Three-dimensional integrated sensor chip packaging module

Abstract

The utility model belongs to the technical field of chip packaging, and particularly relates to a three-dimensional integrated sensor chip packaging module which comprises a base, a supporting column fixedly mounted at the top of the base, a mounting seat arranged at the top of the supporting column, a through groove formed in the mounting seat, a pin groove formed in one side of the mounting seat, and a vacuum pump fixedly mounted at the bottom of the base. A guide pipe is fixedly connected to one side of the vacuum pump, a sliding groove is formed in the base, a sliding block is arranged in the sliding groove, a connecting supporting pipe is fixedly connected to the top of the sliding block, a miniature fan is fixedly installed on one side of the connecting supporting pipe, and a suction cup is arranged on the top of the connecting supporting pipe. According to the utility model, the connecting sleeve and the connecting groove are arranged at the bottom of the sucker, and the threaded head and the sealing ring are arranged at one end of the connecting support tube and are matched for use, so that the sucker can be conveniently and quickly mounted and dismounted, suckers with different sizes can be conveniently replaced, and different chips can be better packaged; and the structural practicability and functionality can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a three-dimensional integrated sensor chip packaging module. Background Art

[0002] As the intelligence of terminal products continues to increase, a variety of sensor chips are emerging. Sensor chips have expanded the application areas of products such as smartphones and tablets. For example, the emergence of fingerprint recognition chips has greatly improved the security of these products. Currently, a typical fingerprint recognition sensor chip includes a semiconductor chip with an array of sensor elements formed as a sensing area. Its most significant feature is that the sensing area on the chip surface interacts with the user's finger, generating an electrical signal that the chip can sense. A chip package is a housing for mounting a semiconductor integrated circuit chip. It serves to house, secure, seal, and protect the chip, enhancing its electrical and thermal performance. It also serves as a bridge between the chip's internal world and external circuits. The chip packaging module is the structure used to secure the chip during the chip packaging process.

[0003] The prior art has the following deficiencies: The prior art publication number is CN201921985526.4, a three-dimensional integrated sensor UNITMA chip packaging module, comprising a mounting seat and a base, the base being located at the bottom of the mounting seat, a slide groove being provided on the top of the base, a fixed block being fixedly connected to the left side of the top of the base, and a slider being slidably connected to the base through the slide groove, a micro suction cup A being installed on the left side of the top of the mounting seat, the bottom of the micro suction cup A passing through the mounting seat and the fixed block, a micro suction cup B being installed on the right side of the top of the mounting seat, the bottom of the micro suction cup B passing through the mounting seat and the slider, a vacuum pump being installed on the right side of the mounting seat, the output end of the vacuum pump being connected with an exhaust pipe, and there are two exhaust pipes, and the exhaust pipes are respectively connected to the bottom of the micro suction cup A and the micro suction cup B on the side away from the vacuum pump.

[0004] Although the above-mentioned device can adjust the distance between the suction cups by moving and fix the packaging of chips of different specifications during use, it is not convenient to quickly install and disassemble the suction cups during use, and it is not convenient to replace different suction cups to better package different chips, which makes it inconvenient to work better. Utility Model Content

[0005] In view of the deficiencies of the prior art, the present invention provides a three-dimensional integrated sensor chip packaging module to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a three-dimensional integrated sensor chip packaging module, comprising a base, a support column fixedly installed on the top of the base, a mounting seat provided on the top of the support column, a through groove provided inside the mounting seat, a pin groove provided on one side of the mounting seat, a vacuum pump fixedly installed on the bottom of the base, a conduit fixedly connected to one side of the vacuum pump, a slide groove provided inside the base, a slider provided inside the slide groove, a connecting support tube fixedly connected to the top of the slider, a micro fan fixedly installed on one side of the connecting support tube, and a suction cup provided on the top of the connecting support tube.

[0007] As a preferred technical solution of the present invention, four support columns are provided, and the support columns are evenly and symmetrically distributed between the base and the mounting seat.

[0008] As a preferred technical solution of the present invention, the vacuum pump is fixedly installed on the bottom of the base by bolts, and the vacuum pump is electrically connected to the external power supply through a wire.

