Silicon wafer heater

Abstract

The utility model relates to a silicon wafer heater, comprising a groove body which is provided with an inner cavity in which a silicon wafer is placed; the side cavities are formed in the two sides of the tank body and communicate with the inner cavity; the bottom cavity is arranged at the bottom of the tank body and is communicated with the inner cavity and the side cavity; the heating assembly is arranged in the bottom cavity; the circulating medium assembly is arranged at the bottom of the tank body and is suitable for enabling heat generated by the heating assembly in the bottom cavity to sequentially pass through the side cavity, the inner cavity and the bottom cavity to exchange heat with the heating assembly; a buffer assembly is arranged between the circulating medium assembly and the bottom of the tank body; the circulating flow of air is realized through the circulating medium assembly, the air passes through the bottom cavity, the side cavity and the inner cavity in sequence, the air in the inner cavity heats and dries the silicon wafer, and the dried air is introduced into the bottom cavity again to exchange heat with the heating assembly and participate in circulation again, so that the silicon wafer is heated and dried.

Description

Technical Field

[0001] The utility model relates to a heater, in particular to a silicon chip heater. Background Art

[0002] After the silicon wafer is cleaned, it needs to be placed in a heater to heat and dry the surface of the silicon wafer to prevent the residual solution on the surface of the silicon wafer;

[0003] The conventional solution is to use a fan to draw air into the tank to heat and dry the silicon wafers inside. During this process, the vibration generated by the fan's rotation is transmitted to the tank, causing the silicon wafers to vibrate or even crack.

[0004] In summary, how to achieve heating and drying of silicon wafers has become an urgent problem that researchers in this field need to solve. Utility Model Content

[0005] The technical problem to be solved by the utility model is: how to realize heating and drying of silicon wafers;

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] The utility model is a silicon wafer heater, comprising: a trough body, which has an inner cavity for placing a silicon wafer; side cavities, which are arranged on both sides of the trough body and communicate with the inner cavity; a bottom cavity, which is arranged at the bottom of the trough body and communicates with the inner cavity and the side cavities; a heating component, which is arranged in the bottom cavity; a circulating medium component, which is arranged at the bottom of the trough body and is suitable for transferring heat generated by the heating component in the bottom cavity through the side cavities, the inner cavity, and the bottom cavity in sequence to exchange heat with the heating component; a buffer component is arranged between the circulating medium component and the bottom of the trough body;

[0008] In this solution, the circulating medium component realizes the circulation of air, which passes through the bottom chamber, side chamber, and inner chamber in sequence. The air in the inner chamber heats and dries the silicon wafers. After the drying is completed, the air is re-introduced into the bottom chamber to exchange heat with the heating component and re-participate in the circulation.

[0009] Since the buffer component is connected to the tank body and the circulating medium component, when the circulating medium component vibrates, the vibration will not be transmitted to the tank body due to the presence of the buffer component.

[0010] In order to illustrate the specific structure of the circulating medium component and the buffer component, the utility model adopts the circulating medium component as an axial flow fan; the buffer component is a rubber ring; the outer ring of the axial flow fan tank body is connected to the bottom of the tank body through the rubber ring.

[0011] To illustrate the specific structure of the heating assembly, the heating assembly used in the present invention includes: a heat source inlet and a heat source outlet U-shaped tube arranged on the same side of the bottom cavity, the ends of which are respectively connected to the heat source inlet and the heat source outlet; a heat exchange fin, which is spirally arranged on the outer wall of the U-shaped tube;

[0012] The heat source enters the U-shaped tube through the heat source inlet and is discharged from the heat source outlet. The heat source exchanges heat with the air through the heat exchange fins in the U-shaped tube to achieve secondary heating of the air.

[0013] In order to prevent the leakage of circulating gas, the utility model adopts a cover plate for covering the top opening of the tank body provided on the top of the tank body; the cover plate is rotatably provided on one side of the tank body;

[0014] When the cover plate is closed on the top opening of the tank body, gas will not leak out, thereby improving the heating and drying efficiency of the heated silicon wafer.

