Structure using PCB (printed circuit board) as carrier for mutual connection of heating sheets

Abstract

The utility model discloses a structure using a PCB as a carrier for mutual connection of heating sheets, the rigid PCB is clamped between an upper layer hot melt adhesive film and a lower layer hot melt adhesive film, and a packaging structure is formed through heating and melting, so that a rigid and non-deformable first waterproof area is realized, and the waterproof performance of the heating sheets is improved. And meanwhile, a flexible and variable second annular waterproof buffer area is formed on the outer side. The durability and the waterproofness of the heating assembly are improved, and the comfort of the heating clothes is also considered. Compared with a traditional flexible circuit board, the flexible circuit board has higher mechanical strength, can be compatible with various heating sheet types, meets individual requirements, improves the market adaptability of heating clothes, and prolongs the service life of the heating clothes.

Description

Technical Field

[0001] The utility model relates to the technical field of wearable heating devices, and in particular to a structure using a PCB circuit board as a carrier for connecting heating sheets to each other. Background Art

[0002] In the design of wearable heating clothes, the connection and fixing methods of heating sheets directly affect the durability, waterproofness of the product and the wearing comfort of users. Traditionally, the industry generally uses flexible printed circuit boards (FPCs) as carriers for connecting heating sheets to each other to adapt to the flexible characteristics of clothes. However, although flexible printed circuit boards perform excellently in terms of flexibility, they have the following problems in practical applications:

[0003] 1. The durability of flexible printed circuit boards is poor. Due to their flexible characteristics, they are prone to cracks or damage under the action of mechanical stresses such as washing and twisting, resulting in connection failures. In addition, the welding temperature requirements of flexible printed circuit boards are relatively low, the solder joint strength is weak, and they are prone to solder joint voiding or solder joint cracking due to long-term use or environmental changes, thus affecting the functional stability of heating clothes.

[0004] 2. Flexible printed circuit boards perform poorly in terms of waterproofness. During multiple washing processes, moisture is likely to penetrate into the interior through the edges or solder joints of flexible printed circuit boards, resulting in circuit board corrosion or short circuits. This situation is particularly serious under harsh usage conditions, restricting the application range of heating clothes.

[0005] See Figure 1 , the copper strip 9 has more connection points, resulting in a poor wearing experience inside the clothes being worn and causing many wires inside the clothes.

[0006] See Figure 2 , the FPC flexible circuit board 10 has a soldering temperature resistance below 180 °C, which is prone to solder joint voiding or poor phenomena such as easy embrittlement of the FPC due to soldering. In addition, in an FPC where many electronic wires are concentratedly connected, it is easily broken by the stress of a washing machine.

[0007] In order to overcome these problems, some designs attempt to use rigid PCB circuit boards instead of flexible printed circuit boards to improve mechanical strength and solder joint reliability. However, the compatibility of rigid PCB circuit boards with flexible clothes is poor, which is likely to reduce wearing comfort. Moreover, during the fixing and encapsulation processes, if not handled properly, stress concentration is easily formed between the rigid area and the flexible clothes, resulting in a poor usage experience.

[0008] Therefore, how to retain both the mechanical strength and waterproofness of rigid PCB circuit boards while also taking into account the flexibility and wearing comfort of heating clothes has become the technical problem to be solved by the utility model. Summary of the Utility Model

[0009] The technical problem solved by the present utility model is to provide a structure using a PCB circuit board as a carrier for interconnecting heating sheets to address the deficiencies in the durability, waterproofness, and flexibility compatibility with clothing of the heating sheet connection method in the above-mentioned prior art, as set forth in the background art.

