PCB structure board convenient for capacitor embedding

Abstract

The utility model relates to a PCB structure board convenient for embedding a capacitor, comprising a PCB body, the surface of the PCB body is provided with an accommodating groove for embedding the capacitor, the accommodating groove is arranged in a rectangular structure, one end of the accommodating groove is provided with a bonding pad positioning part, and the other end of the accommodating groove is provided with a bonding pad positioning part. Right-angle copper sheets which are used for enhancing electrical connection between the capacitor and the PCB, providing mechanical support and ensuring the stability of the capacitor on the PCB are installed on the two sides of the bonding pad positioning part in a limiting mode, and the right-angle copper sheets located on the two sides of the bonding pad positioning part are arranged in a mirror image mode. The utility model relates to a PCB (printed circuit board), which is used for improving the space utilization rate and the overall integration level of the PCB, ensuring the electrical connection quality between a capacitor and the PCB, providing necessary mechanical support and enhancing the stability and durability of a product in a severe environment.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit manufacturing, in particular to a PCB structural plate which is convenient for embedding capacitors. Background Art

[0002] Printed circuit boards (PCBs) play a crucial role in the design and manufacturing of modern electronic products. The rapid development of the electronics industry toward miniaturization, multifunctionality, and high performance has placed higher demands on PCB space utilization and integration. Traditional capacitor mounting methods, which occupy a large area on the board, are increasingly unable to meet advanced design requirements.

[0003] Specifically, in existing technologies, capacitors are typically mounted on the surface of a PCB, using through-hole mounting or surface mount technology (SMT). These traditional methods not only limit the effective use of board space but can also affect electrical performance and mechanical stability.

[0004] To overcome the above problems, some existing improvement measures include using smaller capacitors or adopting advanced mounting techniques, such as flip-chip technology. However, this method not only increases the complexity and cost of manufacturing, but also still does not completely solve the problems of low space utilization and limited electrical performance. At the same time, with the expansion of the application field of electronic products, higher requirements are also placed on the stability and durability of PCBs in harsh environments. For example, in an environment with high temperature, high humidity or corrosive gases, the reliability of capacitors and PCBs will be significantly reduced, so a more robust and reliable design is needed to protect electronic components.

[0005] The above content is only used to assist in understanding the technical solution of the present invention and does not constitute an admission that the above content is prior art. Utility Model Content

[0006] The utility model proposes a PCB structural board that is convenient for embedding capacitors, aiming to improve the space utilization and overall integration of the PCB, while ensuring the quality of the electrical connection between the capacitor and the PCB, providing the necessary mechanical support, and enhancing the stability and durability of the product in harsh environments.

[0007] To achieve the above objectives, the present invention proposes a PCB structural board that facilitates the embedding of capacitors, comprising: a PCB body, a surface of the PCB body having a receiving groove for embedding the capacitor, the receiving groove being arranged in a rectangular structure, and a solder pad positioning portion being provided at one end of the receiving groove, right-angled copper sheets being installed on both sides of the solder pad positioning portion to enhance the electrical connection between the capacitor and the PCB, provide mechanical support, and ensure the stability of the capacitor on the PCB, and the right-angled copper sheets located on both sides of the solder pad positioning portion are arranged as mirror images of each other.

[0008] Preferably, electronic potting glue is added into the receiving groove to fill the gap between the capacitor and the receiving groove.

[0009] Preferably, the electronic potting glue may be epoxy resin, silicone rubber, or a combination of the two.

[0010] Preferably, the right-angle copper sheet is made of nickel silver.

[0011] Preferably, one end of the right-angle copper sheet is welded to a conductive path opened on the surface of the PCB body through solder paste, and the other opposite end of the right-angle copper sheet extends axially into the pad positioning portion through the bent structure portion in the middle thereof, and is also welded to the capacitor end installed in the accommodating groove through solder paste.

[0012] Preferably, the conductive path is circumferentially arranged outside the accommodating groove in a fully enclosed manner, and the positive end of the conductive path is electrically connected to the right-angle copper sheet on one side of the pad positioning portion, while the negative end of the conductive path is electrically connected to the right-angle copper sheet on the other opposite side of the pad positioning portion.

