Integrated busbar with temperature monitoring structure
By introducing the position adjustment of the thermally conductive moving block and the temperature sensor into the integrated busbar, combined with the heat dissipation component and thermal potting glue, the problems of poor heat dissipation effect and incomplete temperature monitoring of the integrated busbar are solved, efficient heat dissipation and comprehensive temperature monitoring are achieved, and the safety and practicality of the equipment are improved.
Patent Information
- Application Number
- CN202421967334.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-08-14
AI Technical Summary
The traditional integrated busbar has poor heat dissipation effect under long-term high load operation and incomplete temperature monitoring, which leads to local overheating of the equipment and even causes safety accidents.
An integrated busbar with a temperature monitoring structure is designed, including a substrate, a thermally conductive bar plate, a thermally conductive moving block, a heat dissipation component, a regulation component and a temperature monitoring component. Through the position adjustment of the thermally conductive moving block and the distribution of the temperature sensor, temperature monitoring of different positions is achieved, and the heat dissipation effect is improved through the heat dissipation component and the thermally conductive potting glue.
It realizes efficient heat dissipation and comprehensive temperature monitoring of the integrated busbar, can detect abnormal situations in a timely manner, and improves the safety and practicality of the equipment.
Smart Images
Figure CN223206593U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated busbars, in particular to an integrated busbar with a temperature monitoring structure. Background Art
[0002] With the continuous development of power electronics technology, the performance stability and safety of integrated busbars, as important components of power transmission, are attracting increasing attention. However, traditional integrated busbars will inevitably generate a certain amount of heat when operating under high load for a long time. If this heat is not discharged in time, it will easily affect the normal operation of the integrated busbar. At the same time, in order to avoid high temperatures in the integrated busbar, temperature sensors are often installed for temperature monitoring. However, traditional temperature monitoring methods can only achieve overall temperature monitoring of the integrated busbar and cannot be refined to monitor the specific location where high temperatures are generated, resulting in incomplete temperature monitoring, which can easily lead to local overheating of the equipment and even cause safety accidents. Therefore, designing an integrated busbar with a temperature monitoring structure to improve its heat dissipation effect and the comprehensiveness of temperature monitoring is of great practical significance.
[0003] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility Model Content
[0004] The purpose of the present invention is to solve the shortcomings mentioned in the above background technology and to propose an integrated busbar with a temperature monitoring structure.
[0005] The above technical objectives of the present utility model are achieved through the following technical solutions: an integrated busbar with a temperature monitoring structure, comprising a base plate, a busbar, a plurality of conductive blocks, a heat-conducting strip plate, a heat-conducting movable block, a heat dissipation component, an adjustment component and a temperature monitoring component;
[0006] The front and back sides of the substrate are provided with strip grooves, the heat-conducting strip plate is fixedly installed in the strip groove on the front side, the number of the busbars is two and they are respectively arranged on the upper and lower sides of the heat-conducting strip plate, and a plurality of conductive blocks are respectively fixedly installed on the corresponding busbars and are arranged at equal intervals. The heat-conducting strip plate is provided with a guide groove, the adjustment component is arranged in the guide groove, the heat-conducting movable block is slidably installed in the guide groove and is connected to the adjustment component, the temperature monitoring component is arranged on the heat-conducting strip plate and the heat-conducting movable block, and the heat dissipation component is arranged on the substrate and connected to the heat-conducting strip plate and the busbar.
[0007] Preferably, the heat dissipation assembly includes a heat dissipation frame and a plurality of heat-conducting connecting plates. The heat dissipation frame is clamped and installed on the outer peripheral side of the substrate. Both sides of the heat-conducting strip plate extend outside the strip groove and are connected to the heat dissipation frame. Multiple heat-conducting connecting plates are fixedly installed on the top inner wall and the bottom inner wall of the heat dissipation frame. The multiple heat-conducting connecting plates extend into the strip groove on the front side and are fixedly connected to the heat-conducting strip plate.
[0008] Preferably, a plurality of heat dissipation slots are provided on the outer peripheral side of the heat dissipation frame.
[0009] Preferably, a card slot is provided on the rear side of the heat-conducting connecting plate, and the card slot is connected to the corresponding busbar.