[0015] The beneficial effects of the utility model are as follows: the utility model is a silicon wafer heater, which realizes the circulation flow of air through the circulating medium component, and passes the air through the bottom cavity, the side cavity, and the inner cavity in turn. The air in the inner cavity heats and dries the silicon wafer. The air after drying is re-introduced into the bottom cavity to exchange heat with the heating component, and re-participates in the circulation to achieve heating and drying of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Figure 1 It is a side view of the present invention with the side cover omitted;

[0018] Figure 2 It is a top view of the utility model;

[0019] Figure 3 yes Figure 1 The cross-sectional view of AA, where the arrows indicate the air flow direction;

[0020] Figure 4 It is a schematic diagram of the structure of the heating component;

[0021] In the figure: 1-tank body, 2-inner cavity, 3-side cavity, 4-bottom cavity, 5-heating component, 51-heat source inlet, 52-heat source outlet, 53-U-shaped tube, 54-heat exchange fin, 6-circulating medium component, 7-buffer component, 8-cover plate. DETAILED DESCRIPTION

[0022] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0023] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0024] like Figure 1-3 As shown, the utility model is a silicon wafer heater, comprising: a tank body 1 having an inner cavity 2 in which a silicon wafer is placed; side cavities 3, which are arranged on both sides of the tank body 1 and communicate with the inner cavity 2; a bottom cavity 4, which is arranged at the bottom of the tank body 1 and communicates with the inner cavity 2 and the side cavities 3; a heating component 5, which is arranged in the bottom cavity 4; a circulating medium component 6, which is arranged at the bottom of the tank body 1 and is suitable for transferring heat generated by the heating component 5 in the bottom cavity 4 through the side cavities 3, the inner cavity 2, and the bottom cavity 4 in sequence to exchange heat with the heating component 5; a buffer component 7 is provided between the circulating medium component 6 and the bottom of the tank body 1;

[0025] In this solution, the circulating medium component 6 realizes the circulation of air, which passes through the bottom chamber 4, the side chamber 3, and the inner chamber 2 in sequence. The air in the inner chamber 2 heats and dries the silicon wafer. After the drying is completed, the air is re-introduced into the bottom chamber 4 to exchange heat with the heating component 5 and re-participate in the circulation.

[0026] Since the buffer assembly 7 is connected to the tank body 1 and the circulating medium assembly 6 , when the circulating medium assembly 6 shakes, the vibration will not be transmitted to the tank body due to the presence of the buffer assembly 7 .

[0027] like Figure 1-3 As shown, in order to illustrate the specific structure of the circulating medium component and the buffer component, the utility model adopts the circulating medium component 6 as an axial flow fan; the buffer component 7 is a rubber ring; the outer ring of the axial flow fan tank body is connected to the bottom of the tank body 1 through the rubber ring.

[0028] like Figure 3-4 As shown, in order to illustrate the specific structure of the heating assembly, the heating assembly 5 used in the present invention includes: a heat source inlet 51 and a heat source outlet 52 arranged on the same side of the bottom cavity 4; a U-shaped tube 53, the ends of which are respectively connected to the heat source inlet 51 and the heat source outlet 52; and a heat exchange fin 54, which is spirally arranged on the outer wall of the U-shaped tube 53;

[0029] The heat source enters the U-shaped tube 53 through the heat source inlet 51 and is discharged from the heat source outlet 52. The heat source exchanges heat with the air through the heat exchange fins 54 in the U-shaped tube 53 to achieve secondary heating of the air.

[0030] like Figure 1 、 3 As shown, in order to prevent the leakage of circulating gas, the utility model adopts a cover plate 8 for covering the top opening of the tank body 1 provided on the top of the tank body 1; the cover plate 8 is rotatably provided on one side of the tank body 1;

[0031] When the cover plate 8 covers the top opening of the tank body 1, gas will not leak out, thereby improving the efficiency of heating and drying the heated silicon wafers.

[0032] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A silicon wafer heater, characterized in that: include: a tank body having an inner cavity in which a silicon wafer is placed; Side cavities, which are arranged on both sides of the tank body and communicate with the inner cavity; A bottom cavity, which is arranged at the bottom of the tank body and communicates with the inner cavity and the side cavity; a heating assembly, which is disposed in the bottom cavity; a circulating medium component, which is arranged at the bottom of the tank body and is suitable for transferring the heat generated by the heating component in the bottom cavity through the side cavity, the inner cavity, and the bottom cavity in sequence to exchange heat with the heating component; A buffer component is provided between the circulating medium component and the bottom of the tank body.

2. A silicon wafer heater according to claim 1, characterized in that: The circulating medium component is an axial flow fan.

3. A silicon wafer heater according to claim 2, characterized in that: The buffer component is a rubber ring; The outer ring of the axial flow fan slot body is connected to the bottom of the slot body through a rubber ring.

4. A silicon wafer heater according to claim 3, characterized in that: The heating assembly comprises: A heat source inlet and a heat source outlet are provided on the same side of the bottom cavity; The U-shaped tube has its ends connected to the heat source inlet and the heat source outlet respectively; The heat exchange fin is spirally arranged on the outer wall of the U-shaped tube.

5. A silicon wafer heater according to claim 4, characterized in that: A cover plate is provided on the top of the tank body for covering the top opening of the tank body; The cover plate is rotatably arranged on one side of the trough body.

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