Radiating, shielding and anti-breakdown adhesive tape for camera module IC (Integrated Circuit)

Abstract

The utility model discloses a heat-dissipation shielding anti-breakdown adhesive tape for a camera module IC (integrated circuit), which comprises a PET (polyethylene terephthalate) double-sided copper-plated film, a No.1 high-temperature-resistant flame-retardant acrylic adhesive layer, a graphite layer, a No.2 high-temperature-resistant flame-retardant acrylic adhesive layer, a flame-retardant PI (polyimide) layer, a No.3 high-temperature-resistant flame-retardant acrylic adhesive layer, a flame-retardant PET layer and a No.4 high-temperature-resistant flame-retardant acrylic adhesive layer, and the four sides of the first high-temperature-resistant flame-retardant acrylic adhesive layer and the PET double-sided copper-plated film extend along the four sides of the graphite layer and then are bonded with the four sides of the second high-temperature-resistant flame-retardant acrylic adhesive layer and the flame-retardant PI layer. The advantages are that the PET double-sided copper-plated film, the first high-temperature-resistant flame-retardant acrylic adhesive layer flame-retardant PI layer and the second high-temperature-resistant flame-retardant acrylic adhesive layer realize coating of the graphite layer, thereby effectively preventing short circuit of components caused by powder falling of the graphite layer. The flame-retardant PI layer can prevent the adhesive tape from being broken down by voltage or pin burrs of a circuit board.

Description

Technical Field

[0001] The utility model relates to the field of adhesive tapes, in particular to a heat dissipation, shielding and anti-breakdown adhesive tape used on a camera module IC. Background Art

[0002] With the upgrading of camera modules, the number of integrated circuits (ICs) on the modules has increased. The electromagnetic waves generated by these ICs can interfere with other components, and heat can easily accumulate on the ICs and remain trapped. This excessive heat can affect the components' proper function. The current solution is to apply tape over the ICs. The tape primarily consists of graphite for heat conduction and dissipation, copper foil for electromagnetic interference resistance, and other adhesive layers for flame retardancy. However, static electricity is easily generated on PCBs, which can break down conventional thermal tapes consisting solely of a PET layer. Furthermore, the graphite on both sides of conventional thermal tape is exposed, leaving graphite dust residue during the manufacturing process. This can also pulverize and fall off over time, causing the ICs to short-circuit. Furthermore, the PCB surface is uneven, with pin burrs present. Therefore, a relatively soft, highly viscous material is required.

[0003] In view of this, it is necessary to provide a heat dissipation shielding and anti-breakdown tape for camera module IC. Summary of the Invention

[0004] The utility model provides a heat dissipation shielding and anti-breakdown adhesive tape for a camera module IC, which effectively solves the problems that the existing adhesive tape is easily broken down and graphite easily loses powder during heat dissipation.

[0005] The technical solution adopted in this utility model is:

[0006] A heat dissipation shielding and anti-breakdown tape used on a camera module IC includes a PET double-sided copper-plated film, a No. 1 high-temperature resistant flame-retardant acrylic adhesive layer arranged on the lower end surface of the PET double-sided copper-plated film, a graphite layer arranged on the lower end surface of the No. 1 high-temperature resistant flame-retardant acrylic adhesive layer, a No. 2 high-temperature resistant flame-retardant acrylic adhesive layer arranged on the lower end surface of the No. 2 high-temperature resistant flame-retardant acrylic adhesive layer, a flame-retardant PI layer arranged on the lower end surface of the No. 2 high-temperature resistant flame-retardant acrylic adhesive layer, a No. 3 high-temperature resistant flame-retardant acrylic adhesive layer arranged on the lower end surface of the flame-retardant PI layer, a flame-retardant PET layer arranged on the lower end surface of the No. 3 high-temperature resistant flame-retardant acrylic adhesive layer, and a No. 4 high-temperature resistant flame-retardant acrylic adhesive layer arranged on the lower end surface of the flame-retardant PET layer. The four sides of the No. 1 high-temperature resistant flame-retardant acrylic adhesive layer and the PET double-sided copper-plated film extend along the four sides of the graphite layer and are bonded to the four sides of the No. 2 high-temperature resistant flame-retardant acrylic adhesive layer and the flame-retardant PI layer.

[0007] Furthermore, the thickness of the No. 1 high temperature resistant flame retardant acrylic adhesive layer, the No. 2 high temperature resistant flame retardant acrylic adhesive layer, the No. 3 high temperature resistant flame retardant acrylic adhesive layer and the No. 4 high temperature resistant flame retardant acrylic adhesive layer are all 5um to 50um.

[0008] Furthermore, the thickness of the graphite layer ranges from 10um to 300um.

[0009] Furthermore, the thickness of the flame-retardant PI layer ranges from 10 μm to 200 μm.

