Positioning device

Abstract

The utility model provides a positioning device which comprises a bearing assembly, a positioning assembly and a driving assembly. The bearing assembly is provided with a bearing surface suitable for bearing a chip. The positioning assembly comprises a first positioning part and a second positioning part which are located on the two sides of the bearing assembly in the first direction, and the first direction is parallel to the bearing face. The driving assembly is configured to be capable of driving the first positioning part to move relative to the bearing assembly in the first direction and driving the second positioning part to move relative to the bearing assembly in the reverse direction of the first direction so as to drive the chip. The positioning mode adopted by the utility model does not need to limit the shape of the chip to be circular; and the positioning mode is low in cost. Therefore, the positioning device provided by the utility model has strong adaptability to chips in different shapes, and is low in cost.

Description

Technical Field

[0001] The utility model relates to the field of chip manufacturing, in particular to a positioning device. Background Art

[0002] After the chip is taken out of the material box, it needs to be positioned before it can be loaded onto the wafer stage. In the related art, the positioning of circular chips is generally performed by CIS sensors or cameras. When positioning with a CIS sensor, the pre-alignment table rotates the circular chip for one circle, and the CIS sensor scans the edge of the circular chip. The center position and angle of the circular chip are obtained (usually the circular chip will have a notch mark), and then the center position and angle of the circular chip are positioned by rotating the pre-alignment table and picking up and placing the robot. Similarly, when positioning with a camera, the camera takes a picture of the edge of the circular chip to obtain the center position and angle of the circular chip, and then the center position and angle of the circular chip are positioned by rotating the pre-alignment table and picking up and placing the robot. However, for the positioning of non-circular chips (such as square chips), CIS positioning cannot be used. If camera positioning is used, an XYθ three-axis system is required to adjust the chip position, which has a complex structure and high cost. Utility Model Content

[0003] The main purpose of the utility model is to provide a positioning device which has strong adaptability to chips of different shapes and low cost.

[0004] To achieve the above objectives, the present invention adopts the following technical solutions:

[0005] A positioning device is used to position the chip, and the positioning device includes:

[0006] A carrying component having a carrying surface suitable for carrying a chip;

[0007] A positioning assembly, comprising a first positioning portion and a second positioning portion located on both sides of the bearing assembly along a first direction, wherein the first direction is parallel to the bearing surface;

[0008] The driving component is configured to drive the first positioning portion to move relative to the carrying component along a first direction, and drive the second positioning portion to move relative to the carrying component in the reverse direction of the first direction, so as to drive the chip.

[0009] In some embodiments, the positioning device further includes a guide rail, the first positioning portion and the second positioning portion are both slidably connected to the guide rail, and the driving assembly is configured to drive the first positioning portion and the second positioning portion to slide relative to the guide rail.

[0010] In some embodiments, the drive assembly also includes a drive member, a synchronous belt and multiple synchronous wheels, one of each synchronous wheel is connected to the output end of the drive member and the first positioning part, and the other is connected to the second positioning part. The synchronous belt is wound around each synchronous wheel so that the drive member can drive the first positioning part and the second positioning part to move synchronously.

[0011] In some embodiments, the positioning assembly further includes a third positioning portion and a fourth positioning portion. The second direction is perpendicular to the first direction and parallel to the bearing surface. The third positioning portion and the first positioning portion are arranged opposite to each other along the second direction. The fourth positioning portion and the second positioning portion are arranged opposite to each other along the second direction. Along the first direction, the third positioning portion and the first positioning portion are both located on one side of the bearing assembly, and the fourth positioning portion and the second positioning portion are both located on the other side of the bearing assembly.

[0012] In some embodiments, when viewed in a direction perpendicular to the carrying surface, the outer contour of the chip is polygonal and has two diagonal sides opposite to each other along a first direction, and the first positioning portion and the second positioning portion are adapted to respectively abut against the diagonal sides and drive the chip;

[0013] or,

[0014] The carrier component has a carrier surface suitable for carrying the chip. When viewed in a direction perpendicular to the carrier surface, the outer contour of the chip is polygonal and has two diagonal points opposite to each other along a first direction. The first positioning portion and the second positioning portion are suitable for respectively abutting the diagonal points and driving the chip.

