Wafer resistivity multi-point measurement sorting device

Abstract

The utility model discloses a wafer resistivity multi-point measurement sorting device, which comprises a feeding mechanism, a blanking mechanism, a detection mechanism and a carrying mechanism, the feeding mechanism comprises a feeding conveying line, the blanking mechanism comprises a blanking conveying line parallel to the feeding conveying line, the detection mechanism is arranged on the outer side of the feeding conveying line and the outer side of the blanking conveying line, and the carrying mechanism is arranged on the outer side of the detection mechanism. The detection mechanism is used for multi-point measurement of resistivity of wafers of different specifications; the carrying mechanism is arranged on the inner side of the detection mechanism, and the carrying mechanism is used for placing the wafers on the feeding conveying line to the detection mechanism and placing the wafers on the detection mechanism to the discharging conveying line; a PN detection assembly is arranged on the discharging conveying line and located on the downstream of the detection mechanism. According to the invention, resistivity multi-point automatic measurement of wafers of different specifications can be realized, automatic sorting and blanking can be realized according to the result of the detection mechanism, PN types of the wafers can be automatically distinguished, the automation degree is high, and the labor investment is reduced; the productivity is improved, and the product circulation efficiency is improved; product quality is improved, and inspection standards are unified.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor silicon wafer sorting, in particular to a wafer resistivity multi-point measurement and sorting device. Background Art

[0002] In the semiconductor industry, special attention is paid to the parameter RRV (radial resistivity variation). RRV refers to the difference in resistivity between the center point of the wafer and a point deviated from the center of the wafer or several symmetrically distributed set points.

[0003] Due to the complex specifications of current wafer products, each specification requires different point settings. Consequently, multiple combinations of setpoint positions are required for measuring this RRV parameter for each wafer. To test diverse products and accommodate diverse measurement needs, this task has long been performed manually. Consequently, this work presents numerous challenges. The manual intervention required to select multiple point locations, resulting in inconsistent reference standards and point selection, poses significant risks to product quality and safety. Testing consumes significant manpower, resulting in low efficiency and production capacity, and creating challenges in the manufacturing process. Utility Model Content

[0004] The purpose of the utility model is to overcome the above technical problems and provide a wafer resistivity multi-point measurement and sorting device.

[0005] To achieve the above objectives, this application provides the following technical solutions:

[0006] A chip resistivity multi-point measurement and sorting device includes a loading mechanism, a unloading mechanism, a detection mechanism and a transport mechanism. The loading mechanism includes a loading conveyor line, the unloading mechanism includes a unloading conveyor line arranged parallel to the loading conveyor line, the detection mechanism is arranged outside the loading conveyor line and the unloading conveyor line, and the detection mechanism is used for multi-point resistivity measurement of chips of different specifications; the transport mechanism is arranged inside the detection mechanism, and the transport mechanism is used to place the chips on the loading conveyor line to the detection mechanism and place the chips at the detection mechanism to the unloading conveyor line; a PN detection component is provided on the unloading conveyor line, and the PN detection component is located downstream of the detection mechanism.

[0007] Optionally, the sorting device also includes a placement box, a code scanning mechanism and a chip reading mechanism. The placement box is used to stack chips, and the code scanning mechanism is set corresponding to the identification code of the placement box; the chip reading mechanism is set corresponding to the chip of the placement box; the reading information of the identification code and the chip includes at least the box number and material information.

[0008] Optionally, the loading mechanism and the unloading mechanism further include an operating conveyor line and a lifting assembly, and a plurality of the operating conveyor lines are arranged side by side on both sides of the loading conveyor line and the unloading conveyor line away from one end of the detection mechanism; the lifting assembly is arranged at one end of the operating conveyor line away from the loading conveyor line and the unloading conveyor line, and the placement box is arranged at the lifting end of the lifting assembly, and the lifting assembly drives the placement box to rise and fall so that the operating conveyor line can transport the stacked chips in the placement box one by one or stack the single chips into the placement box one by one.

[0009] Optionally, the detection mechanism includes a test bench, a test probe and a controller. The test bench is arranged on the outside of the loading conveyor line and the unloading conveyor line. The test bench is suitable for rotating, lifting and moving along the conveying direction of the loading conveyor line. The test probe is provided above the test bench. The test probe is used to measure the resistivity of the chip test point. The controller controls the movement of the test bench according to the different test point information of chips of different specifications. The controller controls the unloading mechanism to sort the chips according to the results of the detection mechanism.

[0010] Optionally, the test probe includes a probe and a counterweight, and the counterweight is provided on the probe.

