Surface mounting and welding integrated pcb chip mounting equipment
Through innovative design along the flat L plate and eccentric wheel structure, the uneven fixation problem of installed components PCB boards is solved, stable clamping and efficient welding are achieved, and the yield rate and user experience of the equipment are improved.
Patent Information
- Application Number
- CN202422439024.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-10-10
AI Technical Summary
The existing PCB patch equipment with integrated mounting and welding cannot be kept flat and fixed when dealing with the PCB board of installed components, resulting in uneven pressure distribution, causing problems such as bending, twisting, inaccurate positioning, and affecting welding quality and yield.
The structure along the flat L plate and the eccentric wheel is adopted, through the rotation of the eccentric wheel and the reverse pushing force of the supply spring, the self-locking fixation of multiple flat L plates is achieved, combined with the coordination of the worm gear and worm gear to prevent the components from rotating and ensure stable clamping of the PCB plate.
Improves the stable fixing effect of the PCB board, prevents bending or distortion, improves welding quality and yield, and reduces the risk of component damage and positioning offset.
Smart Images

Figure CN223194933U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of patch equipment, in particular to a PCB patch equipment integrated with patching and welding. Background Art
[0002] PCB placement equipment with integrated placement and soldering is a core component of surface mount technology (SMT). It is used to directly assemble electronic components onto printed circuit boards (PCBs) and complete the soldering process through methods such as reflow soldering. These integrated PCB placement equipment is widely used in the electronics manufacturing industry, especially in the production of high-density, miniaturized electronic products. These systems improve production efficiency and product consistency through automation, while reducing labor costs and error rates. SMT technology plays a key role in the production of various products, including desktop computers, servers, and printers.
[0003] In the prior art, when performing soldering and mounting operations, PCB mounting equipment that integrates mounting and soldering usually uses clamps on the upper and lower edges to apply pressure to the PCB board to fix it. This fixing method usually works well when processing new PCB boards that have not been assembled with components. However, for PCB boards that have been mounted and soldered once or multiple times, electrical components or supporting circuits are already installed on the top and bottom. The presence of these components makes it challenging to fix the PCB board again. Due to the irregular shape and height differences of the electrical components, the pressure applied by the clamps will make it difficult to fix the PCB board flat, which will cause a series of problems in the subsequent soldering and mounting process. When the PCB board is not fixed flat, it will be subjected to uneven pressure during the soldering process. This uneven pressure distribution can cause the PCB board to bend or twist, thus affecting the soldering quality. In some extreme cases, excessive pressure can even directly cause damage to the PCB board or installed components, such as broken solder joints, component detachment, or PCB board cracking. In addition, uneven fixation also affects the positioning accuracy of the soldering head. In the automated soldering process, the soldering head needs to be precisely aligned with the pads on the PCB board for soldering. If the PCB board is offset or twisted due to uneven fixation, the soldering head cannot be accurately aligned with the pads, resulting in poor soldering or cold soldering. Utility Model Content
[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a PCB patch device with integrated mounting and welding.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a PCB patch device with integrated mounting and welding, including a device body, a base plate fixed at the bottom of the device body, a mounting plate fixed at the top of the base plate, a pad fixed at the top of the mounting plate, a plurality of flat L-plates slidably connected to the top of the mounting plate, wing vertical plates fixed on both sides of the flat L-plate, an end screw fixed to the inner wall of the wing vertical plate at one end, and an end screw slidably connected to the inner wall of the wing vertical plate at the other end, a force supply spring provided on the surface of the end screw, the other end of the end screw is threadedly connected to an auxiliary plate, and an eccentric wheel is provided on the top of the base plate.
[0006] The top of the base plate is provided with a recessed groove, and an output motor is fixed on the inner wall of the recessed groove. An active worm is fixed on the output end of the output motor, and a driven worm wheel is meshed on the surface of the active worm wheel. The bottom of the driven worm wheel is rotatably connected to the top of the base plate, and the top of the driven worm wheel is fixed to the bottom of the eccentric wheel. Since the force supply spring is compressed when subjected to pressure, this compression will cause a reverse driving force to be generated along the flat L plate. This reverse driving force will act on the eccentric wheel, causing it to rotate. The rotation of the eccentric wheel will further affect the position and posture of the flat L plate. Since the rotation of the eccentric wheel will cause a slight offset or tilt of the flat L plate, this offset or tilt will destroy the originally stable fixed state. When the PCB board cannot maintain a stable fixed state, it will have problems such as inaccurate positioning, shaking or even falling off during subsequent processing or testing. To solve such problems, the utility model adopts the method of installing an active worm to solve the problem, and realizes the self-locking property of the drive component through the matching of the worm gear and the worm, thereby preventing the component from rotating and achieving the effect of improving the yield rate.