[0013] Preferably, the conductive path is covered with a micro conductive track of a thin copper foil.

[0014] Preferably, it also includes: a capacitor fixing hole, which is spaced apart from the long axis sides on both sides of the accommodating groove and arranged symmetrically with the accommodating groove, and is used to further fix the position of the capacitor to ensure the stability and reliability of the capacitor on the PCB board.

[0015] The beneficial effects of the technical solution of this utility model are:

[0016] On the one hand, by opening a receiving groove on the surface of the PCB body and directly burying the capacitor therein, the board area occupied by the capacitor is significantly reduced, thereby improving the space utilization and overall integration of the PCB.

[0017] On the other hand, the design of the pad positioning part and the application of right-angle copper sheets not only enhance the electrical connection between the capacitor and the PCB, but also provide the necessary mechanical support, avoiding the problem of capacitor displacement due to vibration or impact in traditional installation methods.

[0018] At the same time, the electronic potting compound added to the receiving groove, such as epoxy resin or silicone rubber, effectively fills the gap between the capacitor and the receiving groove, providing the capacitor with additional protection against moisture, dust and chemical corrosion, thereby extending the service life of the capacitor and the entire PCB.

[0019] Secondly, the conductive path is circumferentially arranged outside the receiving slot in a fully enclosed manner and covered with a micro-conductive track with thin copper foil, thereby optimizing the flow of current, reducing resistance, and improving the electrical connection efficiency between the capacitor and the PCB, while improving the stability and efficiency of current transmission.

[0020] In addition, the setting of the capacitor fixing hole fixes the position of the capacitor, ensuring the stability and reliability of the capacitor on the PCB board, which is particularly suitable for application scenarios that may be subject to strong vibration or impact. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0022] Figure 2 It is a top view of an embodiment of the present invention.

[0023] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the schemes in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0026] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element.

[0027] In addition, if the descriptions of "first", "second", etc. are involved in the present invention, they are only used for descriptive purposes (such as to distinguish the same or similar elements) and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0028] The utility model proposes a PCB structure board that is convenient for embedding capacitors. Figure 1-Figure 2 , including: a PCB body 100, a surface of the PCB body 100 is provided with a receiving groove 110 for embedding the capacitor, the receiving groove 110 is arranged in a rectangular structure, and a pad positioning portion 120 is arranged at one end of the receiving groove 110, and right-angle copper sheets 130 are installed on both sides of the pad positioning portion 120 to enhance the electrical connection between the capacitor and the PCB, and provide mechanical support to ensure the stability of the capacitor on the PCB, and the right-angle copper sheets 130 located on both sides of the pad positioning portion 120 are mirror images of each other.

[0029] In this embodiment, the provision of the receiving slot 110 allows the capacitor to be more securely embedded in the PCB, improving overall reliability and durability. Furthermore, the use of the right-angle copper plate 130 not only strengthens the electrical connection between the capacitor and the PCB, but also provides additional mechanical support for the capacitor, ensuring that it is not easily dislodged or damaged when subjected to external forces.

[0030] In addition, the interior of the receiving groove 110 may be filled with conductive glue or similar conductive materials to enhance the electrical connection between the capacitor and the PCB and reduce capacitor displacement caused by mechanical vibration or thermal expansion.

[0031] In one embodiment, by limiting the conductive material to electronic potting compound, the connection between the capacitor and the PCB is further strengthened.

[0032] Specifically, electronic potting glue is added into the receiving groove 110 to fill the gap between the capacitor and the receiving groove 110 .

[0033] Furthermore, the electronic potting glue can be epoxy resin, silicone rubber, or a combination of the two.

[0034] In this embodiment, after adding electronic potting glue into the receiving groove 110, the glue can fully fill the tiny gap between the capacitor and the receiving groove 110 during the curing process, which not only enhances the positioning and vibration resistance of the capacitor, but also improves its moisture-proof, dust-proof and chemical corrosion resistance.