[0015] In some embodiments, the second direction is perpendicular to the first direction and parallel to the carrying surface. The first positioning portion and the second positioning portion both include a plurality of positioning posts arranged along the second direction. Each positioning post is suitable for abutting and driving the chip.

[0016] In some embodiments, the driving component is further configured to drive the first positioning portion to move relative to the carrier component in the opposite direction of the first direction, and drive the second positioning portion to move relative to the carrier component in the first direction, so that both the first positioning portion and the second positioning portion are away from the chip.

[0017] In some embodiments, the supporting assembly includes a first suction cup, which is configured to absorb the chip when the driving assembly stops working and stop absorbing the chip while the driving assembly is driving the chip.

[0018] In some embodiments, the positioning device also includes a scanning component and a calibration component, the supporting component also includes a second suction cup, the first suction cup and the second suction cup are configured to be relatively close to or away from the chip, the positioning device has a first working state and a second working state, when the positioning device is in the first working state, the first suction cup adsorbs the chip, the second suction cup is away from the chip, and the driving component drives the first positioning part and the second positioning part to drive the chip; when the positioning device is in the second working state, the first suction cup is away from the chip, the second suction cup adsorbs the chip, and the second suction cup can drive the chip to rotate relative to the scanning component, the rotation axis of the chip is parallel to the direction of the second suction cup pointing to the chip, so that the scanning component can obtain the position of the chip, and the calibration component can drive the chip according to the position of the chip.

[0019] In some embodiments, there are multiple first suction cups, and each first suction cup is arranged around the second suction cup.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] The positioning device of the present invention includes a carrier assembly, a positioning assembly and a drive assembly. The carrier assembly has a carrier surface suitable for carrying chips. The positioning assembly includes a first positioning portion and a second positioning portion located on both sides of the carrier assembly along a first direction. The drive assembly is configured to be able to drive the first positioning portion to move relative to the carrier assembly along the first direction, and drive the second positioning portion to move relative to the carrier assembly in the opposite direction of the first direction, so as to drive the chip to move in a direction parallel to the carrier surface. Compared with the positioning method of driving a circular chip to rotate and using a sensor to scan its edge in the related art, the positioning method adopted by the present invention is different and does not need to limit the shape of the chip to a circle; and compared with the positioning method of taking pictures, the positioning method adopted by the present invention is less expensive. Therefore, the positioning device of the present invention is more adaptable to chips of different shapes and is less expensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] Figure 1 A three-dimensional schematic diagram of a positioning device provided in the first embodiment of the present utility model;

[0024] Figure 2 This is a three-dimensional schematic diagram of a positioning device provided in a second embodiment of the present utility model;

[0025] Figure 3 This is a three-dimensional schematic diagram of a positioning device provided in the third embodiment of the present utility model.

[0026] Description of Figure Numbers:

[0027] 100- positioning device;

[0028] 110 - bearing assembly; 111 - bearing surface; 112 - first suction cup; 113 - second suction cup;

[0029] 120 - positioning assembly; 121 - first positioning portion; 122 - second positioning portion; 123 - third positioning portion; 124 - fourth positioning portion; 125 - positioning column;

[0030] 130- drive assembly; 131- drive member; 132- timing belt; 133- timing wheel;

[0031] 140-guide rail;

[0032] 150-Scanning component;

[0033] 160-calibration component;

[0034] X-first direction;

[0035] Y-second direction.

