High heat dissipation type LED lamp

Abstract

The utility model provides a high heat dissipation type LED lamp which comprises an LED chip assembly and a heat dissipation assembly, the LED chip assembly comprises a substrate, LED chips and a heat pipe, the LED chips are arranged on the two side faces where the length and the width of the substrate are located, the LED chips are close to the first end of the substrate, the heat dissipation assembly is close to the second end of the substrate, the heat dissipation assembly is electrically connected with the substrate, and the heat pipe is electrically connected with the heat dissipation assembly. LED chips are arranged on the first side face and the second side face of the substrate, the heat pipe is arranged on the edges of the first side face and the second side face, the end, away from the heat dissipation assembly, of the heat pipe is the first end, and the distance between the first end of the heat pipe and the second end of the substrate is larger than the distance between the LED chips on the same side and the second end of the substrate. The heat pipe and the LED chip are located on the same plane, the light distribution requirement can be well met, meanwhile, the LED chip is closer to the area, with the heat transfer effect, of the heat pipe, and the heat dissipation effect of the whole LED lamp is better.

Description

Technical Field

[0001] The utility model relates to the fields of lamps and automobile manufacturing, and in particular to a high-heat dissipation LED lamp. Background Art

[0002] LED headlights currently offer advantages over the current mainstream halogen and high-pressure discharge (HID) lamps, due to their low voltage, uniform light output, consistent lifespan, instant onset, and neutral light quality. LEDs offer significant advantages over current headlight sources, such as halogen and high-pressure discharge (HID) lamps. They also offer enhanced driving safety, and have become widely used in automotive headlights.

[0003] However, the LED chips used in LED headlights generate a lot of heat during operation. Once the temperature of the LED chips is too high, the LED chips are prone to burn out, affecting the service life of the LED headlights.

[0004] LED headlights currently on the market dissipate heat through heat pipes. Heat pipes are highly efficient heat transfer components that fully utilize the principles of heat conduction and the rapid heat transfer properties of refrigerants to quickly transfer heat from a heating object to the outside of the heat source. Figure 1 As shown, there is an existing LED car lamp, which includes a copper base plate 92, an LED lamp bead 91 welded to the side of the copper base plate 92 at the width, a heat sink 94 connected to one end of the copper base plate 92, a lamp panel 93 arranged on the heat sink 94, heat pipes 95a arranged on both sides of the copper base plate 92 at the thickness thereof, and a heat pipe 95b with a top lower than the LED lamp bead 91 and a bottom connected to the heat sink 94.

[0005] Although the above-mentioned LED headlights are provided with heat pipes, the heat pipes 95a located on the two sides where the thickness of the copper substrate 92 is located will cause the copper substrate 92 to be too thick, which cannot meet the light distribution requirements, and is difficult to weld. Due to the process characteristics, there will be an invalid area of 5mm to 10mm at both ends of the heat pipe, which has no heat transfer function. The LED lamp beads 91 are relatively close to the invalid area of the heat pipe 95b, and the heat dissipation effect is not ideal. Utility Model Content

[0006] The purpose of the utility model is to provide a high heat dissipation LED lamp, which is used to solve the problem that the existing LED lamps have poor heat dissipation effect and cannot meet the light distribution requirements.

[0007] In order to achieve the above-mentioned purpose, the high heat dissipation LED lamp provided by the present invention includes an LED chip assembly and a heat dissipation assembly. The LED chip assembly includes a substrate, an LED chip and a heat pipe. The LED chip is arranged on the two sides where the length and width of the substrate are located, and the LED chip is close to the first end of the substrate, the heat dissipation assembly is close to the second end of the substrate, and the heat dissipation assembly is electrically connected to the substrate. LED chips are arranged on the first side and the second side of the substrate. The heat pipe is arranged at the edge of the first side and the second side. The end of the heat pipe away from the heat dissipation assembly is the first end, and the distance between the first end of the heat pipe and the second end of the substrate is greater than the distance between the LED chip on the same side and the second end of the substrate.