[0035] For example, when epoxy resin or silicone rubber is used as an electronic potting compound, these materials typically have excellent electrical insulation properties and good thermal stability, thereby protecting capacitors from damage caused by temperature fluctuations and electrical shocks. Silicone rubber, due to its excellent flexibility, can also provide additional cushioning effect, reducing damage caused by mechanical stress.

[0036] In one embodiment, one end of the right-angle copper sheet 130 is welded to the conductive path 140 opened on the surface of the PCB body 100 through solder paste, and the other opposite end of the right-angle copper sheet 130 extends axially into the pad positioning portion 120 through the bent structure portion in the middle thereof, and is also welded to the capacitor end 150 installed in the receiving groove 110 through solder paste.

[0037] The right-angle copper sheet 130 is made of nickel silver.

[0038] In this embodiment, one end of the right-angle copper sheet 130 is welded to the conductive path 140 on the PCB body 100, while the other end is extended into the pad positioning portion 120 through the bent portion and welded to the capacitor end 150, thereby ensuring smooth current transmission and providing a stable mechanical connection. The use of the right-angle copper sheet 130 further optimizes the electrical connection and mechanical fixation between the capacitor and the PCB board, making the installation of the capacitor easier and more accurate during the process of embedding the capacitor in the PCB.

[0039] At the same time, the right-angle copper sheet 130 made of nickel silver has excellent conductive properties, which can ensure efficient current transmission between the capacitor and the PCB, and can be well combined with welding materials such as solder paste, ensuring the reliability of the welding point and reducing the possibility of welding defects.

[0040] Secondly, it also has a certain degree of corrosion resistance, which enables the right-angle copper sheet 130 to maintain performance and integrity in a variety of environments, thereby extending the service life of the PCB.

[0041] In addition, nickel silver has a low coefficient of thermal expansion, which means that the length of the copper sheet changes little under temperature changes, which helps maintain the stability of the connection between the capacitor and the PCB. It also has good mechanical strength and fatigue resistance, which helps to withstand the various forces that the PCB may encounter under normal use or external stress.

[0042] In one embodiment, the electrical connection between the capacitor and the PCB is further optimized by using a conductive path 140 that is circumferentially disposed outside the receiving slot 110 in a fully enclosed manner. This ensures that current can flow efficiently from one end of the capacitor to the other, while reducing electrical impedance and signal loss.

[0043] Specifically, the positive terminal of the conductive path 140 is electrically connected to the right-angle copper piece 130 on one side of the pad positioning portion 120, while the negative terminal is electrically connected to the right-angle copper piece 130 on the other side. This layout helps to balance the current load of the two terminals of the capacitor, ensure the balance of the capacitor charging and discharging process, and thus improve the stability and reliability of the entire circuit.

[0044] Furthermore, a micro conductive track of a thin copper foil is covered on the conductive path 140 .

[0045] In this embodiment, the smooth surface of the copper foil can reduce the resistance in contact with the right-angle copper sheet 130, further improving the performance of the overall circuit. In addition, the setting of the copper foil can also provide a larger welding area, making the welding of the capacitor more stable and reliable, and reducing the risk of failure caused by poor welding.

[0046] In addition, the copper foil covering is also conducive to dissipating the heat generated during the operation of the capacitor, thereby extending the service life of the capacitor and maintaining the thermal stability of the circuit.

[0047] In one embodiment, it also includes: a capacitor fixing hole 160, which is spaced apart from the long axis sides on both sides of the accommodating groove 110 and is symmetrically arranged with the accommodating groove 110, and is used to further fix the position of the capacitor to ensure the stability and reliability of the capacitor on the PCB board.

[0048] In this embodiment, capacitor fixing holes 160 provide an additional locking point for the capacitor, preventing the capacitor from moving or rotating within the receiving slot 110, ensuring its secure position on the PCB. Thus, in vibration or shock environments that electronic devices may encounter, capacitor fixing holes 160 help the capacitor resist external forces, reducing the risk of detachment or damage caused by vibration or shock. Furthermore, capacitor fixing holes 160 provide a means of locating the capacitor's installation position, making manual or automated capacitor installation easier and faster, improving assembly efficiency, and reducing the possibility of installation errors.