[0011] Optionally, the transport mechanism includes a robot, a grabbing arm and a suction cup, the robot is a four-degree-of-freedom or six-degree-of-freedom robot; the two grabbing arms are arranged along different horizontal radial directions with the moving end of the robot as the center; the suction cup is arranged at the end of the grabbing arm.

[0012] Optionally, the PN detection component includes a PN probe and a lifting platform, the lifting platform extends above the unloading conveyor line or retracts below the unloading conveyor line, and the PN probe is arranged above the unloading conveyor line corresponding to the lifting platform.

[0013] Optionally, one or more centering components are provided on the loading conveyor line, and the centering components are located upstream of the detection mechanism. The centering components include a lifting platform and a guide wheel group, and the lifting platform is suitable for moving up and out of the loading conveyor line or descending below the loading conveyor line; the guide wheel group is arranged above the loading conveyor line corresponding to the lifting platform, and the guide wheel group includes a plurality of guide wheels distributed along the circumference, and the guide wheels are used to contact the outer peripheral wall of the wafer. The center of the circumferential distribution of the guide wheels is located on the conveying center line of the loading conveyor line, and the plurality of guide wheels are suitable for swinging synchronously in the horizontal plane.

[0014] Optionally, the centering component further includes:

[0015] The central drive includes a driving wheel, a driven wheel and a swing arm. The driving wheel and multiple driven wheels are distributed along the circumferential direction. The driving wheel and the driven wheels are driven by a transmission belt. The swing arms are coaxially connected to the bottom of the driving wheel and the driven wheel respectively, and the guide wheel is provided at the end of the swing arm.

[0016] Optionally, there are one or more centering components, and a thickness measuring component is provided on the loading conveyor line, and the thickness measuring component is located upstream of at least one of the centering components.

[0017] In summary, the present invention has at least the following technical effects and advantages:

[0018] This application can realize multi-point automatic measurement of the resistivity of chips of different specifications and automatically sort and unload them according to the detection results of the detection agency. It has a high degree of automation and reduces labor input; it increases production capacity and improves product flow efficiency; it improves product quality and unifies inspection standards. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a schematic structural diagram of a wafer resistivity multi-point measurement and sorting device in one embodiment of the present invention;

[0021] Figure 2 A top view of a wafer resistivity multi-point measurement and sorting device in one embodiment of the present invention;

[0022] Figure 3 This is a schematic structural diagram of a detection mechanism and a material transfer mechanism in one embodiment of the present invention;

[0023] Figure 4 This is a top view of the detection mechanism and the material transfer mechanism in one embodiment of the present utility model;

[0024] Figure 5 This is a schematic structural diagram of a detection mechanism in one embodiment of the present utility model;

[0025] Figure 6 This is a structural diagram of a centering assembly in one embodiment of the present utility model;

[0026] Figure 7 This is a structural diagram of a feeding mechanism in one embodiment of the present utility model;

[0027] Figure 8This is a top view of a feeding mechanism in one embodiment of the present utility model;

[0028] Figure 9 It is a top view of the blanking mechanism in one embodiment of the present utility model.

[0029] In the picture:

[0030] 01. Chip;

[0031] 1. Loading mechanism; 11. Loading conveyor line; 12. Centering assembly; 121. Guide wheel; 122. Driving wheel; 123. Driven wheel; 124. Swing arm; 125. Mounting plate; 126. Tensioning pulley; 1241. Mounting hole; 13. Thickness measurement assembly; 14. Operation conveyor line; 15. Lifting assembly;

[0032] 2. Unloading mechanism; 21. Unloading conveyor line; 22. PN detection component; 23. Operation conveyor line; 24. Lifting component;

[0033] 3. Detection mechanism; 31. Test bench; 32. Test probe; 311. Transverse movement assembly; 312. Adsorption platform; 321. Probe; 322. Counterweight; 323. Connecting plate;

[0034] 4. Material transfer mechanism; 41. Robot; 42. Robotic arm; 43. Suction cup;

[0035] 5. Frame; 6. Placement box; 7. Code scanning mechanism. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0039] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0040] This embodiment provides a wafer resistivity multi-point measurement and sorting device, such as Figures 1-9 As shown, the system comprises a loading mechanism 1, an unloading mechanism 2, a detection mechanism 3, and a transfer mechanism 4. The loading mechanism 1 includes a loading conveyor line 11; the unloading mechanism 2 includes a unloading conveyor line 21 arranged parallel to the loading conveyor line 11; both the loading conveyor line 11 and the unloading conveyor line 21 are used to sequentially convey single wafers 01. One or more detection mechanisms 3 are respectively located outside the loading conveyor line 11 and the unloading conveyor line 21. The detection mechanisms 3 are used to measure the resistivity of wafers 01 of different specifications at multiple points; the transfer mechanism 4 is located inside the detection mechanisms 3 and is used to transport wafers 01 between the loading conveyor line 11 and the unloading conveyor line 21, respectively, and the detection mechanisms 3.

