced; at the same time, direct connection between the first air pipe connector 35 and the first rotary suction nozzle 31 is avoided, thereby effectively preventing the air pipe from being too long and affecting the rotation accuracy of the first rotary suction nozzle 31.
[0053] In the second embodiment, as Figure 3 As shown, a second air pipe joint 331 is provided on the flip head 33; a third air pipe joint 311 is provided on both the first rotary suction nozzle 31 and the second rotary suction nozzle 41; a second air vent is provided in the flip head 33; on the first feeding mechanism 3 and the second feeding mechanism 4, the first air vent, the second air vent, the second air pipe joint 331 and the third air pipe joint 311 are connected in sequence. In this embodiment, the first air vent is a through hole, the second air vent is a countersunk hole, and the second air vent is connected to the second air pipe joint 331; the second air pipe joint 331 and the third air pipe joint 311 are further connected through an air pipe. Compared with the first embodiment, the second air pipe joint 331 and the third air pipe joint 311 are connected through an air pipe. The advantage is that the air pipe, the second air pipe joint 331 and the third air pipe joint 311 can rotate synchronously, which effectively avoids the problem of winding caused by the air pipe being too long, thereby avoiding the situation where the air affects the rotation accuracy of the rotary suction nozzle.
[0054] Secondly, a manual slide 5 is provided on the electric slide 2; the manual slide 5 is a cross-roller slide; the manual slide 5 can drive the second loading mechanism 4 to move longitudinally and transversely. Specifically, the longitudinal direction is the axial direction of the rotating shaft of the flip motor 32. The cross-roller slide enables the second loading mechanism 4 to move longitudinally and transversely, achieving compensation adjustment of the positioning of a pair of adsorption surfaces, thereby improving the docking accuracy of the pair of adsorption surfaces and further improving the interactive stability of the chip. Of course, a manual slide 5 can also be provided between the first loading mechanism 3 and the transplanting platform 1.
[0055] It should be understood that the above description of the specific embodiments of the present invention is merely for the purpose of illustrating the technical approach and features of the present invention. Its purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, the present invention is not limited to the above-described specific embodiments. Any changes or modifications made within the scope of the claims of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A loading device for flip-chip transport, characterized in that: The loading device comprises a transplanting platform (1), an electric slide (2), a first loading mechanism (3) and a second loading mechanism (4); The electric slide (2) and the first loading mechanism (3) are both mounted on the transplanting platform (1); the transplanting platform (1) is capable of driving the electric slide (2) and the first loading mechanism (3) to slide in a transverse direction; The second feeding mechanism (4) is installed on the electric slide (2); The first feeding mechanism (3) is provided with a first rotary suction nozzle (31); the second feeding mechanism (4) is provided with a second rotary suction nozzle (41); The first rotary suction nozzle (31) and the second rotary suction nozzle (41) are capable of rotating in a first direction, and the electric slide (2) is capable of driving the second feeding mechanism (4) to slide along the transverse direction so that the first rotary suction nozzle (31) and the second rotary suction nozzle (41) abut against each other.
2. The chip loading device for flip-chip transport according to claim 1, characterized in that: The first feeding mechanism (3) and the second feeding mechanism (4) both comprise a flipping motor (32) and a flipping head (33), wherein the flipping head (33) is connected to the rotating shaft of the flipping motor (32); the first rotary suction nozzle (31) and the second rotary suction nozzle (41) are correspondingly arranged on a pair of the flipping heads (33); The turning motor (32) of the first feeding mechanism (3) is arranged on the transplanting platform (1); and the turning motor (32) of the second feeding mechanism (4) is arranged on the electric slide (2).
3. The chip loading device for flip-chip transfer according to claim 2, characterized in that: The flip head (33) is provided with a buffer assembly (34); the buffer assembly (34) includes a linear guide rail (341), an elastic member and a stopper (342); The linear guide rail (341) and the stopper (342) are correspondingly provided on the flip head (33); the linear guide rail (341) can move along the axial direction of the elastic member on the flip head (33); One end of the elastic member is connected to the linear guide rail (341), and the other end is connected to the stop block (342).
4. The chip loading device for flip-chip transport according to claim 2, characterized in that: A first vent hole is provided in the flip motor (32); a first air pipe joint (35) is provided at one end of the flip motor (32) away from the flip head (33); One end of the first vent hole is in communication with the first air pipe joint (35), and the other end is in communication with the first rotary suction nozzle (31) or the second rotary suction nozzle (41).
5. The chip loading device for flip-chip transport according to claim 4, characterized in that: The flip head (33) is provided with a second air pipe joint (331); the first rotary suction nozzle (31) and the second rotary suction nozzle (41) are both provided with a third air pipe joint (311); a second vent hole is provided in the flip head (33); On the first feeding mechanism (3) and the second feeding mechanism (4), the first vent hole, the second vent hole, the second air pipe joint (331) and the third air pipe joint (311) are connected in sequence.
6. The chip loading device for flip-chip transport according to any one of claims 1 to 5, characterized in that: A manual slide (5) is provided on the electric slide (2); The manual slide (5) is a cross roller slide; the manual slide (5) is capable of driving the second feeding mechanism (4) to move in the longitudinal direction and the transverse direction.
7. The chip loading device for flip-chip transport according to any one of claims 1 to 5, characterized in that: The transplanting platform (1) and the electric slide (2) are linear motor modules.
8. The chip loading device for flip-chip transport according to any one of claims 1 to 5, characterized in that: The top surfaces of the first rotary suction nozzle (31) and the second rotary suction nozzle (41) are adsorption surfaces; adsorption holes are provided on the adsorption surfaces.