[0010] Preferably, the adjustment assembly includes a screw and a servo motor, and the same adjustment screw is rotatably installed on the inner walls on both sides of the guide groove. The adjustment screw is threadedly connected to the heat-conducting moving block. A servo motor is fixedly installed on one side of the base plate, and the output shaft of the servo motor is axially fixedly connected to the adjustment screw.
[0011] Preferably, a circular opening is opened on one side of the heat dissipation frame, and the servo motor is located in the circular opening.
[0012] Preferably, the temperature monitoring component includes a plurality of temperature sensors 2, and a plurality of temperature sensors 2 connected to the controller are fixedly mounted on the front side of the heat-conducting strip plate.
[0013] Preferably, the temperature monitoring component further includes a temperature sensor 1, and a mounting groove is provided on the front side of the heat-conducting movable block, in which a temperature sensor 1 connected to the controller is fixedly installed.
[0014] Preferably, the strip groove on the front side of the substrate is filled with thermally conductive potting glue, and the filling range of the thermally conductive potting glue is the space in the strip groove on the front side of the substrate except the guide groove.
[0015] The utility model provides an integrated busbar with a temperature monitoring structure, which has the following beneficial effects:
[0016] 1. The utility model facilitates the discharge of heat through the arrangement of the heat dissipation component, thereby achieving a better heat dissipation effect.
[0017] 2. The present invention can adjust the position of the heat-conducting movable block as needed by setting the adjustment component, so that the heat-conducting movable block can be moved to a position in contact with the corresponding heat-conducting connecting plate according to actual monitoring needs.
[0018] 3. The present invention, through the provision of a temperature monitoring component, can monitor the temperature in the strip groove on the front side of the substrate in real time. At the same time, it can monitor the temperature at different locations according to the position of the heat-conducting movable plate, making it easy to detect abnormal conditions in a timely manner and quickly determine the location of the abnormal condition.
[0019] 4. The present invention can further enhance the heat conduction effect by filling the strip groove on the front side of the base plate with a thermally conductive potting compound, while also providing effective protection for the components installed in the strip groove on the front side of the base plate.
[0020] In summary, the utility model has a reasonable design and is easy to use. It can solve the problems of poor heat dissipation effect and incomplete temperature monitoring of traditional integrated busbars, and improves the practicality and safety of the integrated busbar. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0022] Figure 1 This is a schematic diagram of the three-dimensional structure of an integrated busbar with a temperature monitoring structure proposed by the present invention;
[0023] Figure 2 This is a schematic diagram of the partial three-dimensional structure of an integrated busbar with a temperature monitoring structure proposed by the present invention;
[0024] Figure 3 This is a schematic structural diagram of the busbar and conductive block parts in an integrated busbar with a temperature monitoring structure proposed by the present invention;
[0025] Figure 4 This is a schematic structural diagram of the heat dissipation frame portion of an integrated busbar with a temperature monitoring structure proposed by the present invention;
[0026] Figure 5 This is a partial structural diagram of the heat-conducting strip plate, adjustment component, heat-conducting moving block and part of the temperature sensor proposed in the utility model.
[0027] In the figure: 1. Base plate; 2. Busbar; 21. Conductive block; 3. Heat-conducting strip plate; 31. Heat-conducting connecting plate; 32. Heat dissipation frame; 4. Screw; 41. Heat-conducting moving block; 42. Servo motor; 43. Temperature sensor 1; 5. Temperature sensor 2. DETAILED DESCRIPTION
[0028] The following will clearly and completely describe the technical solutions of the present invention in conjunction with specific embodiments. Obviously, the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.