[0041] In this embodiment, the detection mechanism 3 automatically performs multi-point resistivity measurements based on the specifications of the wafer 01. This improves efficiency compared to manual multi-point position selection and facilitates unified reference standards and point selection. In this embodiment, the loading and unloading conveyor lines 11 and 21 are arranged in parallel, reducing overall space requirements. The detection mechanism 3 is located on either side of the loading and unloading conveyor lines 11 and 21, respectively, and the wafer 01 is moved by the material transfer mechanism 4, resulting in a compact overall structure.

[0042] Alternatively, as Figure 1 and 2 As shown, there are multiple detection mechanisms 3 outside the loading conveyor line 11 and the unloading conveyor line 21, and there can also be multiple material moving mechanisms 4; for example, one material moving mechanism 4 can correspond to two detection mechanisms 3; this can further improve the detection efficiency of the equipment and increase production capacity.

[0043] Alternatively, as Figure 3-5As shown, the detection mechanism 3 includes a test table 31, a test probe 32 and a controller. The test table 31 is used to place the wafer 01, and the test probe 32 is used to measure the resistivity of the test points on the wafer 01. The controller controls the operation of the test table 31. The test table 31 is arranged on the outside of the loading conveyor line 11 and the unloading conveyor line 21. In this embodiment, there are multiple test tables 31, and a test probe 32 is correspondingly arranged above each test table 31. The test table 31 is suitable for rotating, lifting and reciprocating along the conveying direction of the loading conveyor line 11. The test table 31 is lifted and lowered to make the wafer 01 contact with the test probe 32. The test table 31 rotates and moves laterally to move the wafer 01 to change the test point of the wafer 01. The operation of the test table 31 is controlled by the controller. The test probe 32 is arranged above the test table 31. The test probe 32 is used to measure the resistivity of the test point on the wafer 01. The controller is preset with different test point information of chips 01 of different specifications to control the operation of the test bench 31. The controller controls the unloading mechanism 2 to sort the chips 01 according to the results of the detection mechanism 3. The unloading mechanism 2 also sorts and unloads according to the process requirements. Chips 01 within a resistivity multi-point detection range will be sorted into one category.

[0044] Alternatively, as Figure 3-5 As shown, the test bench 31 includes a transverse moving assembly 311, a lifting assembly, a rotating assembly and an adsorption platform 312. The moving direction of the transverse moving assembly 311 is arranged parallel to the loading conveyor line 11. The moving end of the transverse moving assembly 311 is connected to the fixed end of the lifting assembly, the moving end of the lifting assembly is connected to the fixed end of the rotating assembly, and the rotating end of the rotating assembly is connected to the adsorption platform 312. The adsorption platform 312 is used to adsorb the wafer 01. The size of the adsorption platform 312 is larger than the size of the wafer 01. The transverse moving assembly 311 can drive the wafer 01 to move along the conveying direction, and the rotating assembly drives the wafer 01 to rotate in the horizontal plane. In this embodiment, the transverse moving assembly 311 and the rotating assembly are both driven by a servo motor or a stepper motor. The transverse moving assembly 311 can be a linear module, a gear rack structure, a screw nut structure, etc., the rotating assembly can be a rotating module or a gear structure, etc., and the lifting assembly can be a cylinder, a linear module or a hydraulic cylinder, etc. The present application does not limit its specific structure.

[0045] Alternatively, as Figure 3-5 As shown, the test probe 32 includes a probe 321 and a counterweight 322, with the counterweight 322 being mounted on the probe 321. In this embodiment, the probe 321 uses an existing four-probe assembly and is mounted on the horizontal rack 5 above the test table 31 via a connecting plate 323. The probe 321 is provided with a counterweight 322, which applies downward pressure to the wafer 01, simulating the pressure required for testing. The counterweight 322 can be, for example, 300g and can be a weight or a block. The present application does not impose any specific restrictions on the structure and weight of the counterweight 322.

