Heat dissipation performance testing device of heat dissipation module
By designing a detachable and movable pressure testing and heating module, combined with a heat dissipation performance testing device with the base scale mark, the problem of poor versatility of existing devices is solved, and accurate detection and efficient application of different heat dissipation modules are achieved.
Patent Information
- Application Number
- CN202422494947.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-10-15
AI Technical Summary
The existing thermal dissipation module performance testing devices have poor versatility, resulting in the need to re-made the test device every time the thermal dissipation module is changed, which is costly and time-consuming.
A heat dissipation performance testing device including a base, a pressure test module and a heating module is designed. The module is detachably connected to the base and can be moved or fixed in different states. It combines the scale mark to achieve accurate alignment and position adjustment of different heat dissipation modules, which is suitable for a variety of heat dissipation modules.
The meticulous performance research and specific local analysis of different heat dissipation modules are realized, which improves the accuracy of the detection results and the universality of the device, and reduces the cost and time of repeated production.
Smart Images
Figure CN223205152U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of heat dissipation modules, and in particular to a device for testing the heat dissipation performance of a heat dissipation module. Background Art
[0002] During the testing of electronic components, ensuring the performance of the heat dissipation module is crucial. The heat dissipation performance of the heat dissipation module directly affects the stability and lifespan of the electronic components, making accurate performance evaluation essential during the design and production process. Traditional heat dissipation performance testers typically use one tester for each heat dissipation module, resulting in poor versatility. Any changes to the heat dissipation module require re-manufacturing the tester, which is costly and time-consuming. Utility Model Content
[0003] The purpose of the embodiments of the present application is to provide a heat dissipation performance test device for a heat dissipation module to solve the problem of poor versatility of heat dissipation performance test devices for heat dissipation modules. The specific technical solution is as follows:
[0004] An embodiment of the present application provides a heat dissipation performance testing device for a heat dissipation module, comprising: a base, provided with scale lines along a first direction and a second direction, the first direction and the second direction being perpendicular; at least one pressure testing module, detachably connected to the base, comprising a lifting mechanism, a pressure-applying component and a pressure detection component, the pressure-applying component and the pressure detection component being arranged on the lifting mechanism, the lifting mechanism being capable of driving the pressure-applying component and the pressure detection component to move up and down, and the pressure detection component being capable of detecting the pressure of the pressure-applying component; at least one heating module, detachably connected to the base, comprising a heating component and a temperature detection component; a data processing module, electrically connected to the pressure detection component and the temperature detection component, respectively; wherein the pressure testing module and the heating module both have a first state and a second state, in the first state, the pressure testing module and the heating module can move relative to the base, and along the height direction of the heat dissipation performance testing device, the pressure-applying component can be located above the heating component; in the second state, the pressure testing module and the heating module are fixedly connected to the base.
[0005] In some embodiments, the pressure testing module includes: a first support, the first support is magnetically connected to the base, in the second state, the first support is magnetically engaged with the base, and in the first state, the first support is magnetically released from the base; the lifting mechanism is connected to the first support.
[0006] In some embodiments, a first switch is provided on the first support. When the first switch is closed, the first support is magnetically connected to the base. When the first switch is turned on, the first support and the base are released from magnetic connection.
[0007] In some embodiments, the pressure-applying component includes: a fixed block slidably disposed on the lifting mechanism; at least one guide rod disposed along the height direction, the top end of the guide rod being connected to the fixed block;
[0008] An elastic member, which is sleeved on the guide rod; a stop block, which is connected to the bottom end of the elastic member along the height direction and is slidably connected to the guide rod; the pressure detection component is connected to the bottom end of the stop block along the height direction, and the pressure detection component is used to contact the heat dissipation module to be tested.
[0009] In some embodiments, the fixed block is further provided with a first slide rail and a first slider slidably connected to the first slide rail, and the stop block is connected to the first slider.
[0010] In some embodiments, the lifting mechanism includes: a support member, including a column and an upper mounting plate provided at the top end of the column and a lower mounting plate provided at the bottom end of the column, the lower mounting plate being connected to the first support; an operating rod, the bottom end of which is rotatably connected to the lower mounting plate, and the top end partially extends through the upper mounting plate; a lifting slider, threadedly connected to the operating rod, the lifting slider being slidably connected to the column on one side facing the column, for limiting the rotation of the lifting slider so that the lifting slider can slide up and down relative to the column; wherein the pressure-applying component and the pressure detection component are connected to the lifting slider, and rotating the operating rod enables the lifting slider to be lifted and lowered, and drives the pressure-applying component and the pressure detection component to be lifted and lowered.