[0008] It can be seen from the above scheme that in the present invention, the heat pipe and the LED chip are located in the same plane, there is no requirement for the thickness of the substrate, the substrate can be set to be thinner, which can well meet the light distribution requirements and has low welding difficulty. At the same time, the installation position of the heat pipe and the LED chip in this scheme avoids the ineffective area of the heat pipe, and the LED chip is closer to the area where the heat pipe has a heat transfer effect, so that the heat dissipation effect of the entire LED lamp is better.

[0009] A further solution is that the distance between the first end of the heat pipe and the first end of the LED chip close to the substrate is 5 mm to 10 mm.

[0010] A further solution is that the first end of the heat pipe is flush with the first end of the substrate.

[0011] It can be seen from the above solution that the above distance can just avoid the ineffective area of the heat pipe and make full use of the heat transfer effect of the heat pipe to dissipate heat as much as possible.

[0012] A further solution is that the number of LED chips is two groups, the number of heat pipes is two, the two groups of LED chips are arranged opposite to each other, and the two heat pipes are arranged opposite to each other.

[0013] As can be seen from the above solution, the two heat pipes are arranged opposite to each other and located on the same side of the LED lamp, which helps to shield the LED lamp of this solution from glare after being installed on the vehicle.

[0014] A further solution is that the high-heat dissipation LED lamp also includes a power supply component, which is close to the second end of the substrate. The power supply component and the heat dissipation component are arranged parallel to the width direction of the substrate and are electrically connected to the substrate; the power supply component includes a driving board, which is connected to the substrate.

[0015] As can be seen from the above solution, the arrangement of the positional relationship between the power supply component and the substrate in the above position can reduce the volume and length of the LED lamp as much as possible without affecting the lighting effect of the LED lamp, so as to adapt to a wider installation environment.

[0016] A further solution is that a mounting groove is provided at an end of the driving plate close to the base plate, and the second end of the base plate is embedded in the mounting groove.

[0017] It can be seen from the above solution that the fixing method of the driving board and the base plate ensures the stability of the electrical connection, making the entire LED lamp structure more stable.

[0018] A further solution is that the high heat dissipation LED lamp further includes a heat dissipation shell, which is formed by splicing a first shell and a second shell, and the LED chip assembly and the heat dissipation assembly are both located in the heat dissipation shell.

[0019] As can be seen from the above solution, the provision of the heat dissipation housing ensures the safety and stability of the use of the LED lamp.

[0020] A further solution is that a light distribution through hole is provided on the heat dissipation housing, and the LED chip is located in the light distribution through hole.

[0021] It can be seen from the above solution that the provision of the light distribution through-holes ensures the lighting effect of the LED chip.

[0022] A further solution is that a chuck is detachably provided on the outer peripheral wall of the heat dissipation housing.

[0023] It can be seen from the above solution that the setting of the chuck plays a role in positioning and stabilizing the installation of the LED lamp.

[0024] A further solution is that the heat dissipation assembly includes a fan, the fan includes a driving part and a fan blade part, the driving part is closer to the second end of the substrate than the fan blade part; an installation part is provided at one end of the driving part away from the fan blade part, and the installation part is electrically connected to the substrate.

[0025] As can be seen from the above solution, the provision of the electric fan ensures the heat dissipation effect, and the installation method with the base plate ensures the stability of the electrical connection between the electric fan and the base plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural diagram of an existing LED car light.

[0027] Figure 2 It is a structural diagram of the first embodiment of the present utility model.

[0028] Figure 3 It is a structural exploded view of the first embodiment of the present utility model.

[0029] Figure 4 This is a structural diagram of the LED chip assembly in the first embodiment of the present utility model.

[0030] Figure 5 It is a structural diagram of the second shell in the first embodiment of the present utility model.

[0031] Figure 6 It is a structural diagram of the second embodiment of the present utility model.

[0032] Figure 7 It is a structural exploded view of the second embodiment of the present utility model.

[0033] Figure 8 It is a structural diagram of the LED chip assembly in the second embodiment of the present invention.

[0034] Figure 9 It is a structural diagram of the first shell in the second embodiment of the present utility model.

[0035] The present invention will be further described below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0036] First embodiment

[0037] See also Figures 2 to 5 The high heat dissipation LED lamp provided in this embodiment includes a heat dissipation housing 1, an LED chip assembly 2, a power supply assembly and a heat dissipation assembly.

