Quantitative and rapid taking equipment for soldering paste

Abstract

The utility model relates to taking equipment, in particular to quantitative and rapid taking equipment for soldering paste. The quantitative and rapid taking device for the soldering paste comprises a heat preservation cylinder, an installation cylinder, a sealing plate, a clamping block and the like, the installation cylinder is arranged on the heat preservation cylinder, the heat preservation cylinder is clamped with the installation cylinder, the sealing plate is connected into the installation cylinder in a sliding mode, the sealing plate makes contact with the heat preservation cylinder, through holes are symmetrically formed in the clamping positions of the heat preservation cylinder and the installation cylinder, and the clamping block is arranged on the installation cylinder. Clamping blocks are symmetrically connected to the mounting cylinder in a sliding mode and used for locking the heat preservation cylinder and the mounting cylinder. By controlling the temperature regulator, the electric rotary table, the transfer pump and the electric push rod to work, under the cooperation of the feeding pipe, the conveying pipe, the square storage barrel, the n-shaped plate, the discharging spray head and the discharging pipe, soldering paste can be rapidly and stably heated to the corresponding state, quantitative taking is conducted after automatic and sufficient stirring, operation is easy and convenient, time and labor are saved, and working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a taking device, in particular to a quantitative and fast taking device for solder paste. Background Art

[0002] Solder paste is a very critical welding material used in the electronic assembly process, especially in surface mount technology. It is a paste-like homogeneous mixture formed by mixing solder powder, flux and some additives. It has a certain viscosity at room temperature and can initially stick electronic components to a predetermined position. When the solder paste is heated to a certain temperature, the solder paste reflows to interconnect the components to be soldered with the pads, and forms a permanently connected solder joint after cooling.

[0003] Currently, when taking out solder paste, the solder paste must first be taken out of the refrigerator and placed at room temperature for 2-4 hours to return to temperature. After the solder paste reaches room temperature, the solder paste is opened, and then, based on the integrity of the solder paste surface, additives are added as needed for treatment, and the solder paste is fully stirred using a manual or automatic mixer. Subsequently, the solder paste is taken out using a scraper in the principle of adding small amounts multiple times, and then used at the position to be soldered. During the operation, the room temperature must be controlled between 22-28 degrees to ensure the stability and activity of the solder paste. However, the above method of taking out the solder paste requires taking it out of the refrigerator, leaving it to return to temperature, and fully stirring it before it can be taken out. The operation is cumbersome, time-consuming, and labor-intensive, with low work efficiency. In addition, the amount taken out each time cannot be guaranteed, and material loss is easy. Utility Model Content

[0004] In view of this, the utility model provides a quantitative and rapid solder paste taking device which is simple to operate, saves time and labor, and makes rational use of materials. It can solve the shortcomings of the current solder paste taking, which is cumbersome, time-consuming, labor-intensive, and easy to waste materials.

[0005] The technical solution of the utility model is: a quantitative and rapid solder paste taking device, comprising an insulation cylinder, a mounting cylinder, a sealing plate, a clamping block, a temperature regulator, an electric turntable and a material taking mechanism, the insulation cylinder is provided with a mounting cylinder, the insulation cylinder is clamped with the mounting cylinder, a sealing plate is slidably connected in the mounting cylinder, the sealing plate contacts the insulation cylinder, through holes are symmetrically opened at the clamping joints of the insulation cylinder and the mounting cylinder, the mounting cylinder is symmetrically slidably connected with the clamping blocks, the clamping blocks are used to lock the insulation cylinder and the mounting cylinder, the ends of the clamping blocks slide through the through holes on the insulation cylinder and the mounting cylinder, a temperature regulator for regulating the temperature inside the insulation cylinder is connected to the insulation cylinder, an electric turntable for driving barreled solder paste for stirring is connected to the bottom of the insulation cylinder, and a material taking mechanism for taking barreled solder paste is provided on the mounting cylinder.

