Exhaust assembly and vapor deposition device

Abstract

The utility model provides an exhaust assembly and a vapor deposition device. The exhaust assembly comprises an annular first exhaust ring, a hole blocking part and a lifting mechanism. A plurality of first exhaust holes are formed in the first exhaust ring; the hole blocking part comprises a bearing ring and a plurality of air hole plugs, the bearing ring is arranged below the first exhaust ring, and the air hole plugs are arranged on the bearing ring and protrude out of the surface of the bearing ring; the lifting mechanism is used for driving the bearing ring to ascend or descend so that the air hole plug can plug or partially plug the first exhaust hole. According to the exhaust assembly and the vapor deposition device, the hole blocking component is driven by the lifting assembly to be close to or far away from the first exhaust ring to change the ventilation area of the first exhaust hole, and the air resistance of the first exhaust hole is changed by adjusting the relative position of the hole blocking component and the first exhaust ring according to different technological process requirements; air resistance adjustment of the first exhaust hole can be achieved without disassembling the reaction cavity, dynamic adjustment can be achieved in the technological process, and the adjustment efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, in particular to an exhaust component and a vapor deposition device. Background Art

[0002] In the reaction chamber of the vapor deposition equipment, a gas supply device is provided on the top for supplying reaction gas into the reaction chamber, and a base is also provided in the reaction chamber for supporting multiple wafers.

[0003] During the reaction, the base drives the wafer to rotate in the reaction chamber. In order to improve the uniformity of the reaction results on the surfaces of each wafer, it is necessary to ensure that the reaction gas flowing out of the gas supply device flows smoothly through the surfaces of each wafer in a laminar flow manner. To ensure that the gas flow remains stable in a laminar state, the reaction chamber needs to improve its sealing to prevent the internal reaction gas flow from being affected by the outside of the reaction chamber.

[0004] An annular exhaust assembly is provided between the base and the inner wall of the reaction chamber. The exhaust assembly is provided with exhaust holes for discharging the reaction gas after the reaction out of the reaction chamber. After the existing exhaust assembly is installed in the reaction chamber, the aperture of the exhaust hole is fixed, and the overall air resistance and sealing of the exhaust assembly are also determined. However, different reaction processes have different requirements for the air resistance and sealing of the exhaust assembly. The existing exhaust assembly cannot be well adapted to the requirements of different process processes for the exhaust assembly. In order to ensure the best reaction results, the reaction chamber needs to be disassembled and replaced with different exhaust assemblies, which has the disadvantage of being time-consuming. Utility Model Content

[0005] The utility model aims to provide an exhaust component and a vapor deposition device, which have the advantage that the air resistance of the exhaust component can be adjusted.

[0006] To achieve the above objectives, the present invention provides an exhaust assembly comprising:

[0007] An annular first exhaust ring having a plurality of first exhaust holes formed thereon;

[0008] a hole-blocking component, the hole-blocking component comprising a carrying ring and a plurality of air hole plugs, the carrying ring being annular and disposed parallel to and below the first exhaust ring, the air hole plugs being disposed on the carrying ring and protruding from the surface of the carrying ring, the maximum diameter of the air hole plugs being larger than the diameter of the first exhaust hole, and the centers of the air hole plugs being opposite to the centers of the first exhaust hole;

[0009] A lifting mechanism is connected to the carrying ring, and is used to drive the carrying ring to rise or fall so that the air hole plug blocks or partially blocks the first exhaust hole.

[0010] Optionally, the carrying ring includes multiple sub-fan rings, each of which is provided with the air hole plug, and the multiple sub-fan rings are arranged circumferentially to form a complete carrying ring, and each sub-fan ring is connected to at least one lifting mechanism.

[0011] Optionally, the diameter of the air hole plug decreases monotonically along a direction perpendicular to the surface of the carrying ring and away from the carrying ring.

[0012] Optionally, along the radial direction of the carrying ring and perpendicular to the surface direction of the carrying ring, the cross-sectional shape of the air hole plug is a trapezoid or a triangle.

[0013] Optionally, an angle is formed between the side surface of the air hole plug and the upper surface of the carrying ring, and the angles between each air hole plug and the upper surface of the carrying ring are the same or different.