[0029] Reference Figure 1-5 , an integrated busbar with a temperature monitoring structure, comprising a substrate 1, a busbar 2, a plurality of conductive blocks 21, a heat-conducting strip plate 3 and a heat-conducting movable block 41. Strip grooves are provided on the front and back sides of the substrate 1, and the heat-conducting strip plate 3 is fixedly installed in the strip groove on the front side. The number of busbars 2 is two and they are respectively arranged on the upper and lower sides of the heat-conducting strip plate 3. The plurality of conductive blocks 21 are respectively fixedly installed on the corresponding busbar 2 and are arranged at equal intervals. A guide groove is provided on the heat-conducting strip plate 3, and the heat-conducting movable block 41 is slidably installed in the guide groove. The same adjusting screw 4 is rotatably installed on the inner walls of both sides of the guide groove. The adjusting screw 4 is threadedly connected to the heat-conducting movable block 41. A servo motor 42 electrically connected to the controller is fixedly installed on one side of the substrate 1. The output shaft of the servo motor 42 is axially fixedly connected to the adjusting screw 4, and the position of the heat-conducting movable block 41 can be adjusted as needed, so that the heat-conducting movable block 41 can be moved to a position in contact with the corresponding heat-conducting connecting plate 31 according to actual monitoring needs. The front side of the heat-conducting strip plate 3 A plurality of temperature sensors 5 connected to the controller are fixedly installed, which can monitor the temperature in the strip groove on the front side of the substrate 1. A mounting groove is provided on the front side of the heat-conducting movable block 41, and a temperature sensor 43 connected to the controller is fixedly installed in the mounting groove, which can monitor the temperature at different positions according to the position of the heat-conducting movable plate. A heat dissipation frame 32 is clamped and installed on the outer peripheral side of the substrate 1. A circular opening is provided on one side of the heat dissipation frame 32, and the servo motor 42 is located in the circular opening. Both sides of the heat-conducting strip plate 3 extend outside the strip groove and are connected to the heat dissipation frame 32. A plurality of heat-conducting connecting plates 31 are fixedly installed on the top inner wall and the bottom inner wall of the heat dissipation frame 32. The plurality of heat-conducting connecting plates 31 extend into the strip groove on the front side and are fixedly connected to the heat-conducting strip plate 3, so as to facilitate the discharge of heat, thereby achieving better heat dissipation effect. A card slot is provided on the rear side of the heat-conducting connecting plate 31, which is clamped on the corresponding busbar 2, which can not only realize heat transfer, but also provide a stable limiting effect for the busbar 2.
[0030] In this embodiment, in order to increase the contact area between the outer periphery of the heat dissipation frame 32 and the outside air, thereby achieving an improved heat dissipation effect, a plurality of heat dissipation grooves are opened on the outer periphery of the heat dissipation frame 32 .
[0031] In this embodiment, in order to further enhance the heat conduction effect and provide effective protection for the components installed in the strip groove on the front side of the substrate 1, the strip groove on the front side of the substrate 1 is filled with thermally conductive potting glue, and the filling range of the thermally conductive potting glue is the space in the strip groove on the front side of the substrate 1 except the guide groove.
[0032] The circuits, electronic components and module structures involved all use existing technologies, which can be fully implemented by those skilled in the art. Needless to say, the content protected by this application does not involve improvements to software, circuits and methods.
[0033] Among them, the substrate of the integrated busbar with a temperature monitoring structure provided by the present invention is also provided with an alarm (not shown in the figure) electrically connected to the controller, which is used to provide an alarm function when a temperature abnormality occurs.
[0034] Working principle: During use, first turn on the power supply and install the device in the required position. When it is necessary to monitor the temperature on the busbar 2, the servo motor 42 is started by the controller, which can drive the adjusting screw 4 to rotate, and then drive the heat-conducting movable block 41 to slide in the guide groove, so that the position of the heat-conducting movable block 41 can be adjusted according to actual needs, so that the heat-conducting movable block 41 can be moved to a position in contact with the corresponding heat-conducting connecting plate 31 according to actual monitoring needs, and then the temperature on the heat-conducting movable block 41 is monitored through the temperature sensor 1 43. At the same time, the temperature on the heat-conducting strip plate 3 is monitored through the temperature sensor 2 5. Not only can the overall temperature be monitored, but also the temperature of different positions on the busbar 2 can be monitored. When the temperature is abnormal When the temperature reaches 400 °C, the controller controls the alarm to sound an alarm, so that abnormal conditions can be discovered in time and the position of the abnormal condition can be quickly determined by adjusting the position of the heat-conducting movable block 4 in conjunction with the temperature sensor 43, so as to facilitate timely processing and improve safety. At the same time, under the action of the heat-conducting strip plate 3 and the heat-conducting connecting plate 31, the heat on the busbar 2 can be transferred to the heat dissipation frame 32, thereby improving the heat dissipation effect. At the same time, through the setting of the heat dissipation groove, the contact area between the outer peripheral side of the heat dissipation frame 32 and the external air can be further increased, thereby achieving the effect of improving heat dissipation. At the same time, by filling the strip groove located on the front side of the substrate 1 with thermal potting glue, the heat conduction effect can be further improved, and at the same time, the components installed in the strip groove on the front side of the substrate 1 can be provided with effective protection effect, thereby improving practicality.