[0038] The heat dissipation housing 1 is formed by two oppositely disposed first and second housings 11, 12, connected by bolts 16 and screw holes, or by other splicing methods known to those skilled in the art. The heat dissipation housing 1 includes an LED chip assembly 2, a power supply assembly, and a heat dissipation assembly.

[0039] See also Figure 3 and Figure 4 The LED chip assembly 2 includes a substrate 20, an LED chip 21 arranged on the substrate 20, and a heat pipe 22. The number of LED chips 21 is two groups, and the number of heat pipes 22 is two. The two groups of LED chips 21 are respectively arranged on the two side surfaces where the length and width of the substrate 20 are located and are close to the first end of the substrate 20. The power supply assembly is arranged close to the second end of the substrate 20 and is electrically connected to the substrate 20. The sides of the substrate 20 where the LED chips 21 are arranged are the first side surface and the second side surface. A light distribution through hole 13 is provided on the heat dissipation housing 1, and the LED chip 21 is located in the light distribution through hole 13. At the same time, heat pipes 22 are also provided on the edges of the first side surface and the second side surface of the substrate 20, respectively. The heat pipe 22 is arranged parallel to the LED chip 21 on the same side along the width direction of the substrate 20. The end of the heat pipe 22 that is away from the power supply assembly is the first end. The distance between the first end of the heat pipe 22 and the second end of the substrate 20 is greater than the distance between the LED chip 21 and the second end of the substrate 20. Preferably, the difference between the distance between the first end of the heat pipe 22 and the second end of the substrate 20 and the distance between the LED chip 21 and the second end of the substrate 20 is 5 mm to 10 mm. In this embodiment, the first end of the heat pipe 22 is flush with the first end of the substrate 20. The two groups of LED chips 21 are arranged opposite each other. The two heat pipes 22 are also arranged opposite each other.

[0040] The power supply assembly includes a driver board 31 and a power connector 32, which are electrically connected to each other. The power connector 32 includes electrical pins 321 and a mounting plate. The electrical pins 321 are fixed to the mounting plate. The driver board 31 is provided with a mounting hole, and one end of the electrical pins 321 is inserted into the mounting hole. The end of the driver board 31 near the base plate 20 is provided with a mounting groove 311, and the second end of the base plate 20 is inserted into the mounting groove 311.

[0041] In this embodiment, the heat dissipation assembly includes a fan. The fan and the power supply assembly are arranged horizontally along the width of the base plate 20, with the fan being arranged at the second end of the base plate 20. The fan includes a drive portion 41 and a fan blade portion 42 that are connected to each other. The fan blade portion 42 is farther from the second end of the base plate 20 than the drive portion 41, and the drive portion 41 drives the fan blade portion 42 to rotate. A mounting member is provided at one end of the drive portion 41 away from the fan blade portion 42. The mounting member is connected to the second end of the base plate 20 to achieve electrical connection between the power supply assembly, the base plate 20, and the fan.

[0042] See also Figure 5 The side of the heat sink housing 1 corresponding to the heat pipe 22 is the first side 121 of the heat sink housing 1. The side symmetrical to the first side 121, with the LED chip 21 as the axis, is the second side 122. The thickness of the second side 122 is less than that of the first side 121. A placement cavity 15 is provided in the heat sink housing 1 at the location corresponding to the power connector 32. One side of the placement cavity 15 is connected to the power connector 32. The placement cavity 15 is formed by a first placement portion 151 located in the first housing 11 and a second placement portion 152 located in the second housing 12. The power connector 32 is located within the placement cavity 15.

[0043] A fin-shaped heat sink is formed on the heat dissipation housing 1, and the air outlet position includes a plurality of first air outlets 14, and each first air outlet 14 is located between two adjacent fins of the heat dissipation housing 1. The inner sides of the first shell 11 and the second shell 12 are respectively fitted with the outer surfaces of the corresponding heat pipes 22. Optionally, gaps may also be formed between the inner sides of the first shell 11 and the second shell 12 and the outer surfaces of the heat pipes 22. A chuck 17 is detachably provided on the outer peripheral wall of the heat dissipation housing 1. In this embodiment, the heat dissipation housing 1 is made of a material with good thermal conductivity, such as aluminum, and the substrate 20 is made of a material with good electrical and thermal conductivity, such as copper. The LED chip 21 and the heat pipe 22 are both fixed to the substrate 20 by welding.

