Heating reduction device of copper adsorbent for separating CO through pressure swing adsorption
Through the combined design of heater and adsorption tower, the problem of low temperature during the adsorbent reduction process is solved, the reduction effect is improved, and product quality and production stability are ensured.
Patent Information
- Application Number
- CN202421760764.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-07-24
AI Technical Summary
During the pressure swing adsorption separation process, the temperature of the adsorbent is low during the reduction process, resulting in incomplete reduction, affecting product quality and production stability.
Using a combination device of a heater and an adsorption tower, the temperature of the adsorbent bed is increased by heating and heating tracing design of the heating gas and reducing gas to ensure the reduction effect.
It effectively improves the reduction effect of adsorbent, ensures product quality and production stability, and avoids the phenomenon of flying temperature in the adsorbent bed.
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Figure CN223209246U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of pressure swing adsorption, and in particular relates to a temperature-raising reduction device for a copper adsorbent used for separating CO by pressure swing adsorption. Background Art
[0002] Carbon monoxide (CO) is a key chemical raw material with significant industrial applications. It serves as an industrial feedstock gas for the synthesis of many chemical products and can also be used as a reducing agent in the steelmaking industry. CO primarily comes from mixtures of petroleum and natural gas, water gas, semi-water gas, and industrial waste gas. CO is often mixed with gases such as H₂, N₂, CO₂, and CH₄. Therefore, CO must be separated and purified before it can be utilized, while also preventing its direct release into the atmosphere, which could cause environmental pollution and human poisoning. Pressure swing adsorption (PSA) technology is widely used to separate CO from mixed gases due to its low energy consumption, simple process, environmental friendliness, and high degree of automation. Pressure swing adsorption is generally used in physical adsorption processes. This process utilizes the differences in the adsorption capacity of each component gas in the mixture on the adsorbent, as well as the fact that the amount of adsorption varies with pressure. Gas separation is achieved by controlling pressure, enabling adsorption and desorption at reduced pressure. In pressure swing adsorption (PSA) carbon monoxide separation units, the adsorbent loaded into the adsorption tower contains a monovalent copper compound. Before the adsorbent is used for the first time or after prolonged contact with air, the monovalent copper compound in the adsorbent is oxidized to divalent copper compounds. Therefore, the adsorbent must be reduced to restore its activity and ensure stable operation and controllable performance. The degree of reduction determines its effectiveness. However, during the reduction process, the adsorbent bed temperature is prone to low, resulting in incomplete reduction, which affects product quality and reduces production output. During startup with CO and hydrogen, the adsorbent bed is prone to temperature spikes, affecting stable production operations. Utility Model Content
[0003] The purpose of the utility model is to provide a temperature-raising reduction device for a copper adsorbent used for separating CO by pressure swing adsorption, aiming to solve the problem of low temperature during the adsorbent reduction process.
[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: a temperature-raising and reduction device for copper adsorbent for pressure swing adsorption separation of CO is provided, comprising a heater and an adsorption tower, wherein a heating gas discharge pipeline and a reducing gas discharge pipeline are connected to the inlet pipeline of the heater, an inlet pipeline is provided between the outlet of the heater and the upper end of the adsorption tower, a heating pipeline is provided next to the inlet pipeline, the heating gas in the heating gas discharge pipeline is heated by the heater and then discharged into the adsorption tower to increase the temperature in the adsorption tower, and the reducing gas in the reducing gas discharge pipeline is heated by the heater and then discharged into the adsorption tower to reduce the adsorbent in the adsorption tower, and the heating pipeline is used to reduce the heat loss of the gas in the inlet pipeline.
[0005] In a possible implementation, the heating pipeline is arranged along the length direction of the tower inlet pipeline, and the two heating pipelines are respectively arranged on the upper and lower sides of the tower inlet pipeline.
[0006] In a possible implementation, a tower outlet pipeline is provided at the lower end of the adsorption tower, and a vacuum pump is provided on the tower outlet pipeline.