[0035] The above describes in detail the integrated busbar with a temperature monitoring structure provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above examples is only intended to facilitate understanding of the method and core concept of the present invention. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.
Claims
1. An integrated busbar with a temperature monitoring structure, characterized in that: It comprises a base plate (1), a busbar (2), a plurality of conductive blocks (21), a heat-conducting strip plate (3), a heat-conducting movable block (41), a heat dissipation component, a regulating component and a temperature monitoring component; The substrate (1) is provided with strip grooves on both the front and rear sides, the heat-conducting strip plate (3) is fixedly mounted in the strip groove on the front side, the number of the busbars (2) is two and they are respectively arranged on the upper and lower sides of the heat-conducting strip plate (3), a plurality of conductive blocks (21) are respectively fixedly mounted on the corresponding busbars (2) and are arranged at equal intervals, the heat-conducting strip plate (3) is provided with guide grooves, the adjustment component is arranged in the guide grooves, the heat-conducting movable block (41) is slidably mounted in the guide grooves and is connected to the adjustment component, the temperature monitoring component is arranged on the heat-conducting strip plate (3) and the heat-conducting movable block (41), and the heat dissipation component is arranged on the substrate (1) and is connected to the heat-conducting strip plate (3) and the busbar (2).
2. The integrated busbar with a temperature monitoring structure according to claim 1, characterized in that: The heat dissipation assembly comprises a heat dissipation frame (32) and a plurality of heat-conducting connecting plates (31); the heat dissipation frame (32) is clamped and installed on the outer peripheral side of the base plate (1); both sides of the heat-conducting strip plate (3) extend outside the strip groove and are connected to the heat dissipation frame (32); a plurality of heat-conducting connecting plates (31) are fixedly installed on the top inner wall and the bottom inner wall of the heat dissipation frame (32); the plurality of heat-conducting connecting plates (31) extend into the strip groove on the front side and are fixedly connected to the heat-conducting strip plate (3).
3. The integrated busbar with a temperature monitoring structure according to claim 2, characterized in that: A plurality of heat dissipation slots are provided on the outer peripheral side of the heat dissipation frame (32).
4. The integrated busbar with a temperature monitoring structure according to claim 2, characterized in that: A card slot is provided on the rear side of the heat-conducting connecting plate (31), and the card slot is connected to the corresponding busbar (2).
5. The integrated busbar with a temperature monitoring structure according to claim 2, characterized in that: The adjustment assembly comprises a screw (4) and a servo motor (42); the same adjustment screw (4) is rotatably mounted on the inner walls of both sides of the guide groove; the adjustment screw (4) is threadedly connected to the heat-conducting movable block (41); a servo motor (42) is fixedly mounted on one side of the base plate (1); the output shaft of the servo motor (42) is axially fixedly connected to the adjustment screw (4); a circular opening is opened on one side of the heat dissipation frame (32); and the servo motor (42) is located in the circular opening.
6. The integrated busbar with a temperature monitoring structure according to claim 1, characterized in that: The temperature monitoring component comprises a plurality of temperature sensors 2 (5), and a plurality of temperature sensors 2 (5) connected to the controller are fixedly mounted on the front side of the heat-conducting strip plate (3).
7. The integrated busbar with a temperature monitoring structure according to claim 1, characterized in that: The temperature monitoring component also includes a temperature sensor (43). The front side of the heat-conducting movable block (41) is provided with a mounting groove, and a temperature sensor (43) connected to the controller is fixedly installed in the mounting groove.
8. The integrated busbar with a temperature monitoring structure according to claim 1, characterized in that: The strip groove located on the front side of the substrate (1) is filled with heat-conducting potting glue, and the filling range of the heat-conducting potting glue is the space in the strip groove on the front side of the substrate (1) except the guide groove.