[0007] Preferably, a top ladder groove is opened on the top of the mounting plate, and a ladder slide is slidably connected to the inner wall of the top ladder groove. The top of the ladder slide is fixed to the bottom of the flat L-plate. Through the coordination of the top ladder groove and the ladder slide, the component is prevented from slipping, so that the component can only move along the established track, thereby improving the stability of the equipment.
[0008] Preferably, flat wing plates are fixed on both sides of the auxiliary plate, and the surfaces of the flat wing plates are slidably connected to the inner wall of the equipment body, thereby improving the yield rate.
[0009] Preferably, a bottom connecting triangle is fixed along the bottom of the flat L-plate to increase the service life of the equipment.
[0010] Preferably, side parts are fixed on both sides of the device body to improve the stability of the device.
[0011] Preferably, a carrying slot is provided on one side of the side member to facilitate carrying by staff and improve user experience.
[0012] Beneficial effects:
[0013] In the prior art, integrated PCB placement and soldering equipment typically utilizes clamps on the upper and lower edges to apply pressure to the PCB to secure it during soldering and placement operations. This fixing method generally works well when processing new, unassembled PCBs. However, for PCBs that have undergone one or more placement and soldering operations, electrical components or supporting circuits are already installed on the top and bottom. The presence of these components makes it challenging to re-secure the PCB. Due to the irregular shapes and height differences of the electrical components, the pressure applied by the clamps can prevent the PCB from being fixed flat, which in turn causes a series of problems during the subsequent soldering and placement processes. When the PCB is not fixed flat, it will be subjected to uneven pressure during the soldering process. This uneven pressure distribution can cause the PCB to bend or twist, thereby affecting the soldering quality. In some extreme cases, excessive pressure can even directly cause damage to the PCB or installed components, such as broken solder joints, component detachment, or cracking of the PCB. In addition, uneven fixation also affects the positioning accuracy of the soldering head. In the automated soldering process, the soldering head needs to be precisely aligned with the pads on the PCB. During soldering, if the PCB board is offset or twisted due to uneven fixation, the soldering head cannot be accurately aligned with the soldering pad, resulting in poor soldering or cold soldering. To solve such problems, the utility model adopts the method of installing a flat L-plate to solve it. Before production starts, the staff installs a diameter-increasing piece of a suitable size on the circumference of the eccentric wheel. When the staff needs to mount and solder the PCB board, the PCB board is transferred to the pad, and then the eccentric wheel is started to rotate, so that the position of the eccentric wheel with the largest diameter squeezes the auxiliary plate and the flat L-plate near one end of the auxiliary plate in a direction away from each other. The pulling of the auxiliary plate causes the flat L-plate away from one end of the auxiliary plate to be pulled toward the flat L-plate near one end of the auxiliary plate, so that multiple flat L-plates gather toward the center to clamp the PCB, thereby enabling the PCB to be fixed from both sides. At the same time, due to the large contact area between the flat L-plate and the PCB, the PCB can be better fixed during processing to prevent damage. When the processing is completed, the eccentric wheel rotates, the force supply spring releases the elastic potential energy, and at the same time, due to the restriction of the eccentric wheel, the multiple flat L-plates are slowly pushed away in the separation direction, thereby achieving the effect of increasing the applicability of the equipment.Because the force supply spring compresses when subjected to pressure, this compression generates a reverse thrust along the flat L-plate. This reverse thrust acts on the eccentric, causing it to rotate. The rotation of the eccentric further affects the position and posture of the flat L-plate. The rotation of the eccentric can cause the flat L-plate to shift or tilt slightly, disrupting its originally stable fixed state. When the PCB board cannot maintain a stable fixed state, it may experience inaccurate positioning, shaking, or even falling off during subsequent processing or testing. To address these issues, the present invention employs the installation of an active worm gear. This achieves self-locking properties in the drive assembly through the coordination of the worm gear, preventing the assembly from rotating and improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0015] Figure 2 It is a cross-sectional view of the main body of the device of the utility model;
[0016] Figure 3 This is a schematic diagram of the three-dimensional structure of the flat L-plate of the present invention;
[0017] Figure 4 This is a schematic diagram of the three-dimensional structure of the ladder slide of the present invention;
[0018] Figure 5 This is a schematic diagram of the three-dimensional structure of the bottom-connected triangle of the utility model;
[0019] Figure 6 It is a schematic diagram of the three-dimensional structure of the pad of the utility model.