[0044] This embodiment of the high-heat-dissipation LED lamp features a stable structure, a compact length and size, and is easy to install. The LED chip 21 is closer to the heat pipe's active heat transfer area, improving heat dissipation and extending the LED lamp's service life. Furthermore, this high-heat-dissipation LED lamp helps block glare after installation.

[0045] Second embodiment

[0046] See also Figures 6 to 9 The high heat dissipation LED lamp provided in this embodiment includes a heat dissipation housing 5, an LED chip assembly 6, a power supply assembly and a heat dissipation assembly.

[0047] The heat dissipation housing 5 is formed by two oppositely disposed first and second housings 51 and 52 connected by bolts 56 and screw holes, or can be formed by other splicing methods well known to those skilled in the art. The heat dissipation housing 5 includes an LED chip assembly 6, a power supply assembly, and a heat dissipation assembly.

[0048] See also Figure 7 and Figure 8 The LED chip assembly 6 includes a substrate 60, an LED chip 61 arranged on the substrate 60, and a heat pipe 62. The number of LED chips 61 is two groups, and the number of heat pipes 62 is two. The two groups of LED chips 61 are respectively arranged on the two side surfaces where the length and width of the substrate 60 are located and are close to the first end of the substrate 60. The power supply assembly is arranged near the second end of the substrate 60 and is electrically connected to the substrate 60. The sides of the substrate 60 where the LED chips 61 are arranged are the first side surface and the second side surface respectively. A light distribution through hole 53 is provided on the heat dissipation housing 5, and the LED chip 61 is located in the light distribution through hole 53. At the same time, heat pipes 62 are also provided on the edges of the first side surface and the second side surface of the substrate 60, respectively. The heat pipe 62 is arranged parallel to the LED chip 61 on the same side along the width direction of the substrate 60. The end of the heat pipe 62 that is away from the power supply assembly is the first end. The distance between the first end of the heat pipe 62 and the second end of the substrate 60 is greater than the distance between the LED chip 61 and the second end of the substrate 60. Preferably, the difference between the distance between the first end of the heat pipe 62 and the second end of the substrate 60 and the distance between the LED chip 61 and the second end of the substrate 60 is 5 mm to 10 mm. In this embodiment, the first end of the heat pipe 62 is flush with the first end of the substrate 60. The two groups of LED chips 61 are arranged opposite each other. The two heat pipes 62 are also arranged opposite each other.

[0049] The power supply assembly includes a driver board 71. A mounting slot 711 is provided at the end of the driver board 71 near the base plate 60. The second end of the base plate 60 is embedded in the mounting slot 711. A second through hole 59 is provided in the heat dissipation housing 5 at a position corresponding to the driver board 71. A wire can be soldered to the driver board 71 and passed through the second through hole 59 to connect to an external power source for electrical communication.

[0050] In this embodiment, the heat dissipation assembly includes a fan. The fan and the power supply assembly are arranged horizontally along the width of the base plate 60, with the fan being arranged at the second end of the base plate 60. The fan includes a drive portion 81 and a fan blade portion 82 that are connected to each other. The fan blade portion 82 is farther from the second end of the base plate 60 than the drive portion 81, and the drive portion 81 drives the fan blade portion 82 to rotate. A mounting member is provided at one end of the drive portion 81 away from the fan blade portion 82. The mounting member is connected to the second end of the base plate 60 to achieve electrical connection between the power supply assembly, the base plate 60, and the fan.

[0051] See also Figure 9 The side of the heat dissipation housing 5 corresponding to the heat pipe 62 is the first side 511 of the heat dissipation housing 5, and the side symmetrical to the first side 511 of the heat dissipation housing 5 with the LED chip 61 as the axis is the second side 512, and the thickness of the second side 512 is less than the thickness of the first side 511.