[0014] Optionally, a vent hole is provided on the carrying ring.

[0015] Optionally, the width of the carrying ring is smaller than the width of the first exhaust ring.

[0016] Optionally, the hole blocking component is made of graphite material and is coated with a silicon carbide layer on the surface.

[0017] Optionally, the lifting mechanism includes a connecting rod and a driving device, and both ends of the connecting rod are respectively connected to the carrying ring and the driving device.

[0018] Optionally, the lifting mechanism further includes a thermal insulation pad, which is arranged between the carrying ring and the connecting rod.

[0019] Optionally, the exhaust assembly further includes an annular second exhaust ring, the second exhaust ring is provided with a plurality of second exhaust holes, and the second exhaust ring is parallel to the first exhaust ring and is arranged above the first exhaust ring.

[0020] Optionally, the number of the second exhaust holes is greater than the first exhaust holes; and / or, the plurality of second exhaust holes are evenly distributed along the circumference of the second exhaust ring.

[0021] Optionally, the exhaust assembly further includes an annular third exhaust ring, the third exhaust ring being provided with a plurality of third exhaust holes, and the third exhaust ring being parallel to the first exhaust ring and being arranged below the first exhaust ring.

[0022] Optionally, the exhaust assembly further includes an annular sleeve, the annular sleeve including an inner ring and an outer ring arranged concentrically, and the first exhaust ring, the second exhaust ring and the third exhaust ring are all arranged between the inner ring and the outer ring.

[0023] Optionally, the number of the third exhaust holes is less than that of the first exhaust holes; and / or, the plurality of third exhaust holes are evenly distributed along the circumference of the third exhaust ring.

[0024] The utility model also provides a vapor deposition device, comprising:

[0025] reaction chamber;

[0026] A base is provided in the reaction chamber, and the base is used to place a wafer;

[0027] a gas supply device connected to the reaction chamber to supply reaction gas into the reaction chamber for processing the wafer;

[0028] As described above, the exhaust assembly is located in the reaction chamber, surrounds the base and is disposed between the base and the inner wall of the reaction chamber. The gas in the reaction chamber is discharged out of the reaction chamber through the exhaust assembly.

[0029] Optionally, the exhaust assembly includes an annular sleeve, the annular sleeve includes an inner ring and an outer ring, the inner ring is arranged around and tightly attached to the base, and the outer ring is tightly attached to the inner wall of the reaction chamber.

[0030] In summary, compared with the prior art, the exhaust assembly and vapor deposition device provided by the present invention have the following beneficial effects:

[0031] The exhaust assembly and vapor deposition device of the present invention drive the hole-blocking component to move closer to or away from the first exhaust ring through the lifting assembly to achieve a change in the ventilation area of the first exhaust hole. The hole-blocking component can completely block or completely open the linear first exhaust hole at the two extreme positions. The relative positions of the hole-blocking component and the first exhaust ring can be adjusted according to different process requirements to change the gas resistance of the first exhaust hole. The gas resistance of the first exhaust hole can be adjusted without disassembling the reaction chamber, and dynamic adjustment can be achieved during the process to improve adjustment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the structure of a vapor deposition device with an exhaust component.

[0033] Figure 2 This is a schematic structural diagram of a vapor deposition device with an exhaust assembly according to the present invention.

[0034] Figure 3 This is a schematic structural diagram of the sub-fan ring with an exhaust assembly of the present invention.

[0035] Figure 4 It is a cross-sectional schematic diagram of the vapor deposition device of the present invention.

[0036] Figure 5 This is a schematic top view of the vapor deposition device of the present invention.

[0037] Description of reference numerals:

[0038] Vapor deposition device 10

[0039] Reaction chamber 110

[0040] Base 120

[0041] Gas supply device 130

[0042] Exhaust assembly 140

[0043] Exhaust assembly 20

[0044] First exhaust ring 210

[0045] Hole blocking component 220

[0046] Carrying ring 221

[0047] Sub-sector ring 2211

[0048] Air hole plug 222

[0049] Lifting mechanism 230

[0050] Connecting rod 231

[0051] Drive device 232

[0052] Thermal insulation pad 240

[0053] Second exhaust ring 250

[0054] Third exhaust ring 260

[0055] Ring sleeve 270

[0056] Inner ring 271

[0057] Outer ring 272

[0058] Vapor deposition device 30

[0059] Reaction chamber 310

[0060] Base 320

[0061] Gas supply device 330 DETAILED DESCRIPTION

[0062] The following will be combined with the appended examples in the embodiment of the present invention Figure 1 ~Attached Figure 5 , the technical solutions, structural features, achieved objectives and effects in the embodiments of the present utility model are described in detail.