[0010] To solve the above technical problems, the technical solution adopted by the present utility model is as follows:

[0011] A structure using a PCB circuit board as a carrier for interconnecting heating sheets, comprising:

[0012] An upper hot melt adhesive film;

[0013] A lower hot melt adhesive film;

[0014] A rigid circuit board sandwiched between the upper hot melt adhesive film and the lower hot melt adhesive film, wherein the rigid circuit board is provided with pads for connecting a power input, a temperature controller, and at least one heating sheet, and the pads are connected to corresponding electronic wire harnesses by welding;

[0015] Wherein, the upper hot melt adhesive film and the lower hot melt adhesive film are adhesively bonded to each other by heating and melting to form a packaging structure covering the rigid circuit board and its pads, and the packaging structure forms a rigid and non-deformable first waterproof region by virtue of the non-deformable property of the rigid circuit board;

[0016] Moreover, the surface areas of the upper hot melt adhesive film and the lower hot melt adhesive film are respectively larger than the surface area of the rigid circuit board, such that after the upper hot melt adhesive film and the lower hot melt adhesive film are melted and bonded, the rigid circuit board is located between the upper hot melt adhesive film and the lower hot melt adhesive film, thereby forming a flexible and deformable second annular waterproof buffer region on the outer side of the rigid and non-deformable waterproof region.

[0017] As a further aspect of the present utility model, the rigid circuit board is a rigid PCB circuit board, and the pads of the rigid PCB circuit board are connected to the electronic wire harnesses by a high-temperature welding process. The heating sheets that the rigid PCB circuit board can connect include, but are not limited to, carbon fiber heating sheets, carbon nanotube thin film heating sheets, graphene thin film heating sheets, and printed conductive carbon-based paste heating sheets.

[0018] As a further aspect of the present utility model, the thickness of the rigid circuit board is 0.8 mm or more to ensure that the PCB circuit board has sufficient rigidity and durability.

[0019] As a further aspect of the present utility model, the upper hot melt adhesive film and the lower hot melt adhesive film are respectively made of thermoplastic polyurethane material (TPU) to ensure effective adhesion and formation of a waterproof packaging structure when heated.

[0020] As a further solution of the present utility model, when the structure using the PCB circuit board as the carrier for connecting the heating sheets is used in a heating garment, the encapsulation structure forms a rigid waterproof area in the heating garment that can maintain its structural integrity and functional stability during wearing and washing.

[0021] As a further solution of the present utility model, an upper fabric layer is fixedly arranged on the upper surface of the upper hot-melt adhesive film, and a lower fabric layer is fixedly arranged on the lower surface of the lower hot-melt adhesive film.

[0022] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0023] 1. Improve durability and reliability: By using a rigid PCB circuit board, the encapsulation structure forms a rigid and non-deformable first waterproof area after encapsulation. Compared with traditional flexible circuit boards, the rigid PCB circuit board of the present utility model has higher mechanical strength and stability, can effectively resist external mechanical stress and bending deformation, and significantly improves the durability and reliability of the heating component in complex usage environments.

[0024] 2. Enhance waterproof performance: The surface areas of the upper and lower hot-melt adhesive films are larger than that of the rigid PCB circuit board. After heating and melting, not only a first waterproof area is formed on the surface of the rigid PCB circuit board, but also a flexible and variable second annular waterproof buffer area is formed outside the rigid area. The double-layer waterproof structure makes the present utility model far superior to the prior art in terms of waterproof effect, and can effectively prevent water from infiltrating during long-term wearing and multiple washing processes, protecting the integrity and stability of the internal circuit.

[0025] 3. Balance flexibility and rigidity: The present utility model combines a rigid PCB circuit board and a flexible hot-melt adhesive film, not only retaining the protective performance of the rigid area, but also providing a flexible area outside the rigid area. This structural design ingeniously solves the contradiction between the flexibility required for the heating garment and the rigidity of the circuit board, enabling the heating garment to have higher durability and protective performance while maintaining comfort.

[0026] 4. Diverse compatibility with heating sheets: The rigid PCB circuit board can be compatible with various types of heating sheets, including but not limited to carbon fiber heating sheets, carbon nanotube film heating sheets, graphene film heating sheets, and printed conductive carbon-based paste heating sheets, etc. Compared with the limitations of traditional flexible circuit boards, the present utility model greatly expands the selection range of heating sheets, meets the personalized needs of different users for heating garments, and has significant market adaptability.