[0046] In this embodiment, under the premise of ensuring that the probe 321 is fixed, the test table 31 on which the chip 01 is placed is moved to ensure the multi-laterality of the probe 321's piercing points, thereby ensuring the breadth and diversity of testable products. The controller sets different test points corresponding to chips 01 of different specifications. For example, the test points on the chip 01 have a straight-line change or a cross-shaped change. For the straight-line change, the test table 31 only needs to be raised and lowered and moved horizontally during the detection process; for the cross-shaped change, the test table 31 needs to be raised and lowered, moved horizontally, and rotated during the detection process. For chips 01 of different specifications, the positions of the test points are also different. Depending on the position, the lateral and rotational positions of the test table 31 are controlled by the servo or stepper motor of the lateral movement motor and the rotation motor.

[0047] Alternatively, as Figure 2-5 As shown, the material transfer mechanism 4 includes a robot 41, a robotic arm 42, and a suction cup 43. The robot 41 is a four-degree-of-freedom or six-degree-of-freedom robot 41. The robot 41 drives the robotic arm 42 to move and rotate to accurately place or remove the wafer 01. The two robotic arms 42 are arranged along different horizontal radial directions with the moving end of the robot 41 as the center. The angle between the two robotic arms 42 can be acute, right, or obtuse. For example, in this embodiment, the angle between the two robotic arms 42 is right. One robot 41 is equipped with two robotic arms 42, which facilitates the placement of the wafer 01 to be inspected and the removal of the wafer 01 after inspection, which can further improve work efficiency. The suction cup 43 is located at the end of the robotic arm 42 and is used to absorb the wafer 01.

[0048] In this embodiment, the robot 41 may be a SCARA robot. SCARA (Selective Compliance Assembly Robot Arm) is an industrial robot based on a cylindrical coordinate system, has four degrees of freedom, and has the characteristics of relatively high rigidity, good compliance, and fast movement.

[0049] Alternatively, as Figure 6As shown, to ensure that the placement point of the wafer 01 is the center point after the wafer 01 is removed by the robotic arm 42, the centering assembly 12 is used to center the wafer 01. To this end, a centering assembly 12 is provided on the loading conveyor line 11. The centering assembly 12 is located upstream of the detection mechanism 3. The centering assembly 12 includes a lifting platform and a guide wheel assembly. The lifting platform is suitable for moving up and out of the loading conveyor line 11 or lowering below the loading conveyor line 11. The loading conveyor line 11 has a corresponding lifting platform with a gap for the lifting platform to pass through. The lifting platform can be driven up and down by a cylinder, a hydraulic cylinder, an electric push rod or a linear module. The guide wheel assembly is located above the loading conveyor line 11 corresponding to the lifting platform. The guide wheel assembly includes a plurality of guide wheels 121 distributed along the circumference. The guide wheels 121 are used to contact the outer peripheral wall of the wafer 01. The center of the circumferential distribution of the guide wheels 121 is located on the conveying center line of the loading conveyor line 11. The plurality of guide wheels 121 are suitable for synchronously swinging in the horizontal plane.

[0050] In this embodiment, a sensor is used to detect that the chip 01 has arrived at the lifting platform of the centering component 12. The sensor can be a photoelectric sensor or an infrared sensor, etc. The sensor can be set on one side of the lifting platform. The loading conveyor line 11 stops conveying, and the lifting platform lifts the chip 01 upward to the position of the guide wheel 121. In the initial state, each guide wheel 121 is located at the periphery of the chip 01 and does not contact the chip 01. As the guide wheel 121 swings inward, the guide wheel 121 contacts the outer peripheral wall of the chip 01, thereby aligning the center of the chip 01 with the conveying center line of the loading conveyor line 11. The guide wheel 121 swings outward and disengages from the chip 01. The lifting platform falls, and the chip 01 falls onto the loading conveyor line 11, and the loading conveyor line 11 continues to convey the chip 01.

[0051] Alternatively, as Figure 3 、 4 As shown in Figures 6 and 7, the centering assembly 12 also includes a centering drive, which includes a driving wheel 122, a driven wheel 123, and a swing arm 124. The driving wheel 122 and multiple driven wheels 123 are distributed along the circumferential direction, and the center of the circumferential distribution is the same as the center of the circumferential distribution of the guide wheel 121. The driving wheel 122 and the driven wheel 123 are driven by a transmission belt. The swing arm 124 is coaxially connected to the bottom of the driving wheel 122 and the driven wheel 123, and the end of the swing arm 124 is provided with a guide wheel 121. The motor drives the driving wheel 122 to rotate, and the driving wheel 122 drives each driven wheel 123 to rotate through the transmission belt. The driven wheel 123 and the driving wheel 122 drive their respective swing arms 124 to rotate, and the swing arm 124 drives the guide wheel 121 to swing inward or outward. In this embodiment, the driving wheel 122 and the driven wheel 123 are mounted on a horizontal mounting plate 125 above the loading conveyor line 11. In order to clearly reflect the swing arm 124 and the guide wheel 121, Figure 6The mounting plate is omitted. A tensioning pulley 126 is also provided on the mounting plate 125 corresponding to the transmission belt. The location of the tensioning pulley 126 is not limited. In other embodiments, the swing arm 124 has multiple mounting holes 1241 along its length. The driving pulley 122 and the driven pulley 123 can be connected to the mounting holes 1241 to adjust the inward movement distance of the guide wheel 121, thereby improving the adaptability of the centering assembly 12 to wafers 01 of different sizes.