[0006] Further explanation: the material taking mechanism includes a mounting bracket, a suction pump, a feed pipe, a delivery pipe, a discharge nozzle, a discharge pipe and a pushing assembly. The mounting barrel is connected to the mounting bracket, and the mounting bracket is connected to a suction pump for extracting barreled solder paste. The feed port of the suction pump is connected to the feed pipe, and the end of the feed pipe away from the suction pump is the feed port. The feed pipe passes through the sealing plate, and the discharge port of the suction pump is connected to the delivery pipe, and the end of the delivery pipe away from the suction pump is the discharge port. A one-way valve is provided in the discharge port of the delivery pipe to prevent the solder paste from flowing back. A pushing assembly for pushing out the solder paste in a quantitative manner is provided on the mounting bracket, and the pushing assembly is located above the suction pump, and the discharge port of the delivery pipe is connected to the pushing assembly, and the pushing assembly is connected to the discharge pipe, and the discharge pipe passes through one side of the mounting barrel, and the discharge pipe is connected to a discharge nozzle for discharging the solder paste, and the end of the discharge nozzle away from the discharge pipe is the discharge port.

[0007] Further explanation: the pushing assembly includes a square storage barrel, an n-shaped plate and an electric push rod. The square storage barrel is connected to the mounting frame, and the square storage barrel is connected to the discharge port of the feed pipe. An n-shaped plate is slidingly connected inside the square storage barrel, and an electric push rod for quantitatively pushing the solder paste is connected inside the mounting barrel. The telescopic rod of the electric push rod is connected to the n-shaped plate.

[0008] Further explanation: a placement ring is also included. The mounting tube is connected to a placement ring for limiting the discharge nozzle. The discharge nozzle and the placement ring are in sliding cooperation.

[0009] Further explanation: a conical cover is also included. The mounting cylinder is connected to the conical cover for closing the discharge port of the discharge nozzle. The conical cover is located directly below the placement ring and is engaged with the discharge port of the discharge nozzle.

[0010] Further description, it also includes a handle, which is rotatably connected to the mounting tube.

[0011] The utility model has the following advantages: the utility model controls the operation of the temperature regulator, the electric turntable, the material pump and the electric push rod, and with the cooperation of the feed pipe, the material delivery pipe, the square material storage barrel, the n-shaped plate, the material discharge nozzle and the material discharge pipe, the solder paste can be quickly and stably returned to the corresponding state, and after automatic and sufficient stirring, it can be quantitatively taken out. The operation is simple, time and labor are saved, work efficiency is improved, the stability and activity of the solder paste during use can be guaranteed, and the materials are reasonably utilized to ensure the feeding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.

[0013] Figure 2 It is a schematic diagram of the cross-sectional three-dimensional structure of the utility model.

[0014] Figure 3It is a three-dimensional structural diagram of the heat preservation cylinder, the installation cylinder and the clamping block of the utility model.

[0015] Figure 4 It is a three-dimensional structural diagram of the components of the utility model, including the mounting frame, the material extraction pump, and the square material storage barrel.

[0016] Figure 5 It is a three-dimensional structural diagram of the square storage barrel, N-shaped plate, electric push rod and other components of the utility model.

[0017] Figure 6 It is a three-dimensional structural diagram of the discharge nozzle and placement ring of the utility model.

[0018] In the above drawings: 1-insulation cylinder, 2-mounting cylinder, 21-sealing plate, 22-clamping block, 3-temperature regulator, 4-electric turntable, 5-mounting frame, 6-suction pump, 61-feed pipe, 62-delivery pipe, 7-square storage cylinder, 71-n-shaped plate, 8-electric push rod, 9-discharge nozzle, 10-discharge pipe, 11-placing ring, 12-conical cover, 13-handle. DETAILED DESCRIPTION

[0019] The present invention will be further described below in conjunction with specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention.