[0027] 5. Simple and controllable process: The preparation method of the present utility model has a simple process and is easy to control. By the heating and melting process, the hot melt adhesive film is tightly combined with the rigid PCB circuit board, enabling efficient and stable product quality control during the production process, suitable for large-scale production, and reducing production costs.

[0028] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0030] Figure 1 It is a schematic structural diagram of the connection method of the copper strip machine in the prior art.

[0031] Figure 2 It is a schematic structural diagram of the connection method of the FPC flexible circuit board in the prior art.

[0032] Figure 3 It is a schematic structural diagram of the preparation method of the heating sheet of the present utility model using a single group of carbon fibers and a PCB circuit board as a heating carrier.

[0033] Figure 4 It is a schematic structural diagram of the preparation method of the heating sheet of the present utility model using two groups or multiple groups of carbon fibers and a PCB circuit board as a heating carrier.

[0034] Figure 5 It is a schematic diagram of the carbon fiber heating sheet of the present utility model.

[0035] Figure 6 It is a schematic structural diagram of the preparation method of the heating sheet of the present utility model in series with 2 sheets using a sheet-like material or a sheet-like structure heating material, including a printed conductive carbon-based slurry, or a carbon nanotube film or a graphene film material, as a heating carrier.

[0036] Figure 7 It is a schematic structural diagram of the preparation method of the heating sheet of the present utility model in series with 4 sheets or more sheets using a sheet-like material or a sheet-like structure heating material, including a printed conductive carbon-based slurry, or a carbon nanotube film or a graphene film material, as a heating carrier.

[0037] Figure 8This is a schematic structural diagram of a preparation method for making a heating sheet, which uses two sheets of sheet materials or sheet structures in parallel for the heating material of the present utility model, including a printed conductive carbon-based paste, or a carbon nanotube thin film or a graphene thin film material as the heating carrier.

[0038] Figure 9 This is a schematic structural diagram of a preparation method for making a heating sheet, which uses four or more sheets of sheet materials or sheet structures in parallel for the heating material of the present utility model, including a printed conductive carbon-based paste, or a carbon nanotube thin film or a graphene thin film material as the heating carrier.

[0039] Figure 10 This is a schematic structural diagram of the series connection mode of heating sheets of printed or thin film type sheet heating materials.

[0040] Figure 11 This is a schematic structural diagram of the parallel connection mode of heating sheets of printed or thin film type sheet heating materials.

[0041] The reference numerals and names in the figure are as follows:

[0042] Upper hot melt adhesive film 1, lower hot melt adhesive film 2, rigid circuit board 3, solder pad 4, electronic wire harness 5, upper fabric layer 6, lower fabric layer 7, heating sheet 8, copper strip 9, and FPC flexible circuit board 10. Specific embodiments

[0043] Next, the technical solutions in the embodiments of the present utility model will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0044] Please refer to Figure 3 —11. In the embodiments of the present utility model,

[0045] A structure using a PCB circuit board as a carrier for connecting heating sheets to each other includes: an upper hot melt adhesive film 1; a lower hot melt adhesive film 2;

[0046] A rigid circuit board 3 sandwiched between the upper hot melt adhesive film 1 and the lower hot melt adhesive film 2. The rigid circuit board 3 is provided with solder pads 4 for connecting a power input, a temperature controller, and at least one heating sheet 8. The solder pads 4 are connected to the corresponding electronic wire harness 5 by welding;

[0047] Among them, the upper hot melt adhesive film 1 and the lower hot melt adhesive film 2 are mutually adhered by heating and melting to form a packaging structure covering the rigid circuit board 3 and its solder pads 4. The packaging structure forms a rigid and non-deformable first waterproof area by using the non-deformable characteristic of the rigid circuit board 3.

[0048] Moreover, the surface areas of the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2 are respectively larger than the surface area of the rigid circuit board 3, such that after the rigid circuit board 3 is melted and bonded by the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2, it is located between the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2, thereby forming a flexible and deformable second annular waterproof buffer region on the outer side of the rigid and non-deformable waterproof region.

