High-temperature and high-pressure sensor based on sputtering film core body

Abstract

The utility model provides a high-temperature and high-pressure sensor based on a sputtering film core body, which relates to the technical field of sensors and comprises a pressure interface seat, a shell welded at the top of the pressure interface seat, a pressure sensitive core body welded at the top of the pressure interface seat, and a circuit board support fixedly mounted at the top of the pressure interface seat. According to the utility model, the pressure interface seat is arranged and is matched with the circuit board bracket and the signal switching circuit board, a sputtering film technology is applied to the sensor, a layer of extremely thin and firm film is formed in a pressure sensitive area, and the film not only can accurately sense pressure change, but also can bear a larger pressure range; therefore, the measurement range and the accuracy of the sensor are remarkably improved, the problems of cost increase and stability reduction caused by simultaneous use of a plurality of sensors are avoided, each part of the sensor adopts a modular design, installation, maintenance and replacement are convenient, and the maintenance cost and time are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a high-temperature and high-pressure sensor based on a sputtered thin film core. Background Art

[0002] Pressure sensors can convert pressure signals into electrical signals. Pressure sensors are usually composed of a pressure-sensitive core, a signal conditioning circuit, and a signal output device. The pressure-sensitive core converts the pressure signal into a weak electrical signal, and the signal conditioning circuit converts the weak electrical signal into a standard electrical signal. The standard electrical signal is sent to the signal receiving end through the signal output device.

[0003] Existing pressure sensors have a small range and cannot meet a wide range of pressure measurement needs. When it is necessary to measure a wide range of pressure changes, people need to add sensors and calibrate and maintain each sensor separately, which increases the workload and maintenance cost of purchasing sensors. There may be performance differences or mutual interference between sensors, which will also affect the stability and reliability of the entire system. Utility Model Content

[0004] The purpose of the present utility model is to solve the problem that when the above-mentioned equipment is used, additional sensors need to be added due to the small measuring range, which leads to increased costs and affects the stability of the system. Therefore, a high-temperature and high-pressure sensor based on a sputtered thin film core is proposed.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solution: a high-temperature and high-pressure sensor based on a sputtered thin film core, including a pressure interface seat, a shell welded on the top of the pressure interface seat, a pressure-sensitive core welded on the top of the pressure interface seat, and a circuit board bracket fixedly installed on the top of the pressure interface seat.

[0006] Preferably, a signal transfer circuit board is fixedly mounted on the circuit board bracket, and the bottom of the signal transfer circuit board is welded to the top of the pressure sensitive core.

[0007] Preferably, a group of copper seats are welded on the signal transfer circuit board.

[0008] Preferably, a group of copper needles are fixedly inserted into the inner surface wall of a group of the copper seats.

[0009] Preferably, a signal conditioning circuit board is welded between the outer walls of a group of the copper needles.

[0010] Preferably, an outlet terminal is welded to the top of the housing.

[0011] Preferably, a signal transmission line is provided on the top of the outlet terminal.

[0012] Compared with the prior art, the advantages and positive effects of the present invention are:

[0013] In this utility model, sputtering film technology is applied to the sensor through the pressure interface seat provided, in conjunction with the circuit board bracket and the signal adapter circuit board, to form an extremely thin and strong film in the pressure sensitive area. This film can not only accurately sense pressure changes, but also withstand a larger pressure range, thereby significantly improving the measurement range and accuracy of the sensor, avoiding the problems of increased cost and reduced stability caused by the simultaneous use of multiple sensors. The various components of the sensor adopt a modular design, which is easy to install, maintain and replace, reducing maintenance costs and time.

