Semiconductor material cutting device
Through the innovative design of semiconductor material cutting devices, the problem of low bottom burr treatment efficiency in traditional cutting methods is solved, and the efficient cutting effect of synchronous cleaning of burrs is achieved.
Patent Information
- Application Number
- CN202422299099.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-20
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-09-20
AI Technical Summary
Under the traditional cutting method, the bottom burr treatment efficiency of semiconductor materials is low, which affects the cutting efficiency.
The semiconductor material cutting device is used to fix the material by clamping the placement part and locking screws, and the cutting material is cut in combination with the inner wall mounting groove, transfer screw, through groove, moving plate, front and rear screw, screw motor and cutting disk, and the burrs on the bottom surface of the cut are synchronized by using the bottom polishing disk.
It realizes synchronous cleaning of the burrs on the bottom of the cut during the cutting process, improving cutting efficiency and quality.
Smart Images
Figure CN223199288U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor processing, in particular to a semiconductor material cutting device. Background Art
[0002] Semiconductors, materials with electrical conductivity between conductors and insulators at room temperature, are widely used in high-tech industries, such as consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. The initial processing of semiconductors is inseparable from the cutting of materials. The traditional cutting method uses a diamond cutting disc to cut the plate material.
[0003] When cutting, burrs usually appear on the lower surface of the material. The burrs generated during the upper surface processing are easier to handle, but the bottom is more troublesome to handle. If the entire material is removed for processing, it will affect the cutting efficiency. Utility Model Content
[0004] In view of the problems existing in the prior art, the utility model discloses a semiconductor material cutting device, which adopts the technical solution of comprising a cutting box, a base, side rails, a pull-out plate, a locking screw, a material clamping and placing portion, an inner wall mounting groove, a transfer screw, a rear through-groove, a moving plate, a front and rear screws, a screw motor, a lower T-shaped seat, an upper T-shaped seat, an adjustable mounting structure, an upper L-shaped mounting frame, a lower L-shaped mounting frame, an electrical box, a cutting disc and a bottom grinding disc. The base is fixed to the bottom of the cutting box, side rails are arranged on the left and right side walls of the cutting box, and the left and right side walls of the pull-out plate are provided with a plurality of screws. The right end is placed through the side track, and the position of the pull-out plate is locked by the locking screw that is installed in conjunction with the outer wall of the cutting box and extends into the side track to ensure the stability of the pull-out plate when the material is cut inside. A material clamping and placing part is provided on the pull-out plate to clamp and place the material. An inner wall mounting groove is opened on the front side wall inside the cutting box, in which a transfer screw driven by a motor is rotatably installed. This motor is used for external power supply. A rear through-groove is opened on the inner rear side wall. The front end of the moving plate is in the inner wall mounting groove and is installed in conjunction with the transfer screw. The rear side is penetrated from the rear The slot extends out, and the left and right positions of the movable plate can be adjusted under the rotation of the transfer screw to achieve the adjustment of the final cutting position. The rear end of the movable plate is integrally formed with a lower T-shaped seat, and the upper T-shaped seat is installed on the horizontal part of the lower T-shaped seat through an adjustable mounting structure. The front side of the upper T-shaped seat is integrally formed with a plate body, and the plate body and the middle of the movable plate are provided with a front-to-back direction through slots, and the front and back screws are rotatably installed in the lower slot and the upper slot, and the front and back screws are driven by a screw motor. The vertical parts of the upper L-shaped mounting frame and the lower L-shaped mounting frame are respectively located on the upper L-shaped mounting frame. and the groove of the lower L-shaped mounting frame and are installed in cooperation with the forward and backward lead screws in their respective grooves. Electrical boxes are installed on the upper surface of the upper L-shaped mounting frame and the lower surface of the lower L-shaped mounting frame, which have batteries and controllers. The cutting disk is rotatably installed on the left side of the vertical part of the upper L-shaped mounting frame, and the cutting disk is driven by the vertical motor on the right side of the vertical part of the upper L-shaped mounting frame. The bottom grinding disk is rotatably installed on the horizontal part of the lower L-shaped mounting frame and is driven by the motor set on the lower surface of the horizontal part. The bottom surface of the interior of the cutting box is a V-shaped inclined bottom surface, and a leakage groove is opened at the lowest point in the middle of the V-shaped inclined bottom surface.
[0005] As an optimal technical solution of the present invention, an axis is fixed in the front and rear directions of the side track, and through holes are opened in the front and rear directions of the left and right sides of the pull-out plate. The pull-out plate is movably mounted on the axis through the through holes. This structure can improve the stability of the pull-out plate during movement.