[0049] The rigid circuit board 3 is a rigid PCB circuit board. The pads 4 of the rigid PCB circuit board are connected to the electronic wire harness 5 through a high-temperature welding process. The heating sheets 8 that the rigid PCB circuit board can connect include but are not limited to carbon fiber heating sheets, carbon nanotube thin film heating sheets 8, graphene thin film heating sheets 8, and printed conductive carbon-based paste heating sheets 8.

[0050] The thickness of the rigid circuit board is 0.8 mm or more to ensure that the PCB circuit board has sufficient rigidity and durability.

[0051] The upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2 are respectively made of thermoplastic polyurethane material (TPU) to ensure that they can be effectively bonded when heated and form a waterproof encapsulation structure.

[0052] When the structure using the PCB circuit board as the carrier for connecting heating sheets is used in a heating garment, the encapsulation structure enables the rigid circuit board 3 to form a rigid waterproof region in the heating garment that can maintain its structural integrity and functional stability during wearing and washing.

[0053] The upper surface of the upper hot-melt adhesive film 1 is fixedly provided with an upper fabric layer 6, and the lower surface of the lower hot-melt adhesive film 2 is fixedly provided with a lower fabric layer 7.

[0054] A preparation method for a structure using a PCB circuit board as the carrier for connecting heating sheets includes the following steps:

[0055] Step 1, provide a rigid PCB circuit board: Provide a rigid PCB circuit board with multiple pads 4 provided thereon for connecting a power input, a temperature controller, and at least one heating sheet 8;

[0056] Step 2, weld the electronic wire harness 5: Through a high-temperature welding process, weld the electronic wire harness 5 to the pads 4. The electronic wire harness 5 is used to connect the power supply, the temperature controller, and the heating sheet 8;

[0057] Step 3, arrange the hot-melt adhesive film: Clamp the rigid PCB circuit board between the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2. The surface areas of the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2 are respectively larger than the surface area of the rigid PCB circuit board;

[0058] Step 4: Heating and melting: heating the upper hot melt adhesive film 1 and the lower hot melt adhesive film 2 to melt and adhere them to the rigid PCB circuit board to form a packaging structure covering the rigid PCB circuit board and its pads 4;

[0059] Step 5: Forming a waterproof area: Utilizing the rigidity of the rigid PCB circuit board, the packaging structure forms a rigid, non-deformable first waterproof area, while forming a flexible, deformable second annular waterproof buffer area on the outside of the rigid area.

[0060] In step 1, the surface of the rigid PCB circuit board is subjected to an anti-oxidation treatment to improve the durability and environmental adaptability of the circuit board.

[0061] In step 2, the temperature of the high temperature soldering process ranges from 240°C to 300°C to ensure the reliability of soldering and the mechanical strength of the solder joints.

[0062] In step 3, the layout location of the rigid PCB is pre-treated to make its surface dust-free and oil-free to ensure the best bonding effect between the hot melt adhesive film and the PCB.

[0063] The difference between the PCB circuit board of the utility model and the FPC flexible circuit board as the carrier for connecting the heating sheets in the heating clothing is as follows:

[0064]

[0065] Example 1:

[0066] In the practical application of wearable heating garments, conventional flexible printed circuits (FPCs) are typically designed as a carrier for connecting the heating pads 8 due to their flexible nature. However, during long-term use, heating garments are often subjected to mechanical distortion, repeated washing, and environmental changes, which can lead to damage to the FPCs, poor solder joints, or even breakage. In such cases, the connection between the heating pads 8 fails, directly affecting the functional stability of the heating garment and the user experience.

[0067] In order to solve this problem, in this embodiment, a rigid PCB circuit board 5 is used as a connection carrier of the heating plate 8, and through innovative packaging technology, a heating component structure that takes into account waterproofness, durability and flexibility is achieved.

