Semiconductor material box clamping device and semiconductor plasma cleaning machine

Abstract

The utility model relates to the technical field of plasma cleaning devices, in particular to a semiconductor material box clamping device and a semiconductor plasma cleaning machine.The device comprises a material box containing plate, a material box pulling plate and a movable limiting mechanism, the material box containing plate comprises a containing plate body, and a plurality of movable limiting holes are formed in the containing plate body; a plurality of material box fixing and positioning plates are fixed on the top surface of the placing plate main body; the movable limiting mechanism comprises a plurality of material box movable positioning plates, a lead screw assembly and a plurality of movable matching receding assemblies. The screw rod assembly comprises a screw rod and a pair of screw rod fixing seats; each movable matching receding assembly comprises a receding block and a spring. When the adjusting lead screw stretches out and draws back, the width of the clamping positions formed between the multiple material box movable positioning plates and the corresponding material box fixed positioning plates is synchronously adjusted. According to the semiconductor material box clamping device, the width of the clamping position can be adjusted by manually rotating the end of the lead screw, the semiconductor material box clamping device is suitable for clamping material boxes with different widths, the structure is simple and effective, and operation is convenient.

Description

Technical Field

[0001] The utility model relates to the field of plasma cleaning equipment, and specifically provides a semiconductor material box clamping device and a semiconductor plasma cleaning machine. Background Art

[0002] Materials for semiconductor plasma cleaning machines are typically placed in a magazine similar to a bullet clip. The magazines vary depending on the material shape and size (more than six types are commonly used). To accommodate a wide range of materials, clamping designs for different materials (and different magazines) have been developed.

[0003] The general design is to use an automated or semi-automated structural design to enable the clamping device to adapt to different sizes of magazines and make corresponding automatic adjustments to clamp the magazines. However, the disadvantage of this type of design is that the adjustment mechanism is very cumbersome and complicated, and the utilization rate of the adjustment mechanism is not high.

[0004] After investigation, we found that:

[0005] 1. The frequency of semiconductor material updates during general production is not high, that is, semiconductor materials of different sizes and specifications are not frequently replaced within a shift;

[0006] 2. Semiconductor materials of different sizes and specifications will not be mixed for cleaning: that is, semiconductor materials of different sizes and specifications will not be cleaned together at the same time, and the magazines used for cleaning the same batch will not be of different specifications.

[0007] This provides some inspiration for improving the design of the material box clamping mechanism:

[0008] The mechanism for clamping the magazine does not need to be automated, as long as it can ensure that the time for each adjustment is less than a certain time, such as less than 15 minutes. This can greatly simplify the structural design; or different designs can be made according to customer needs;

[0009] Different bullet clips are designed with corresponding adaptive structures in different lengths, widths and heights. Summary of the Invention

[0010] The present application provides a semiconductor material box clamping device, which can solve the technical problem of the existing automated or semi-automated material box clamping device having a complex structure.

[0011] In a first aspect, the present application provides a semiconductor material box clamping device, comprising:

[0012] The material box placement plate includes a placement plate body, on which a plurality of movable limiting holes are spaced apart along the length direction of the placement plate body, and a plurality of material box fixing positioning plates are fixed on the top surface of the placement plate body, which are respectively located on one side of each movable limiting hole and extend upward;

[0013] The material box pulling plate is located below the placing plate body and is arranged parallel to the placing plate body;

[0014] The movable limiting mechanism includes multiple material box movable positioning plates, at least one group of screw rod assemblies and multiple groups of movable matching yielding assemblies; multiple material box movable positioning plates respectively pass through a movable limiting hole, and the bottom end is slidably connected to the material box pulling plate; the screw rod assembly includes a screw rod and a pair of screw rod fixing seats, the screw rod is telescopically connected to a pair of screw rod fixing seats, and the telescopic direction is consistent with the length direction of the placement plate main body, the middle of the screw rod is fixed on the material box pulling plate, the outer end of the screw rod protrudes from the outside of the outermost screw rod fixing seat, and a pair of the screw fixing seats are fixed to the bottom surface of the placement plate main body; multiple groups of movable matching yielding assemblies all include yielding blocks and springs, multiple yielding blocks are fixedly connected to the material box pulling plate, and the bottom ends of multiple material box movable positioning plates pass through a movable limiting hole, and the spring is clamped between the yielding block and the proximal end portion of the bottom end of the material box movable positioning plate.