[0049] In addition, the metal part near the fixing hole can serve as an additional heat path to help the capacitor dissipate heat, thereby optimizing the thermal management of the capacitor.

[0050] Specifically, capacitor fixing holes 160 are spaced apart from the long axis of the receiving slot 110 and arranged symmetrically with the receiving slot 110. They are designed to accommodate the mounting pins or guide pins of the capacitor, providing additional support points for the capacitor from a physical perspective. They also provide additional locking points for the capacitor, preventing it from moving or rotating within the receiving slot 110 and ensuring its secure position on the PCB.

[0051] Working principle:

[0052] First, according to the predetermined circuit design, a receiving groove 110 is opened on the PCB body 100, and a U-shaped pad positioning portion 120 is set at one end of the receiving groove 110. Then, the right-angle copper sheet 130 is limitedly installed on both sides of the pad positioning portion 120, and one end of the copper sheet is welded to the conductive path 140 on the PCB through solder paste. Next, the capacitor is placed in the receiving groove 110, and the end of the capacitor is welded to the other end of the right-angle copper sheet 130 through solder paste. Finally, electronic potting glue is injected into the receiving groove 110 to fill the gap between the capacitor and the receiving groove 110. After the potting glue is cured, the embedded installation of the capacitor is completed.

[0053] The above description is only part or preferred embodiments of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A PCB structure board that is convenient for embedding capacitors, characterized in that: include: A PCB body (100) is provided with a receiving groove (110) for embedding a capacitor on the surface of the PCB body (100), the receiving groove (110) is arranged in a rectangular structure, and a pad positioning portion (120) is arranged at one end of the receiving groove (110), and right-angle copper sheets (130) are installed on both sides of the pad positioning portion (120) to enhance the electrical connection between the capacitor and the PCB and provide mechanical support to ensure the stability of the capacitor on the PCB, and the right-angle copper sheets (130) located on both sides of the pad positioning portion (120) are arranged in mirror images of each other.

2. The PCB structure board for facilitating capacitor embedding according to claim 1, characterized in that: Electronic potting glue is added into the receiving groove (110) to fill the gap between the capacitor and the receiving groove (110).

3. The PCB structure board for facilitating capacitor embedding according to claim 2, characterized in that: The electronic potting glue can be epoxy resin, silicone rubber, or a combination of the two.

4. The PCB structure board for facilitating capacitor embedding according to claim 1, characterized in that: The right-angle copper sheet (130) is made of nickel silver.

5. The PCB structure board for facilitating capacitor embedding according to claim 4, characterized in that: One end of the right-angle copper sheet (130) is welded to a conductive path (140) provided on the surface of the PCB body (100) via solder paste, and the other opposite end of the right-angle copper sheet (130) extends axially into the pad positioning portion (120) via a bent structure portion in the middle thereof, and is also welded to a capacitor end (150) installed in the receiving groove (110) via solder paste.

6. The PCB structure board for facilitating capacitor embedding according to claim 5, characterized in that: The conductive path (140) is circumferentially arranged outside the accommodating groove (110) in a fully enclosed manner, and the positive end of the conductive path (140) is electrically connected to the right-angle copper sheet (130) on one side of the pad positioning portion (120), while the negative end of the conductive path (140) is electrically connected to the right-angle copper sheet (130) on the other opposite side of the pad positioning portion (120).

7. The PCB structure board for facilitating capacitor embedding according to claim 6, characterized in that: The conductive path (140) is covered with a micro conductive track of a thin copper foil.

8. The PCB structure board for facilitating capacitor embedding according to claim 1, characterized in that: Also includes: The capacitor fixing hole (160) is spaced apart from the long axis sides of the accommodating groove (110) and arranged symmetrically with the accommodating groove (110), and is used to further fix the position of the capacitor to ensure the stability and reliability of the capacitor on the PCB board.

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