[0068] The specific implementation steps are as follows:

[0069] First, a rigid PCB 5 is selected as the connection carrier between the heating element 8. This PCB 5 is pre-equipped with multiple solder pads 4 for connecting the heating element 8, the power input line, and the temperature controller. Because rigid PCBs have high mechanical strength and can effectively resist external mechanical stress, they can maintain circuit stability during long-term wear and washing.

[0070] Next, through a high-temperature welding process, the electronic wire harness 5 is firmly welded to the pad 4 on the PCB circuit board 5. This welding process is selected to be carried out within the temperature range of 240°C to 300°C to ensure that the solder joints have sufficient mechanical strength and prevent virtual soldering or breakage due to temperature changes or external forces during actual use.

[0071] After welding, the rigid PCB circuit board 5 is clamped between the upper hot-melt adhesive film 18 and the lower hot-melt adhesive film 22. It should be noted that the surface areas of both the upper and lower hot-melt adhesive films 22 are larger than the surface area of the rigid PCB circuit board 5. This design ensures that during the subsequent heating and melting process, the hot-melt adhesive film can completely cover the rigid PCB circuit board 5 and extend outside it to form a flexible area.

[0072] Subsequently, the assembled combination of the PCB circuit board 5 and the hot-melt adhesive film is placed in a heating device for heating and melting treatment. The hot-melt adhesive film melts and adheres to the rigid PCB circuit board 5 during heating to form a packaging structure. During this process, by utilizing the rigidity of the rigid PCB circuit board 5, a rigid and non-deformable first waterproof area 12 is formed on its surface. In addition, due to the ductility of the hot-melt adhesive film, a flexible and variable second annular waterproof buffer area 13 is formed outside the rigid PCB circuit board 5.

[0073] The finally packaged heating component not only ensures the protection and durability of the circuit board within the rigid area but also effectively takes into account the softness and wearing comfort of the heating clothing through the flexible area. Compared with traditional FPC circuit boards, this structural design can significantly improve the waterproof performance of the heating clothing. Especially in the case of multiple washes or a humid environment, it can still effectively prevent moisture from penetrating into the circuit, thus ensuring the long-term normal operation of the heating clothing.

[0074] Through the technical solution of this embodiment, the heating clothing not only has a significant improvement in durability and waterproofness but also overcomes the incompatibility problem between the rigid circuit board 3 and the flexible clothing, significantly enhancing the user's wearing experience.

[0075] Embodiment 2:

[0076] In the design of wearable heating clothes with multiple heating sheets 8, traditionally, flexible printed circuit boards (FPCs) are often used for connection because of their flexibility, which can better adapt to the bending characteristics of clothes. However, when the number of heating sheets 8 increases, the limitations of FPCs gradually become apparent. Especially when connecting multiple different types of heating sheets 8, due to insufficient solder joint strength and low mechanical strength of FPCs, it is easy to have poor soldering and solder joint cracking during the welding process, and even breakage problems may occur during multiple washings and wearings. In addition, due to the poor heat resistance of FPCs themselves, their reliability and durability are greatly limited when using different types of heating sheets 8.

[0077] To solve the above problems, this embodiment proposes a design that uses a rigid PCB circuit board 5 as the connection carrier for the heating sheets 8 and combines a multi-layer hot melt adhesive film encapsulation process to ensure the reliable connection of multiple heating sheets 8 and enhance the durability and waterproofness of the overall structure.

[0078] The specific application steps are as follows:

[0079] First, select a suitable rigid PCB circuit board 5 with multiple pads 4 arranged thereon for connecting different types of heating sheets 8. In this embodiment, the types of heating sheets 8 include carbon fiber heating sheets, carbon nanotube thin film heating sheets 8, and graphene thin film heating sheets 8. Since the rigid PCB circuit board 5 can withstand a relatively high welding temperature (240°C to 300°C), the reliability of the solder joints is greatly improved, effectively avoiding the poor soldering and solder joint cracking problems that are prone to occur when the flexible circuit board connects different types of heating sheets 8.