[0015] Furthermore, the material box placement plate is further provided with a plurality of limit plates extending upward. When the plurality of material boxes are fixed on the clamping positions, the plurality of limit plates are used to be limited to the rear of the material boxes.

[0016] Furthermore, the movable limiting hole is a square hole, and the square hole has a first length along the length direction of the placement plate body. The upper part of the material box movable positioning plate is located above the placement plate body, and the middle part passes through the square hole. The material box movable positioning plate is driven to telescopically move within the first length space relative to the corresponding material box fixed positioning plate.

[0017] Furthermore, the movable positioning plate of the material box includes a baffle portion and a movable limiting portion. The width of the baffle portion is greater than the width of the movable limiting portion. The movable limiting portion is connected to the bottom of the baffle portion and passes through the movable limiting hole. A spring is clamped between the bottom of the movable limiting portion and the yield block.

[0018] Furthermore, spring end mounting grooves are respectively provided on the opposite surfaces of the said giving way block and the movable limiting portion, and the two ends of the said spring are respectively embedded in the two said spring end mounting grooves.

[0019] Furthermore, a plurality of slide rails are provided on the top surface of the material box pulling plate, and the length extension direction of the plurality of slide rails is consistent with the length extension direction of the placement plate body, and the bottom ends of the plurality of material box movable positioning plates are respectively slidably fitted on the corresponding slide rails.

[0020] Furthermore, a strip-shaped groove is provided on the bottom end surface of the movable positioning plate of the material box, and the slide rail is a strip-shaped convex rail, and the strip-shaped groove is slidably matched with the strip-shaped convex rail.

[0021] Furthermore, a pair of the screw rod support seats are each provided with a threaded hole, the screw rod is threadedly engaged in the threaded holes of the pair of the screw rod support seats, and the outermost end of the protruding screw rod is used for manual rotation of the screw rod.

[0022] Furthermore, the outermost end of the screw rod is a hexagonal head.

[0023] Furthermore, it also includes a height adjustment mechanism, which includes a lifting cylinder and a top plate. The top plate is connected to the end of the piston of the lifting cylinder. The top plate is used to adapt to touching material boxes of different heights under the lifting and lowering adjustment action of the piston.

[0024] In a second aspect, the present application provides a semiconductor plasma cleaning machine, comprising the semiconductor material box clamping device as described above.

[0025] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0026] The semiconductor material box clamping device provided in the present application is adapted to clamp material boxes of different widths and is simple and convenient to operate, providing a material box clamping device for semiconductor cleaning that is simple and convenient to operate and has low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 A schematic diagram of the three-dimensional structure of a semiconductor material box clamping device provided in an embodiment of the present application;

[0029] Figure 2 A schematic diagram of the three-dimensional structure of the semiconductor material box clamping device provided in an embodiment of the present application from another angle;

[0030] Figure 3 A schematic diagram of the three-dimensional structure of the semiconductor material box clamping device provided in an embodiment of the present application from another angle;

[0031] Figure 4 This is a schematic structural diagram of the movable positioning plate of the material box provided in an embodiment of the present application.

[0032] In the figure: 1. Placement plate body; 11. Movable limiting hole; 12. Material box fixed positioning plate; 13. Limiting plate; 2. Material box pulling plate; 31. Material box movable positioning plate; 311. Baffle part; 312. Movable limiting part; 313. Slider; 321. Screw; 3211. Outer end of screw; 322. Screw fixing seat; 323. Fixed block; 331. Give way block; 332. Spring; 333. Slide rail; 4. Material box. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] An embodiment of the present application provides a semiconductor material box clamping device to solve the technical problems in the prior art that the specifications of the semiconductor materials to be cleaned are not adjusted frequently, and the existing automated or semi-automated material box clamping devices have complex structures and are difficult to adjust.

[0035] First, please refer to Figure 1 and Figure 2, the present application provides a semiconductor material box clamping device for clamping a semiconductor material box 4 in a semiconductor plasma cleaning machine, the device includes a material box placing plate, a material box pulling plate 2 and a movable limiting mechanism; the material box placing plate includes a placing plate main body 1, and a plurality of movable limiting holes 11 are provided on the placing plate main body 1 at intervals along the length direction of the placing plate main body 1, and a plurality of material box 4 fixing positioning plates 12 are fixed on the top surface of the placing plate main body 1, which are respectively located on one side of each movable limiting hole 11 and extended upward; the material box pulling plate 2 is located below the placing plate main body 1 and is arranged parallel to the placing plate main body 1; the movable limiting mechanism includes a plurality of material box movable positioning plates 31, at least one set of screw rod 321 components and a plurality of sets of movable matching giving way components; the plurality of said material box movable positioning plates 31 respectively pass through a movable limiting hole 11, and the bottom end slides and connects The cam 322 is fixed on the cam 324 by the spring 330 so as to prevent the cam 324 from sliding off and the cam 325 from sliding off, so that the cam 322 can be fixed on the cam 324 by the spring 330 so as to prevent the cam 324 from sliding off and the cam 325 from sliding off.