[0020] Example: A device for quickly taking out solder paste quantitatively, such as Figures 1-6 As shown, it includes an insulation cylinder 1, a mounting cylinder 2, a sealing plate 21, a clamping block 22, a temperature regulator 3, an electric turntable 4 and a material-retrieving mechanism. The mounting cylinder 2 is installed on the top of the insulation cylinder 1, and the insulation cylinder 1 is clamped with the mounting cylinder 2. The sealing plate 21 is slidably connected inside the mounting cylinder 2, and the bottom of the sealing plate 21 can contact the top of the insulation cylinder 1. The clamping parts of the insulation cylinder 1 and the mounting cylinder 2 are both symmetrically opened with through holes in the front and back. The mounting cylinder 2 is symmetrically slidably connected with the clamping blocks 22, and the ends of the clamping blocks 22 slide through the through holes on the insulation cylinder 1 and the mounting cylinder 2. The inner wall of the insulation cylinder 1 is fixedly connected with the temperature regulator 3, and the electric turntable 4 is installed on the bottom of the insulation cylinder 1. The top of the electric turntable 4 is provided with a groove structure, and the groove of the electric turntable 4 can clamp the bottom of the barreled solder paste. The mounting cylinder 2 is provided with a material-retrieving mechanism.

[0021] like Figure 2 、 Figure 4 、 Figure 5 and Figure 6As shown, the material taking mechanism includes a mounting frame 5, a suction pump 6, a feed pipe 61, a delivery pipe 62, a discharge nozzle 9, a discharge pipe 10 and a pushing assembly. The mounting frame 5 is fixedly connected to the top of the mounting cylinder 2, and the suction pump 6 is bolted to the bottom of the mounting frame 5. The feed port of the suction pump 6 is connected with the feed pipe 61, and the lower end of the feed pipe 61 is the feed port. The feed pipe 61 passes through the sealing plate 21, and the discharge port of the suction pump 6 is connected with the delivery pipe 62. The upper end of the delivery pipe 62 is the discharge port. A one-way valve is provided in the discharge port of the delivery pipe 62. A pushing assembly is provided at the top of the mounting frame 5. The pushing assembly is located above the suction pump 6. The discharge port of the delivery pipe 62 is connected to the pushing assembly. The right side of the pushing assembly is connected with the discharge pipe 10. The discharge pipe 10 passes through the right side of the mounting cylinder 2, the lower end of the discharge pipe 10 is connected with the discharge nozzle 9, and the lower end of the discharge nozzle 9 is the discharge port.

[0022] like Figure 2 、 Figure 4 and Figure 5 As shown, the pushing assembly includes a square storage barrel 7, an n-shaped plate 71 and an electric push rod 8. The square storage barrel 7 is fixedly connected to the top of the mounting frame 5. The square storage barrel 7 is connected to the discharge port of the delivery pipe 62. The n-shaped plate 71 is slidably connected to the square storage barrel 7. The electric push rod 8 is fixedly connected to the left side of the top of the mounting barrel 2. The telescopic rod of the electric push rod 8 is fixedly connected to the inner top of the n-shaped plate 71. By controlling the quantitative extension of the telescopic rod of the electric push rod 8, the n-shaped plate 71 can be driven to push the solder paste in the square storage barrel 7 to the right, thereby completing the quantitative use of the solder paste.

[0023] like Figure 1 and Figure 6 As shown, a placement ring 11 is also included. The placement ring 11 is fixedly connected to the lower right side of the installation cylinder 2, and the discharge nozzle 9 is slidably matched with the placement ring 11.

[0024] like Figure 1 As shown, a conical cover 12 is also included. The conical cover 12 is fixedly connected to the lower right side of the mounting cylinder 2. The conical cover 12 is located directly below the placement ring 11. The conical cover 12 is engaged with the discharge port of the discharge nozzle 9.

[0025] like Figure 1 As shown, a handle 13 is also included, and the handle 13 is rotatably connected to the left side of the upper part of the installation cylinder 2.