[0063] It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the implementation methods of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in the present invention without affecting the efficacy and purpose that can be achieved by the present invention.

[0064] It should be noted that, in the present invention, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus comprising a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0065] Figure 1 The figure shows a vapor deposition device 10, which includes a reaction chamber 110, a base 120, a gas supply device 130 and an exhaust assembly 140. The base 120 is arranged in the reaction chamber 110 for carrying wafers. The gas supply device 130 is arranged opposite to the base 120 and is located above the base 120, and is used to supply reaction gas to the reaction chamber 110. The exhaust assembly 140 is arranged around the base 120 and is used to discharge the gas in the reaction chamber 110 out of the reaction chamber 110. The exhaust assembly 140 is provided with an exhaust hole with a fixed aperture, and the overall air resistance and sealing of the exhaust assembly 140 are determined by the aperture of the exhaust hole. However, different reaction processes have different requirements for the air resistance and sealing of the exhaust assembly 140. The exhaust assembly 140 with a fixed aperture exhaust hole cannot meet the requirements of different process processes for the exhaust assembly 140. In order to ensure better reaction results, the reaction chamber 110 needs to be disassembled to replace different exhaust assemblies 140, which is time-consuming and inefficient.

[0066] In order to solve the above technical problems, the present invention provides an exhaust assembly 20, such as Figure 4 As shown, it is arranged in the reaction chamber 310 of the vapor deposition device 30. Figure 4 As shown, the exhaust assembly 20 includes an annular first exhaust ring 210, a hole-blocking member 220, and a lifting mechanism 230. The first exhaust ring 210 is provided with a plurality of first exhaust holes (not shown) arranged circumferentially. The first exhaust holes serve as gas channels for exhausting gas out of the reaction chamber 310 through the first exhaust holes.

[0067] like Figure 2 As shown, the hole plugging component 220 includes a carrying ring 221 and a plurality of air hole plugs 222 (such as Figure 3 (As shown). The carrier ring 221 is annular and is disposed parallel to and below the first exhaust ring 210. The air vent plug 222 is disposed on the carrier ring 221 and protrudes from the surface of the carrier ring 221. The maximum diameter of the air vent plug 222 is larger than the diameter of the first exhaust hole, and the center of the air vent plug 222 is opposite the center of the first exhaust hole. The carrying ring 221 can move in a direction perpendicular to the plane where the first exhaust ring 210 is located. When it is necessary to increase the air resistance of the first exhaust hole or even block the first exhaust hole, the carrying ring 221 is driven to move upward, and the air pore plug 222 gradually approaches the first exhaust hole but does not completely close the first exhaust hole. At this time, the first exhaust hole can still conduct air but the air resistance becomes larger than when the air pore plug 222 is away from the first exhaust hole. As the carrying ring 221 gradually approaches the first exhaust ring 210, the air pore plug 222 is closer and closer to the first exhaust hole, and the air resistance of the first exhaust hole gradually increases until the air pore plug 222 completely blocks the first exhaust hole. At this time, the first exhaust hole is completely closed and the gas cannot flow through the first exhaust hole.

[0068] The lifting mechanism 230 is connected to the carrying ring 221 , and is used to drive the carrying ring 221 to rise or fall so that the air hole plug 222 moves away from or blocks or partially blocks the first air hole.