[0011] In some embodiments, the heating module includes a second support, which is magnetically connected to the base. In the second state, the first support is magnetically engaged with the base. In the first state, the first support is magnetically released from the base, and the heating component and the temperature detection component are arranged on the second support.
[0012] In some embodiments, the heating component includes: a first heat-conducting block, the first heat-conducting block is arranged close to the second support, and at least one first arc-shaped groove is provided on the top of the first heat-conducting block; a second heat-conducting block is arranged on the side of the first heat-conducting block away from the second support, and at least one second arc-shaped groove is provided on the side of the second heat-conducting block close to the first heat-conducting block, and the second arc-shaped groove is arranged one by one opposite to the first arc-shaped groove and is connected; a heating element, the heating element is arranged in the first arc-shaped groove and the second arc-shaped groove; the side of the second heat-conducting block away from the first heat-conducting block is used to contact the heat dissipation module to be tested, and the temperature detection component is arranged on the side of the second heat-conducting block away from the first heat-conducting block.
[0013] In some embodiments, two first arc-shaped grooves are provided on the top of the first heat-conducting block, and two second arc-shaped grooves are provided on a side of the second heat-conducting block close to the first heat-conducting block.
[0014] In some embodiments, a protrusion is provided on a side of the second heat-conducting block away from the first heat-conducting block, and the protrusion is used to contact the detected part. Along the height direction, a groove is provided on the upper surface of the protrusion, and the temperature detection component is placed in the groove, and the temperature detection component is in contact with the detected part.
[0015] The heat dissipation performance testing device for a heat dissipation module provided in an embodiment of the present application includes a pressure testing module and a heating module. This allows for separate variables to be used to study the performance of the heat dissipation module under different pressures and power consumptions, enabling detailed analysis of the performance of the heat dissipation module under test. Furthermore, the pressure testing module and the heating module are movable relative to a base, allowing for analysis of specific local locations of the heat dissipation module under test. The base is provided with scale lines in a first direction and a second direction, allowing for accurate reading of the specific location of the heat dissipation module under test. Furthermore, since the pressure testing module and the heating module are detachably connected to the base, in a first state, the pressure testing module and the heating module can be adjusted according to the actual location of the heat dissipation module under test, allowing the pressure testing module to be moved above the heat dissipation module under test and the heating module to be moved below the heat dissipation module under test. This allows for heat dissipation performance testing of different heat dissipation modules under test by moving the pressure testing module and the heating module. Therefore, the heat dissipation performance testing device for a heat dissipation module can be adapted to different heat dissipation modules under test, providing excellent versatility. Furthermore, since the base is provided with scale lines, the heat dissipation performance testing device for the heat dissipation module can be accurately located and precisely aligned with the heat dissipation module under test. In the second state, the pressure test module and the heating module are fixedly connected to the base, that is, the two are in a locked state, and no shaking or shifting will occur, which can improve the accuracy of the test results.
[0016] Of course, any product implementing the present application does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0018] Figure 1 A schematic structural diagram of a heat dissipation performance testing device for a heat dissipation module according to an embodiment of the present application;
[0019] Figure 2 for Figure 1 Schematic diagram of the structure of the middle base and heating module;
[0020] Figure 3 for Figure 1 Schematic diagram of the structure of the medium pressure test module;
[0021] Figure 4 for Figure 1 Schematic diagram of the structure of the heating module;
[0022] Figure 5 It is a front view of the pressure-applying component and the pressure-detecting component of the pressure test module;
[0023] Figure 6 A side view of the pressure-applying component and the pressure-detecting component of the pressure test module;
[0024] Figure 7 It is a front view of the support member of the lifting mechanism;
[0025] Figure 8 A side view of a support member of the lifting mechanism;
[0026] Figure 9 It is a structural diagram of the operating rod and lifting slider of the lifting mechanism;
[0027] Figure 10 for Figure 4 Schematic diagram of the structure of the middle heating module without the second support;
[0028] Figure 11 This is a graph showing the temperature test results of a heat dissipation module to be tested provided in an embodiment of the present application.
