Jig for cracking ITO (indium tin oxide) waste edge of TFT (thin film transistor) product

Abstract

The utility model relates to the technical field of jigs, in particular to a jig for cracking ITO (indium tin oxide) slitter edges of TFT (thin film transistor) products, which is characterized in that a cracking platform is arranged on a jig base, a cracking portal frame is arranged on one side of the cracking platform, a positioning column is arranged on the other side of the cracking platform, and a waste collecting box is arranged below the cracking portal frame; the splitting portal frame comprises a splitting cross beam, and a horizontal splitting groove is formed in the splitting cross beam; and the depth of the splitting groove is smaller than the width of the ITO slitter edge. Compared with the prior art, the jig for cracking the ITO slitter edge of the TFT product can effectively solve the problem that the slitter edge scratches an ITO circuit due to manual piece cracking, reduces the risk of product failure caused by scratching, improves the quality and competitiveness of the product, and is beneficial to production.

Description

Technical field

[0001] The utility model relates to the technical field of jigs, in particular to a jig for treating cracked ITO waste edges of TFT products. [Background Technology]

[0002] In the prior art, the scrap edges of cracked ITO in TFT products are usually removed manually. Manual removal can easily cause the scrap edges to scratch the ITO circuits, resulting in product defects or failure, which is not conducive to production. [Utility Model Content]

[0003] In order to overcome the above problems, the present invention proposes a jig for removing cracked ITO waste edges of TFT products that can effectively solve the above problems.

[0004] The utility model provides a technical solution to solve the above-mentioned technical problems: providing a jig for cracking ITO waste edges of TFT products, including a jig base, a cracking platform is provided on the jig base, a cracking gantry is provided on one side of the cracking platform, a positioning column is provided on the other side of the cracking platform, and a waste collection box is provided under the cracking gantry; the cracking gantry includes a cracking beam, and a horizontal cracking groove is provided on the cracking beam; the depth of the cracking groove is less than the width of the ITO waste edge.

[0005] Preferably, a split platform plate is provided on the split platform, a cantilever plate is provided on one side of the split platform plate, and the cantilever plate is located above the opening of the waste collection box.

[0006] Preferably, the split gantry comprises two vertical columns, a main beam is connected between the two columns, and the split beam is arranged on the lower side of the main beam.

[0007] Preferably, one side of the cantilever plate is located below one side of the main beam, and the top surface of the cantilever plate is flush with the bottom surface of the split groove.

[0008] Preferably, the jig base is connected to a gantry base by screws, and the split gantry is fixed to the gantry base by screws.

[0009] Preferably, the gantry base includes two raised connecting platforms, a connecting groove is formed between the two raised connecting platforms, and the bottom end of the column is fixed to the connecting groove.

[0010] Preferably, the splitting platform, splitting gantry and positioning columns are all made of anti-static bakelite.

[0011] Compared with the existing technology, the jig for cracking ITO waste edges of TFT products of the present invention can effectively solve the problem of waste edges scratching ITO circuits due to manual cracking, reduce the risk of product failure caused by scratches, improve product quality and competitiveness, and facilitate production.

Brief Description of the Drawings

[0012] Figure 1 This is an overall diagram of the fixture for cracked ITO waste edges of TFT products of the utility model;

[0013] Figure 2 A three-dimensional diagram of the chip cracking gantry of the jig for cracking ITO scrap edges of TFT products of the utility model;

[0014] Figure 3 A three-dimensional diagram of the gantry base of the fixture for cracked ITO waste edges of TFT products according to the present invention;

[0015] Figure 4 This is a three-dimensional diagram of the cracking platform of the fixture for cracking ITO waste edges of TFT products of the present invention. [Specific implementation method]

[0016] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0017] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are limited to relative positions on a specified view, rather than absolute positions.

[0018] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0019] See also Figures 1 to 4 The jig for cracking ITO waste edges of TFT products of the present invention includes a jig base 10, a cracking platform 20 is provided on the jig base 10, a cracking gantry 30 is provided on one side of the cracking platform 20, a positioning column 50 is provided on the other side of the cracking platform 20, and a waste collection box 60 is provided below the cracking gantry 30.

[0020] The split gantry 30 includes a split beam 33 , and a horizontal split groove 34 is formed on the split beam 33 .