[0069] Furthermore, the carrying ring 221 includes a plurality of sub-sector rings 2211. Figure 3 One of the sub-fan rings 2211 is shown. Multiple sub-fan rings 2211 are arranged along the circumference to form a complete bearing ring 221. Each sub-fan ring 2211 is connected to at least one lifting mechanism 230. The lifting mechanism 230 can independently control the lifting of each sub-fan ring 2211, and each sub-fan ring 2211 is provided with an air hole plug 222. When it is necessary to adjust the air resistance of the first exhaust hole along the circumference of the base 320, the position of each sub-fan ring 2211 is adjusted accordingly to achieve partitioned adjustment of the air resistance along the circumference of the base 320. It should be noted that Figure 3 Taking the central angle of the sub-fan ring 2211 as 90° as an example, four sub-fan rings 2211 can be assembled into a complete supporting ring 221; the central angle of the sub-fan ring 2211 is not limited to 90°, and can be 60°, 120°, 180° or other angles. It is also possible to use multiple sub-fan rings 2211 with different central angles, such as 90°+270°, which is not limited here.

[0070] In this embodiment, the diameter of the pore plug 222 decreases monotonically along the direction perpendicular to the surface of the carrying ring 221 and away from the carrying ring 221, that is, the diameter of the pore plug 222 is largest at one end close to the carrying ring 221, and the diameter of the pore plug 222 is smaller the further away from the carrying ring 221. The smallest diameter of the pore plug 222 is smaller than the diameter of the first exhaust hole. When the first exhaust hole is completely blocked, a portion of the pore plug 222 extends into the first exhaust hole, and the side edge of the pore plug 222 abuts against the lower edge of the first exhaust hole to achieve the blocking of the first exhaust hole. With such an arrangement, the lifting mechanism 230 can achieve a finer adjustment of the gap between the pore plug 222 and the first exhaust hole when driving the carrying ring 221 to move, that is, achieve a fine adjustment of the air resistance of the first exhaust hole.

[0071] In other embodiments, the air hole plug 222 may also be configured as a cylindrical plug with equal diameters at the top and bottom.

[0072] In this embodiment, Figure 3 As shown, along the radial direction of the carrying ring 221 and perpendicular to the surface direction of the carrying ring 221 , the cross-section of the air hole plug 222 is a trapezoid.

[0073] In other embodiments, the cross-sectional shape of the air hole plug 222 along the radial direction of the carrying ring 221 and perpendicular to the surface of the carrying ring 221 may also be a triangle.

[0074] In this embodiment, there is an angle between the side surface of the air pore plug 222 and the upper surface of the carrying ring 221. The angles between each air pore plug 222 and the upper surface of the carrying ring 221 are the same, and the shapes of each air pore plug 222 are the same. When the carrying ring 221 is driven to move, each air pore plug 222 has the same sealing effect on each first exhaust hole, thereby improving the uniformity of the air pressure at various locations in the reaction chamber 310.

[0075] In other embodiments, the angles between each pore plug 222 and the upper surface of the carrier ring 221 may also be different. The different angles between each pore plug 222 and the upper surface of the carrier ring 221, i.e., the shapes of each pore plug 222, are different. This means that when the sub-sector rings 2211 carrying each pore plug 222 are at the same height, each pore plug 222 has a different sealing effect on the first exhaust hole. The shape of each pore plug 222 can be set according to process requirements.

[0076] In this embodiment, a vent hole (not shown) is provided on the carrier ring 221 . The vent hole is provided on the carrier ring 221 to allow gas to flow through the carrier ring 221 .

[0077] The width of the carrier ring 221 may also be set to be smaller than the width of the first exhaust ring 210 , so that gas can flow through the inside or outside of the carrier ring 221 , further reducing the gas resistance of the carrier ring 221 itself.

[0078] In this embodiment, the hole-blocking member 220 is made of graphite with a silicon carbide coating on its surface. Alternatively, the hole-blocking member 220 may be made of quartz. The hole-blocking member 220 made of graphite or quartz can withstand the high temperatures within the reaction chamber 310, preventing damage to the hole-blocking member 220 from high-temperature gas flowing through it.

[0079] Continue as Figure 2 As shown, the lifting mechanism 230 includes a connecting rod 231 and a driving device 232. The two ends of the connecting rod 231 are respectively connected to the support ring 221 and the driving device 232. The output end of the driving device 232 drives the connecting rod 231 to move up and down. The end of the connecting rod 231 away from the driving device 232 is connected to the support ring 221. The driving device 232 drives the support ring 221 in a vertical direction to block the first exhaust hole or open the first exhaust hole. In this embodiment, the driving device 232 is a motor used to drive the support ring 221 up and down. The rotational motion of the motor is converted into linear motion by a gear rack or other mechanism to drive the connecting rod 231 and the support ring 221 to move up and down.