[0029] The reference numerals are as follows:
[0030] Base 1; scale line 11; first direction X; second direction Y; height direction Z;
[0031] Pressure testing module 2; pressure applying component 21; fixed block 211; first slide rail 2111; first slider 2112; guide rod 212; elastic member 213; stop block 214; pressure detecting component 22; contact block 221; first support 23; first switch 231; lifting mechanism 24; support member 241; column 2411; guide rail 24111; upper mounting plate 2412; lower mounting plate 2413; connecting member 242; operating rod 243; lifting slider 244; guide block 2441; handle 245;
[0032] Heating module 3 ; heating component 31 ; first heat conducting block 311 ; first arc-shaped groove 3111 ; second heat conducting block 312 ; second arc-shaped groove 3121 ; protrusion 313 ; groove 3131 ; second support 32 . DETAILED DESCRIPTION
[0033] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field based on this application are within the scope of protection of this application.
[0034] This application provides a heat dissipation performance test device for a heat dissipation module. Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The heat dissipation performance testing device includes: a base 1, at least one pressure testing module 2, at least one heating module 3 and a data processing module. The base 1 is provided with scale lines 11 along the first direction X and the second direction Y, and the first direction X and the second direction Y are perpendicular. The pressure testing module 2 is detachably connected to the base 1, and the pressure testing module 2 includes a lifting mechanism 24, a pressure-applying component 21 and a pressure detection component 22. The pressure-applying component 21 and the pressure detection component 22 are arranged on the lifting mechanism 24. The lifting mechanism 24 can drive the pressure-applying component 21 and the pressure detection component 22 to rise and fall, and the pressure detection component 22 can detect the pressure of the pressure-applying component 21. The heating module 3 is detachably connected to the base 1, and the heating module 3 includes a heating component 31 and a temperature detection component. The data processing module is electrically connected to the pressure detection component 22 and the temperature detection component respectively. Among them, the pressure testing module 2 and the heating module 3 both have a first state and a second state. In the first state, the pressure testing module 2 and the heating module 3 can move relative to the base 1, and along the height direction Z of the heat dissipation performance testing device, the pressure-applying component 21 can be located above the heating component 31; in the second state, the pressure testing module 2 and the heating module 3 are fixedly connected to the base 1.
[0035] In this embodiment, the pressure-applying component 21 and the pressure-detecting component 22 are mounted on a lifting mechanism 24. The lifting mechanism 24 can adjust the height of the pressure-applying component 21 and the pressure-detecting component 22 to apply pressure to the heat dissipation module under test. The heat dissipation performance testing device for the heat dissipation module includes both a pressure testing module 2 and a heating module 3. Different variables can be used to study the performance of the heat dissipation module under different pressures and power consumption, enabling detailed performance analysis of the heat dissipation module under test. Furthermore, the pressure testing module 2 and the heating module 3 can be moved relative to the base 1, allowing analysis of specific local locations of the heat dissipation module under test. The base 1 is provided with scale lines 11 in the first direction X and the second direction Y, which can accurately read the specific position of the heat dissipation module to be tested. Since the pressure test module 2 and the heating module 3 are detachably connected to the base 1, in the first state, the pressure test module 2 and the heating module 3 can be adjusted according to the actual position of the heat dissipation module to be tested, so that the pressure test module 2 can be moved above the heat dissipation module to be tested, and the heating module 3 can be moved below the heat dissipation module to be tested. For different heat dissipation modules to be tested, the heat dissipation performance can also be tested by moving the pressure test module 2 and the heating module 3. Therefore, the performance test device of the heat dissipation module can be applied to different heat dissipation modules to be tested, and has good versatility. And since the base 1 has scale lines 11 on it, even if the heat dissipation module to be tested is placed randomly, its position can be accurately read through the scale lines 11 on the base 1, and precise alignment with the heat dissipation module to be tested can be achieved by moving the pressure test module 2 and the heating module 3. Furthermore, for different heat dissipation modules to be tested, the position of the heat dissipation module to be tested can be accurately read due to the setting of the scale lines 11 on the base 1. By moving the pressure test module 2 and the heating module 3, precise alignment with the heat dissipation module to be tested can be achieved. This eliminates the need to set up different heat dissipation performance test devices for different heat dissipation modules to be tested, greatly improving its versatility. In the second state, the pressure test module 2 and the heating module 3 are fixedly connected to the base 1, that is, they are in a locked state, and will not shake or shift, which can improve the accuracy of the test results.
[0036] Among them, the heat dissipation performance testing device of the heat dissipation module may include a pressure testing module 2 and a heating module 3, or may include two pressure testing modules 2 and two heating modules 3, or include more than two pressure testing modules 2 and more than two heating modules 3. In this way, when the heat dissipation module has one or two heat dissipation components that need to be tested, it can be completed through one test, saving time. The pressure testing module 2 and the heating module 3 can be set in a one-to-one correspondence, which is convenient for evaluating the heat dissipation performance of the heat dissipation module under different pressures and heat consumption. The heat dissipation performance testing device includes a pressure detection component 22 and a temperature detection component, and a data processing module electrically connected to the pressure detection component 22 and the temperature detection component, which can quantitatively evaluate the heat dissipation performance of the heat dissipation module.