[0007] In a possible implementation, a cooler is provided on the tower outlet pipeline.
[0008] In a possible implementation, two groups of coolers are provided, which are respectively arranged on both sides of the vacuum pump.
[0009] In a possible implementation, a buffer tank is provided at the other end of the tower outlet pipeline, and a return pipeline is provided at the outlet of the buffer tank, and the return pipeline is connected to the inlet pipeline.
[0010] In a possible implementation, two groups of buffer tanks are arranged in parallel between the tower outlet pipeline and the return pipeline.
[0011] In a possible implementation, a second sampling point is provided on the return pipeline.
[0012] In a possible implementation manner, a first sampling point is provided on the inlet pipeline, and the first sampling point is provided close to the heater.
[0013] In a possible implementation, the heater is a steam heater, and a steam discharge pipeline and a condensate discharge pipeline are connected to the steam heater.
[0014] The beneficial effects of the temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO provided by the utility model are:
[0015] Compared with the prior art, a heater and an adsorption tower are provided, and a heating gas discharge pipeline and a reducing gas discharge pipeline are respectively connected to the inlet pipeline of the heater, and the heater and the adsorption tower are connected through a tower inlet pipeline. A heating pipeline is provided beside the tower inlet pipeline to reduce the heat loss of the gas in the tower inlet pipeline. The heating gas in the heating gas discharge pipeline enters the heater, and the heater heats the heating gas discharged from the heating gas discharge pipeline. The heating gas heated by the heater enters the adsorption tower through the tower inlet pipeline. The heating pipeline increases the temperature of the heating gas entering the adsorption tower, thereby increasing the temperature of the adsorbent bed during the reduction process. After the temperature of the adsorption tower is increased to the specified value, the reducing gas in the reducing gas discharge pipeline is heated by the heater and then discharged into the adsorption tower to reduce the reducing agent, thereby improving the reduction effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 This is a schematic structural diagram of a temperature-raising reduction device for a copper adsorbent for pressure swing adsorption separation of CO provided in an embodiment of the present invention.
[0018] In the figure: 1. Heating gas discharge pipeline; 2. Reducing gas discharge pipeline; 3. Inlet pipeline; 4. First sampling point; 5. Steam discharge pipeline; 6. Heater; 7. Condensate discharge pipeline; 8. Tower inlet pipeline; 9. Heating pipeline; 10. Adsorption tower; 11. Tower outlet pipeline; 12. Cooler; 13. Vacuum pump; 14. Buffer tank; 15. Return pipeline; 16. Second sampling point. DETAILED DESCRIPTION
[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0020] Please refer to Figure 1A specific embodiment of a temperature-raising reduction device for copper adsorbent for pressure swing adsorption CO separation provided by the utility model is now described. The device includes a heater 6 and an adsorption tower 10. The inlet pipeline 3 of the heater 6 is connected to a heating gas discharge pipeline 1 and a reducing gas discharge pipeline 2. A tower inlet pipeline 8 is provided between the outlet of the heater 6 and the upper end of the adsorption tower 10. A heating pipeline 9 is provided next to the tower inlet pipeline 8. The heating gas in the heating gas discharge pipeline 1 is heated by the heater 6 and then discharged into the adsorption tower 10 to increase the temperature in the adsorption tower 10. The reducing gas in the reducing gas discharge pipeline 2 is heated by the heater 6 and then discharged into the adsorption tower 10 to reduce the adsorbent in the adsorption tower 10. The heating pipeline 9 is used to reduce the heat loss of the gas in the tower inlet pipeline 8.