[0009] As a preferred technical solution of the present invention, the outer diameter of the slider is matched with the inner diameter of the chute, and the slider is slidably connected to the chute.

[0010] As an optimal technical solution of the present invention, the connecting support tube includes a threaded head and a sealing ring. A threaded head is provided at one end of the connecting support tube, and a sealing ring is provided at one end of the threaded head. The connecting support tube is connected to the catheter through a slider.

[0011] As a preferred technical solution of the present invention, a plurality of micro fans are provided, and the micro fans are evenly and symmetrically distributed on both sides of the connecting support tube.

[0012] As an optimal technical solution of the present invention, the suction cup includes a connecting sleeve and a threaded groove. A connecting sleeve is provided at the bottom of the suction cup, and a threaded groove is provided inside the connecting sleeve. The inner diameter of the threaded groove is adapted to the outer diameter of the thread head. The connecting support tube is threadably connected to the threaded groove inside the connecting sleeve through the threaded head.

[0013] Compared with the existing technology, the present invention provides a three-dimensional integrated sensor chip packaging module with the following beneficial effects:

[0014] The three-dimensional integrated sensor chip packaging module is used in conjunction with a vacuum pump, a conduit, a connecting support tube and a suction cup. By driving the vacuum pump to work, the chip can be adsorbed and fixed on the top of the suction cup, thereby improving its placement stability and facilitating its packaging. By setting a slider and a sliding groove for sliding connection, the suction cup spacing can be adjusted left and right, thereby facilitating the adsorption and fixation of chips of different sizes. By providing a connecting sleeve and a connecting groove at the bottom of the suction cup and providing a threaded head and a sealing ring at one end of the connecting support tube for coordinated use, the suction cup can be quickly installed and disassembled, and suction cups of different sizes can be easily replaced, so as to better package different chips, thereby improving its structural practicality and functionality. By providing micro fans on both sides of the connecting support tube for coordinated use, dust adhering to the bottom of the chip can be quickly and effectively cleaned, thereby avoiding affecting the effect of the packaging work and facilitating better work use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the cross-sectional structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the connection structure of the suction cup and the support pipe of the utility model;

[0018] Figure 4 This is a schematic diagram of the suction cup connection and support tube separation structure of the utility model.

[0019] In the figure: 1. Base; 2. Support column; 3. Mounting seat; 4. Through groove; 5. Pin groove; 6. Vacuum pump; 7. Conduit; 8. Slide groove; 9. Slider; 10. Connecting support tube; 1001. Threaded head; 1002. Sealing ring; 11. Micro fan; 12. Suction cup; 1201. Connecting sleeve; 1202. Threaded groove. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4The top of the slider 9 is fixed with a connecting support tube 10, and a suction cup 12 is provided on the top of the connecting support tube 10 to facilitate the adsorption and fixation of the chip.

[0022] In this embodiment, four support columns 2 are provided, and the support columns 2 are evenly and symmetrically distributed between the base 1 and the mounting base 3, so as to facilitate connection and support and facilitate work and use;

[0023] In this embodiment, the vacuum pump 6 is fixedly mounted on the bottom of the base 1 by bolts. The vacuum pump 6 is electrically connected to an external power source via a wire, so as to facilitate driving it to work and evacuate the interior of the connecting support tube 10.

[0024] In this embodiment, the outer diameter of the slider 9 is adapted to the inner diameter of the chute 8, and the slider 9 is slidably connected to the chute 8, which facilitates sliding adjustment and facilitates left and right movement to adjust the spacing between the suction cups 12;

[0025] In this embodiment, the connecting support tube 10 includes a threaded head 1001 and a sealing ring 1002. The threaded head 1001 is provided at one end of the connecting support tube 10, and the sealing ring 1002 is provided at one end of the threaded head 1001. The connecting support tube 10 is connected to the conduit 7 through the slider 9, which facilitates the connection of the interior of the connecting support tube 10 and facilitates vacuuming.