[0010] Furthermore, the thickness of the flame-retardant PET layer and the PET double-sided copper-plated film are both in the range of 6um to 100um.

[0011] The utility model has the following beneficial effects: The graphite layer is coated with a double-sided copper-plated PET film, a No. 1 high-temperature flame-retardant acrylic adhesive layer, a flame-retardant PI layer, and a No. 2 high-temperature flame-retardant acrylic adhesive layer, effectively preventing graphite powder shedding and component short circuits. The flame-retardant PI layer effectively prevents the tape from being penetrated by voltage or pin burrs on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is an overall schematic diagram of the heat dissipation shielding and anti-breakdown tape used on the camera module IC provided in an embodiment of the present application.

[0013] The markings in the figure are: 1. PET double-sided copper-plated film; 2. No. 1 high-temperature resistant flame-retardant acrylic adhesive layer; 3. Graphite layer; 4. No. 2 high-temperature resistant flame-retardant acrylic adhesive layer; 5. Flame-retardant PI layer; 6. No. 3 high-temperature resistant flame-retardant acrylic adhesive layer; 7. Flame-retardant PET layer; 8. No. 4 high-temperature resistant flame-retardant acrylic adhesive layer; DETAILED DESCRIPTION

[0014] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0015] like Figure 1 As shown, the heat dissipation shielding and anti-breakdown tape for the camera module IC provided in the embodiment of the present application comprises a PET double-sided copper-plated film 1, a No. 1 high-temperature resistant flame-retardant acrylic adhesive layer 2 arranged on the lower end surface of the PET double-sided copper-plated film 1, a graphite layer 3 arranged on the lower end surface of the No. 1 high-temperature resistant flame-retardant acrylic adhesive layer 2, a No. 2 high-temperature resistant flame-retardant acrylic adhesive layer 4 arranged on the lower end surface of the graphite layer 3, and a flame retardant adhesive layer arranged on the lower end surface of the No. 2 high-temperature resistant flame-retardant acrylic adhesive layer 4. PI layer 5, No. 3 high-temperature resistant flame-retardant acrylic adhesive layer 6 arranged on the lower end surface of the flame-retardant PI layer 5, flame-retardant PET layer 7 arranged on the lower end surface of the No. 3 high-temperature resistant flame-retardant acrylic adhesive layer 6, and No. 4 high-temperature resistant flame-retardant acrylic adhesive layer 8 arranged on the lower end surface of the flame-retardant PET layer 7, the No. 1 high-temperature resistant flame-retardant acrylic adhesive layer 2 and the four sides of the PET double-sided copper-plated film 1 extend along the four sides of the graphite layer 3 and are bonded to the four sides of the No. 2 high-temperature resistant flame-retardant acrylic adhesive layer 4 and the flame-retardant PI layer 5.

[0016] In actual use, the graphite layer 3 is coated by the No. 1 high-temperature resistant flame-retardant acrylic adhesive layer 2 and the No. 2 high-temperature resistant flame-retardant acrylic adhesive layer 4 to prevent the graphite powder generated by the die-cutting or striping of the graphite layer 3 from falling onto the components due to the shaking of the camera during use, causing a short circuit in the components. The PET double-sided copper-plated film 1 serves as a shielding and reflective layer, which can effectively reflect electromagnetic waves, and the shielding effectiveness can reach more than 80db at 30MHZ-1.5GHZ. The graphite layer 3 has good thermal conductivity, which can reach 1800W / MK, and can have good thermal conductivity. The flame-retardant PI layer 5 is not only flame-retardant, but also can prevent voltage breakdown and puncture by pin burrs on the circuit board. The flame-retardant PET layer 7, as a base material layer, also has a flame-retardant function.

[0017] In the above design, the graphite layer 3 is coated with a double-sided copper-plated PET film 1, a first-grade high-temperature flame-retardant acrylic adhesive layer 2, a flame-retardant PI layer 5, and a second-grade high-temperature flame-retardant acrylic adhesive layer 4, effectively preventing graphite layer 3 from shedding powder and causing component short circuits. The flame-retardant PI layer 5 effectively prevents the tape from being penetrated by voltage or pin burrs on the circuit board.

[0018] Specifically, the thickness of the No. 1 high temperature resistant flame retardant acrylic adhesive layer 2 , the No. 2 high temperature resistant flame retardant acrylic adhesive layer 4 , the No. 3 high temperature resistant flame retardant acrylic adhesive layer 6 and the No. 4 high temperature resistant flame retardant acrylic adhesive layer 8 are all 5um to 50um.

