High-stability printed circuit board (PCB) with mutually embedded power supply stacking structure

Abstract

The utility model discloses a high-stability printed circuit board (PCB) with a mutually embedded power supply stacking structure. The heat conduction plate comprises a substrate, a copper plating layer is electroplated on the upper surface of the substrate, a bonding pad layer is sprayed on the upper surface of the copper plating layer, a heat conduction plate adheres to the lower surface of the substrate, the substrate, the copper plating layer and the bonding pad layer which are of a symmetrical structure are arranged on the lower surface of the heat conduction plate, an insertion lug is welded to one side of the heat conduction plate, and the insertion lug is welded to the other side of the heat conduction plate. And a copper substrate is adhered to the bonding pad layer below the heat conducting plate. According to the utility model, heat generated by the copper-plated layer circuit is absorbed by the heat-conducting plate of the interlayer in the double-layer substrate, the heat is conducted to the copper substrate through the plurality of insertion columns, and then is dissipated by the plurality of copper fins, so that the heat dissipation efficiency of natural heat dissipation or fan heat dissipation can be improved, and the heat in the PCB can be conducted and dissipated for cooling; the problem of burnout caused by excessive accumulation of internal heat is avoided, the heat stability and the service life of the PCB in use are improved, and the maintenance cost and the repair cost of equipment are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, in particular to a PCB board with a high stability and a power supply stacking structure embedded in each other. Background Art

[0002] PCB power stacking refers to stacking power layers and ground layers (or other reference layers) in a specific order and spacing in a multi-layer PCB design to optimize power distribution, improve signal integrity, and enhance electromagnetic compatibility. This stacking method helps reduce power noise, minimize signal crosstalk, and provide a stable power supply. The design of the power stacking requires consideration of multiple factors, including the number of layers, layer arrangement, layer material type, routing, and vias, to ensure the performance and reliability of the PCB board.

[0003] The basic board in the PCB board is a double-sided board, and the number of power supply stacking layers that can be achieved is two. It is usually used in simple circuits. The number of layers of the PCB board is doubled. It is a multi-panel formed by gluing multiple double-sided boards. Common four-layer boards, six-layer boards and eight-layer boards are common. Although the increase in the number of layers can be better used in complex circuits, once the internal circuit of the multi-layer board is burned and damaged, it cannot be repaired and can only be replaced with a new PCB board.

[0004] When using existing multi-layer PCBs, as the number of layers increases, the internal copper circuits generate heat and accumulate when electricity is applied. Although most equipment chassis are equipped with cooling fans, the accumulated heat is difficult to conduct to the outer wall. Over time, the heat dissipation efficiency of the heat connection will be poor, causing the PCB board temperature to rise too quickly and the thermal stability to be poor, which can cause the PCB board to burn out and be damaged. This greatly reduces the life of the equipment and increases the cost of equipment use and maintenance. Utility Model Content

[0005] The purpose of the present invention is to provide a PCB board with high stability and a power supply stacking structure embedded in each other, so as to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution: a PCB board with a high-stability mutually embedded power supply stack structure, comprising a substrate, the upper surface of the substrate being electroplated with a copper layer, the upper surface of the copper layer being sprayed with a solder pad layer, the lower surface of the substrate being adhered to a heat conducting plate, the lower surface of the heat conducting plate being provided with a symmetrical structure of the substrate, the copper layer, and the solder pad layer, one side of the heat conducting plate being welded with an insert, the solder pad layer below the heat conducting plate being adhered to a copper substrate, the lower surface of the copper substrate being welded with copper fins, one side of the copper substrate being welded with a bottom ear, and the insert and the inner wall of the bottom ear being plugged with a plug post.

[0007] By adopting the above technical solution, the heat generated by the copper-plated circuit is absorbed by the heat-conducting plate in the interlayer of the double-layer substrate, and the heat is conducted to the copper substrate through multiple pins. The heat is then dissipated by multiple copper fins, which can improve the heat dissipation efficiency of natural heat dissipation or fan heat dissipation. The heat inside the PCB board can be conducted and dissipated to cool down the board, avoiding the problem of excessive internal heat accumulation and burning, improving the thermal stability and service life of the PCB board, and reducing equipment maintenance and repair costs.