[0036] When the screw rod 321 is extended and adjusted, the screw rod 321 drives the material box pulling plate 2 to move along the length direction of the placement plate body 1, and adjusts the width of each clamping position on the placement plate body 1; specifically, when the screw rod 321 is in the initial position, the length of the outer end portion 3211 of the screw rod is at the shortest state, and the material box movable positioning plate 31 is close to the edge of the movable limiting hole 11 of the fixed positioning plate 12 of the material box 4 at the corresponding clamping position, and the width of the clamping position is at the minimum at this time; when the screw rod 321 is unscrewed, that is, when the length of the protruding part of the outer end portion 3211 of the screw rod becomes longer, the screw rod 321 drives the material box pulling plate 2 to move along the length direction of the placement plate body 1, and adjusts the width of each clamping position on the placement plate body 1; specifically, when the screw rod 321 is in the initial position, the length of the outer end portion 3211 of the screw rod is at the shortest state, and the material box movable positioning plate 31 is close to the edge of the movable limiting hole 11 of the fixed positioning plate 12 of the material box 4 at the corresponding clamping position, and the width of the clamping position is at the minimum When the material box pulling plate 2 moves in the second direction, the screw rod 321 synchronously drives all the giving blocks 331 fixedly connected thereto to link and mobilize the corresponding material box movable positioning plate 31 to move in the first direction, and the clamping position between the material box movable positioning plate 31 and the material box 4 fixed positioning plate 12 at the corresponding clamping position becomes wider until the giving block 331 drives the material box movable positioning plate 31 to move to the edge of the movable limiting hole 11 away from the fixed positioning plate 12 of the material box 4, at which time the widest clamping position is provided; clamping positions of different widths are suitable for clamping material boxes 4 of different widths.

[0037] The semiconductor material box clamping device provided in the present application is adapted to clamp material boxes 4 of different widths by setting a movable limiting mechanism. The width of the clamping position of the material box 4 on the material box placement plate can be adjusted manually by rotating the end of the screw rod 321. The device is simple and convenient to operate and provides a material box clamping device for semiconductor cleaning that is simple, convenient to operate and low in cost.

[0038] In the present application, multiple fixed positioning plates 12 of material boxes 4 and multiple movable positioning plates 31 of material boxes correspond to each other into multiple groups, and the width between the fixed positioning plates 12 of material boxes 4 and the movable positioning plates 31 of material boxes in each group is the width of the clamping position of the material box 4; specifically, a clamping position of the material box 4 is formed between a fixed positioning plate 12 of a material box 4 and an upper part of the movable positioning plate 31 of the material box extending out of an adjacent movable limiting hole 11; more specifically, the fixed positioning plates 12 of the material box 4 and the movable positioning plates 31 of the material box are both provided with clamping surfaces, and a clamping position of the material box 4 is formed between the relative clamping surfaces of the two; preferably, the width of the fixed positioning plates 12 of the material box 4 and the width of the upper part of the movable positioning plates 31 of the material box are adapted to the longest length of semiconductor materials of different sizes to be cleaned, or even exceed the longest length, so as to adapt to and be compatible with semiconductor materials of different lengths, and it is only necessary to adjust the width of the clamping position to adapt to clamping material boxes 4 of different widths and lengths.

[0039] In this application, the length direction of the placement plate body 1 corresponds to the width of the material box 4, and multiple material boxes 4 are placed side by side and spaced apart along the length direction of the placement plate body 1; the width direction of the placement plate body 1 corresponds to the length of the material box 4.

[0040] In one embodiment, please refer to Figure 1 The material box placement plate is also provided with a plurality of limit plates 13 extending upward. When the plurality of material boxes 4 are fixed on the clamping position, the plurality of limit plates 13 are used to limit the rear of the material box 4. Combined with the fixed positioning plate 12 of the material box 4 and the movable positioning plate 31 of the material box corresponding to the clamping position, a more stable limiting and clamping effect is achieved on the circumference of the material box 4.