[0037] Alternatively, as Figure 2 As shown, the scale lines 11 of the first direction X and the second direction Y on the base 1 can be set with the center of the base 1 as the origin, or with one of the vertices of the base 1 as the origin. The scale lines 11 of the first direction X and the second direction Y are set with the center of the base 1 as the origin, and the upper surface of the base 1 is divided into the following parts: Figure 2 The four areas marked A, B, C, and D are marked with scale lines 11 on the horizontal and vertical center lines, and each grid represents 10 mm. The position of the heating module 3 is adjusted by moving the second support 32 to different positions at the scale lines 11, so that the relative position of the heating module 3 is consistent with that of the heat dissipation module to be tested, thereby facilitating testing. The advantage of this solution is that it does not require milling a set of heating modules 3 for different positions of the heat dissipation module to be tested for each project as in the traditional method. Among them, the heat dissipation module to be tested can be a heat dissipation module of an electronic device such as a laptop computer or a tablet computer. For example, the heat dissipation module to be tested is a heat dissipation module of a CPU or a graphics card of a laptop computer. The heat dissipation performance testing device includes two pressure test modules 2 and two heating modules 3, which correspond to the heat dissipation modules of the CPU and the graphics card of the laptop computer, respectively.
[0038] In some embodiments of this application, reference Figure 1 and Figure 3 The pressure test module 2 includes a first support 23 , which is magnetically connected to the base 1 . In the second state, the first support 23 is magnetically engaged with the base 1 , and in the first state, the first support 23 is magnetically engaged with the base 1 . A lifting mechanism 24 is connected to the first support 23 .
[0039] In this embodiment, the pressure test module 2 is magnetically connected to the base 1 via the first support 23. This simplifies the structure by only requiring the base 1 and the first support 23 to be magnetically coupled. If the first support 23 is not present, part of the structure of the lifting mechanism 24 needs to be magnetically coupled. The support member 241 and the first support 23 can be connected via an L-shaped connector 242, which can also reinforce the support member 241. When the first support 23 is magnetically coupled to the base 1, the first support 23 and the base 1 are locked, and the first support 23 cannot move relative to the base 1. The lifting mechanism 24 can drive the pressure-applying component 21 and the pressure detection component 22 to move up and down. When the first support 23 and the base 1 are released from magnetic coupling, the first support 23 can move relative to the base 1, allowing the pressure test module 2 to move above the heat dissipation module to be tested, thereby applying pressure to the heat dissipation module to be tested and evaluating the heat dissipation performance of the heat dissipation module under different pressure conditions.
[0040] The first support 23 is detachably connected to the base 1 via magnetic attraction, offering a simple structure and convenient switching between the first and second states. The lifting mechanism 24 drives the pressure-applying component 21 and the pressure-detecting component 22 to move upward and downward, facilitating pressure application to heat dissipation modules at different heights and expanding the applicability of the heat dissipation performance testing device for heat dissipation modules.
[0041] In some embodiments of the present application, the first support 23 and the base 1 can also be detachably connected via a clamping component, which includes a U-shaped elastic clamp, an elastic member 213, and a pin. One of the clamping portions of the U-shaped elastic clamp, such as the clamping portion located above the base 1, is provided with a mounting hole, and the pin is installed in the mounting hole. The elastic member 213 is disposed between the clamping portion and the pin and is used to apply pressure to the upper clamping portion to secure the first support 23 to the base 1. The elastic member 213 may be a spring. Alternatively, the clamping component may be a conventional elastic clamp.
[0042] In some embodiments of this application, reference Figure 1 and Figure 3 A first switch 231 is provided on the first support 23. When the first switch 231 is closed, the first support 23 is magnetically connected to the base 1. When the first switch 231 is turned on, the first support 23 and the base 1 are released from magnetic attraction.
[0043] When the first switch 231 is off, the first support 23 is magnetically connected to the base 1. This allows the pressure test module 2 to remain connected to the base 1 when the heat dissipation performance test device for the heat dissipation module is not in use, thereby maintaining a unified structure and facilitating movement and transportation of the heat dissipation performance test device for the heat dissipation module. When the first switch 231 is on, the first support 23 is magnetically engaged with the base 1, allowing the pressure test module 2 to move relative to the base 1, facilitating adjustment of the pressure test module 2's position according to the position of the heat dissipation module to be tested.