[0036] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0039] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or", "and / or" or "and / or" appear in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0040] After the chip is taken out of the material box, it needs to be positioned before it can be loaded onto the wafer stage. In the related art, the positioning of circular chips is generally performed by CIS sensors or cameras. When positioning with a CIS sensor, the pre-alignment table rotates the circular chip for one circle, and the CIS sensor scans the edge of the circular chip. The center position and angle of the circular chip are obtained (usually the circular chip will have a notch mark), and then the center position and angle of the circular chip are positioned by rotating the pre-alignment table and picking up and placing the robot. Similarly, when positioning with a camera, the camera takes a picture of the edge of the circular chip to obtain the center position and angle of the circular chip, and then the center position and angle of the circular chip are positioned by rotating the pre-alignment table and picking up and placing the robot. However, for the positioning of non-circular chips (such as square chips), CIS positioning cannot be used. If camera positioning is used, an XYθ three-axis system is required to adjust the chip position, which has a complex structure and high cost.

[0041] In view of this, see Figure 1-Figure 3 In one embodiment of the present invention, a positioning device 100 is provided for positioning a chip. The chip can be of any suitable type and shape, without limitation. Furthermore, the positioning device 100 can be used in any suitable process in a chip production line. For example, the positioning device 100 can be used between the process of removing a chip from a magazine and the process of loading the chip onto a wafer stage.

[0042] The positioning device 100 includes a bearing assembly 110, a positioning assembly 120 and a driving assembly 130. Figure 1, the carrier component 110 has a carrier surface 111 suitable for carrying the chip. In other words, the carrier surface 111 is the contact surface between the carrier component 110 and the chip when carrying the chip. In different embodiments, the carrier component 110 may have one or more parts suitable for carrying the chip, so there may be one or more carrier surfaces 111. Therefore, according to the shape of the chip and the positioning requirements, the carrier component 110 can have any suitable structural shape and adopt any suitable carrying method and carrying direction. For example, in some embodiments, the chip can be directly placed on the carrying surface 111 of the carrier component 110 along the direction of gravity, so that the carrier component 110 carries the chip; in other embodiments, the carrier component 110 can also actively adsorb the chip, so that the carrier component 110 carries the chip.

[0043] See also Figure 1 or Figure 2 The positioning assembly 120 includes a first positioning portion 121 and a second positioning portion 122 located on both sides of the carrier assembly 110 along a first direction X. The first direction X is parallel to the carrier surface 111. It is understood that since the first positioning portion 121 and the second positioning portion 122 are located on both sides of the carrier assembly 110, they can also be located on both sides of the chip, thereby abutting and positioning different sides of the chip. In addition, in different embodiments, the shape and structure of the first positioning portion 121 and the second positioning portion 122 can be the same or different.

[0044] See also Figure 1 or Figure 2 The driving component 130 is configured to drive the first positioning portion 121 to move relative to the carrier component 110 along the first direction X, and drive the second positioning portion 122 to move relative to the carrier component 110 in the opposite direction of the first direction X, so as to drive the chip to move in a direction parallel to the carrier surface 111. This driving process is the positioning process of the chip, and when the first positioning portion 121 and the second positioning portion 122 both reach their limit positions, the chip can be located in the positioning position accordingly. It can be understood that since the first positioning portion 121 and the second positioning portion 122 can be located on opposite sides of the chip along the first direction X, driving the first positioning portion 121 and the second positioning portion 122 in opposite directions can make both move toward each other in the direction close to the chip, thereby driving the chip to adjust the position of the chip. In this process, the chip also moves relative to the carrier component 110, and the carrier surface 111 can continue to support the chip. Depending on the shape of the chip and positioning requirements, the first direction X can be any suitable direction.

[0045] Based on the above embodiments, it can be seen that the positioning device 100 of the present invention includes a carrier assembly 110, a positioning assembly 120, and a drive assembly 130. The carrier assembly 110 has a carrier surface 111 suitable for supporting a chip. The positioning assembly 120 includes a first positioning portion 121 and a second positioning portion 122 located on either side of the carrier assembly 110 along a first direction X. The drive assembly 130 is configured to drive the first positioning portion 121 relative to the carrier assembly 110 in the first direction X and to drive the second positioning portion 122 relative to the carrier assembly 110 in the opposite direction of the first direction X, thereby driving the chip to move parallel to the carrier surface 111. Compared to the related art positioning method that rotates a circular chip and uses a sensor to scan its edge, the positioning method adopted in the present invention is different and does not require the chip to be circular in shape. Furthermore, compared to the positioning method using camera photography, the positioning method adopted in the present invention is less expensive. Therefore, the positioning device 100 of the present invention is more adaptable to chips of different shapes and is less expensive.