[0014] In the present invention, the high temperature resistant glue not only simplifies the assembly process and improves the assembly efficiency, but also can maintain good bonding performance under extreme temperature conditions, ensuring the stable operation of the sensor in harsh environments, which can effectively extend the service life of the sensor and reduce maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a main structural perspective diagram of a high-temperature and high-pressure sensor based on a sputtered thin film core proposed in the utility model;

[0016] Figure 2 The utility model proposes a schematic diagram of the external structure of a high-temperature and high-pressure sensor based on a sputtered thin film core;

[0017] Figure 3 The utility model proposes a schematic diagram of the internal structure of a high-temperature and high-pressure sensor based on a sputtered thin film core;

[0018] Figure 4 The present invention proposes a three-dimensional structural diagram of a circuit board bracket in a high-temperature and high-pressure sensor based on a sputtered thin film core;

[0019] Figure 5 This is a top perspective view of a copper seat in a high-temperature and high-pressure sensor based on a sputtered thin film core proposed in the utility model;

[0020] Figure 6 The present invention provides a three-dimensional schematic diagram of a signal transfer circuit board in a high-temperature and high-pressure sensor based on a sputtered thin film core;

[0021] Figure 7 The present invention provides a three-dimensional structural diagram of a signal conditioning circuit board in a high-temperature and high-pressure sensor based on a sputtered thin film core.

[0022] Legend:

[0023] 1. Pressure interface seat; 2. Housing; 3. Pressure sensitive core; 4. Circuit board bracket; 5. Signal transfer circuit board; 6. Copper seat; 7. Copper needle; 8. Signal conditioning circuit board; 9. Outlet terminal; 10. Signal transmission line. DETAILED DESCRIPTION

[0024] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0026] Example 1, as Figure 1-Figure 7 As shown, the utility model provides a high-temperature and high-pressure sensor based on a sputtered thin film core, including a pressure interface seat 1, a shell 2 welded to the top of the pressure interface seat 1, a pressure sensitive core 3 welded to the top of the pressure interface seat 1, a circuit board bracket 4 fixedly installed on the top of the pressure interface seat 1, a signal transfer circuit board 5 fixedly installed on the circuit board bracket 4, and the bottom of the signal transfer circuit board 5 is welded to the top of the pressure sensitive core 3.

[0027] The effect achieved by the entire embodiment 1 is that in the fine assembly process of the sensor, the pressure sensitive core 3 is first welded to the pressure interface seat 1 by laser welding technology. This step not only ensures the firmness of the connection, but also takes into account the sealing, laying a solid foundation for the stable operation of the sensor. Then, the circuit board bracket 4 is securely installed on the pressure interface seat 1 by carefully applying high-temperature resistant glue, which can surround and partially surround the side of the pressure sensitive core 3, providing the necessary support and ensuring the complete exposure of the top film layer of the core, so as to efficiently perform signal detection in subsequent steps. Subsequently, the signal transfer circuit board 5, as a key component of signal transmission, is also accurately fixed on the circuit board bracket 4 by applying high-temperature resistant glue. It not only achieves a close combination between the circuit board and the bracket, but also makes full preparations for subsequent signal transfer and processing, ensuring the stability and reliability of the sensor performance.

[0028] Example 2, as Figure 2-Figure 7 As shown, a group of copper seats 6 are welded on the signal transfer circuit board 5, a group of copper pins 7 are fixedly inserted into the inner surface wall of a group of copper seats 6, a signal conditioning circuit board 8 is welded between the outer surface walls of a group of copper pins 7, an output terminal 9 is welded on the top of the housing 2, and a signal transmission line 10 is provided on the top of the output terminal 9.

[0029] The effect achieved by the entire embodiment 2 is that the copper seat 6 is first welded to the preset position of the signal transfer circuit board 5. In order to construct an efficient and stable electrical path between the pressure-sensitive core 3 and the signal transfer circuit board 5, silicon-aluminum wire pressure welding technology is adopted to precisely connect the corresponding pads on the two to ensure accurate signal transmission. In order to further protect the pressure-sensitive core 3, a layer of protective glue is carefully coated on its surface. This protective film not only enhances the durability of the core, but also significantly improves its protective performance. The copper needle 7 is welded to the circuit board and then inserted into the corresponding copper seat 6 to form a tight and reliable physical connection. In order to strengthen this connection, high-temperature resistant glue is additionally applied between the copper needle 7 and the copper seat 6 to effectively prevent damage caused by temperature changes or vibrations. The looseness of the sensor is further improved, and the overall stability and reliability of the sensor are improved. The signal transmission line 10 is welded to the specified position of the signal conditioning circuit board 8 to ensure the integrity and accuracy of the signal transmission. Subsequently, the housing 2 is installed on the pressure interface seat 1 by laser welding technology, forming a sturdy and sealed protective packaging structure, which provides all-round protection for the internal components of the sensor. The output terminal 9 passes through the signal transmission line 10 and is firmly fixed to the housing 2 by laser welding technology, which not only completes the fixation of the signal transmission line 10, but also ensures the stability and reliability of the connection between the sensor and the external system. After the packaging is completed, the signal transmission line 10 of the sensor is smoothly connected to the external system, and the pressure interface seat 1 is installed in the pressure system.

