Heat dissipation type printed circuit board
By introducing heat dissipation fins, thermal glue strips and blowing mechanisms on the printed circuit board, combined with semiconductor refrigeration sheets, the problem of insufficient heat dissipation of the printed circuit board is solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422439909.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-10-10
AI Technical Summary
The existing printed circuit boards have weak heat dissipation performance, which can easily lead to overheating.
The combined structure of the base, circuit board main body, heat dissipation fins, thermal conduction glue strips, blower mechanisms and semiconductor refrigeration sheets is adopted to conduct heat through the heat dissipation fins and thermal conduction glue strips, and the cooling is reduced by using the blower mechanisms and semiconductor refrigeration sheets to form an airflow channel to take away heat.
It realizes a printed circuit board with simple structure and good heat dissipation, effectively reducing the circuit board temperature.
Smart Images
Figure CN223207305U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of printed circuit boards, in particular to a heat dissipation type printed circuit board. Background Art
[0002] PCB, whose Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components.
[0003] The electronic components on the printed circuit board will generate a lot of heat during operation, and the existing printed circuit board has relatively weak heat dissipation performance, which easily leads to overheating of the printed circuit board. Therefore, in view of the above situation, there is an urgent need to develop a heat dissipation printed circuit board with a simple structure and good heat dissipation performance to overcome the shortcomings in current practical applications and meet current needs. Utility Model Content
[0004] The purpose of the present utility model is to provide a heat dissipation printed circuit board to solve the problems raised in the above background technology.
[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0006] The heat dissipation device is a heat dissipation device, a heat dissipation device, a heat dissipation device, and a heat dissipation device. The heat dissipation device is a heat dissipation device, a heat dissipation device being installed in an open position, and a heat dissipation device being installed in an open position.
[0007] Preferably, the heat dissipation fins are made of copper.
[0008] Preferably, the tail end of the catheter is in a sealed state.
[0009] Preferably, each of the blowing nozzles is inserted into an air flow channel.
[0010] Preferably, the thermally conductive adhesive strip is made of silicone grease heat dissipation adhesive.
[0011] Preferably, the base is provided with a plurality of mounting holes for screws to pass through.
[0012] The beneficial effects of the present utility model are as follows: when the heat dissipation type printed circuit board is in use, the heat on the circuit board body is dissipated outward into the air through the heat dissipation fins, the thermally conductive adhesive strips are cooled by the semiconductor cooling sheet, and the heat on the circuit board body is absorbed by the thermally conductive adhesive strips to cool it down. At the same time, the air flow is blown into the conduit by the heat dissipation fan, and the air flow is blown into the air flow channel by the blowing nozzle. The circulating air flow removes the heat from the bottom of the circuit board body. At the same time, the circulating air flow also removes the heat generated by the hot end of the semiconductor cooling sheet, thereby reducing the temperature of the circuit board body. In summary, the present utility model has a simple structure and good heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model Figure 1 .
[0014] Figure 2 This is a schematic diagram of the three-dimensional structure of the utility model Figure 2 .
[0015] Figure 3 This is a schematic diagram of the three-dimensional structure of the utility model Figure 3 .
[0016] Figure 4 This is a partial structural diagram of the utility model Figure 1 .
[0017] Figure 5 This is a partial structural diagram of the utility model Figure 2 .
[0018] Legend:
[0019] 1. Base; 101. Mounting hole; 2. Circuit board body; 201. Heat dissipation hole; 3. Heat dissipation fins; 4. Thermal conductive adhesive strips; 5. Blowing mechanism; 501. Mounting shell; 502. Cooling fan; 503. Conduit; 504. Blowing nozzle; 6. Air flow channel; 7. Semiconductor cooling plate. DETAILED DESCRIPTION
[0020] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0021] Specific examples are given below.