[0052] Alternatively, as Figure 2 and 8 As shown, there are one or more centering components 12, and a thickness measuring component 13 is provided on the feeding conveyor line 11. The thickness measuring component 13 is located upstream of at least one centering component 12. In this embodiment, there are two centering components 12, which are located upstream and downstream of the thickness measuring component 13 respectively. The thickness measuring component 13 is used to measure the thickness of the wafer 01. The thickness measuring component 13 includes a lifting platform and a thickness measuring probe. The lifting platform has the same structure as the aforementioned lifting platform. The thickness measuring probe is arranged above the feeding conveyor line 11. The lifting platform rises to bring the upper surface of the wafer 01 into contact with the thickness measuring probe. After the thickness measurement is completed, the lifting platform moves down to place the wafer 01 back on the feeding conveyor line 11. In this embodiment, the thickness measuring probe adopts the existing contact thickness measuring structure. In other embodiments, the thickness measuring probe can also adopt a non-contact thickness measuring structure. Then, the wafer 01 can stop when it reaches the thickness measuring position, and the lifting platform structure can be omitted.

[0053] Optionally, the measurement and sorting device also includes a placement box 6, a code scanning mechanism 7, and a chip reading mechanism. The placement box 6 is used to stack the wafers 01. The placement box 6 loaded with wafers 01 can be placed at the loading mechanism 1 for loading, and the empty placement box 6 can be placed at the unloading mechanism 2 for sorting and unloading. Wafers 01 with different resistivity multi-point measurement ranges are classified and placed in different placement boxes 6. The code scanning mechanism 7 is set corresponding to the identification code of the placement box 6. The chip reading mechanism is set corresponding to the chip in the placement box 6; the identification code and the chip reading information include the box number and material information, and the material information includes the specifications of the wafer 01. The specifications of the wafers 01 placed in the same placement box 6 are the same. The controller obtains the specifications of the wafer 01 and controls the corresponding actions of the test bench 31.

[0054] Alternatively, as Figure 7-9As shown, the loading and unloading of the wafers 01 in the placement box 6 can be done manually or automatically. In order to improve the automation level of the equipment and save manpower, this embodiment adopts an automatic loading and unloading structure. The loading mechanism 1 and the unloading mechanism 2 also include a running conveyor line and a lifting assembly. Multiple running conveyor lines are arranged side by side at the end of the loading conveyor line 11 and the unloading conveyor line 21 away from the detection mechanism 3, and the two ends of the running conveyor line extend out of both sides of the loading conveyor line 11 and the unloading conveyor line 21. The lifting assembly is arranged at both ends of the running conveyor line, and the placement box 6 is arranged at the lifting end of the lifting assembly. The lifting assembly drives the placement box 6 to rise and fall so that the running conveyor line can transport the stacked wafers 01 in the placement box 6 one by one or stack the single wafers 01 into the placement box 6 one by one. In this embodiment, the lifting end of the lifting assembly and the placement box 6 are provided with a notch corresponding to the running conveyor line. One end of the running conveyor line extends into the notch to facilitate the removal or delivery of the wafers 01. In this embodiment, the code scanning mechanism 7 is arranged on the frame 5 above the loading conveyor line 11 and the unloading conveyor line 21, and the code scanning mechanism 7 is arranged in a one-to-one correspondence with the placement box 6; the chip reading mechanism is arranged on the moving end of the lifting component, and its moving end is used to place the placement box 6, and the chip reading mechanism is arranged in a one-to-one correspondence with the placement box 6.

[0055] When loading, if Figure 7 and 8 As shown, the lifting assembly 15 drives the placement box 6 to move down the same distance each time, so that the stacked wafers 01 in the placement box 6 flow from bottom to top through the operation conveyor line 14 to the loading conveyor line 11. Figure 9 As shown, the controller transfers wafers 01 via unloading conveyor line 21 to the corresponding operating conveyor line 23 based on the resistivity multi-point test results of wafers 01. Operating conveyor line 23 then delivers wafers 01 to the corresponding placement cassette 6. During unloading, the lifting assembly 24 operates in the opposite direction of loading. During unloading, the lifting assembly 24 moves placement cassette 6 upward by the same distance, stacking wafers 01 from top to bottom within placement cassette 6. The two side walls of placement cassette 6 are provided with partitions to separate wafers 01 and prevent contact between wafers 01 within placement cassette 6. In this embodiment, placement cassette 6 is a wafer basket.