[0008] Preferably, the pad layer above the substrate is adhered to an upper board, and the upper board includes a substrate, a copper plating layer, a pad layer and a heat conducting plate.

[0009] By adopting the above technical solution and arranging different layers of the upper board, heat can be transferred by using heat conducting plates at the same layer position, so that double-layer, four-layer or more layers can continue to be adhered and stacked to form a high thermal stability PCB board for use.

[0010] Preferably, connecting columns are inserted into the ears of the copper substrate in the upper layer board and the ears of the bottom copper substrate.

[0011] By adopting the above technical solution, by using connecting posts to be plugged into the upper and lower ears, the heat conducting plate of the upper board can be used to continuously conduct heat with the copper substrate at the bottom, so that heat is transferred along the four connecting posts to the copper substrate for dissipation, thereby improving the heat dissipation effect of the four-layer or multi-layer copper substrate, improving the overall cooling efficiency, and enabling complex circuits to operate stably when using multi-layer PCB boards, reducing the probability of burning and damage.

[0012] Preferably, the plug posts and the connecting posts are both made of metal copper, and are each plugged into and tightly fit with the corresponding plug ears and bottom ears.

[0013] By adopting the above technical solution, by using metal copper material to form the connecting column, the excellent thermal conductivity of metal copper can be used to conduct heat, so that the heat can be transferred to the copper substrate more quickly through the plug column and the connecting column for heat dissipation, thereby improving the overall heat dissipation efficiency.

[0014] Preferably, silicone grease is evenly applied to the upper surface of the copper substrate and the pad layer below to adhere to each other, and resin is evenly applied to the outer wall of the pad layer.

[0015] By adopting the above technical solution, the bottom copper substrate can be bonded evenly and firmly by using silicone grease, and the heat contained in the silicone grease can be directly transferred to the copper substrate to improve the heat transfer efficiency and cooling efficiency.

[0016] Preferably, screw holes are provided on the substrate, copper plating layer, pad layer, heat conducting plate and copper substrate, the diameters of the copper plating layer and pad layer are larger than the diameters of the substrate, heat conducting plate and copper substrate, and the diameters of the substrate, heat conducting plate and copper substrate are the same.

[0017] By adopting the above technical solution, bolt holes of different diameters are set to ensure fixation while avoiding the problem of electric shock and short circuit caused by contact with the copper-plated layer. The screws are effectively fixed by fitting with the holes of the substrate without contacting the copper-plated layer, thereby ensuring the safety and stability of the PCB board.

[0018] Preferably, the copper substrate is located at the bottom of the entire PCB board, and the height of the copper fins is one millimeter.

[0019] By adopting the above technical solution, a copper substrate is provided at the bottom of the PCB board to ensure that components can be normally assembled on the upper surface of the PCB board. At the same time, the copper substrate adhered to the bottom does not affect normal use and can also dissipate heat, thereby improving the stability and practicality of the device.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] (1) The heat generated by the copper-plated circuit is absorbed by the heat-conducting plate in the interlayer of the double-layer substrate, and the heat is transferred to the copper substrate through multiple plug-in pins. The heat is then dissipated by multiple copper fins, which can improve the heat dissipation efficiency of natural heat dissipation or fan heat dissipation, so that the heat inside the PCB board can be transferred and dissipated to cool down, avoiding the problem of excessive internal heat accumulation and burning, improving the thermal stability and service life of the PCB board, and reducing equipment maintenance and repair costs;

[0022] (2) By using connecting columns to be plugged into the upper and lower ears, the heat conducting plate of the upper layer can be used as a channel for continuous heat transfer with the copper substrate at the bottom, so that the heat is transferred to the copper substrate along the four connecting columns and dissipated, thereby improving the heat dissipation effect of the four-layer or multi-layer copper substrate, improving the overall cooling efficiency, and allowing complex circuits to operate stably when using multi-layer PCB boards, reducing the probability of burning and damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of the device of the present utility model;

[0024] Figure 2 This is a schematic diagram of the upper plate structure of the present utility model;

[0025] Figure 3 This is an exploded view of the local structure of the device of the utility model;

[0026] Figure 4 This is a schematic diagram of the copper substrate and copper fins of the present invention.