[0044] Alternatively, as Figure 3 As shown, the first switch 231 can be a knob switch or a push switch.
[0045] In some embodiments of this application, reference Figure 3 、 Figure 5 and Figure 6The pressure-applying component 21 includes a fixed block 211, at least one guide rod 212, an elastic member 213 and a stop block 214. The fixed block 211 is slidably arranged on the lifting mechanism 24. The guide rod 212 is arranged along the height direction Z, and the top of the guide rod 212 is connected to the fixed block 211. The elastic member 213 is sleeved on the guide rod 212. The stop block 214 is connected to the bottom end of the elastic member 213 along the height direction Z, and is slidably connected to the guide rod 212. The pressure detection component 22 is connected to the bottom end of the stop block 214 along the height direction Z, and the pressure detection component 22 is used to contact the heat dissipation module to be tested.
[0046] In this embodiment, when the pressure detection component 22 is not in contact with the heat dissipation module to be tested, the stop block 214 stays at a position away from the top of the fixed block 211 under the action of the elastic member 213. When pressure needs to be applied, the pressure component 21 as a whole is lowered along with the lifting mechanism 24. After the pressure detection component 22 contacts the heat dissipation module to be tested, the pressure component 21 continues to descend, and the stop block 214 moves in the opposite direction along the guide rod 212, that is, it moves upward. At this time, the stop block 214 will compress the elastic member 213 to cause it to deform, thereby generating pressure on the contact between the heat dissipation module to be tested and the heating block. This pressure can be measured by the pressure detection component 22, such as a high-precision weighing sensor, and the high-precision pressure sensor will be connected to a matching data processing module to display pressure data. The data processing module includes a display instrument for displaying pressure data. The pressure data is the contact pressure applied to the heat dissipation module to be tested and the heating block.
[0047] Optionally, refer to Figure 5 、 Figure 6 There are two guide rods 212, and the two guide rods 212 can be symmetrically distributed. Each guide rod 212 is provided with an elastic member 213, wherein the elastic member 213 can be a spring.
[0048] Optionally, refer to Figure 5 、 Figure 6 A contact block 221 is further provided below the pressure detection component 22. The contact block 221 is used to contact the heat dissipation module to be tested. The shape and size of the contact block 221 can be made to simulate the shape and size of the heat dissipation module to be tested to ensure that the heat dissipation module to be tested is evenly pressured as a whole.
[0049] In some embodiments of this application, reference Figure 5 、 Figure 6 The fixed block 211 is further provided with a first slide rail 2111 and a first slider 2112 slidably connected to the first slide rail 2111 , and the stop block 214 is connected to the first slider 2112 .
[0050] The stop block 214 is connected to the first slider 2112, and the first slider 2112 is slidably connected to the first slide rail 2111. When the stop block 214 moves in the opposite direction, the first slide rail 2111 can play a guiding role, so that the pressure generated by the elastic member 213 is in the vertical direction, perpendicular to the surface of the heat dissipation module to be tested.
[0051] In some embodiments of this application, reference Figure 3 、 Figure 7 、 Figure 8 and Figure 9 The lifting mechanism 24 includes a support member 241, an operating rod 243, and a lifting slider 244. The support member 241 includes a column 2411, an upper mounting plate 2412 located at the top of the column 2411, and a lower mounting plate 2413 located at the bottom of the column 2411. The lower mounting plate 2413 is connected to the first support 23. The operating rod 243 is rotatably connected to the lower mounting plate 2413 at its bottom end, and its top end extends partially through the upper mounting plate 2412. The lifting slider 244 is threadedly connected to the operating rod 243. The side of the lifting slider 244 facing the column 2411 is slidably connected to the column 2411, restricting the rotation of the lifting slider 244 and allowing it to slide up and down relative to the column 2411. The pressure-applying component 21 and the pressure-detecting component 22 are connected to the lifting slider 244. Rotating the operating rod 243 causes the lifting slider 244 to rise and fall, driving the pressure-applying component 21 and the pressure-detecting component 22 to rise and fall.
[0052] The various components of support member 241 can be integrally formed or mechanically connected. A portion of operating rod 243 extends from upper mounting plate 2412, facilitating rotation of operating rod 243 via this extended portion. Lifting slider 244 is threadedly connected to operating rod 243 and slidably connected to column 2411 on the side facing column 2411. This sliding connection serves to limit the rotation of lifting slider 244, allowing it to move up and down relative to operating rod 243 and column 2411 when operating rod 243 rotates.