[0006] As an optimal technical solution of the present invention, the material clamping and placing part includes positioning screws, an L-shaped shelf plate and pull-out plate screw holes. Pull-out plate screw holes are opened on the front and back sides of the pull-out plate. The front and rear ends of the horizontal part of the L-shaped shelf plate are cooperated to install positioning screws. The positioning screws are installed in cooperation with the pull-out plate screw holes to fix the position of the L-shaped shelf plate.
[0007] As an optimal technical solution of the present invention, the adjustable mounting structure includes a bidirectional screw, a fixed shaft and a limit plate. A fixed shaft is fixed on the left side of the horizontal part of the upper T-shaped seat. The upper T-shaped seat is movably connected to the fixed shaft. The adjusting screw is rotatably installed on the right side of the horizontal part of the lower T-shaped seat. The horizontal part of the upper T-shaped seat is installed in cooperation with the adjusting screw, and the upper end of the adjusting screw is integrally formed with a limit plate.
[0008] As a preferred technical solution of the present invention, the screw motors installed on the rear sides of the lower T-shaped seat and the upper T-shaped seat are externally connected to a power supply and are controlled by a synchronous controller.
[0009] The beneficial effects of the present invention are as follows: the plate material is placed and clamped by the material clamping and placing portion, and then the pull-out plate is sent into the cutting box and fixed in position by the locking screw, and the semiconductor material is cut at different positions through the inner wall mounting groove, transfer screw, rear through groove, movable plate, front and rear screws, screw motor and cutting disc, and the movement of the lower L-shaped mounting frame and the upper L-shaped mounting frame is synchronized, ensuring that the burrs on the bottom surface of the incision are directly cleaned by the bottom grinding disc during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 This is a schematic diagram of the structure of the utility model;
[0011] Figure 2 This is a schematic diagram of the right side cross-sectional structure of the present invention;
[0012] Figure 3 It is a schematic diagram of the top cross-sectional structure of the present utility model.
[0013] In the figure: cutting box 1, base 2, side rails 3, pull-out plate 4, locking screw 6, positioning screw 7, L-shaped shelf 8, pull-out plate screw hole 9, inclined bottom surface 10, leakage groove 11, inner wall mounting groove 12, transfer screw 13, rear through groove 14, movable plate 15, front and rear screw 16, screw motor 161, lower T-shaped seat 17, upper T-shaped seat 18, bidirectional screw 19, fixed shaft 20, limit plate 21, upper L-shaped mounting frame 22, lower L-shaped mounting frame 221, electrical box 23, cutting disk 24, bottom grinding disk 25. DETAILED DESCRIPTION
[0014] Example 1
[0015] like Figures 1 to 3As shown, the utility model discloses a semiconductor material cutting device, which adopts the technical solution of comprising a cutting box 1, a base 2, a side rail 3, a pull-out plate 4, a locking screw 6, a material clamping and placing portion, an inner wall mounting groove 12, a transfer screw 13, a rear through-groove 14, a movable plate 15, a front and rear screw 16, a screw motor 161, a lower T-shaped seat 17, an upper T-shaped seat 18, an adjustable mounting structure, an upper L-shaped mounting frame 22, a lower L-shaped mounting frame 221, an electrical box 23, a cutting disc 24 and a bottom grinding disc 25. The base 2 is fixed to the bottom of the cutting box 1, and side rails 3 are provided on the left and right side walls of the cutting box 1. The left and right ends of the pull-out plate 4 are moved by the side rails 3. Placement, the position of the pull-out plate 4 is locked by the locking screw 6 that cooperates with the outer wall of the cutting box 1 and extends to the locking screw 6 in the side rail 3. The pull-out plate 4 is provided with a material clamping and placing portion. The inner front side wall of the cutting box 1 opens an inner wall mounting groove 12, in which a transfer screw 13 driven by a motor is rotatably installed. The inner rear side wall opens a rear side through-groove 14. The front end of the movable plate 15 is in the inner wall mounting groove 12 and is installed in conjunction with the transfer screw 13, and the rear side extends out from the rear through-groove 14. The rear end of the movable plate 15 is integrally formed with a lower T-shaped seat 17. The upper T-shaped seat 18 is installed on the horizontal part of the lower T-shaped seat 17 through an adjustable mounting structure. The front side of the upper T-shaped seat 18 is integrally formed There is a plate body, and the middle part of the plate body and the movable