[0026] Initially, the telescopic rod of the electric push rod 8 is in a retracted state, the n-shaped plate 71 is located on the left side of the square storage barrel 7, and the sealing plate 21 is located in the middle of the mounting barrel 2, the feed port of the feed pipe 61 is located in the mounting barrel 2, the discharge nozzle 9 is inserted into the placement ring 11, and the discharge port of the discharge nozzle 9 is engaged with the conical cover 12; when it is necessary to store the solder paste, the temperature in the insulation barrel 1 is adjusted to a temperature suitable for storing the solder paste by controlling the temperature regulator 3, and then the two clamping blocks 22 are sequentially removed from the insulation barrel 1 and the mounting barrel 2. The engaging part is removed to disengage the end of the clamping block 22 from contact with the heat preservation tube 1 and the installation tube 2, so that the clamping block 22 no longer locks the heat preservation tube 1 and the installation tube 2, and then the installation tube 2 is pulled upward to disengage the installation tube 2 from the heat preservation tube 1, thereby opening the heat preservation tube 1, and then the barreled solder paste to be stored is placed into the groove of the electric turntable 4, so that the bottom of the barreled solder paste is engaged with the groove of the electric turntable 4. After placement, the heat preservation tube 1 and the two clamping blocks 22 are placed back in place in turn, and the solder paste can be stored in this way;When solder paste is needed, the temperature in the insulation cylinder 1 is adjusted to 25 degrees by controlling the temperature regulator 3 to allow the solder paste to return to temperature quickly and stably. After a certain period of time, the two clamping blocks 22 and the insulation cylinder 1 are removed in turn to open the insulation cylinder 1. After opening the lid of the barrel of solder paste, according to the surface condition of the solder paste, add the corresponding additives as needed, pull the sealing plate 21 downward, slide the sealing plate 21 to the lower part of the mounting cylinder 2, and make the feed port of the feed pipe 61 located outside the mounting cylinder 2. Then put the mounting cylinder 2 back on the insulation cylinder 1, insert the feed port of the feed pipe 61 into the barrel of solder paste, and make the bottom of the sealing plate 21 contact with the top of the insulation cylinder 1. Then put the two clamping blocks 22 back in place, and then Then the electric turntable 4 is controlled to work, which can drive the barreled solder paste to rotate, and with the cooperation of the feed pipe 61, the barreled solder paste is stirred. After a certain period of time, the barreled solder paste is fully stirred, and then the electric turntable 4 is controlled to stop working, so that the barreled solder paste stops rotating, and then the extraction pump 6 is controlled to work, and the extraction pump 6 extracts the solder paste through the feed pipe 61, and conveys the extracted solder paste to the square storage barrel 7 through the delivery pipe 62, thereby completing the quantitative feeding of the square storage barrel 7, and then pulling the discharge nozzle 9 upward to disengage the discharge port of the discharge nozzle 9 from the conical cover 12, and the discharge nozzle 9 disengages from the placement ring 11, thereby releasing the limit of the discharge nozzle 9, and then the discharge nozzle The discharge port of the head 9 is aligned with the position to be welded, and then the telescopic rod of the electric push rod 8 is controlled to extend quantitatively, driving the n-shaped plate 71 to move a certain position to the right. The n-shaped plate 71 pushes the solder paste in the square storage barrel 7 to the right, and under the action of the one-way valve of the delivery pipe 62, the solder paste is transported to the discharge nozzle 9 along the discharge pipe 10, and the solder paste is loaded to the position to be welded through the discharge port of the discharge nozzle 9, so that the solder paste can be quantitatively taken. Similarly, the solder paste can be loaded to other positions. When the solder paste is not needed, the discharge nozzle 9 is inserted downward into the placement ring 11 so that the discharge port of the discharge nozzle 9 is fully engaged with the conical cover 12, thereby completing the limit of the discharge nozzle 9, and then the two are sequentially Remove the two clamping blocks 22 and the insulation cylinder 1, thereby opening the insulation cylinder 1. If there is little solder paste left in the insulation cylinder 1, take the barrel of the solder paste out of the groove of the electric turntable 4. If there is still solder paste left, close the lid of the barrel of solder paste, and adjust the temperature in the insulation cylinder 1 to a temperature suitable for storing the solder paste by controlling the temperature regulator 3. Then push the sealing plate 21 upward to make the sealing plate 21 slide to the middle of the installation cylinder 2, and the feed port of the feed pipe 61 is located in the installation cylinder 2. Then, the installation cylinder 2 and the two clamping blocks 22 are placed and reset in sequence, thereby completing the engagement and locking between the insulation cylinder 1 and the installation cylinder 2. The handle 13 makes it easy to carry the device to the location where it is needed.In this way, the solder paste can be easily taken, saving time and effort, improving work efficiency, ensuring the stability and activity of the solder paste during use, taking a fixed amount of solder paste each time, making rational use of materials, and ensuring the feeding effect. In addition, the storage, preparation and use of the solder paste are integrated, making it convenient to use and having a wide range of applications.