[0021] The utility model provides a temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO. Compared with the prior art, the device is provided with a heater 6 and an adsorption tower 10. A heating gas discharge pipeline 1 and a reducing gas discharge pipeline 2 are respectively connected to an inlet pipeline 3 of the heater 6. The heater 6 and the adsorption tower 10 are connected through a tower inlet pipeline 8. A heating pipeline 9 is arranged beside the tower inlet pipeline 8 to reduce heat loss of the gas in the tower inlet pipeline 8. The heating gas in the heating gas discharge pipeline 1 enters the heater 6. The heater 6 heats the heating gas discharged from the heating gas discharge pipeline 1. The heating gas heated by the heater 6 enters the adsorption tower 10 through the tower inlet pipeline 8. The heating pipeline 9 increases the temperature of the heating gas entering the adsorption tower 10, thereby increasing the temperature of the adsorbent bed during the reduction process. After the temperature of the adsorption tower 10 is increased to a specified value, the reducing gas in the reducing gas discharge pipeline 2 is heated by the heater 6 and then discharged into the adsorption tower 10 to reduce the reducing agent, thereby improving the reduction effect.
[0022] For details, please refer to Figure 1 , including a heater 6 and an adsorption tower 10, a heating gas discharge pipeline 1 and a reducing gas discharge pipeline 2 are respectively connected to the inlet pipeline 3 of the heater 6, the heating gas discharge pipeline 1 is connected to an external gas source, the heating gas can be nitrogen or other chemically stable gases, the reducing gas discharge pipeline 2 is connected to an external gas source, the reducing gas is CO, the tower inlet pipeline 8 connects the outlet of the heater 6 and the upper end of the adsorption tower 10, the heating pipeline 9 is arranged next to the tower inlet pipeline 8, one end of the heating pipeline 9 is connected to an external steam source, and the other end is open to facilitate the discharge of steam, the heater 6 heats the heating gas, the heating gas enters the adsorption tower 10, and increases the temperature of the adsorbent bed. After the temperature of the adsorption tower 10 reaches the specified value, the reducing gas heated by the heater 6 enters the adsorption tower 10 to reduce the reducing agent and improve the reduction effect.
[0023] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 The heating pipeline 9 is arranged along the length direction of the tower inlet pipeline 8, and the two heating pipelines 9 are respectively arranged on the upper and lower sides of the tower inlet pipeline 8.
[0024] For details, please refer to Figure 1 There are two heating pipelines 9, which are arranged along the length direction of the tower inlet pipeline 8. The two heating pipelines 9 are correspondingly arranged on the upper and lower sides of the tower inlet pipeline 8 to reduce heat loss of the tower inlet pipeline 8.
[0025] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 The lower end of the adsorption tower 10 is provided with a tower outlet pipeline 11, and the tower outlet pipeline 11 is provided with a vacuum pump 13.
[0026] For details, please refer to Figure 1 The outlet pipeline 11 is arranged at the lower end of the adsorption tower 10, and the vacuum pump 13 is arranged on the outlet pipeline 11 to facilitate the discharge of gas in the adsorption tower 10.
[0027] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 A cooler 12 is provided on the tower outlet pipeline 11.
[0028] For details, please refer to Figure 1 A cooler 12 for cooling the gas is provided on the tower outlet pipeline 11. The cooler 12 is provided with a water inlet pipe and a water outlet pipe to facilitate the entry and discharge of cooling water, and the cooling water cools the gas.
[0029] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 There are two groups of coolers 12, which are respectively arranged on both sides of the vacuum pump 13.
[0030] For details, please refer to Figure 1 There are two groups of coolers 12, which are arranged on the front and back sides of the vacuum pump 13 to cool the gas entering the vacuum pump 13 to prevent overheated gas from damaging the vacuum pump 13. The vacuum pump 13 is a reciprocating vacuum pump 13.
[0031] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 A buffer tank 14 is provided at the other end of the tower outlet pipeline 11 , and a return pipeline 15 is provided at the outlet of the buffer tank 14 , and the return pipeline 15 is connected to the inlet pipeline 3 .
[0032] For details, please refer to Figure 1The buffer tank 14 is set at the end of the tower outlet pipeline 11 away from the absorption tower. The reducing gas and the heated gas are discharged into the buffer tank 14 for temporary storage. The side wall of the buffer tank 14 is provided with a return pipeline 15. The return pipeline 15 is connected to the inlet pipeline 3 to form a gas circulation, avoiding the reducing gas from being directly discharged into the atmosphere and affecting the environment, and avoiding the waste of heated gas.