[0041] In one embodiment, the movable limiting hole 11 is a square hole or a hole of another shape having at least two straight edges, the two straight edges being parallel to the fixed positioning plate 12 of the material box 4; the movable limiting hole 11 has a first length along the length direction of the placement plate body 1; the upper portion of the movable positioning plate 31 of the material box is located above the placement plate body 1, and the middle portion passes through the square hole; the movable positioning plate 31 of the material box is driven to move along the first length direction and telescopically move relative to the corresponding fixed positioning plate 12 of the material box 4 within the first length space. Specifically, the movable positioning plate 31 of the material box moves away from the fixed positioning plate 12 of the material box 4 at the corresponding clamping position along the first length direction to an extreme position, correspondingly adapting to clamping the material box 4 with the maximum width; when the movable positioning plate 31 of the material box approaches the fixed positioning plate 12 of the material box 4 at the corresponding clamping position along the first length direction to an extreme position, correspondingly adapting to clamping the material box 4 with the minimum width.

[0042] In one embodiment, please refer to Figure 3 The movable positioning plate 31 of the material box includes an upper baffle portion 311 and a lower movable limiting portion 312. The width of the baffle portion 311 is greater than the width of the movable limiting portion 312, so as to form a longer clamping position with the fixed positioning plate 12 of the material box 4 at the corresponding clamping position, which is compatible with the material box 4 of the maximum length and the material box 4 of other lengths, and plays a stable clamping effect, thereby preventing the material box 4 from loosening and shifting during the semiconductor material cleaning process. The movable limiting portion 312 is connected to the baffle portion 311 and the lower movable limiting portion 312. When the cam 331 is in the unlock state, the cam 332 is in the unlock state, and the cam 333 is in the unlock state, so that the cam 333 is unlocked and the cam 333 is unlocked.

[0043] In one embodiment, spring end mounting grooves are respectively formed on the opposing surfaces of the stop block 331 and the movable limiting portion 312 , and both ends of the spring 332 are respectively embedded and fixedly mounted in the two spring end mounting grooves.

[0044] In the modified embodiment of the present application, a slider 313 can also be fixed at the bottom of the movable limiting portion 312, and the slider slides with the corresponding slide rail 333. The slider can be designed to be wider and taller than the movable limiting portion 312, so as to facilitate the opening of a spring end mounting groove on its side section and provide a stable and reliable contact force surface for the contact limit on the side of the yield block 331.

[0045] In an alternative embodiment of the present application, the spring end mounting groove can be designed to have a certain depth. When the clamping position is clamping the material box, when the spring 332 is in a compressed state, the slider 313 exactly contacts the side end surface of the stop block, thereby providing a more stable stop. This prevents the extremely compressed spring 332 from still protruding between the slider 313 and the stop block 331, thereby affecting the stable stop effect of the contact between the slider 313 and the stop block 331.

[0046] In one embodiment, the middle portion of the screw rod 321 passes through a fixing block 323 , and the bottom surface of the fixing block 323 is fixed to the material box pulling plate 2 .

[0047] In one embodiment, a plurality of slide rails 333 are fixedly installed on the top surface of the material box pulling plate 2, and the length extension direction of the plurality of slide rails 333 is consistent with the length extension direction of the placement plate body 1, and the bottom ends of the plurality of material box movable positioning plates 31 are respectively slidably fitted on the corresponding slide rails 333.

[0048] In one embodiment, please refer to Figure 4 The bottom end surface of the material box movable positioning plate 31 is provided with a strip groove, and the slide rail 333 is a strip convex rail. The strip groove slides with the strip convex rail. Multiple strip convex rails are fixed at intervals on the top surface of the material box pulling plate 2. The length direction of multiple strip convex rails is consistent with the length direction of the material box pulling plate 2, and multiple strip convex rails are on the same straight line.

[0049] In one embodiment, a pair of the screw rod 321 support seats are each provided with a threaded hole, and the screw rod 321 is screwed into the threaded holes of the pair of the screw rod 321 support seats, and the protruding outermost end of the screw rod 321 is used for manual rotation of the screw rod 321; preferably, the outermost end of the screw rod 321 is a hexagonal head, which is convenient for manual rotation of its end for telescopic adjustment.

[0050] In one embodiment, a height adjustment mechanism is further included. The height adjustment mechanism includes a lifting cylinder and a top plate. The top plate is connected to the end of the piston of the lifting cylinder. The top plate is used to adapt to contact material boxes 4 of different heights under the lifting and lowering adjustment of the piston. Combined with the width adjustment design of the clamping position described above, a clamping design is implemented to clamp material boxes 4 of different widths and heights, and is compatible with material boxes 4 of different lengths.