[0022] See also Figures 1 to 5 , In an embodiment of the present invention, a heat dissipation type printed circuit board includes a base 1, a circuit board body 2, heat dissipation fins 3, thermal conductive adhesive strips 4, an air blowing structure 5, an air flow channel 6 and a semiconductor refrigeration sheet 7. The base 1 is provided with a plurality of mounting holes 101 for screws to pass through. The screws are passed through the mounting holes 101 to fix the external objects, thereby fixing the base 1. A circuit board body 2 is provided above the base 1. A plurality of thermal conductive adhesive strips 4 for supporting the circuit board body 2 are fixed on the base 1. The thermal conductive adhesive strips 4 are made of silicone grease heat dissipation adhesive, which has good thermal conductivity. A plurality of air flow channels 6 are formed between the plurality of thermal conductive adhesive strips 4 so that air can circulate through the air flow channels 6 to take away the heat on the circuit board body 2. Heat dissipation fins 3 are installed on the left and right sides of the circuit board body 2. The heat dissipation fins 3 are made of copper, so that it has good thermal conductivity. The heat on the circuit board body 2 is dissipated to the air through the heat dissipation fins 3. 2 is provided with a plurality of heat dissipation holes 201, and the heat dissipation holes 201 are provided so that air flow can pass through and take away the heat from the circuit board body 2. A semiconductor refrigeration plate 7 is installed on the side of each of the thermal conductive strips 4, and each of the semiconductor refrigeration plates 7 is located in the air flow channel 6 so that when the air flow in the air flow channel 6 flows, the heat generated by the hot end of the semiconductor refrigeration plate 7 can be taken away. A blower mechanism 5 for blowing air into the multiple air flow channels 6 is installed on the base 1, and the blower mechanism 5 includes: a mounting shell 501, a cooling fan 502, a duct 503 and a blowing nozzle 504. The mounting shell 501 is fixed on the base 1, and a cooling fan 502 is installed in the mounting shell 501. A duct 503 connected to the mounting shell 501 is fixed on the front side of the mounting shell 501, and a plurality of blowing nozzles 504 are provided on the duct 503. The tail end of the duct 503 is in a sealed state, so that the air flow can only flow out from the blowing nozzle 504, and each of the blowing nozzles 504 is inserted into an air flow channel 6.
[0023] Working principle: When the heat dissipation type printed circuit board is in use, the heat on the circuit board body 2 is dissipated into the air through the heat dissipation fins 3, the thermal conductive strip 4 is cooled by the semiconductor refrigeration sheet 7, and the heat on the circuit board body 2 is absorbed by the thermal conductive strip 4 to cool it down. At the same time, the air flow is blown into the duct 503 through the heat dissipation fan 502, and the air flow is blown into the air flow channel 6 through the blowing nozzle 504. The circulating air flow takes away the heat at the bottom of the circuit board body 2. At the same time, the circulating air flow also takes away the heat generated by the hot end of the semiconductor refrigeration sheet 7, thereby reducing the temperature of the circuit board body 2.
[0024] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A heat dissipation printed circuit board, characterized in that: The invention comprises a base (1), a circuit board body (2), heat dissipation fins (3), a heat conductive adhesive strip (4), a blower mechanism (5), an air flow channel (6) and a semiconductor refrigeration sheet (7); a circuit board body (2) is arranged above the base (1); a plurality of heat conductive adhesive strips (4) for supporting the circuit board body (2) are fixed on the base (1); a plurality of air flow channels (6) are formed between the plurality of heat conductive adhesive strips (4); heat dissipation fins (3) are installed on both sides of the circuit board body (2); a plurality of heat dissipation holes (201) are arranged in the blank area on the circuit board body (2); and a heat conductive adhesive strip (4) is installed on the side of each heat conductive adhesive strip (4). A semiconductor refrigeration plate (7), each of the semiconductor refrigeration plates (7) is located in an air flow channel (6), a blower mechanism (5) for blowing air into the multiple air flow channels (6) is installed on the base (1), the blower mechanism (5) comprises: a mounting shell (501), a heat dissipation fan (502), a duct (503) and a blowing nozzle (504), the mounting shell (501) is fixed on the base (1), a heat dissipation fan (502) is installed in the mounting shell (501), a duct (503) connected to the mounting shell (501) is fixed on the front side of the mounting shell (501), and a plurality of blowing nozzles (504) are provided on the duct (503).
2. The heat dissipation printed circuit board according to claim 1, characterized in that: The heat dissipation fins (3) are made of copper.
3. The heat dissipation printed circuit board according to claim 1, characterized in that: The tail end of the catheter (503) is in a sealed state.
4. The heat dissipation printed circuit board according to claim 1, wherein: Each of the blowing nozzles (504) is inserted into an air flow channel (6).
5. The heat dissipation printed circuit board according to claim 1, characterized in that: The thermally conductive adhesive strip (4) is made of silicone grease heat dissipation adhesive.
6. The heat dissipation printed circuit board according to any one of claims 1 to 5, characterized in that: The base (1) is provided with a plurality of mounting holes (101) for screws to pass through.