[0046] Regarding the specific form of the driving assembly 130 driving the positioning assembly 120. For ease of description, the positioning parts described herein all refer to the first positioning part 121 and / or the second positioning part 122 and / or other parts of the positioning assembly 120 having similar functions. Figure 1 In some embodiments, the positioning device 100 further includes a guide rail 140, and the first positioning portion 121 and the second positioning portion 122 are both slidably connected to the guide rail 140. Specifically, in some embodiments, the first positioning portion 121 and the second positioning portion 122 may both have grooves, and the guide rail 140 may have protrusions, so that the positioning portions can form a sliding connection with the guide rail 140; in other embodiments, the first positioning portion 121 and the second positioning portion 122 may both have protrusions, and the guide rail 140 may have grooves, so that the positioning portions can form a sliding connection with the guide rail 140.

[0047] See also Figure 1In some embodiments, the driving assembly 130 is configured to drive the first positioning portion 121 and the second positioning portion 122 to slide relative to the guide rail 140. More specifically, in some embodiments, the driving assembly 130 further includes a driving member 131, a synchronous belt 132, and a plurality of synchronous pulleys 133. One of the synchronous pulleys 133 is drivingly connected to the output end of the driving member 131 and the first positioning portion 121, and the other is drivingly connected to the second positioning portion 122. The synchronous belt 132 is wound around each synchronous pulley 133, so that the driving member 131 can drive the first positioning portion 121 and the second positioning portion 122 to move synchronously. In the above-described transmission configuration, the synchronous belt 132 is an endless belt with evenly spaced teeth on its inner circumference, while the synchronous pulley 133 has tooth grooves corresponding to the tooth profile of the synchronous belt 132. The teeth on the synchronous belt 132 and the synchronous pulley 133 interlock with each other. As the synchronous pulley 133 rotates, the teeth and tooth grooves mesh to transmit motion and power to the synchronous belt 132, thereby preventing slippage during the transmission process and ensuring the accuracy and stability of the transmission. When the driving member 131 is a motor, the output end of the driving member 131 corresponds to the motor's drive shaft. The drive shaft can be inserted into the synchronous pulley 133, so that the latter can drive the former to rotate, thereby forming a transmission connection between the synchronous pulley 133 and the output end of the driving member 131. Furthermore, to ensure that the rotation of each synchronizing wheel 133 drives the synchronous rotation of the corresponding positioning portion, the synchronizing wheel 133 and the first positioning portion 121 and the second positioning portion 122 can be connected in any suitable manner. For example, in some embodiments, the synchronizing wheel 133 and the first positioning portion 121 and the second positioning portion 122 can be connected in a toothed manner or in a winding manner. This driving method ensures a high synchronization rate between the movement of the positioning portions, thereby achieving more accurate positioning.

[0048] Furthermore, in some embodiments, the drive assembly 130 is further configured to drive the first positioning portion 121 to move relative to the carrier assembly 110 in the opposite direction of the first direction X, and to drive the second positioning portion 122 to move relative to the carrier assembly 110 in the first direction X, so that both the first positioning portion 121 and the second positioning portion 122 are away from the chip. Through this reverse retraction motion, each positioning portion can be reset after the chip is positioned, thereby preventing the positioning portion from subsequently affecting the chip's position and facilitating subsequent robotic grasping operations.