[0053] The sliding connection between the lifting slider 244 and the column 2411 can be achieved by one of them being provided with a slot and the other being provided with a guide rail 24111, for example, the column 2411 being provided with a guide rail 24111 and the lifting slider 244 being provided with a slot. The sliding connection between the lifting slider 244 and the column 2411 can also be achieved by a sliding connection via a guide block 2441, wherein the lifting slider 244 and the guide block 2441 are fixedly connected, and one of the guide block 2441 and the column 2411 being provided with a slot and the other being provided with a guide rail 24111, for example, the column 2411 being provided with a guide rail 24111 and the lifting slider 244 being provided with a slot. The sliding connection between the lifting slider 244 and the column 2411 through the cooperation of the slot and the guide rail 24111 not only limits the rotation of the lifting slider 244 but also serves as a guide, allowing the lifting slider 244 to be raised and lowered linearly along the guide rail 24111.
[0054] The pressure-applying component 21 and the pressure-detecting component 22 are connected to the lifting slider 244 . The movement of the lifting slider 244 can drive the pressure-applying component 21 and the pressure-detecting component 22 to move up and down, thereby applying pressure to the heat dissipation module to be tested.
[0055] Optionally, a handle 245 is provided at the top of the operating rod 243 to facilitate the operator's operation. When the handle 245 is shaken, the pressure-applying component 21 and the pressure detection component 22 are guided to rise and fall along the operating rod 243 to apply pressure to or release the heat dissipation module to be tested.
[0056] In some embodiments of this application, reference Figure 1 and Figure 4 The heating module 3 includes a second support 32, which is magnetically connected to the base 1. In the second state, the first support 23 is magnetically engaged with the base 1. In the first state, the first support 23 is magnetically released from the base 1, and the heating component 31 and the temperature detection component are arranged on the second support 32.
[0057] The second support 32 is magnetically connected to the base 1. When the second support 32 and the base 1 are magnetically engaged, the second support 32 and the base 1 are locked, and the second support 32 cannot move relative to the base 1. When the second support 32 and the base 1 are released from magnetic engagement, the second support 32 can move relative to the base 1, allowing the heating module 3 to move below the heat dissipation module under test, thereby heating the heat dissipation module under test and evaluating the heat dissipation performance of the heat dissipation module under test at different temperatures.
[0058] The second support 32 and the base 1 are detachably connected through magnetic attraction, which has the advantages of simple structure and convenient switching between the first state and the second state.
[0059] Optionally, a second switch (not shown in the figure) is provided on the second support 32. When the second switch is closed, the second support 32 is magnetically connected to the base 1. When the second switch is turned on, the second support 32 and the base 1 are released from magnetic connection.
[0060] When the second switch is off, the second support 32 is magnetically connected to the base 1. This allows the heating module 3 to remain connected to the base 1 when the heat dissipation performance test device for the heat dissipation module is not in use, thereby maintaining a unified structure and facilitating movement and transportation of the heat dissipation performance test device for the heat dissipation module. When the second switch is on, the second support 32 is magnetically engaged with the base 1, allowing the heating module 3 to move relative to the base 1, facilitating adjustment of the position of the heating module 3 according to the position of the heat dissipation module to be tested.
[0061] Optionally, the second switch may be a knob switch or a push switch.
[0062] In some embodiments of this application, reference Figure 4 、 Figure 10 The heating component 31 includes a first heat-conducting block 311, a second heat-conducting block 312, and a heating element. The first heat-conducting block 311 is positioned adjacent to the second support 32, and at least one first arc-shaped groove 3111 is defined on the top of the first heat-conducting block 311. The second heat-conducting block 312 is positioned on a side of the first heat-conducting block 311 away from the second support 32, and at least one second arc-shaped groove 3121 is defined on a side of the second heat-conducting block 312 adjacent to the first heat-conducting block 311. The second arc-shaped groove 3121 is positioned opposite and connected to the first arc-shaped groove 3111. The heating element is positioned within the first arc-shaped groove 3111 and the second arc-shaped groove 3121.
