Wireless charging assembly with dual refrigeration

Abstract

The utility model provides a wireless charging assembly with dual refrigeration, which comprises a shell, a magnetic absorption emission module, a first refrigeration assembly used for cooling the magnetic absorption emission module and a mobile terminal and a second refrigeration assembly used for cooling the mobile terminal are arranged in the shell, the first refrigeration assembly comprises a first semiconductor refrigeration sheet, and the second refrigeration assembly comprises a second semiconductor refrigeration sheet. The first refrigeration surface is connected with the module substrate; the second refrigeration surface penetrates out of the shell to directly cool the mobile terminal or is in contact with the shell to transfer cold energy to cool the mobile terminal; the first heating face and the second heating face are each provided with a heat dissipation assembly. According to the scheme, the first refrigeration assembly not only can cool the magnetic absorption emission module, but also can conduct cold energy through the module substrate and the magnetic part to cool the shell, so that the mobile terminal is cooled; and meanwhile, the second semiconductor refrigeration sheet has good cooling and refrigeration effects on the mobile terminal through conduction of the shell, and the refrigeration assembly is suitable for a high-power wireless charging scene.

Description

Technical Field

[0001] The utility model relates to the technical field of wireless charging equipment, and in particular to a wireless charging component with dual refrigeration. Background Art

[0002] Mobile device chargers have long undergone a wired phase. With increasing demand for convenience, wireless charging technology has emerged. Wireless charging utilizes coils between the mobile device and charger to achieve charging through electromagnetic conversion. Specifically, the wireless charger has a built-in transmitting coil and the mobile device has a receiving coil. When the mobile device and charger are close together, the transmitting coil generates a magnetic field, which is sensed by the receiving coil and converted into electrical energy for charging. The WPC (Wireless Power Consortium) has announced that the Qi2 standard will replace its predecessor, Qi, and is a new and enhanced wireless charging standard being developed by the WPC Wireless Power Consortium. The current Qi certification types include the following: 1) Qi-BPP certification: products that support power below 5W and use the Qi protocol must pass BPP certification; 2) Qi-EPP certification: products that support power above 5W and use the Qi protocol must pass EPP certification; 3) Qi-MPP certification: The new standard adds the MPP magnetic power profile (MAGNETIC POWER PROFILE). MPP is developed based on MAGSAFE magnetic charging technology and will provide a better wireless charging user experience, including higher charging efficiency. Higher charging efficiency will provide faster charging speeds. However, higher charging efficiency requires higher charging power to support it (the next stage is planned to expand to 50-60W, or even higher). We know that the greater the power, the greater the heat generated. When both the charger and the mobile terminal reach a high temperature, not only will the charger and the mobile terminal be easily damaged, but the charging power will also decrease. Therefore, it is necessary to find a way to cool the charger and the mobile terminal.

[0003] A wireless charging heat dissipation device and a wireless charger are disclosed in the patent document with the authorization announcement number CN220553839U, wherein the wireless charging heat dissipation device includes a transmitting module, a heat dissipation component and a metal shell, wherein the metal shell is connected to the side of the heat dissipation component for heat dissipation, and the metal shell has an annular placement surface facing away from the heat dissipation component and used to place the mobile terminal, and the transmitting module is arranged in the charging space enclosed by the annular placement surface and is electrically coupled with the receiving module of the mobile terminal. The metal shell has high thermal conductivity and can quickly conduct heat. The annular placement surface of the metal shell contacts the mobile terminal, thereby conducting the heat of the mobile terminal through the metal shell to the heat dissipation component, and the heat dissipation component is cooled. Such a setting can effectively improve the heat dissipation effect of the wireless charging heat dissipation device, and the mobile terminal can always maintain a lower temperature and maintain a high charging power for charging. This solution can cool down the mobile terminal to a certain extent by setting up a heat dissipation component and a metal shell, but the cooling effect is not obvious because the cooling plate 124 of this solution is in contact with the transmitting module 10, and the transmitting module includes a transmitting coil and a magnet, and a substrate is required to install the transmitting coil and the magnet. Figure 4 As shown in , the cooling energy generated by the cooling plate 124 must first be transferred to the base plate. The cooling energy is absorbed by the base plate and the transmitting coil and magnet on the base plate. The remaining cooling energy is then transferred to the mobile terminal through the base plate, transmitting coil, and magnet. Since the transmitting coil also generates heat during operation, the above structure can actually transfer very little cooling energy to the mobile terminal, and the cooling effect is not very good. Therefore, this structure can no longer meet the cooling requirements of high-power wireless chargers. Therefore, it is necessary to design a new structure to solve the above problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is the cooling problem of the wireless charger itself and the mobile terminal during high-power wireless charging.