[0027] In the figure: 1. Baseboard; 2. Copper plating layer; 3. Pad layer; 4. Heat conducting plate; 5. Plug; 6. Copper base plate; 7. Bottom ear; 8. Plug column; 9. Copper fin; 10. Connecting column; 11. Upper board. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] The following is combined with Figure 1-4 The utility model is described in further detail.

[0030] Example 1

[0031] See also Figures 1 to 4 The utility model provides an embodiment: a PCB board with a high stability and mutually embedded power supply stacking structure, comprising a substrate 1, a copper plated layer 2 electroplated on the upper surface of the substrate 1, a pad layer 3 sprayed on the upper surface of the copper plated layer 2, a heat conducting plate 4 adhered to the lower surface of the substrate 1, a symmetrical structure of the substrate 1, the copper plated layer 2 and the pad layer 3 are arranged on the lower surface of the heat conducting plate 4, an ear 5 is welded on one side of the heat conducting plate 4, a copper base plate 6 is adhered to the pad layer 3 below the heat conducting plate 4, a copper fin 9 is welded on the lower surface of the copper base plate 6, and a copper fin 9 is welded on one side of the copper base plate 6. A bottom ear 7 is connected, and a plug-in post 8 is inserted into the inner wall of the plug-in ear 5 and the bottom ear 7. The heat generated by the circuit of the copper-plated layer 2 is absorbed by the heat-conducting plate 4 in the interlayer of the double-layer substrate 1, and the heat is conducted to the copper base plate 6 through multiple plug-in posts 8. The heat is then dissipated by multiple copper fins 9, which can improve the heat dissipation efficiency of natural heat dissipation or fan heat dissipation, so that the heat inside the PCB board can be conducted and dissipated to cool down, avoiding the problem of excessive internal heat accumulation and burning, improving the thermal stability and service life of the PCB board, and reducing equipment maintenance costs and repair costs.

[0032] Example 2

[0033] See also Figures 1 to 4The pad layer 3 above the substrate 1 is adhered to the upper board 11. The upper board 11 includes the substrate 1, the copper-plated layer 2, the pad layer 3 and the heat-conducting plate 4. By setting the different layers of the upper board 11, the heat-conducting plate 4 at the same layer position can be used to transfer heat, so that double layers, four layers or multiple layers can continue to be adhered and stacked to form a high-performance PCB board. The ear 5 of the copper substrate 6 in the upper board 11 and the ear 5 of the bottom copper substrate 6 are internally plugged with a connecting column 10. By using the connecting column 10 to be plugged into the ear 5 at the upper and lower ends, the heat-conducting plate 4 of the upper board 11 can be used to continuously transfer heat with the copper substrate 6 at the bottom. The heat is transferred along the four connecting pillars 10 to the copper substrate 6 for dissipation, thereby improving the heat dissipation effect of the four-layer or multi-layer copper substrate 6, improving the overall cooling efficiency, and enabling the complex circuit to operate stably when using a multi-layer PCB board, thereby reducing the probability of burning and damage. The plug posts 8 and the connecting posts 10 are both made of metal copper material, and each is plugged into and fits tightly with the corresponding plug ears 5 and bottom ears 7. By using metal copper material to form the connecting posts 10, the excellent thermal conductivity of metal copper can be used to conduct heat, so that the heat can be transferred to the copper substrate 6 faster through the plug posts 8 and the connecting posts 10 for heat dissipation, thereby improving the overall heat dissipation efficiency.

[0034] Example 3

[0035] See also Figures 1 to 4 , the upper surface of the copper substrate 6 and the pad layer 3 below are evenly coated with silicone grease for adhesion, and the outer wall of the pad layer 3 is evenly coated with resin. By using silicone grease to adhere the bottom copper substrate 6, not only can it be evenly adhered firmly, but the silicone grease contained can also be used to directly transfer heat to the copper substrate 6 to improve the heat transfer efficiency and cooling efficiency. Screw holes are provided on the substrate 1, the copper-plated layer 2, the pad layer 3, the heat conducting plate 4 and the copper substrate 6. The diameters of the copper-plated layer 2 and the pad layer 3 are larger than the diameters of the substrate 1, the heat conducting plate 4 and the copper substrate 6, and the diameters of the substrate 1, the heat conducting plate 4 and the copper substrate 6 are the same. By setting bolt holes of different diameters, the screws can be fixed effectively by fitting with the holes of the substrate 1 to avoid contact with the copper-plated layer 2 to prevent electric shock and short circuit. The screws will not come into contact with the copper-plated layer 2, thus ensuring the safety and stability of the PCB. The copper substrate 6 is located at the bottom of the entire PCB, and the height of the copper fins 9 is one millimeter. By setting the copper substrate 6 at the bottom of the PCB, the components on the upper surface of the PCB can be assembled normally, while the copper substrate 6 adhered to the bottom does not affect normal use and can also dissipate heat, thereby improving the stability and practicality of the device.