[0020] Legend:
[0021] 1. Equipment body; 101. Base plate; 2. Mounting plate; 201. L-shaped plate; 202. Wing plate; 203. Pad; 204. End screw; 205. Force supply spring; 206. Auxiliary plate; 207. Eccentric wheel; 3. Sink; 301. Output motor; 302. Driving worm; 303. Driven worm gear; 4. Top ladder groove; 401. Ladder slide; 402. Flat wing plate; 403. Bottom connecting triangle; 5. Side body; 501. Handle groove. DETAILED DESCRIPTION
[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific embodiments and drawings. However, the following embodiments are only preferred embodiments of the present invention and are not exhaustive. Based on the embodiments in the implementation manner, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.
[0023] The specific embodiments of the present utility model are described below with reference to the accompanying drawings. Specific embodiment:
[0025] Reference Figure 1-6, a PCB patch device integrated with placement and welding, including a device body 1, a base plate 101 is fixed at the bottom of the device body 1, a mounting plate 2 is fixed on the top of the base plate 101, a pad 203 is fixed on the top of the mounting plate 2, a plurality of flat L-plates 201 are slidably connected to the top of the mounting plate 2, wing vertical plates 202 are fixed on both sides of the flat L-plate 201, an end screw 204 is fixed to the inner wall of the wing vertical plate 202 at one end, and an end screw 204 is slidably connected to the inner wall of the wing vertical plate 202 at the other end, a force supply spring 205 is provided on the surface of the end screw 204, and the other end of the end screw 204 is threadedly connected to an auxiliary plate 206, an eccentric wheel 207 is provided on the top of the base plate 101, and the PCB patch device integrated with placement and welding usually performs welding and placement operations. Using clamps on the upper and lower edges to apply pressure to the PCB to secure it is generally effective when handling new, unassembled PCBs. However, for PCBs that have undergone one or more soldering operations, electrical components or supporting circuits are already installed on the top and bottom. The presence of these components makes it challenging to secure the PCB again. Due to the irregular shapes and height differences of electrical components, the pressure applied by the clamps can cause the PCB to be unstable and unstable, which in turn causes a series of problems during the subsequent soldering and mounting processes. When the PCB is not stable and stable, it will be subjected to uneven pressure during the soldering process. This uneven pressure distribution can cause the PCB to bend or twist, thus affecting the soldering process. The problem of poor soldering or cold soldering is that the soldering head cannot be aligned with the soldering pad on the PCB board. If the PCB board is offset or twisted due to uneven fixation, the soldering head cannot be aligned with the soldering pad accurately, resulting in poor soldering or cold soldering. The problem is solved by installing the flat L-plate 201. Before production starts, the staff installs a diameter-increasing piece of appropriate size on the circumference of the eccentric wheel 207. When the staff needs to mount and solder the PCB board, the PCB board is transferred to the pad 203. The eccentric wheel 207 is started to rotate, and the position of the eccentric wheel 207 with the largest diameter squeezes the auxiliary plate 206 and the flat L-plate 201 near one end of the auxiliary plate 206 in the direction away from each other. Due to the pulling of the auxiliary plate 206, the flat L-plate 201 away from one end of the auxiliary plate 206 is pulled toward the flat L-plate 201 near one end of the auxiliary plate 206, so that multiple flat L-plates 201 gather toward the center to clamp the PCB board, so that the PCB board can be fixed from both sides. At the same time, since the contact area between the flat L-plate 201 and the PCB board is large, the PCB board can be better fixed during processing to prevent it from being damaged. When the processing is completed, the eccentric wheel 207 rotates, and the force spring 205 releases its elastic potential energy.At the same time, due to the restriction of the eccentric wheel 207, the multiple L-shaped plates 201 are slowly pushed away in the direction of separation, thereby achieving the effect of increasing the applicable range of the equipment.