[0005] In order to solve the above technical problems, the utility model provides a wireless charging component with dual refrigeration, including a shell, in which a magnetic emission module, a first refrigeration component for cooling the magnetic emission module and the mobile terminal, and a second refrigeration component for cooling the mobile terminal are provided, and the first refrigeration component and the second refrigeration component are arranged adjacent to each other; the magnetic emission module includes a module substrate and a coil and a magnetic part provided on the module substrate; the first refrigeration component includes a first semiconductor refrigeration plate, the first semiconductor refrigeration plate includes a first cooling surface and a first heating surface, and the first cooling surface is connected to the module substrate; the second refrigeration component includes a second semiconductor refrigeration plate, the second semiconductor refrigeration plate includes a second cooling surface and a second heating surface, the second cooling surface passes through the shell to directly cool the mobile terminal or contacts the shell and transfers cold energy to the mobile terminal through the shell; heat dissipation components are provided on the first heating surface and the second heating surface.

[0006] In the above structure, the mobile terminal is attached to the shell through the adsorption of the magnetic part, and the magnetic absorption transmitting module and the first cooling component correspond to the position of the receiving coil in the mobile terminal. Then, the area of the mobile terminal next to the receiving coil (usually, this part of the area in the mobile terminal is the area where the battery is placed) can correspond to the position of the second cooling component; the first cooling component can not only cool the magnetic absorption transmitting module, but also conduct cold energy through the module substrate and the magnetic part to cool the outer shell, and then cool the mobile terminal; at the same time, the second cooling surface of the second semiconductor cooling plate can directly cool the mobile terminal through the shell, and can also be attached to the inner side of the shell, and cool the mobile terminal through conduction of the shell, that is: when the mobile terminal is attached to the solution of the utility model, both the first cooling component and the second cooling component can cool the mobile terminal, and the cooling effect is good. The cooling component is suitable for high-power wireless charging scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the utility model;

[0008] Figure 2 This is a schematic diagram of the exploded structure of an embodiment of the utility model in which the housing is made of metal;

[0009] Figure 3 This is a cross-sectional view of an embodiment of the present invention in which the housing is made of metal;

[0010] Figure 4 This is a schematic diagram of the exploded structure of an embodiment of the utility model in which the housing is made of plastic;

[0011] Figure 5 This is a cross-sectional view of an embodiment of the present invention in which the housing is made of plastic. DETAILED DESCRIPTION

[0012] The present invention will be described in further detail below with reference to the accompanying drawings and specific implementation methods.

[0013] like Figures 1 to 5 As shown, a wireless charging component with dual cooling includes a shell 1, in which a magnetic absorption transmitting module 2, a first cooling component 3 and a second cooling component 4 are arranged.

[0014] The first refrigeration component 3 is used to cool the magnetic emission module 2 and the mobile terminal; the second refrigeration component 4 is used to cool the mobile terminal. The first refrigeration component 3 and the second refrigeration component 4 are arranged adjacent to each other.

[0015] In this embodiment, the mobile terminal is a device that needs to be charged, such as a mobile phone; when the wireless charging component is used vertically, the first refrigeration component 3 is located above the second refrigeration component 4; when the wireless charging component is used horizontally, the first refrigeration component 3 is located on the left or right side of the second refrigeration component 4.