[0080] The drive device 232 is disposed outside the reaction chamber 310. The bottom wall of the reaction chamber 310 has a through-hole for the connecting rod 231 to pass through. This placement of the drive device 232 outside the reaction chamber 310 protects it from damage caused by the high-temperature reaction gases within the reaction chamber 310. A bellows connection between the drive device 232 and the bottom wall of the reaction chamber 310 seals the two, preventing gas from leaking through the through-hole at the bottom of the reaction chamber 310.

[0081] In this embodiment, the lifting mechanism 230 also includes an insulating pad 240, which is disposed between the carrier ring 221 and the connecting rod 231. The high-temperature gas in the reaction chamber 310 transfers heat to the carrier ring 221, causing the temperature of the carrier ring 221 to be higher. To prevent the high temperature in the reaction chamber 310 from being transferred through the carrier ring 221 and the connecting rod 231 to the drive device 232, thereby preventing the drive device 232 from being damaged due to excessive temperature, the insulating pad 240 is disposed between the carrier ring 221 and the connecting rod 231. This reduces the transfer of the high temperature in the reaction chamber 310 from the carrier ring 221 to the connecting rod 231, thereby keeping the drive device 232 away from the high-temperature heat source and reducing the probability of damage to the drive device 232 due to excessive temperature. In addition, the location of the drive device 232 outside the reaction chamber 310 also helps keep it away from the high-temperature heat source in the reaction chamber 310, reducing the probability of damage to the drive device 232 due to excessive temperature.

[0082] The exhaust assembly 20 also includes an annular second exhaust ring 250, which is provided with a plurality of second exhaust holes. When the gas within the reaction chamber 310 is exhausted through the first exhaust ring 210, the pressure near the first exhaust ring 210 decreases. This pressure drop is then transmitted to the interior of the reaction chamber 310, creating a pressure gradient within the reaction chamber 310. To reduce the pressure change within the reaction chamber 310 caused by the exhaust process of the first exhaust ring 210, the second exhaust ring 250 is positioned parallel to and above the first exhaust ring 210. In order for the gas in the reaction chamber 310 to flow out of the reaction chamber 310 through the exhaust assembly 20, it first needs to flow through the second exhaust hole on the second exhaust ring 250 and enter the area between the second exhaust ring 250 and the first exhaust ring 210. After mixing in this area, it flows downward through the first exhaust hole until it flows out of the reaction chamber 310; the area between the first exhaust ring 210 and the second exhaust ring 250 serves as a buffer zone for changes in the air pressure gradient, so that the air pressure change when the gas flows through the first exhaust ring 210 occurs as much as possible in the area between the first exhaust ring 210 and the second exhaust ring 250, thereby reducing the impact of the air pressure change inside the reaction chamber 310.

[0083] The number of second exhaust holes is greater than the number of first exhaust holes, and the plurality of second exhaust holes are evenly distributed along the circumference of the second exhaust ring 250. Providing the plurality of second exhaust holes evenly distributed along the circumference of the second exhaust ring 250 allows the gas within the reaction chamber 310 to flow as evenly as possible through the second exhaust holes into the area between the second exhaust ring 250 and the first exhaust ring 210, thereby reducing the impact of the exhaust process on the uniformity of the gas pressure within the reaction chamber 310.

[0084] In this embodiment, the exhaust assembly 20 also includes an annular third exhaust ring 260, which is provided with a plurality of third exhaust holes. The third exhaust ring 260 is located parallel to and below the first exhaust ring 210. Gas within the reaction chamber 310 flows through the second exhaust ring 250 and the first exhaust ring 210, then flows into the area between the first exhaust ring 210 and the third exhaust ring 260, and finally exits the reaction chamber 310 through the third exhaust holes in the third exhaust ring 260. By placing the third exhaust ring 260 below the first exhaust ring 210, the gas within the reaction chamber 310 does not flow directly out of the reaction chamber 310 after passing through the first exhaust ring 210. Instead, the gas in the reaction chamber 310 acts as a buffer in the area between the first exhaust ring 210 and the third exhaust ring 260, thereby reducing the pressure gradient within the exhaust assembly 20 and mitigating the impact of pressure changes within the reaction chamber 310 caused by the exhaust process.