[0049] For more precise positioning, see Figure 1In some embodiments, the positioning assembly 120 further includes a third positioning portion 123 and a fourth positioning portion 124. For ease of explanation, the second direction Y is defined below as perpendicular to the first direction X and parallel to the supporting surface 111. Therefore, the third positioning portion 123 and the first positioning portion 121 are arranged opposite each other along the second direction Y, and the fourth positioning portion 124 and the second positioning portion 122 are arranged opposite each other along the second direction Y. Along the first direction X, the third positioning portion 123 and the first positioning portion 121 are both located on one side of the supporting assembly 110, and the fourth positioning portion 124 and the second positioning portion 122 are both located on the other side of the supporting assembly 110. It is understandable that the positioning assembly 120 may include four positioning portions arranged diagonally, and the distance between each positioning portion may be determined according to the shape of the chip to be positioned. Specifically, in some embodiments, when the outer contour of the chip is rectangular when viewed in a direction perpendicular to the carrier surface 111, the above-mentioned four positioning portions may be responsible for respectively abutting the four diagonal points of the rectangular chip, and then abutting and driving the four diagonal points of the chip (specifically, one or two of the diagonal points may be abutted and driven simultaneously in a direction parallel to the carrier surface 111), thereby forming the center positioning of the chip. In addition, depending on the shape of the chip, the positioning assembly 120 may also include more positioning portions, and the structural shapes of the positioning portions may be the same or different.

[0050] For more detailed information on the coordination between the positioning unit and the chip, see Figure 1 In some embodiments, when viewed from a direction perpendicular to the carrying surface 111, the outer contour of the chip is polygonal and has two diagonal sides opposite to each other along the first direction X. The first positioning portion 121 and the second positioning portion 122 are adapted to respectively abut against the diagonal sides and drive the chip. Alternatively, see Figure 2 In other embodiments, when viewed perpendicular to the carrier surface 111, the chip's outer contour is polygonal and has two diagonal points opposite each other along the first direction X. The first positioning portion 121 and the second positioning portion 122 are adapted to abut the diagonal points, respectively, and drive the chip. It is understood that both of the aforementioned abutment drive methods enable the first positioning portion 121 and the second positioning portion 122 to correspond to the two diagonal positions of the chip, respectively, thereby ensuring that the abutment drive can drive the chip to a predetermined central positioning position. In conjunction with the aforementioned embodiment, when the positioning assembly 120 further includes a third positioning portion 123 and a fourth positioning portion 124, similarly, two additional synchronous wheels 133 may be respectively connected to the third positioning portion 123 and the fourth positioning portion 124, so that the four positioning portions can move synchronously toward the center, and at least one positioning portion can abut a diagonal position of the chip. After all four positioning portions move toward the center to their extreme positions, the portions of the four positioning portions adapted to abut the chip can enclose the outer contour shape and size of the chip. The location of this shape is then the target position for chip positioning.

[0051] For more detailed information on the positioning structure, see Figure 1 In some embodiments, the first positioning portion 121 and the second positioning portion 122 each include a plurality of positioning posts 125 arranged along the second direction Y, and each positioning post 125 is suitable for abutting and driving the chip. It is understood that in one embodiment shown in the figure, the first positioning portion 121 and the second positioning portion 122 each include two positioning posts 125. The positioning posts 125 are the parts of each positioning portion suitable for abutting the chip, and each positioning post 125 can abut the chip simultaneously during the driving process, thereby making the abutment driving of the chip by each positioning portion more stable. In addition, the above-mentioned arrangement can also be applied to other positioning portions, such as the third positioning portion 123 and the fourth positioning portion 124.

[0052] Furthermore, in order to make the position of the chip more stable during the positioning process and not easy to shake, see Figure 1 or Figure 2 or Figure 3 In some embodiments, the carrier assembly 110 includes a first suction cup 112, whereby the first suction cup 112 is configured to adsorb the chip when the driving assembly 130 stops working, and to stop adsorbing the chip while the driving assembly 130 is driving the chip. It is understandable that the state in which the driving assembly 130 stops working can be, on the one hand, the state after the robot places the chip on the carrier assembly 110 and before the driving assembly 130 starts driving the positioning assembly 120 to abut the chip; on the other hand, it can also be the state after the chip positioning is completed and before the robot further moves the chip. Therefore, the above-mentioned arrangement can fix the chip through the first suction cup 112 when the positioning assembly 120 is not driving to position the chip.