[0056] Optionally, a PN detection component 22 is further provided on the unloading conveyor line 21. The PN detection component 22 is located downstream of the detection mechanism 3. The PN detection component 22 is used to detect whether the wafer 01 is P-type or N-type, which is beneficial for subsequent differentiation.

[0057] Optionally, the PN detection assembly 22 includes a PN probe and a lifting platform, the lifting platform extends above the unloading conveyor line 21 or retracts below the unloading conveyor line 21, and the PN probe is arranged above the unloading conveyor line 21 corresponding to the lifting platform. The lifting platform has the same structure as the aforementioned lifting platform, and the PN probe is an existing probe.

[0058] This embodiment also provides a method for the aforementioned wafer resistivity multi-point measurement and sorting device, comprising the following steps:

[0059] S1. Loading: Obtain the specifications of wafer 01, and load the single wafers 01 onto the loading conveyor line 11 in sequence.

[0060] The code scanning mechanism 7 and the chip reading mechanism identify the placement box 6 with the wafer 01, obtain the box number and material information, and send the box number and material information to the controller. After successful identification, the lifting component 15 corresponding to the placement box 6 moves down the same distance each time, and the wafer 01 in the placement box 6 is transported from bottom to top by the operating conveyor line 14 to the loading conveyor line 11.

[0061] S2. Alignment and thickness measurement: the thickness measurement component 13 and the centering component 12 measure the thickness and align the wafer 01 respectively.

[0062] In this embodiment, the centering component 12 first aligns the chip 01, and then sends it to the thickness measuring component 13 for thickness measurement. Before being transported to the detection mechanism 3, the centering component 12 aligns the chip 01 again to center the position of the chip 01, ensuring the accuracy of the gripping position of the robot arm 42, thereby improving the accuracy of the test point.

[0063] S3. Multi-point resistivity measurement: The material transfer mechanism 4 moves the wafer 01 to the test table 31. The controller controls the lifting, translation or rotation of the test table 31 according to the test points corresponding to the specifications of the wafer 01. The test probe 32 pierces the resistivity of the test points on the wafer 01.

[0064] The robot 41 grabs the wafer 01 and places it on the test table 31. The controller controls the test table 31 to move horizontally to the bottom of the probe 321. The test table 31 moves upward so that the wafer 01 contacts the probe 321. The probe 321 is pressed down by the counterweight 322 to obtain the resistivity data of the wafer 01. The test table 31 moves downward. The controller controls the test table 31 to move horizontally a certain distance again. The probe 321 presses down again to obtain the resistivity data of the wafer 01. For example, the controller has a straight-line or cross-shaped change for the test point on the wafer 01. For the straight-line change, the test table 31 only needs to be raised and lowered and moved horizontally during the detection process; for the cross-shaped change, the test table 31 needs to be raised and lowered, moved horizontally, and rotated during the detection process. For wafers 01 of different specifications, the position of the test point is also different. According to the different points, the lateral and rotation positions of the test table 31 are controlled by the servo or stepper motor of the lateral motor and the rotation motor.

[0065] S4. Sorting and unloading: the material transfer mechanism 4 transports the tested wafer 01 from the test table 31 to the unloading conveyor line 21 . The controller controls the unloading mechanism 2 to sort the wafer 01 to the corresponding placement box 6 according to the detection result of the wafer 01 .

[0066] Based on the multi-point resistivity test results of wafers 01, the controller transfers wafers 01 from unloading conveyor line 21 to the corresponding operating conveyor line 23. Operating conveyor line 23 delivers wafers 01 to the corresponding placement box 6. During unloading, the movement of lifting assembly 24 is opposite to that during loading. During unloading, lifting assembly 24 drives placement box 6 upward by the same distance, stacking wafers 01 from top to bottom in placement box 6. This embodiment divides wafers into different bins according to process requirements, and wafers within a multi-point resistivity test range will enter a placement box 6.