[0051] In a second aspect, the present application provides a semiconductor plasma cleaning machine, comprising the semiconductor material box clamping device as described above.

[0052] It should be noted that, in this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0053] The foregoing is merely a list of specific embodiments of the present application, intended to enable those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the broadest scope consistent with the principles and novel features of the present application.

Claims

1. A semiconductor material box clamping device, characterized in that: include: The material box placement plate includes a placement plate body, on which a plurality of movable limiting holes are spaced apart along the length direction of the placement plate body, and a plurality of material box fixing positioning plates are fixed on the top surface of the placement plate body, which are respectively located on one side of each movable limiting hole and extend upward; The material box pulling plate is located below the placing plate body and is arranged parallel to the placing plate body; The movable limiting mechanism includes multiple material box movable positioning plates, at least one group of screw rod assemblies and multiple groups of movable matching yielding assemblies; multiple material box movable positioning plates respectively pass through a movable limiting hole, and the bottom end is slidably connected to the material box pulling plate; the screw rod assembly includes a screw rod and a pair of screw rod fixing seats, the screw rod is telescopically connected to a pair of screw rod fixing seats, and the telescopic direction is consistent with the length direction of the placement plate main body, the middle of the screw rod is fixed on the material box pulling plate, the outer end of the screw rod protrudes from the outside of the outermost screw rod fixing seat, and a pair of the screw fixing seats are fixed to the bottom surface of the placement plate main body; multiple groups of movable matching yielding assemblies all include yielding blocks and springs, multiple yielding blocks are fixedly connected to the material box pulling plate, and the bottom ends of multiple material box movable positioning plates pass through a movable limiting hole, and the spring is clamped between the yielding block and the proximal end portion of the bottom end of the material box movable positioning plate.

2. The semiconductor material box clamping device according to claim 1, characterized in that: The material box placement plate is further provided with a plurality of limit plates extending upward. When the plurality of material boxes are fixed on the clamping positions, the plurality of limit plates are used to be limited to the rear of the material boxes.

3. The semiconductor material box clamping device according to claim 1, characterized in that: The movable limiting hole is a square hole, and the square hole has a first length along the length direction of the placement plate body. The upper part of the material box movable positioning plate is located above the placement plate body, and the middle part passes through the square hole. The material box movable positioning plate is driven to telescopically move relative to the corresponding material box fixed positioning plate within the first length space.

4. The semiconductor material box clamping device according to claim 1, characterized in that: The movable positioning plate of the material box includes a baffle portion and a movable limiting portion. The width of the baffle portion is greater than the width of the movable limiting portion. The movable limiting portion is connected to the bottom of the baffle portion and passes through the movable limiting hole. A spring is clamped between the bottom of the movable limiting portion and the yield block.

5. The semiconductor material box clamping device according to claim 4, characterized in that: The opposite surfaces of the said giving block and the movable limiting part are respectively provided with spring end mounting grooves, and the two ends of the said spring are respectively embedded in the two said spring end mounting grooves.

6. The semiconductor material box clamping device according to claim 4, characterized in that: A plurality of slide rails are provided on the top surface of the material box pulling plate, and the length extension direction of the plurality of slide rails is consistent with the length extension direction of the placement plate body, and the bottom ends of the plurality of material box movable positioning plates are respectively slidably fitted on the corresponding slide rails.

7. The semiconductor material box clamping device according to claim 6, characterized in that: A strip-shaped groove is provided on the bottom end surface of the movable positioning plate of the material box, and the slide rail is a strip-shaped convex rail, and the strip-shaped groove is slidably matched with the strip-shaped convex rail.

8. The semiconductor material box clamping device according to claim 1, characterized in that: A pair of the screw rod support seats are each provided with a threaded hole, and the screw rod is threadedly engaged in the threaded holes of the pair of the screw rod support seats, and the outermost end of the protruding screw rod is used for manually rotating the screw rod.

9. The semiconductor material box clamping device according to claim 1, characterized in that: It also includes a height adjustment mechanism, which includes a lifting cylinder and a top plate. The top plate is connected to the end of the piston of the lifting cylinder. The top plate is used to adapt to touching material boxes of different heights under the lifting and lowering adjustment action of the piston.

10. A semiconductor plasma cleaning machine, characterized in that: It comprises the semiconductor material box clamping device according to any one of claims 1 to 9.

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