[0053] Based on the first suction cup 112 defined in the above embodiment, the positioning device 100 may further have other positioning methods according to different chip types or different positioning requirements. Figure 3In some embodiments, the positioning device 100 further includes a scanning component 150 and a calibration component 160, and the supporting component 110 further includes a second suction cup 113. The first suction cup 112 and the second suction cup 113 are both configured to be relatively close to or away from the chip. Based on this, the positioning device 100 has a first working state and a second working state. The two working states can be different states when the positioning device 100 positions chips of different shapes, or can be different states of the positioning device 100 under different positioning requirements. For ease of explanation, the following description is based on an embodiment in which the positioning device 100 positions a square chip when in the first working state and positions a circular chip when in the second working state. When the positioning device 100 is in the first working state, the first suction cup 112 adsorbs the chip, the second suction cup 113 moves away from the chip, and the driving component 130 drives the first positioning portion 121 and the second positioning portion 122 to drive the chip. This positioning method can refer to the description in the above embodiments and will not be repeated here. In addition, the positioning device 100 may have another positioning method. When the positioning device 100 is in the second working state, the first suction cup 112 is away from the chip, the second suction cup 113 adsorbs the chip, and the second suction cup 113 can drive the chip to rotate relative to the scanning component 150. The rotation axis of the chip is parallel to the direction in which the second suction cup 113 points to the chip, so that the scanning component 150 can obtain the position of the chip, and the calibration component 160 can drive the chip according to the position of the chip. Among them, the scanning component 150 can be specifically a CIS sensor or other similar sensors, and the calibration component 160 can be specifically a manipulator (the manipulator can be a manipulator for transferring chips between different workstations, or it can be a separately provided manipulator), and the calibration component 160 can be configured to move in a direction parallel to the carrying surface 111 and adjust the position of the chip. The following is an exemplary description of the working process in the second working state. First, the manipulator adsorbs the chip from the storage box and places it on the rotating table. Thereafter, the pre-alignment table rotates the circular chip one circle, and the CIS scans the edge of the circular chip. Since the working principle of CIS is to convert light into electrical signals, when light shines on the CIS chip, the photosensitive unit converts photons into electric charges, which are then read by the reader and converted into digital signals, eventually forming a digital image. After that, the eccentric position of the chip is calculated through the edge detection sensor (such as a laser sensor or image sensor) in conjunction with the turntable, and based on the eccentric position, the chip offset direction is rotated to the movement direction of the robot. The robot picks up and places the chip to adjust the chip's center offset, thereby calibrating the chip's position. After completing the above steps, the robot automatically grabs the chip from the workbench and puts it back into the wafer box.

[0054] In addition, based on the first suction cup 112 and the second suction cup 113 defined above. Figure 1 or Figure 3In some embodiments, there are multiple first suction cups 112, each of which is arranged around the second suction cup 113. In conjunction with the above description, it can be seen that in the first operating state, the positioning portion pushes the end of the chip to position it. Therefore, the first suction cup 112, which supports the chip, also supports the end of the chip accordingly, ensuring stable support for the chip during this process and more accurate positioning. In the second operating state, the second suction cup 113 rotates the chip while holding it. This allows the second suction cup 113 to be positioned at the geometric center of the chip, making it easier for the scanning assembly 150 to determine the chip's position and achieving more accurate positioning. Furthermore, in conjunction with the definition of the holding surface 111 in the previous embodiment, in some embodiments, in the first operating state, the second suction cup 113 can support the chip without holding it; or, during the process of the robot arm transferring the chip to the positioning device 100, the second suction cup 113 rises to receive the chip, then descends and transfers the chip to the first suction cup 112 for holding.

[0055] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention specification and drawings, or direct / indirect applications in other related technical fields, within the application concept of the present invention, are included in the patent protection scope of the present invention.