[0067] In summary, this embodiment directly places a cassette containing wafers on the loading mechanism, automatically reads the cassette number and material information, executes the relevant measurement process, and sorts the wafers to designated locations based on the test results, without requiring human intervention or additional operations. Accordingly, the relevant components of this device are manufactured using special materials that meet on-site cleanliness requirements, and the corresponding software, electrical control, and test algorithms adhere to semiconductor industry standards. This embodiment enables multi-point automatic resistivity measurement of wafers of different specifications and automatically sorts and unloads the wafers based on the test results of the testing mechanism. This achieves a high degree of automation and reduces manual effort. It also increases production capacity and improves product flow efficiency. It also improves product quality, unifies inspection standards, and aligns with national standards. It also enhances technical capabilities and offers flexible optimization and development space to accommodate subsequent functional development needs.

[0068] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer resistivity multi-point measurement and sorting device, characterized by: It includes a loading mechanism, an unloading mechanism, a detection mechanism and a conveying mechanism. The loading mechanism includes a loading conveyor line, the unloading mechanism includes a unloading conveyor line arranged parallel to the loading conveyor line, the detection mechanism is arranged on the outside of the loading conveyor line and the unloading conveyor line, and the detection mechanism is used for multi-point measurement of the resistivity of chips of different specifications; the conveying mechanism is arranged on the inside of the detection mechanism, and the conveying mechanism is used to place the chips on the loading conveyor line to the detection mechanism and place the chips at the detection mechanism to the unloading conveyor line; a PN detection component is provided on the unloading conveyor line, and the PN detection component is located downstream of the detection mechanism.

2. The wafer resistivity multi-point measurement and sorting device according to claim 1, characterized in that: The sorting device also includes a placement box, a code scanning mechanism and a chip reading mechanism. The placement box is used to stack wafers, and the code scanning mechanism is set corresponding to the identification code of the placement box; the chip reading mechanism is set corresponding to the chip of the placement box; the reading information of the identification code and the chip includes at least the box number and material information.

3. The wafer resistivity multi-point measurement and sorting device according to claim 2, characterized in that: The loading mechanism and the unloading mechanism also include an operating conveyor line and a lifting assembly. A plurality of the operating conveyor lines are arranged side by side on both sides of the loading conveyor line and the unloading conveyor line away from one end of the detection mechanism; the lifting assembly is arranged at one end of the operating conveyor line away from the loading conveyor line and the unloading conveyor line, and the placement box is arranged at the lifting end of the lifting assembly. The lifting assembly drives the placement box to rise and fall so that the operating conveyor line can transport the stacked wafers in the placement box one by one or stack the single wafers into the placement box one by one.

4. The wafer resistivity multi-point measurement and sorting device according to any one of claims 1 to 3, characterized in that: The detection mechanism includes a test bench, a test probe and a controller. The test bench is arranged on the outside of the loading conveyor line and the unloading conveyor line. The test bench is suitable for rotating, lifting and moving along the conveying direction of the loading conveyor line. The test probe is provided above the test bench. The test probe is used to measure the resistivity of the chip test point. The controller controls the movement of the test bench according to the different test point information of chips of different specifications. The controller controls the unloading mechanism to sort the chips according to the results of the detection mechanism.

5. The wafer resistivity multi-point measurement and sorting device according to claim 4, characterized in that: The test probe includes a probe and a counterweight, and the counterweight is arranged on the probe.

6. The wafer resistivity multi-point measurement and sorting device according to any one of claims 1 to 3 and 5, characterized in that: The transport mechanism includes a robot, a grabbing arm and a suction cup, the robot is a four-degree-of-freedom or six-degree-of-freedom robot; the two grabbing arms are arranged along different horizontal radial directions with the moving end of the robot as the center; the suction cup is arranged at the end of the grabbing arm.

7. The wafer resistivity multi-point measurement and sorting device according to claim 4, characterized in that: The transport mechanism includes a robot, a grabbing arm and a suction cup, the robot is a four-degree-of-freedom or six-degree-of-freedom robot; the two grabbing arms are arranged along different horizontal radial directions with the moving end of the robot as the center; the suction cup is arranged at the end of the grabbing arm.

8. The wafer resistivity multi-point measurement and sorting device according to any one of claims 1-3, 5, and 7, characterized in that: The PN detection component includes a PN probe and a lifting platform. The lifting platform extends above the unloading conveyor line or retracts below the unloading conveyor line. The PN probe is arranged above the unloading conveyor line corresponding to the lifting platform.

9. The wafer resistivity multi-point measurement and sorting device according to any one of claims 1-3, 5, and 7, characterized in that: One or more centering components are provided on the feeding conveyor line, and the centering components are located upstream of the detection mechanism. The centering components include a lifting platform and a guide wheel group. The lifting platform is suitable for moving up and out of the feeding conveyor line or descending below the feeding conveyor line; the guide wheel group is arranged above the feeding conveyor line corresponding to the lifting platform, and the guide wheel group includes a plurality of guide wheels distributed along the circumference, and the guide wheels are used to contact the outer peripheral wall of the wafer. The center of the circumferential distribution of the guide wheels is located on the conveying center line of the feeding conveyor line, and the plurality of guide wheels are suitable for synchronously swinging in the horizontal plane.