plate 15 are both provided with a groove running through in the front-back direction. The front-back screw 16 is rotatably installed in the lower groove and the upper groove, and the front-back screw 16 is driven by the screw motor 161. The vertical parts of the upper L-shaped mounting frame 22 and the lower L-shaped mounting frame 221 are respectively in the grooves of the upper L-shaped mounting frame 22 and the lower L-shaped mounting frame 221 and are installed in conjunction with the front-back screw 16 in their respective grooves. The upper surface of the upper L-shaped mounting frame 22 and the lower surface of the lower L-shaped mounting frame 221 are both installed with an electrical box 23, which has a battery and a controller. The control method of this controller can be remotely controlled. The left side of the vertical part of the upper L-shaped mounting frame 22 is rotated. A cutting disc 24 is installed, and the cutting disc 24 is a diamond cutting disc. The cutting disc 24 is driven by a vertical motor on the right side of the vertical part of the upper L-shaped mounting frame 22. A bottom grinding disc 25 is rotatably installed on the horizontal part of the lower L-shaped mounting frame 221, and is driven by a motor set on the lower surface of the horizontal part. The position of the bottom grinding disc 25 is staggered with the position of the cutting disc 24. During the cutting process, the bottom grinding disc 25 is used to deburr the bottom of the incision of the completed cut part. The inner bottom surface of the cutting box 1 is a V-shaped inclined bottom surface 10. A leakage groove 11 is opened at the lowest point in the middle of the V-shaped inclined bottom surface 10. Under the guidance of the inclined bottom surface 10, the debris generated during the cutting process can be discharged from the leakage groove 11.
[0016] As an optimal technical solution of the present invention, an axis is fixed in the front-to-back direction of the side rail 3, and through holes 5 are opened in the front-to-back direction on the left and right sides of the pull-out plate 4. The pull-out plate 4 is movably mounted on the axis through the through holes 5 to improve the stability of the movement of the pull-out plate 4.
[0017] As an optimal technical solution of the present invention, the material clamping and placing portion is that pull-out plate screw holes 9 are opened on the front and rear sides of the pull-out plate 4, and positioning screws 7 are installed at the front and rear ends of the horizontal part of the L-shaped shelf plate 8. The positioning screws 7 are installed in conjunction with the pull-out plate screw holes 9 to fix the position of the L-shaped shelf plate 8.
[0018] As a preferred technical solution of the present invention, the specific setting method of the adjustable mounting structure is that a fixed shaft 20 is fixed on the left side of the horizontal part of the upper T-shaped seat 18, the upper T-shaped seat 18 is movably connected to the fixed shaft 20, and the adjusting screw 19 is rotatably installed on the right side of the horizontal part of the lower T-shaped seat 17. The horizontal part of the upper T-shaped seat 18 is installed in coordination with the adjusting screw 19, and the upper end of the adjusting screw 19 is integrally formed with a limit plate 21.
[0019] As a preferred technical solution of the present invention, the screw motors 161 installed on the rear side of the lower T-shaped seat 17 and the upper T-shaped seat 18 are connected to an external power supply and controlled by a synchronous controller so that the two screw motors 161 can operate synchronously.
[0020] The working principle of the present invention is as follows: when in use, the pull-out plate 4 is pulled out to adjust and fix the position of the L-shaped shelf plate 8 according to the specifications of the plate material, the L-shaped shelf plate 8 is used to place and clamp the plate body, and then the pull-out plate 4 is pushed into the cutting box 1 and the position of the pull-out plate 4 is locked by the locking screw 6. During the cutting process, the transfer screw 13 is driven by the motor, and the screw motor 161 drives the forward and backward screw 16 to rotate to adjust the cutting position. The upper L-shaped mounting frame 22 and the lower L-shaped mounting frame 221 move so that the burrs generated on the bottom surface at the cutting position can be processed by the bottom grinding disc 25 while cutting.
[0021] Components not described in detail herein are prior art.
[0022] Although the specific embodiments of the present invention are described in detail above, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by ordinary technicians in this field, various changes can be made without departing from the purpose of the present invention. Modifications or deformations that do not involve creative work are still within the scope of protection of the present invention.