[0063] The heating element is inserted into the through hole formed by the first arc-shaped groove 3111 and the second arc-shaped groove 3121, and is used to heat the first heat-conducting block 311 and the second heat-conducting block 312, so that the heat of the heating element can be evenly and quickly transferred to the first heat-conducting block 311 and the second heat-conducting block 312. The heating element can be a heating rod. The heating rod is connected to an external power supply to set the required voltage and current. The voltage × current is the thermal power consumption of the heating to simulate the thermal power consumption generated by the actual chip. The side of the second heat-conducting block 312 away from the first heat-conducting block 311 is in contact with the heat dissipation module to be tested. The second heat-conducting block 312 is used to simulate the working state of the chip. The temperature detection component is provided on this side, which can detect the temperature of the surface of the second heat-conducting block 312 to determine whether the heat dissipation performance of the heat dissipation module to be tested meets the standard.
[0064] The material of the first heat-conducting block 311 and the second heat-conducting block 312 is generally a metal material with good thermal conductivity. For example, the material of the first heat-conducting block 311 and the second heat-conducting block 312 is copper. Copper has a high thermal conductivity coefficient and can quickly and evenly conduct heat from the heating rod.
[0065] In some embodiments of the present application, a protrusion 313 is provided on a side of the second heat-conducting block 312 away from the first heat-conducting block 311, and the protrusion 313 is used to contact the detected part. Along the height direction Z, a groove 3131 is provided on the upper surface of the protrusion 313, and the temperature detection component is placed in the groove 3131, and the temperature detection component is in contact with the detected part.
[0066] Protrusion 313 simulates the shape of a chip and contacts the heat dissipation module under test. A temperature detection component is located within groove 3131 of protrusion 313, ensuring close contact between protrusion 313 and the heat dissipation module under test. This facilitates detecting the surface temperature of protrusion 313 to determine whether the heat dissipation performance of the heat dissipation module under test meets the required standards. Alternatively, the temperature detection component may be a thermocouple or a temperature sensor.
[0067] A protrusion 313 is provided on the side of the second heat-conducting block 312 facing away from the first heat-conducting block 311. By simulating the shape of a chip, the shape and size of the second heat-conducting block 312 are not restricted by the shape and size of the heat-dissipating module to be tested. This allows the second heat-conducting block 312 to be used as a universal component. If the size of the heat-dissipating module to be tested changes, only the protrusion 313 can be replaced, further improving the versatility of the heat-dissipating performance testing device for heat-dissipating modules. The protrusion 313 is smaller than the second heat-conducting block 312, making it easier to achieve temperature uniformity.
[0068] Along the height direction Z, the protrusion 313 is located above the first arc-shaped groove 3111 and the second arc-shaped groove 3121 , so that the protrusion 313 is closer to the heat source, which is conducive to uniform temperature of the protrusion 313 .
[0069] Generally, the height of the protrusion 313 is greater than the depth of the groove 3131. In this way, the groove 3131 does not penetrate the protrusion 313, and the temperature sensing component placed in the groove 3131 can accurately sense the surface temperature of the protrusion 313. Considering the heat conduction rate, the height of the protrusion 313 should not be too high, for example, it can be 2 to 4 times the depth of the groove 3131.
[0070] The data processing module includes a temperature data processing module and a pressure data processing module, wherein the temperature data processing module includes a thermocouple arrangement module for surface temperature measurement and a data collector connected to the thermocouple for reading and displaying. First, the thermocouple is embedded in the groove 3131 of the protrusion 313 on the upper surface of the second heat conducting block 312 to simulate the measurement of the surface temperature of the protrusion 313. Then, the thermocouple is connected to the data collector to read the temperature data at different times in real time and save the data. The data shown in Table 1 below can be generated by the set program, and the corresponding thermal resistance under different power consumption (Power, P) can be calculated and plotted into a curve as shown in FIG. Figure 11As shown, it can be quickly concluded that the ideal working state of the heat dissipation module is 55W, at which point the thermal resistance is the smallest.
[0071] Table 1
[0072] No. Power(W) Tc(℃) Ta(℃) R_℃ / W 1 45 60.00 25.10 0.78 2 50 61.00 24.80 0.72 3 55 62.00 25.30 0.67 4 60 68.00 25.00 0.72 5 65 81.00 25.20 0.86 6 70 92.00 24.90 0.96
[0073] The above description is only a preferred embodiment of the present application and is not intended to limit the scope of protection of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the scope of protection of the present application.