[0027] The above description is merely an example of the implementation of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention shall be included within the scope of protection of the present invention. Any matters not fully described in the present invention are prior art known to those skilled in the art.

Claims

1. A device for quickly taking quantitative solder paste, characterized in that: The invention comprises a heat preservation tube (1), a mounting tube (2), a sealing plate (21), a clamping block (22), a temperature regulator (3), an electric turntable (4) and a material taking mechanism. The heat preservation tube (1) is provided with a mounting tube (2). The heat preservation tube (1) is clamped with the mounting tube (2). The sealing plate (21) is slidably connected in the mounting tube (2). The sealing plate (21) contacts the heat preservation tube (1). Through holes are symmetrically opened at the clamping position of the heat preservation tube (1) and the mounting tube (2). The mounting tube (2) is symmetrically slidably connected with the sealing plate (21). A connecting block (22) is used to lock the heat preservation tube (1) and the installation tube (2); the ends of the connecting block (22) slide through the through holes on the heat preservation tube (1) and the installation tube (2); a temperature regulator (3) for regulating the temperature inside the heat preservation tube (1) is connected to the heat preservation tube (1); an electric turntable (4) for driving the barreled solder paste to stir is connected to the bottom of the heat preservation tube (1); and a material taking mechanism for taking the barreled solder paste is provided on the installation tube (2).

2. The solder paste quantitative quick-use device according to claim 1, characterized in that: The material taking mechanism comprises a mounting frame (5), a material extraction pump (6), a material feeding pipe (61), a material delivery pipe (62), a material discharge nozzle (9), a material discharge pipe (10) and a material pushing assembly. The mounting frame (5) is connected to the mounting cylinder (2). The material extraction pump (6) for extracting the barreled solder paste is connected to the mounting frame (5). The material feeding port of the material extraction pump (6) is connected to the material feeding pipe (61). The end of the material feeding pipe (61) away from the material extraction pump (6) is the material feeding port. The material feeding pipe (61) passes through the sealing plate (21). The material discharge port of the material extraction pump (6) is connected to the material delivery pipe (62). The material delivery pipe ( The end of the delivery pipe (62) away from the extraction pump (6) is a discharge port, a one-way valve for preventing the solder paste from flowing back is provided in the discharge port of the delivery pipe (62), a pushing assembly for quantitatively pushing out the solder paste is provided on the mounting frame (5), the pushing assembly is located above the extraction pump (6), the discharge port of the delivery pipe (62) is connected to the pushing assembly, a discharge pipe (10) is connected to the pushing assembly, the discharge pipe (10) passes through one side of the mounting cylinder (2), a discharge nozzle (9) for discharging the solder paste is connected to the discharge pipe (10), and the end of the discharge nozzle (9) away from the discharge pipe (10) is the discharge port.

3. The solder paste quantitative quick-use device according to claim 2, characterized in that: The pushing assembly comprises a square material storage barrel (7), an n-shaped plate (71) and an electric push rod (8); the square material storage barrel (7) is connected to the mounting frame (5); the square material storage barrel (7) is communicated with the discharge port of the feeding pipe (62); the n-shaped plate (71) is slidably connected in the square material storage barrel (7); the electric push rod (8) for quantitatively pushing the solder paste is connected in the mounting barrel (2); and the telescopic rod of the electric push rod (8) is connected to the n-shaped plate (71).

4. The solder paste quantitative quick-use device according to claim 3, characterized in that: It also includes a placement ring (11). The installation cylinder (2) is connected with the placement ring (11) for limiting the position of the discharge nozzle (9). The discharge nozzle (9) and the placement ring (11) are in sliding cooperation.

5. The solder paste quantitative quick-use device according to claim 4, characterized in that: The invention also includes a conical cover (12), which is connected to the mounting cylinder (2) and is used to close the discharge port of the discharge nozzle (9). The conical cover (12) is located directly below the placement ring (11), and the conical cover (12) is engaged with the discharge port of the discharge nozzle (9).

6. The solder paste quantitative quick-use device according to claim 5, characterized in that: The utility model also comprises a handle (13), and the mounting cylinder (2) is rotatably connected with the handle (13).

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