[0085] In this embodiment, the number of third exhaust holes is less than the number of first exhaust holes, and the multiple third exhaust holes are evenly distributed along the circumference of the third exhaust ring 260. After passing through the first exhaust holes, the gas is located in the space between the first exhaust ring 210 and the third exhaust ring 260. The fewer third exhaust holes than the first exhaust holes reduces the speed of gas flowing through the third exhaust holes, preventing a rapid drop in gas pressure caused by excessive gas flow through the third exhaust ring 260. The provision of the third exhaust ring 260 reduces the impact of the exhaust assembly 20 on pressure changes within the reaction chamber 310 during exhaust.

[0086] The exhaust assembly 20 also includes an annular sleeve 270. The annular sleeve 270 comprises a concentrically arranged inner ring 271 and outer ring 272. Both the inner ring 271 and the outer ring 272 are vertically arranged circular rings, with the inner ring 271 having a smaller diameter than the outer ring 272. The first exhaust ring 210, the second exhaust ring 250, and the third exhaust ring 260 are all disposed between the inner ring 271 and the outer ring 272. The first, second, and third exhaust rings 210, 250, and 260 are horizontal circular rings, each fixedly connected on its inner side to the inner ring 271 of the annular sleeve 270 and on its outer side to the outer ring 272 of the annular sleeve 270.

[0087] The width of the carrier ring 221 can be smaller than the gap between the inner ring 271 and the outer ring 272 of the annular sleeve 270, or can be equal to the gap between the inner ring 271 and the outer ring 272 of the annular sleeve 270. When the width of the carrier ring 221 is equal to the gap between the inner ring 271 and the outer ring 272 of the annular sleeve 270, a vent must be provided on the carrier ring 221 to allow gas to flow through. When the width of the carrier ring 221 is smaller than the gap between the inner ring 271 and the outer ring 272 of the annular sleeve 270, a vent is not required on the carrier ring 221, and gas can flow through the gap between the carrier ring 221 and the inner ring 271 or the outer ring 272 of the annular sleeve 270.

[0088] like Figure 4 and Figure 5 As shown, the present invention also provides a vapor deposition device 30, including a reaction chamber 310, a base 320, a gas supply device 330 and an exhaust component 20. The vapor deposition reaction is carried out in the reaction chamber 310. The base 320 is arranged in the reaction chamber 310, and the base 320 is used to place the wafer. The gas supply device 330 is connected to the reaction chamber 310 to supply reaction gas into the reaction chamber 310, and the reaction gas is used to process the wafer. The exhaust component 20 is located in the reaction chamber 310, surrounds the base 320 and is arranged between the base 320 and the inner wall of the reaction chamber 310, and the gas in the reaction chamber 310 is discharged outside the reaction chamber 310 through the exhaust component 20.

[0089] The exhaust assembly 20 includes an annular sleeve 270, which includes an inner ring 271 and an outer ring 272. The inner ring 271 is arranged around and tightly attached to the base 320, and the outer ring 272 is tightly attached to the inner wall of the reaction chamber 310. If the gas in the reaction chamber 310 wants to be discharged from the reaction chamber 310 through the exhaust assembly 20, it must flow out of the reaction chamber 310 through the first exhaust ring 210 in the exhaust assembly 20; avoid the gas from flowing out through the gap between the annular sleeve 270 and the base 320 or the annular sleeve 270 and the inner wall of the reaction chamber 310, and ensure the regulating effect of the hole blocking component 220 of the exhaust assembly 20 on the air resistance of the first exhaust ring 210.