Claims

1. A positioning device for positioning a chip, characterized in that: The positioning device comprises: A carrying component having a carrying surface suitable for carrying the chip; A positioning assembly, comprising a first positioning portion and a second positioning portion located on both sides of the bearing assembly along a first direction, wherein the first direction is parallel to the bearing surface; The driving assembly is configured to drive the first positioning portion to move relative to the carrier assembly along the first direction, and drive the second positioning portion to move relative to the carrier assembly in the opposite direction of the first direction, so as to drive the chip.

2. The positioning device according to claim 1, characterized in that The positioning device further includes a guide rail, the first positioning portion and the second positioning portion are both slidably connected to the guide rail, and the driving assembly is configured to drive the first positioning portion and the second positioning portion to slide relative to the guide rail.

3. The positioning device according to claim 2, characterized in that The drive assembly also includes a drive member, a synchronous belt and a plurality of synchronous wheels, one of the synchronous wheels is connected to the output end of the drive member and the first positioning part, and the other is connected to the second positioning part. The synchronous belt is wound around each of the synchronous wheels so that the drive member can drive the first positioning part and the second positioning part to move synchronously.

4. The positioning device according to claim 1, characterized in that The positioning assembly also includes a third positioning portion and a fourth positioning portion. The second direction is perpendicular to the first direction and parallel to the bearing surface. The third positioning portion and the first positioning portion are arranged opposite to each other along the second direction. The fourth positioning portion and the second positioning portion are arranged opposite to each other along the second direction. Along the first direction, the third positioning portion and the first positioning portion are both located on one side of the bearing assembly, and the fourth positioning portion and the second positioning portion are both located on the other side of the bearing assembly.

5. The positioning device according to claim 1, characterized in that When viewed in a direction perpendicular to the carrying surface, the outer contour of the chip is polygonal and has two diagonal sides opposite to each other along the first direction, and the first positioning portion and the second positioning portion are adapted to respectively abut against the diagonal sides and drive the chip; or, The carrier component has a carrying surface suitable for carrying the chip. When viewed in a direction perpendicular to the carrying surface, the outer contour of the chip is polygonal and has two diagonal points opposite to each other along the first direction. The first positioning portion and the second positioning portion are suitable for respectively abutting the diagonal points and driving the chip.

6. The positioning device according to claim 1, characterized in that The second direction is perpendicular to the first direction and parallel to the carrying surface. The first positioning portion and the second positioning portion both include a plurality of positioning posts arranged along the second direction. Each of the positioning posts is suitable for abutting against and driving the chip.

7. The positioning device according to claim 1, characterized in that The driving component is further configured to drive the first positioning portion to move relative to the carrier component in the opposite direction of the first direction, and to drive the second positioning portion to move relative to the carrier component in the first direction, so that both the first positioning portion and the second positioning portion are away from the chip.

8. The positioning device according to claim 1, characterized in that The carrying component includes a first suction cup, which is configured to absorb the chip when the driving component stops working and stop absorbing the chip when the driving component drives the chip.

9. The positioning device according to claim 8, characterized in that The positioning device further includes a scanning component and a calibration component, and the carrying component further includes a second suction cup. The first suction cup and the second suction cup are both configured to be relatively close to or away from the chip. The positioning device has a first working state and a second working state. When the positioning device is in the first working state, the first suction cup absorbs the chip and the second suction cup moves away from the chip. The driving component drives the first positioning portion and the second positioning portion to drive the chip. When the positioning device is in the second working state, the first suction cup is away from the chip, the second suction cup adsorbs the chip, and the second suction cup can drive the chip to rotate relative to the scanning component. The rotation axis of the chip is parallel to the direction in which the second suction cup points to the chip, so that the scanning component can obtain the position of the chip, and the calibration component can drive the chip according to the position of the chip.

10. The positioning device according to claim 9, characterized in that There are multiple first suction cups, and each of the first suction cups is arranged around the second suction cup.

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