[0033] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 The two groups of buffer tanks 14 are arranged in parallel between the tower outlet pipeline 11 and the return pipeline 15.
[0034] For details, please refer to Figure 1 There are two groups of buffer tanks 14, which are arranged in parallel to increase the storage capacity of gas.
[0035] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 A second sampling point 16 is provided on the return pipeline 15 .
[0036] For details, please refer to Figure 1 A second sampling point 16 is provided on the return pipeline 15 for extracting gas samples in the pipeline, so as to facilitate real-time analysis of the composition of the gas in the return pipeline 15 and adjust the discharge amount of the reducing gas and the heating gas according to the content of various gases.
[0037] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 A first sampling point 4 is provided on the inlet pipeline 3 , and the first sampling point 4 is provided close to the heater 6 .
[0038] For details, please refer to Figure 1 A first sampling point 4 is provided on the inlet pipeline 3. The first sampling point 4 is provided at one end of the inlet pipeline 3 close to the heater 6, so as to facilitate real-time analysis of the composition of the gas in the inlet pipeline 3 and adjust the discharge amount of the reducing gas and the heating gas according to the content of various gases.
[0039] As a specific embodiment of the temperature reduction device of copper adsorbent for pressure swing adsorption separation of CO provided by the utility model, please refer to Figure 1 The heater 6 is a steam heater 6 , and the steam heater 6 is connected to a steam discharge pipeline 5 and a condensate discharge pipeline 7 .
[0040] For details, please refer to Figure 1The heater 6 is a steam heater 6 , which is connected to an external steam source to heat the gas in the heater 6 , and the condensate discharge pipeline 7 facilitates the discharge of the condensate.
[0041] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A temperature reduction device for copper adsorbent for pressure swing adsorption separation of CO, characterized in that: It includes a heater and an adsorption tower. The inlet pipeline of the heater is connected to a heating gas discharge pipeline and a reducing gas discharge pipeline. A tower inlet pipeline is arranged between the outlet of the heater and the upper end of the adsorption tower. A heating pipeline is arranged next to the tower inlet pipeline. The heating gas in the heating gas discharge pipeline is heated by the heater and then discharged into the adsorption tower to increase the temperature in the adsorption tower. The reducing gas in the reducing gas discharge pipeline is heated by the heater and then discharged into the adsorption tower to reduce the adsorbent in the adsorption tower. The heating pipeline is used to reduce the heat loss of the gas in the tower inlet pipeline.
2. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 1, characterized in that: The heating pipeline is arranged along the length direction of the tower inlet pipeline, and the two heating pipelines are respectively arranged on the upper and lower sides of the tower inlet pipeline.
3. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 1, characterized in that: The lower end of the adsorption tower is provided with a tower outlet pipeline, and the tower outlet pipeline is provided with a vacuum pump.
4. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 3, characterized in that: A cooler is provided on the tower outlet pipeline.
5. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 4, characterized in that: The coolers are provided in two groups, which are respectively arranged on both sides of the vacuum pump.
6. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 3, characterized in that: A buffer tank is provided at the other end of the outlet pipeline, and a return pipeline is provided at the outlet of the buffer tank, and the return pipeline is connected to the inlet pipeline.
7. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 6, characterized in that: The two groups of buffer tanks are arranged in parallel between the tower outlet pipeline and the return pipeline.
8. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 6, characterized in that: A second sampling point is provided on the return pipeline.
9. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 1, characterized in that: A first sampling point is provided on the inlet pipeline, and the first sampling point is provided close to the heater.
10. The temperature-raising reduction device for copper adsorbent for pressure swing adsorption separation of CO according to claim 1, characterized in that: The heater is a steam heater, and a steam discharge pipeline and a condensate discharge pipeline are connected to the steam heater.