[0052] A fin-shaped heat sink is formed on the heat dissipation housing 5, and the air outlet includes a plurality of first air outlets 54, each of which is located between two adjacent fins of the heat dissipation housing 5. The inner sides of the first shell 51 and the second shell 22 are respectively fitted with the outer surfaces of the corresponding heat pipes 62. Optionally, gaps may also be formed between the inner sides of the first shell 51 and the second shell 52 and the outer surfaces of the heat pipes 62. A second air outlet 55 is provided at the bottom of the heat dissipation housing 5, and the fan is located above the second air outlet 55. The second air outlet 55 is an air inlet, and the first air outlet 54 is an air outlet. Optionally, the second air outlet 55 may be an air outlet, and the first air outlet 54 may be an air inlet.

[0053] A chuck 57 is removably mounted on the outer wall of the heat dissipation housing 5. A sealing ring 58 is positioned below the chuck 57. The sealing ring 58 is sleeved onto the outer wall of the heat dissipation housing 5 and abuts against the chuck 57. In this embodiment, the heat dissipation housing 5 is made of a material with good thermal conductivity, such as aluminum, and the base plate 60 is made of a material with good electrical and thermal conductivity, such as copper. The LED chip 61 and heat pipe 62 are both secured to the base plate 60 by welding.

[0054] This embodiment of a high-heat-dissipation LED lamp boasts a stable structure, compact length and size, and is easy to install. It avoids the inactive area of the heat pipe 62, placing the LED chip 61 closer to the heat pipe's active heat transfer area, resulting in improved heat dissipation. Furthermore, this high-heat-dissipation LED lamp helps block glare when installed on a vehicle. It can be used in non-plug-in vehicle lamps.

[0055] Finally, it should be emphasized that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-heat-dissipation LED lamp, comprising an LED chip assembly and a heat sink assembly. The LED chip assembly comprises a substrate, an LED chip, and a heat pipe. The LED chip is disposed on both sides of the substrate, where the length and width of the substrate are located, with the LED chip proximate to the first end of the substrate. The heat sink assembly is proximate to the second end of the substrate and is electrically connected to the substrate. The LED chip is disposed on both the first and second sides of the substrate. Its characteristics are: The heat pipe is arranged at the edges of the first side surface and the second side surface, and the end of the heat pipe away from the heat dissipation component is the first end. The distance between the first end of the heat pipe and the second end of the substrate is greater than the distance between the LED chip on the same side and the second end of the substrate.

2. The high heat dissipation LED lamp according to claim 1, wherein: The distance between the first end of the heat pipe and the first end of the LED chip close to the substrate is between 5 mm and 10 mm.

3. The high heat dissipation LED lamp according to claim 1, wherein: The first end of the heat pipe is flush with the first end of the substrate.

4. The high heat dissipation LED lamp according to claim 1, wherein: The number of the LED chips is two groups, the number of the heat pipes is two, the two groups of LED chips are arranged opposite to each other, and the two heat pipes are arranged opposite to each other.

5. The high heat dissipation LED lamp according to claim 1, wherein: The high heat dissipation LED lamp further includes a power supply component, the power supply component is close to the second end of the substrate, the power supply component and the heat dissipation component are arranged parallel to each other along the width direction of the substrate and are electrically connected to the substrate; The power supply assembly includes a driving board connected to the substrate.

6. The high heat dissipation LED lamp according to claim 5, wherein: The end of the driving plate close to the base plate is provided with a mounting groove, and the second end of the base plate is embedded in the mounting groove.

7. The high heat dissipation LED lamp according to claim 1, characterized in that : The high heat dissipation LED lamp further comprises a heat dissipation shell, which is formed by splicing a first shell and a second shell. The LED chip assembly and the heat dissipation assembly are both located in the heat dissipation shell.

8. The high heat dissipation LED lamp according to claim 7, wherein: The heat dissipation housing is provided with a light distribution through hole, and the LED chip is located in the light distribution through hole.

9. The high heat dissipation LED lamp according to claim 7 or 8, characterized in that: A chuck is detachably provided on the outer peripheral wall of the heat dissipation shell.

10. The high heat dissipation LED lamp according to any one of claims 1 to 8, characterized in that: The heat dissipation assembly includes a fan, the fan includes a driving portion and a fan blade portion, and the driving portion is closer to the second end of the substrate than the fan blade portion; A mounting piece is provided at one end of the driving portion away from the fan blade portion, and the mounting piece is electrically connected to the substrate.

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