[0090] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. After reading the above description, various modifications and alternatives to the present invention will be readily apparent to those skilled in the art. Therefore, the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. An exhaust assembly, characterized in that: The exhaust assembly comprises: An annular first exhaust ring having a plurality of first exhaust holes formed thereon; a hole-blocking component, the hole-blocking component comprising a carrying ring and a plurality of air hole plugs, the carrying ring being annular and disposed parallel to and below the first exhaust ring, the air hole plugs being disposed on the carrying ring and protruding from the surface of the carrying ring, the maximum diameter of the air hole plugs being larger than the diameter of the first exhaust hole, and the centers of the air hole plugs being opposite to the centers of the first exhaust hole; A lifting mechanism is connected to the carrying ring, and is used to drive the carrying ring to rise or fall so that the air hole plug blocks or partially blocks the first exhaust hole.

2. The exhaust assembly according to claim 1, wherein The carrying ring includes a plurality of sub-fan rings, each of which is provided with an air hole plug, and the plurality of sub-fan rings are arranged circumferentially to form a complete carrying ring, and each sub-fan ring is connected to at least one lifting mechanism.

3. The exhaust assembly according to claim 1 or 2, wherein: The diameter of the air hole plug decreases monotonically along a direction perpendicular to the surface of the carrying ring and away from the carrying ring.

4. The exhaust assembly according to claim 3, wherein: Along the radial direction of the carrying ring and perpendicular to the surface direction of the carrying ring, the cross-sectional shape of the air hole plug is a trapezoid or a triangle.

5. The exhaust assembly according to claim 4, wherein: An included angle is formed between the side surface of the air hole plug and the upper surface of the carrying ring, and the included angles between each air hole plug and the upper surface of the carrying ring are the same or different.

6. The exhaust assembly according to claim 1, wherein: The carrying ring is provided with a vent hole.

7. The exhaust assembly according to claim 1 or 6, wherein: The width of the carrying ring is smaller than the width of the first exhaust ring.

8. The exhaust assembly according to claim 1, wherein: The hole blocking component is made of graphite material and is coated with a silicon carbide coating on the surface.

9. The exhaust assembly according to claim 1, wherein: The lifting mechanism includes a connecting rod and a driving device, and two ends of the connecting rod are respectively connected to the carrying ring and the driving device.

10. The exhaust assembly of claim 9, wherein: The lifting mechanism further includes a heat-insulating pad, which is arranged between the carrying ring and the connecting rod.

11. The exhaust assembly of claim 1, wherein: The exhaust assembly further includes an annular second exhaust ring, the second exhaust ring being provided with a plurality of second exhaust holes, and the second exhaust ring being parallel to the first exhaust ring and being arranged above the first exhaust ring.

12. The exhaust assembly of claim 11, wherein: The number of the second exhaust holes is greater than the first exhaust holes; and / or the plurality of second exhaust holes are evenly distributed along the circumference of the second exhaust ring.

13. The exhaust assembly of claim 11, wherein: The exhaust assembly further includes an annular third exhaust ring, the third exhaust ring being provided with a plurality of third exhaust holes, and the third exhaust ring being parallel to the first exhaust ring and being arranged below the first exhaust ring.

14. The exhaust assembly of claim 13, wherein: The exhaust assembly further includes an annular sleeve, which includes an inner ring and an outer ring that are concentrically arranged, and the first exhaust ring, the second exhaust ring and the third exhaust ring are all arranged between the inner ring and the outer ring.

15. The exhaust assembly of claim 13, wherein: The number of the third exhaust holes is less than that of the first exhaust holes; and / or the plurality of third exhaust holes are evenly distributed along the circumference of the third exhaust ring.

16. A vapor deposition device, characterized in that: include: reaction chamber; A base is provided in the reaction chamber, and the base is used to place a wafer; a gas supply device connected to the reaction chamber to supply reaction gas into the reaction chamber for processing the wafer; The exhaust assembly according to any one of claims 1 to 15, wherein the exhaust assembly is located in the reaction chamber, surrounds the base and is disposed between the base and the inner wall of the reaction chamber, and the gas in the reaction chamber is discharged out of the reaction chamber through the exhaust assembly.

17. The vapor deposition apparatus according to claim 16, wherein: The exhaust assembly includes an annular sleeve, which includes an inner ring and an outer ring. The inner ring is arranged around and closely attached to the base, and the outer ring is closely attached to the inner wall of the reaction chamber.

Images