[0019] In the above design, the first high-temperature-resistant flame-retardant acrylic adhesive layer 2 primarily connects the graphite layer 3 and the double-sided copper-plated PET film 1; the second high-temperature-resistant flame-retardant acrylic adhesive layer 4 primarily connects the graphite layer 3 and the flame-retardant PI layer 5; the third high-temperature-resistant flame-retardant acrylic adhesive layer 6 primarily connects the flame-retardant PI layer 5 and the flame-retardant PET layer 7; and the fourth high-temperature-resistant flame-retardant acrylic adhesive layer 8 primarily connects the external module and the flame-retardant PET layer 7. The thickness of the first high-temperature-resistant flame-retardant acrylic adhesive layer 2, the second high-temperature-resistant flame-retardant acrylic adhesive layer 4, the third high-temperature-resistant flame-retardant acrylic adhesive layer 6, and the fourth high-temperature-resistant flame-retardant acrylic adhesive layer 8 is 5 to 50 μm, which meets the requirements for product thinness and adhesive performance.

[0020] Specifically, the thickness of the graphite layer 3 is in the range of 10 μm to 300 μm.

[0021] In the above design, the thermal conductivity of the graphite layer 3 reaches 1800W / MK and has good temperature resistance. The thickness of the graphite layer 3 ranges from 10um to 300um, which can not only meet the requirements of thinness of the product, but also ensure temperature resistance of 2000℃.

[0022] Specifically, the thickness of the flame-retardant PI layer 5 is in the range of 10 μm to 200 μm.

[0023] In the above design, the flame retardant grade of the flame retardant PI layer 5 is UL94V0, and the thickness of the flame retardant PI layer 5 is in the range of 10um to 200um, which can not only ensure the adhesion, but also ensure that the breakdown voltage reaches 5.0KV or more.

[0024] Specifically, the thickness of the flame-retardant PET layer 7 and the PET double-sided copper-plated film 1 are both in the range of 6um to 100um.

[0025] In the above design, the flame-retardant PET layer 7 has good flame retardancy, with a flame retardant grade of UL94V0, and a thickness range of 6um to 100um, which can ensure good flame retardant performance. The XY and Z direction resistances of the PET double-sided copper-plated film 1 are both less than 0.05 ohms, and the thickness range is 6um to 100um, which can effectively meet the electromagnetic shielding performance.

[0026] To further explain in detail, it should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Heat dissipation shielding and anti-breakdown tape used on camera module IC, characterized by: The invention comprises a PET double-sided copper-plated film (1), a first high-temperature-resistant flame-retardant acrylic adhesive layer (2) arranged on the lower end surface of the PET double-sided copper-plated film (1), a graphite layer (3) arranged on the lower end surface of the first high-temperature-resistant flame-retardant acrylic adhesive layer (2), a second high-temperature-resistant flame-retardant acrylic adhesive layer (4) arranged on the lower end surface of the graphite layer (3), a flame-retardant PI layer (5) arranged on the lower end surface of the second high-temperature-resistant flame-retardant acrylic adhesive layer (4), and three flame-retardant PI layers (5) arranged on the lower end surface of the flame-retardant PI layer (5). A No. 1 high-temperature resistant flame-retardant acrylic adhesive layer (6), a flame-retardant PET layer (7) arranged on the lower end surface of the No. 3 high-temperature resistant flame-retardant acrylic adhesive layer (6), and a No. 4 high-temperature resistant flame-retardant acrylic adhesive layer (8) arranged on the lower end surface of the flame-retardant PET layer (7); the No. 1 high-temperature resistant flame-retardant acrylic adhesive layer (2) and the PET double-sided copper-plated film (1) extend along the four sides of the graphite layer (3) and are bonded to the four sides of the No. 2 high-temperature resistant flame-retardant acrylic adhesive layer (4) and the flame-retardant PI layer (5).

2. The heat dissipation shielding and anti-breakdown tape for camera module IC according to claim 1, characterized in that: The thickness of the No. 1 high temperature resistant flame retardant acrylic adhesive layer (2), the No. 2 high temperature resistant flame retardant acrylic adhesive layer (4), the No. 3 high temperature resistant flame retardant acrylic adhesive layer (6) and the No. 4 high temperature resistant flame retardant acrylic adhesive layer (8) are all 5um to 50um.

3. The heat dissipation shielding and anti-breakdown tape for camera module IC according to claim 1, characterized in that: The thickness of the graphite layer (3) ranges from 10 μm to 300 μm.

4. The heat dissipation shielding and anti-breakdown tape for camera module IC according to claim 1, characterized in that: The thickness of the flame-retardant PI layer (5) ranges from 10 μm to 200 μm.

5. The heat dissipation shielding and anti-breakdown tape for camera module IC according to claim 1, characterized in that: The thickness of the flame-retardant PET layer (7) and the PET double-sided copper-plated film (1) both range from 6 μm to 100 μm.

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