[0030] Working principle: During the assembly of the sensor, the pressure-sensitive core 3 is first accurately installed on the pressure interface seat 1 using laser welding technology to ensure the stability and sealing of the connection. Subsequently, the circuit board bracket 4 is firmly installed on the pressure interface seat 1 by applying high-temperature resistant glue. At this time, the circuit board bracket 4 cleverly surrounds and surrounds the side of the pressure-sensitive core 3, while the top film layer of the core remains exposed for subsequent signal detection. The copper seat 6 is welded to the designated position of the signal transfer circuit board 5, and the signal transfer circuit board 5 is fixed to the circuit board bracket 4 by applying high-temperature resistant glue. In order to establish an electrical connection between the pressure-sensitive core 3 and the signal transfer circuit board 5, the corresponding pads on the two are connected by silicon-aluminum wire pressure welding technology, and a layer of protective glue is coated on the surface of the pressure-sensitive core 3 to enhance its durability and protection performance. During the assembly stage of the signal conditioning circuit board 8, the copper needle 7 is soldered to the board and then inserted into the corresponding copper seat 6. In order to further enhance the stability of the connection, high-temperature resistant glue is applied between the copper needle 7 and the copper seat 6. The signal transmission line 10 is soldered to the corresponding position of the signal conditioning circuit board 8 to ensure accurate signal transmission. The housing 2 is installed on the pressure interface seat 1 by laser welding technology to form a protective packaging structure. At the same time, the output terminal 9 passes through the signal transmission line 10 and is fixed to the housing 2 by laser welding technology, thereby completing the fixation of the signal transmission line 10 and the packaging process of the entire sensor. After the packaging is completed, the signal transmission line 10 of the sensor is connected to the external system, and the pressure interface seat 1 is installed in the pressure system. At this point, the sensor is ready for calibration and testing to ensure that it can accurately and reliably monitor and transmit pressure data.

[0031] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any other form. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes for application in other fields. However, any simple modification, equivalent change and modification of the above embodiment made according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A high-temperature and high-pressure sensor based on a sputtered thin film core, comprising a pressure interface seat (1), characterized in that: A shell (2) is welded to the top of the pressure interface seat (1), a pressure sensitive core (3) is welded to the top of the pressure interface seat (1), and a circuit board bracket (4) is fixedly mounted to the top of the pressure interface seat (1).

2. The high-temperature and high-pressure sensor based on a sputtered thin film core according to claim 1, characterized in that: A signal transfer circuit board (5) is fixedly mounted on the circuit board bracket (4), and the bottom of the signal transfer circuit board (5) is welded to the top of the pressure sensitive core (3).

3. The high-temperature and high-pressure sensor based on a sputtered thin film core according to claim 2, characterized in that: A group of copper seats (6) are welded on the signal transfer circuit board (5).

4. The high-temperature and high-pressure sensor based on a sputtered thin film core according to claim 3, characterized in that: A group of copper needles (7) are fixedly inserted into the inner surface wall of a group of copper seats (6).

5. The high-temperature and high-pressure sensor based on a sputtered thin film core according to claim 4, characterized in that: A signal conditioning circuit board (8) is welded between the outer walls of a group of copper needles (7).

6. The high-temperature and high-pressure sensor based on a sputtered thin film core according to claim 5, characterized in that: An outlet terminal (9) is welded to the top of the housing (2).

7. The high-temperature and high-pressure sensor based on a sputtered thin film core according to claim 6, characterized in that: A signal transmission line (10) is provided on the top of the outlet terminal (9).

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