Claims
1. A semiconductor material cutting device, comprising a cutting box (1) and a base (2), characterized in that: The cutting box (1) comprises a side rail (3), a pull-out plate (4), a locking screw (6), a material clamping and placing portion, an inner wall mounting groove (12), a transfer screw (13), a rear through groove (14), a moving plate (15), a front and rear screw (16), a screw motor (161), a lower T-shaped seat (17), an upper T-shaped seat (18), an adjustable mounting structure, an upper L-shaped mounting frame (22), a lower L-shaped mounting frame (221), an electrical box (23), a cutting disc (24) and a bottom grinding disc (25); the bottom of the cutting box (1) is fixed with a base (2); the left and right side walls inside the cutting box (1) are provided with side rails ( 3), the left and right ends of the pull-out plate (4) are placed through the side rails (3); the position of the pull-out plate (4) is locked by the locking screw (6) which is installed in conjunction with the outer wall of the cutting box (1) and extends into the locking screw (6) in the side rails (3); the pull-out plate (4) is provided with a material clamping and placing portion; the inner front side wall of the cutting box (1) is provided with an inner wall mounting groove (12), in which a transfer screw (13) driven by a motor is rotatably installed, and the inner rear side wall is provided with a rear through groove (14); the front end of the movable plate (15) is located in the inner wall mounting groove (12) and is installed in conjunction with the transfer screw (13), and the rear side is provided with a material clamping and placing portion; The rear side of the movable plate (15) extends through the slot (14); the rear end of the movable plate (15) is integrally formed with a lower T-shaped seat (17); the horizontal part of the lower T-shaped seat (17) is mounted with an upper T-shaped seat (18) through an adjustable mounting structure; the front side of the upper T-shaped seat (18) is integrally formed with a plate body; the plate body and the middle of the movable plate (15) are both provided with slots running through in the front-back direction; the front-back screws (16) are rotatably mounted in the lower slot and the upper slot; the front-back screws (16) are driven by a screw motor (161); the vertical parts of the upper L-shaped mounting frame (22) and the lower L-shaped mounting frame (221) are respectively located on the upper L-shaped mounting frame (2 2) and the groove of the lower L-shaped mounting frame (221) and are installed in cooperation with the forward and backward lead screws (16) in their respective grooves; the upper surface of the upper L-shaped mounting frame (22) and the lower surface of the lower L-shaped mounting frame (221) are both installed with an electrical box (23), which contains a battery and a controller; the left side of the vertical part of the upper L-shaped mounting frame (22) is rotatably installed with a cutting disk (24), and the cutting disk (24) is driven by a vertical motor on the right side of the vertical part of the upper L-shaped mounting frame (22); the horizontal part of the lower L-shaped mounting frame (221) is rotatably installed with a bottom grinding disk (25), which is driven by a motor arranged on the lower surface of the horizontal part.
2. The semiconductor material cutting device according to claim 1, characterized in that: An axle body is fixed in the front-to-back direction in the side rail (3), and through holes (5) are opened in the front-to-back direction on the left and right sides of the pull-out plate (4), and the pull-out plate (4) is movably sleeved on the axle body through the through holes (5).
3. The semiconductor material cutting device according to claim 1, characterized in that: The material clamping and placing portion comprises a positioning screw (7), an L-shaped shelf plate (8) and a pull-out plate screw hole (9); the pull-out plate screw holes (9) are provided on the front and rear sides of the pull-out plate (4); the positioning screws (7) are installed in conjunction with the front and rear ends of the horizontal part of the L-shaped shelf plate (8), and the positioning screws (7) are installed in conjunction with the pull-out plate screw holes (9) to fix the position of the L-shaped shelf plate (8).
4. The semiconductor material cutting device according to claim 1, characterized in that: The inner bottom surface of the cutting box (1) is a V-shaped inclined bottom surface (10), and a drain groove (11) is provided at the lowest point in the middle of the V-shaped inclined bottom surface (10).
5. The semiconductor material cutting device according to claim 1, characterized in that: The adjustable mounting structure comprises an adjusting screw (19), a fixed shaft (20) and a limit plate (21); the fixed shaft (20) is fixed on the left side of the horizontal part of the upper T-shaped seat (18), and the upper T-shaped seat (18) and the fixed shaft (20) are movably sleeved; the adjusting screw (19) is rotatably mounted on the right side of the horizontal part of the lower T-shaped seat (17), and the horizontal part of the upper T-shaped seat (18) is mounted in conjunction with the adjusting screw (19), and the upper end of the adjusting screw (19) is integrally formed with the limit plate (21).
6. The semiconductor material cutting device according to claim 1, characterized in that: The screw motor (161) installed at the rear side of the lower T-shaped seat (17) and the upper T-shaped seat (18) is externally connected to a power supply and is controlled by a synchronous controller.