10. The wafer resistivity multi-point measurement and sorting device according to claim 4, characterized in that: One or more centering components are provided on the feeding conveyor line, and the centering components are located upstream of the detection mechanism. The centering components include a lifting platform and a guide wheel group. The lifting platform is suitable for moving up and out of the feeding conveyor line or descending below the feeding conveyor line; the guide wheel group is arranged above the feeding conveyor line corresponding to the lifting platform, and the guide wheel group includes a plurality of guide wheels distributed along the circumference, and the guide wheels are used to contact the outer peripheral wall of the wafer. The center of the circumferential distribution of the guide wheels is located on the conveying center line of the feeding conveyor line, and the plurality of guide wheels are suitable for synchronously swinging in the horizontal plane.

11. The wafer resistivity multi-point measurement and sorting device according to claim 6, characterized in that: One or more centering components are provided on the feeding conveyor line, and the centering components are located upstream of the detection mechanism. The centering components include a lifting platform and a guide wheel group. The lifting platform is suitable for moving up and out of the feeding conveyor line or descending below the feeding conveyor line; the guide wheel group is arranged above the feeding conveyor line corresponding to the lifting platform, and the guide wheel group includes a plurality of guide wheels distributed along the circumference, and the guide wheels are used to contact the outer peripheral wall of the wafer. The center of the circumferential distribution of the guide wheels is located on the conveying center line of the feeding conveyor line, and the plurality of guide wheels are suitable for synchronously swinging in the horizontal plane.

12. The wafer resistivity multi-point measurement and sorting device according to claim 8, characterized in that: One or more centering components are provided on the feeding conveyor line, and the centering components are located upstream of the detection mechanism. The centering components include a lifting platform and a guide wheel group. The lifting platform is suitable for moving up and out of the feeding conveyor line or descending below the feeding conveyor line; the guide wheel group is arranged above the feeding conveyor line corresponding to the lifting platform, and the guide wheel group includes a plurality of guide wheels distributed along the circumference, and the guide wheels are used to contact the outer peripheral wall of the wafer. The center of the circumferential distribution of the guide wheels is located on the conveying center line of the feeding conveyor line, and the plurality of guide wheels are suitable for synchronously swinging in the horizontal plane.

13. The wafer resistivity multi-point measurement and sorting device according to claim 9, characterized in that: The centering assembly further comprises: The central drive includes a driving wheel, a driven wheel and a swing arm. The driving wheel and multiple driven wheels are distributed along the circumferential direction. The driving wheel and the driven wheels are driven by a transmission belt. The swing arms are coaxially connected to the bottom of the driving wheel and the driven wheel respectively, and the guide wheel is provided at the end of the swing arm.

14. The wafer resistivity multi-point measurement and sorting device according to claim 10, characterized in that: The centering assembly further comprises: The central drive includes a driving wheel, a driven wheel and a swing arm. The driving wheel and multiple driven wheels are distributed along the circumferential direction. The driving wheel and the driven wheels are driven by a transmission belt. The swing arms are coaxially connected to the bottom of the driving wheel and the driven wheel respectively, and the guide wheel is provided at the end of the swing arm.

15. The wafer resistivity multi-point measurement and sorting device according to claim 11, characterized in that: The centering assembly further comprises: The central drive includes a driving wheel, a driven wheel and a swing arm. The driving wheel and multiple driven wheels are distributed along the circumferential direction. The driving wheel and the driven wheels are driven by a transmission belt. The swing arms are coaxially connected to the bottom of the driving wheel and the driven wheel respectively, and the guide wheel is provided at the end of the swing arm.

16. The wafer resistivity multi-point measurement and sorting device according to claim 12, characterized in that: The centering assembly further comprises: The central drive includes a driving wheel, a driven wheel and a swing arm. The driving wheel and multiple driven wheels are distributed along the circumferential direction. The driving wheel and the driven wheels are driven by a transmission belt. The swing arms are coaxially connected to the bottom of the driving wheel and the driven wheel respectively, and the guide wheel is provided at the end of the swing arm.

17. The wafer resistivity multi-point measurement and sorting device according to any one of claims 10 to 16, characterized in that: There are one or more centering components, and a thickness measuring component is provided on the feeding conveyor line. The thickness measuring component is located upstream of at least one of the centering components.

Images