[0026] In this embodiment, a plurality of micro fans 11 are provided, and the micro fans 11 are evenly and symmetrically distributed on both sides of the connecting support tube 10, so as to facilitate quick and effective cleaning of dust on the surface of the chip and facilitate better packaging thereof;

[0027] In this embodiment, the suction cup 12 includes a connecting sleeve 1201 and a thread groove 1202. The connecting sleeve 1201 is provided at the bottom of the suction cup 12, and the thread groove 1202 is provided inside the connecting sleeve 1201. The inner diameter of the thread groove 1202 is adapted to the outer diameter of the thread head 1001. The connecting support tube 10 is threadably connected to the thread groove 1202 inside the connecting sleeve 1201 through the thread head 1001, which facilitates quick connection and installation of the suction cup 12 and facilitates replacement and use.

[0028] The working principle and usage process of the present invention are as follows: the operator places the chip on the top of the suction cup 12 and drives the vacuum pump 6 to work, so that the chip can be adsorbed and fixed on the top of the suction cup 12, thereby improving its placement stability and facilitating better packaging work. By moving the connecting support tube 10 left and right, the suction cup 12 can be driven to move left and right for adjustment, which facilitates adjustment of the spacing between them and facilitates the adsorption and fixation of chips of different sizes. By driving the micro fan 11 to work, the dust adhered to the bottom of the chip can be quickly and effectively cleaned to avoid affecting the use effect of the packaging work. By rotating the suction cup 12, the connecting sleeve 1201 can be driven to rotate, which facilitates the installation and disassembly of the suction cup 12 and facilitates the replacement of different suction cups 12 for work use.

[0029] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A three-dimensional integrated sensor chip packaging module, comprising a base (1), a support column (2) fixedly mounted on the top of the base (1), a mounting seat (3) provided on the top of the support column (2), a through groove (4) provided inside the mounting seat (3), and a pin groove (5) provided on one side of the mounting seat (3), characterized in that: A vacuum pump (6) is fixedly installed at the bottom of the base (1), a guide tube (7) is fixedly connected to one side of the vacuum pump (6), a slide groove (8) is provided inside the base (1), a slider (9) is provided inside the slide groove (8), a connecting support tube (10) is fixedly connected to the top of the slider (9), a micro fan (11) is fixedly installed on one side of the connecting support tube (10), and a suction cup (12) is provided on the top of the connecting support tube (10).

2. The three-dimensional integrated sensor chip packaging module according to claim 1, characterized in that: Four support columns (2) are provided, and the support columns (2) are evenly and symmetrically distributed between the base (1) and the mounting seat (3).

3. The three-dimensional integrated sensor chip packaging module according to claim 1, characterized in that: The vacuum pump (6) is fixedly mounted on the bottom of the base (1) by means of bolts, and the vacuum pump (6) is electrically connected to an external power supply via a wire.

4. The three-dimensional integrated sensor chip packaging module according to claim 1, characterized in that: The outer diameter of the slider (9) is matched with the inner diameter of the slide groove (8), and the slider (9) is slidably connected to the slide groove (8).

5. The three-dimensional integrated sensor chip packaging module according to claim 1, characterized in that: The connecting support tube (10) comprises a threaded head (1001) and a sealing ring (1002); one end of the connecting support tube (10) is provided with a threaded head (1001); one end of the threaded head (1001) is provided with a sealing ring (1002); and the connecting support tube (10) is connected to the conduit (7) via a slider (9).

6. The three-dimensional integrated sensor chip packaging module according to claim 1, characterized in that: A plurality of micro fans (11) are provided, and the micro fans (11) are evenly and symmetrically distributed on both sides of the connecting support tube (10).

7. The three-dimensional integrated sensor chip packaging module according to claim 1, characterized in that: The suction cup (12) comprises a connecting sleeve (1201) and a thread groove (1202); the connecting sleeve (1201) is provided at the bottom of the suction cup (12); the thread groove (1202) is provided inside the connecting sleeve (1201); the inner diameter of the thread groove (1202) is adapted to the outer diameter of the thread head (1001); the connecting support tube (10) is threadably connected to the thread groove (1202) inside the connecting sleeve (1201) via the thread head (1001).

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