[0036] Working principle: When in use, the heat generated by the copper-plated layer 2 circuit is absorbed by the heat-conducting plate 4 in the interlayer of the double-layer substrate 1, and the heat is conducted to the copper substrate 6 through multiple plug-in posts 8, and then dissipated by multiple copper fins 9. The air flowing from the equipment's own cooling fan acts on the copper fins 9 to bring out the dissipated heat, thereby achieving the effect of heat dissipation of the inner wall temperature everywhere. At the same time, the connecting posts 10 are plugged into the ears 5 at the upper and lower ends, and the heat-conducting plate 4 of the upper plate 11 can be used as a channel for continuous heat transfer with the copper substrate 6 at the bottom, so that the heat is transferred to the copper substrate 6 along the four connecting posts 10 for dissipation.

[0037] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention.

Claims

1. A PCB board with a high stability and mutually embedded power supply stacking structure, comprising a substrate (1), characterized in that: The upper surface of the substrate (1) is electroplated with a copper plating layer (2), the upper surface of the copper plating layer (2) is sprayed with a pad layer (3), the lower surface of the substrate (1) is adhered with a heat conducting plate (4), the lower surface of the heat conducting plate (4) is provided with a symmetrical structure of the substrate (1), the copper plating layer (2) and the pad layer (3), one side of the heat conducting plate (4) is welded with an insert (5), the pad layer (3) below the heat conducting plate (4) is adhered with a copper substrate (6), the lower surface of the copper substrate (6) is welded with a copper fin (9), one side of the copper substrate (6) is welded with a bottom ear (7), and the inner wall of the insert ear (5) and the bottom ear (7) is plugged with a plug post (8).

2. The PCB board with a high stability and mutually embedded power supply stacking structure according to claim 1, characterized in that: The pad layer (3) above the substrate (1) is adhered to an upper plate (11), and the upper plate (11) comprises a substrate (1), a copper-plated layer (2), a pad layer (3) and a heat-conducting plate (4).

3. The PCB board with a high stability and mutually embedded power supply stacking structure according to claim 2, characterized in that: The inserting ears (5) of the copper substrate (6) in the upper plate (11) and the inserting ears (5) of the bottom copper substrate (6) are internally plugged with connecting columns (10).

4. The PCB board with a high stability and mutually embedded power supply stacking structure according to claim 3, characterized in that: The plug post (8) and the connecting post (10) are both made of metal copper, and are each plugged into and tightly fitted with the corresponding plug ear (5) and bottom ear (7).

5. The PCB board with a high stability and mutually embedded power supply stacking structure according to claim 1, characterized in that: The upper surface of the copper substrate (6) and the pad layer (3) below are evenly coated with silicone glue for adhesion, and the outer wall of the pad layer (3) is evenly coated with resin.

6. The PCB board with a high stability and mutually embedded power supply stacking structure according to claim 1, characterized in that: Screw holes are provided on the substrate (1), the copper-plated layer (2), the soldering pad layer (3), the heat-conducting plate (4), and the copper substrate (6); the diameters of the copper-plated layer (2) and the soldering pad layer (3) are larger than the diameters of the substrate (1), the heat-conducting plate (4), and the copper substrate (6); and the diameters of the substrate (1), the heat-conducting plate (4), and the copper substrate (6) are the same.

7. The PCB board with a high stability and mutually embedded power supply stacking structure according to claim 1, characterized in that: The copper substrate (6) is located at the bottom of the entire PCB board, and the height of the copper fin (9) is one millimeter.

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