[0021] During the splitting process, the ITO product has cutting lines after being cut by the front-stage cutting wheel, and the waste edge is not broken at this time; a single ITO waste edge product to be split is placed on the splitting platform 20, the left side of the product is aligned with the positioning column 50, the CF side of the product is facing up, and it is moved forward to the splitting gantry 30. At this time, the waste edge is stuck in the splitting groove 34. The other end of the product is lifted, the waste edge is separated from the substrate, and falls into the waste collection box 60, completing the ITO waste edge splitting process.

[0022] The utility model discloses a jig for cracking ITO waste edges of TFT products, which can effectively solve the problem of waste edges scratching ITO circuits due to manual cracking, reduce the risk of product failure caused by scratches, improve product quality and competitiveness, and facilitate production.

[0023] A splitting platform plate 21 is provided on the splitting platform 20 , and a cantilever plate 22 is provided on one side of the splitting platform plate 21 . The cantilever plate 22 is located above the opening of the waste collection box 60 .

[0024] The split gantry 30 includes two vertical columns 31 , a main beam 32 is connected between the two columns 31 , and the split beam 33 is arranged on the lower side of the main beam 32 .

[0025] One side of the cantilever plate 22 is located below one side of the main beam 32, and the top surface of the cantilever plate 22 is flush with the bottom surface of the split groove 34. In this way, when the product is placed on the split platform 20 and pushed toward the split gantry 30, the ITO waste edge can slide smoothly into the split groove 34.

[0026] The depth of the split groove 34 is smaller than the width of the ITO scrap edge, so that the ITO scrap edge is only partially inserted into the split groove 34, thereby preventing the ITO circuit inside the ITO scrap edge from being damaged during splitting.

[0027] The fixture base 10 is connected to a gantry base 70 by screws, and the split gantry 30 is fixed to the gantry base 70 by screws.

[0028] The gantry base 70 includes two protruding connecting platforms 71 , a connecting groove 72 is formed between the two protruding connecting platforms 71 , and the bottom end of the column 31 is fixed to the connecting groove 72 .

[0029] The splitting platform 20, the splitting gantry 30 and the positioning column 50 are all made of anti-static bakelite.

[0030] Compared with the existing technology, the jig for cracking ITO waste edges of TFT products of the present invention can effectively solve the problem of waste edges scratching ITO circuits due to manual cracking, reduce the risk of product failure caused by scratches, improve product quality and competitiveness, and facilitate production.

[0031] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any modifications, equivalent replacements and improvements made within the concept of the present invention should be included in the patent protection scope of the present invention.

Claims

1. A fixture for cracked ITO scrap edges of TFT products, characterized in that: The jig comprises a jig base, wherein a splitting platform is provided on the jig base, a splitting gantry is provided on one side of the splitting platform, a positioning column is provided on the other side of the splitting platform, and a waste collection box is provided below the splitting gantry; The split gantry includes a split beam, and a horizontal split groove is formed on the split beam; The depth of the crack groove is smaller than the width of the ITO waste edge.

2. The jig for cracking ITO scrap edges of TFT products according to claim 1, characterized in that: A split platform plate is provided on the split platform, and a cantilever plate is provided on one side of the split platform plate. The cantilever plate is located above the opening of the waste collection box.

3. The jig for cracking ITO scrap edges of TFT products according to claim 2, characterized in that: The split gantry comprises two vertical columns, a main crossbeam is connected between the two columns, and the split crossbeam is arranged on the lower side of the main crossbeam.

4. The jig for cracking ITO scrap edges of TFT products according to claim 3, characterized in that: One side of the cantilever plate is located below one side of the main beam, and the top surface of the cantilever plate is flush with the bottom surface of the split groove.

5. The jig for cracking ITO scrap edges of TFT products as claimed in claim 3, characterized in that: The fixture base is connected to a gantry base via screws, and the split gantry is fixed to the gantry base via screws.

6. The jig for cracking ITO scrap edges of TFT products according to claim 5, characterized in that: The gantry base includes two protruding connecting platforms, a connecting groove is formed between the two protruding connecting platforms, and the bottom end of the column is fixed to the connecting groove.

7. The jig for cracking ITO scrap edges of TFT products according to claim 1, characterized in that: The split platform, the split gantry and the positioning column are all made of anti-static bakelite.

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