[0026] The top of the base plate 101 is provided with a sinking groove 3, the inner wall of which is fixed with an output motor 301, the output end of the output motor 301 is fixed with an active worm 302, the surface of the active worm 302 is meshed with a driven worm gear 303, the bottom of the driven worm gear 303 is rotatably connected to the top of the base plate 101, and the top of the driven worm gear 303 is fixed to the bottom of the eccentric wheel 207. Since the force supply spring 205 is compressed when subjected to pressure, this compression will cause a reverse driving force to be generated along the flat L plate 201, and this reverse driving force will act on the eccentric wheel 207, causing it to rotate. The rotation of wheel 207 further affects the position and posture of the L-shaped plate 201. The rotation of eccentric wheel 207 causes a slight shift or tilt of the L-shaped plate 201, which can disrupt its originally stable fixed state. When the PCB board cannot maintain a stable fixed state, it may experience inaccurate positioning, shaking, or even falling off during subsequent processing or testing. This problem is solved by installing an active worm 302. The worm gear and worm gear are combined to achieve self-locking properties in the drive assembly, preventing the assembly from rotating and thus improving the yield rate. A top ladder groove 4 is provided at the top of the mounting plate 2. A ladder slide 401 is slidably connected to the inner wall of the top ladder groove 4. The top of the ladder slide 401 is fixed to the bottom of the L-shaped plate 201. The combination of the top ladder groove 4 and the ladder slide 401 prevents the assembly from slipping, forcing the assembly to move only along a predetermined track, thereby improving the stability of the device. Flat wings 402 are fixed to both sides of the auxiliary plate 206. The surface of the flat wings 402 is slidably connected to the inner wall of the device body 1, improving the yield rate. A bottom tie triangle 403 is fixed along the bottom of the flat L-shaped plate 201 to increase the device's service life. Side members 5 are fixed to both sides of the device body 1 to improve device stability. Handle slots 501 are provided on one side of the side members 5 to facilitate handling and enhance the user experience.
[0027] The working principle of the utility model is as follows: before the start of production, the staff installs a diameter increasing piece of a suitable size on the circumference of the eccentric wheel 207. When the staff needs to mount and solder a PCB board, the PCB board is transferred to the pad 203, and then the eccentric wheel 207 is started to rotate, so that the position of the eccentric wheel 207 with the largest diameter squeezes the auxiliary plate 206 and the flat L-shaped plate 201 near one end of the auxiliary plate 206 in a direction away from each other. Due to the pulling of the auxiliary plate 206, the flat L-shaped plate 201 away from one end of the auxiliary plate 206 is pushed towards the auxiliary plate. The flat L-plate 201 at one end of 206 is pulled, so that multiple flat L-plates 201 gather toward the center to clamp the PCB board, so that the PCB board can be fixed from both sides. At the same time, since the contact area between the flat L-plate 201 and the PCB board is large, the PCB board can be better fixed during processing to prevent it from being damaged. When the processing is completed, the eccentric wheel 207 rotates, and the force spring 205 releases its elastic potential energy. At the same time, due to the restriction of the eccentric wheel 207, the multiple flat L-plates 201 are slowly pushed away in the direction of separation.
[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0029] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.
Claims
1. A PCB mounting device with integrated mounting and welding, comprising a device body (1), a substrate (101) being fixed at the bottom of the device body (1), characterized in that: A mounting plate (2) is fixed on the top of the base plate (101), a pad (203) is fixed on the top of the mounting plate (2), a plurality of L-shaped plates (201) are slidably connected to the top of the mounting plate (2), wing vertical plates (202) are fixed on both sides of the L-shaped plates (201), an end screw (204) is fixed to the inner wall of the wing vertical plate (202) at one end, and an end screw (204) is slidably connected to the inner wall of the wing vertical plate (202) at the other end, a force supply spring (205) is provided on the surface of the end screw (204), and the other end of the end screw (204) is threadedly connected to an auxiliary plate (206), and an eccentric wheel (207) is provided on the top of the base plate (101).
2. The PCB mounting equipment with integrated mounting and welding according to claim 1, characterized in that: A sinking groove (3) is provided at the top of the base plate (101), an output motor (301) is fixed to the inner wall of the sinking groove (3), an active worm (302) is fixed to the output end of the output motor (301), a driven worm wheel (303) is meshed on the surface of the active worm wheel (302), the bottom of the driven worm wheel (303) is rotatably connected to the top of the base plate (101), and the top of the driven worm wheel (303) is fixed to the bottom of the eccentric wheel (207).
3. The PCB mounting equipment with integrated mounting and welding according to claim 1, characterized in that: A top ladder groove (4) is provided on the top of the mounting plate (2); a ladder slide (401) is slidably connected to the inner wall of the top ladder groove (4); and the top of the ladder slide (401) is fixed to the bottom of the flat L-plate (201).
4. The PCB mounting equipment with integrated mounting and welding according to claim 1, characterized in that: Flat wing plates (402) are fixed on both sides of the auxiliary plate (206), and the surfaces of the flat wing plates (402) are slidably connected to the inner wall of the device body (1).
5. The PCB mounting equipment with integrated mounting and welding according to claim 1, characterized in that: A bottom connecting triangle (403) is fixed to the bottom of the flat L-plate (201).
6. The PCB mounting equipment with integrated mounting and welding according to claim 1, characterized in that: Side parts (5) are fixed on both sides of the equipment main body (1).
7. The PCB mounting equipment with integrated mounting and welding according to claim 6, characterized in that: A hand-carrying slot (501) is provided on one side of the side member (5).