[0080] Next, place the welded rigid PCB circuit board 5 between the upper hot melt adhesive film 18 and the lower hot melt adhesive film 22. In particular, the surface area of the hot melt adhesive film is designed to be larger than the surface area of the rigid PCB circuit board 5 so that during the encapsulation process, the rigid PCB circuit board 5 can be completely covered by the hot melt adhesive film and a flexible area is formed on the outside. This design not only provides a rigid and waterproof protection area but also ensures the comfort of the heating clothes through the flexible area on the outside. [[ID=##]] [[ID=##]]

[0081] Subsequently, through the heating and melting process, the upper and lower hot melt adhesive films 22 are melted and bonded to the rigid PCB circuit board 5. The melted hot melt adhesive film tightly covers the rigid PCB circuit board 5 and the pads 4, not only forming a good waterproof encapsulation structure in the rigid area but also forming a flexible and variable waterproof area in the external area of the PCB board. This design effectively solves the compatibility problem of multiple different types of heating sheets 8 in the same heating clothes, ensuring the reliable connection between the heating sheets 8 and the flexibility of the overall clothing.

[0082] Through the application of this embodiment, not only the stable connection and operation of multiple heating sheets 8 are achieved, but also the service life of the heating clothing and the user's wearing experience are greatly improved. Compared with the traditional solution using flexible circuit boards, this embodiment demonstrates significant progress in mechanical strength, welding reliability, waterproofness, and flexible compatibility, ensuring the wide applicability of the heating clothing in different application scenarios.

[0083] In the present utility model, unless otherwise clearly specified and defined, terms such as "installation", "setting", "connection", "fixation", "swivel connection", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the interaction relationship between two components. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0084] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, it is intended to encompass all changes falling within the meaning and scope of the equivalent elements of the claims in the present utility model.

Claims

1. A structure using PCB circuit boards as a carrier for connecting heating sheets to each other, characterized in that: include: Upper hot melt adhesive film; Lower layer hot melt adhesive film; A rigid circuit board sandwiched between the upper hot melt adhesive film and the lower hot melt adhesive film, the rigid circuit board being provided with soldering pads for connecting a power input, a temperature controller and at least one heating element, the soldering pads being connected to corresponding electronic wiring harnesses by welding; The upper hot melt adhesive film and the lower hot melt adhesive film are bonded to each other by heating and melting to form a packaging structure covering the rigid circuit board and its pads. The packaging structure utilizes the rigid and non-deformable characteristics of the rigid circuit board to form a rigid, non-deformable first waterproof area. Moreover, the surface areas of the upper and lower hot-melt adhesive films are respectively larger than the surface areas of the rigid circuit board, so that after the upper and lower hot-melt adhesive films are melted and bonded, the rigid circuit board is located between the upper and lower hot-melt adhesive films, thereby forming a flexible and deformable second annular waterproof buffer area on the outer side of the rigid and non-deformable waterproof area.

2. The structure of using a PCB circuit board as a carrier for interconnecting heating sheets according to claim 1, characterized in that: The rigid circuit board is a rigid PCB circuit board, and the solder pads of the rigid PCB circuit board are connected to the electronic wiring harness through a high-temperature welding process. The heating sheets that can be connected to the rigid PCB circuit board include but are not limited to carbon fiber heating sheets, carbon nanotube film heating sheets, graphene film heating sheets and printed conductive carbon-based slurry heating sheets.

3. The structure of using a PCB circuit board as a carrier for interconnecting heating sheets according to claim 2, characterized in that: The thickness of the rigid circuit board is greater than 0.8 mm.

4. The structure of using a PCB circuit board as a carrier for interconnecting heating sheets according to claim 1, characterized in that: The upper hot melt adhesive film and the lower hot melt adhesive film are respectively made of thermoplastic polyurethane materials.

5. The structure of using a PCB circuit board as a carrier for interconnecting heating sheets according to claim 1, characterized in that: An upper fabric layer is fixedly arranged on the upper surface of the upper hot-melt adhesive film, and a lower fabric layer is fixedly arranged on the lower surface of the lower hot-melt adhesive film.

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