[0016] The magnetic launch module 2 includes a module substrate 20 and a coil 21 and a magnetic part 22 arranged on the module substrate 20. Usually, the magnetic part 22 is a magnet. Of course, the magnetic launch module 2 also includes components such as a PCB control board. Since the magnetic launch module 2 is a mature existing technology, its specific structure will not be described here.

[0017] The first refrigeration assembly 3 includes a first semiconductor refrigeration plate 31 . The first semiconductor refrigeration plate 31 includes a first cooling surface 311 and a first heating surface 312 . The first cooling surface 311 is connected to the bottom of the module substrate 20 .

[0018] The second refrigeration assembly 4 includes a second semiconductor refrigeration plate 41 . The second semiconductor refrigeration plate 41 includes a second cooling surface 411 and a second heating surface 412 .

[0019] like Figure 2 and Figure 3 As shown, when the shell 1 is made of metal, the module substrate 20 is connected to the shell 1 through the magnetic member 22; the cold energy generated by the first semiconductor refrigeration plate 31 is transferred to the shell 1 by the module substrate 20 and the magnetic member 22. In this way, the cold energy generated by the first semiconductor refrigeration plate 31 can not only cool the coil 21, but also cool the shell 1, and then cool the mobile terminal through the shell; the second cooling surface 411 of the second semiconductor refrigeration plate 41 is connected to the inner surface of the shell 1, and the cold energy generated by the second semiconductor refrigeration plate 41 is directly transferred to the shell 1. Since the mobile terminal is in contact with the outer surface of the shell 1, the shell 1 can directly cool the mobile terminal. This structure adopts a dual cooling method and is suitable for high-power wireless charging scenarios. The shell 1 in this embodiment can be a metal with high thermal conductivity such as aluminum alloy, zinc alloy or copper alloy; the substrates of the first semiconductor refrigeration plate 31 and the second semiconductor refrigeration plate 41 can be metal plates or ceramic plates.

[0020] like Figure 4 and Figure 5 As shown, when the housing 1 is made of plastic, in order to ensure the cooling transfer effect, a cooling ring 100 is provided on the housing 1 , and the magnetic member 22 is provided between the cooling ring 100 and the module substrate 20 .

[0021] A through hole 101 is formed in the housing 1, and a second semiconductor cooling plate 41 is disposed within the through hole 101. The second cooling surface 411 is coplanar with the outer surface of the cooling ring 100. Of course, if the substrate of the second semiconductor cooling plate 41 is ceramic, since ceramics are not easily colored, a cooling plate (not shown) can also be provided on the second cooling surface 411 to meet the color requirements of the product appearance. It is only necessary to ensure that the outer surface of the cooling plate is coplanar with the outer surface of the cooling ring 100. Due to the low cost of plastic, this method can reduce production costs while still achieving excellent cooling effect.

[0022] To dissipate the heat generated by the first heating surface 312 and the second heating surface 412 in a timely manner, a heat dissipation assembly 5 is provided on each of the first heating surface 312 and the second heating surface 412. The heat dissipation assembly 5 includes heat dissipation fins 51 and a heat dissipation fan 52 disposed on the heat dissipation fins 51. The heat dissipation fins 51 and the heat dissipation fan 52 on the first heating surface 312 and the second heating surface 412 can be separate, or the heat dissipation fins 51 can be connected to both the first heating surface 312 and the second heating surface 412. Similarly, the number of heat dissipation fans 52 is designed based on the amount of heat generated and can be one or more.

[0023] In this embodiment, in order to simplify the structure and improve the heat conduction and heat dissipation effects, the heat dissipation assembly 5 also includes a heat conducting plate 50 connected to both the first heating surface 312 and the second heating surface 412, and the heat dissipation fins 51 and the heat dissipation fan 52 are arranged on the other side of the heat conducting plate 50.