Claims
1. A heat dissipation performance testing device for a heat dissipation module, characterized in that: include: A base having scale lines along a first direction and a second direction, wherein the first direction and the second direction are perpendicular; at least one pressure testing module, detachably connected to the base, comprising a lifting mechanism, a pressure-applying component, and a pressure-detecting component, wherein the pressure-applying component and the pressure-detecting component are disposed on the lifting mechanism, the lifting mechanism being capable of driving the pressure-applying component and the pressure-detecting component to rise and fall, and the pressure-detecting component being capable of detecting the pressure of the pressure-applying component; at least one heating module, detachably connected to the base, comprising a heating component and a temperature detection component; a data processing module, electrically connected to the pressure detection component and the temperature detection component respectively; In which, the pressure testing module and the heating module both have a first state and a second state. In the first state, the pressure testing module and the heating module can move relative to the base, and along the height direction of the heat dissipation performance testing device, the pressure-applying component can be located above the heating component; in the second state, the pressure testing module and the heating module are fixedly connected to the base.
2. The heat dissipation performance testing device of the heat dissipation module according to claim 1, characterized in that: The stress testing module includes: a first support, the first support being magnetically connected to the base, the first support being magnetically engaged with the base in the second state, and the first support being magnetically disengaged from the base in the first state; The lifting mechanism is connected to the first support.
3. The heat dissipation performance testing device of the heat dissipation module according to claim 2, characterized in that: The first support is provided with a first switch. When the first switch is closed, the first support is magnetically connected to the base. When the first switch is turned on, the first support and the base are released from magnetic connection.
4. The heat dissipation performance testing device of the heat dissipation module according to claim 2, characterized in that: The pressure applying component comprises: A fixed block, slidably disposed on the lifting mechanism; at least one guide rod, arranged along the height direction, the top end of the guide rod being connected to the fixing block; an elastic member, wherein the elastic member is sleeved on the guide rod; a stop block connected to the bottom end of the elastic member along the height direction and slidably connected to the guide rod; The pressure detection component is connected to the bottom end of the stop block along the height direction, and the pressure detection component is used to contact the heat dissipation module to be tested.
5. The heat dissipation performance testing device of the heat dissipation module according to claim 4, characterized in that: The fixed block is further provided with a first slide rail and a first slider slidably connected to the first slide rail, and the stop block is connected to the first slider.
6. The heat dissipation performance testing device of the heat dissipation module according to claim 2, characterized in that: The lifting mechanism comprises: A support member, comprising a column, an upper mounting plate provided at the top end of the column, and a lower mounting plate provided at the bottom end of the column, wherein the lower mounting plate is connected to the first support; An operating rod, the bottom end of which is rotatably connected to the lower mounting plate, and the top end of which extends partially through the upper mounting plate; A lifting slider is threadedly connected to the operating rod, and is slidably connected to the column on a side of the lifting slider facing the column, and is used to limit the rotation of the lifting slider so that the lifting slider can slide up and down relative to the column; The pressure-applying component and the pressure-detecting component are connected to the lifting slider, and rotating the operating lever enables the lifting slider to be raised and lowered, thereby driving the pressure-applying component and the pressure-detecting component to be raised and lowered.
7. The heat dissipation performance testing device of a heat dissipation module according to any one of claims 2 to 6, characterized in that: The heating module includes a second support, which is magnetically connected to the base. In the second state, the first support is magnetically engaged with the base. In the first state, the first support is magnetically released from the base. The heating component and the temperature detection component are arranged on the second support.
8. The heat dissipation performance testing device of the heat dissipation module according to claim 7, characterized in that: The heating component comprises: a first heat-conducting block, the first heat-conducting block being arranged close to the second support, and the top of the first heat-conducting block being provided with at least one first arc-shaped groove; a second heat conducting block, disposed on a side of the first heat conducting block away from the second support, the second heat conducting block having at least one second arc-shaped groove disposed on a side close to the first heat conducting block, the second arc-shaped groove being opposite to and connected to the first arc-shaped groove; a heating element, the heating element being disposed in the first arc-shaped groove and the second arc-shaped groove; The side of the second heat-conducting block away from the first heat-conducting block is used to contact the heat dissipation module to be tested, and the temperature detection component is arranged on the side of the second heat-conducting block away from the first heat-conducting block.
9. The heat dissipation performance testing device of the heat dissipation module according to claim 8, characterized in that: Two first arc-shaped grooves are provided on the top of the first heat-conducting block, and two second arc-shaped grooves are provided on a side of the second heat-conducting block close to the first heat-conducting block.
10. The heat dissipation performance testing device of the heat dissipation module according to claim 8, characterized in that: A protrusion is provided on a side of the second heat-conducting block away from the first heat-conducting block, and the protrusion is used to contact the detected part. Along the height direction, a groove is provided on the upper surface of the protrusion, and the temperature detection component is placed in the groove, and the temperature detection component is in contact with the detected part.