[0024] In this embodiment, the heat conducting plate 50 and the heat dissipating fins 51 are both made of copper sheets. In this way, the heat generated by the first heating surface 312 and the second heating surface 412 can be promptly conducted away by the heat conducting plate 50 and dissipated to the outside of the shell 1 by the heat dissipating fins 51 and the heat dissipating fan 52.

[0025] In order to further improve the efficiency of cooling and heat transfer, in this embodiment, silicone grease is coated on the cooling surface and the heating surface of the first semiconductor refrigeration plate 31 and the second semiconductor refrigeration plate 41.

[0026] In the above structure, the mobile terminal is attached to the shell 1 through the adsorption of the magnetic part 22, and the magnetic absorption transmitting module 2 and the first cooling component 3 correspond to the position of the receiving coil 21 in the mobile terminal, so as to realize normal wireless charging; the area of the mobile terminal next to the receiving coil 21 (usually, this part of the area in the mobile terminal is the area where the battery is placed) can correspond to the position of the second cooling component 4; the first cooling component 3 can not only cool the magnetic absorption transmitting module 2, but also conduct cold energy through the module substrate 20 and the magnetic part 22 to cool the shell 1, and then cool the mobile terminal; at the same time, the second semiconductor cooling plate 41 can also cool the mobile terminal, that is: when the mobile terminal is attached to the solution of the utility model, the first cooling component 3 and the second cooling component 4 can both cool the mobile terminal, and the cooling effect is good. The cooling component is suitable for high-power wireless charging scenarios.

Claims

1. A wireless charging assembly with dual cooling, comprising a housing, characterized in that: A magnetic emission module, a first cooling assembly for cooling the magnetic emission module and the mobile terminal, and a second cooling assembly for cooling the mobile terminal are provided in the housing, and the first cooling assembly and the second cooling assembly are adjacent to each other. The magnetic attraction launch module includes a module substrate and a coil and a magnetic component arranged on the module substrate; The first refrigeration component includes a first semiconductor refrigeration plate, the first semiconductor refrigeration plate includes a first cooling surface and a first heating surface, and the first cooling surface is connected to the module substrate; The second refrigeration assembly includes a second semiconductor refrigeration plate, the second semiconductor refrigeration plate includes a second cooling surface and a second heating surface, and the second cooling surface is connected to the shell; Heat dissipation components are provided on both the first heating surface and the second heating surface.

2. The wireless charging assembly with dual cooling according to claim 1, characterized in that: The shell is made of plastic, a cooling ring is provided on the shell, and the magnetic component is provided between the cooling ring and the module substrate; the second cooling surface is provided in the same plane as the outer surface of the cooling ring after passing through the shell.

3. The wireless charging assembly with dual cooling according to claim 1, characterized in that: The shell is made of metal, the module substrate is connected to the shell via a magnetic member; and the second cooling surface is connected to the inner surface of the shell.

4. The wireless charging assembly with dual cooling according to claim 1, characterized in that: The heat dissipation component includes heat dissipation fins and a heat dissipation fan arranged on the heat dissipation fins.

5. The wireless charging assembly with dual cooling according to claim 4, characterized in that: The heat dissipation assembly further includes a heat conducting plate, one side of which is connected to both the first heating surface and the second heating surface, and the other side of which is connected to the heat dissipation fins.

6. The wireless charging assembly with dual cooling according to claim 2, characterized in that: A cooling fin is provided on the second refrigeration surface, and an outer surface of the cooling fin is arranged in the same plane as an outer surface of the cooling ring.

7. The wireless charging assembly with dual cooling according to claim 1, characterized in that: Silicone grease is coated on the cooling surface and the heating surface of the first semiconductor refrigeration plate and the second semiconductor refrigeration plate.

8. The wireless charging assembly with dual cooling according to claim 5, characterized in that: The heat conducting sheet and the heat dissipating fins are both made of copper sheets.

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