Resistor element

Abstract

The utility model provides a resistor element. The resistor element comprises a substrate; the resistor body is arranged on the front surface of the substrate; and the first protection layer is arranged on the back surface of the substrate. According to the invention, the first protection layer is arranged on the back surface of the substrate, so that the substrate is protected by the first protection layer, the possibility of appearance damage of the resistor in the manufacturing process is effectively reduced, and the product yield is greatly improved.

Description

Technical Field

[0001] The present application relates to the field of resistor devices, and in particular to a resistor element. Background Art

[0002] Currently, existing resistors often use fiberglass as their substrates. However, during the resistor manufacturing process, which includes steps such as substrate movement, measurement, handling, and packaging, fiberglass substrates are often scratched due to their lack of rigidity, resulting in poor appearance. Utility Model Content

[0003] In view of the above-mentioned deficiencies in the prior art, the object of the present application is to provide a resistor element to reduce the possibility of appearance damage to the resistor during the manufacturing process and significantly improve the yield rate.

[0004] In a first aspect, the present application provides a resistor element, comprising:

[0005] substrate;

[0006] A resistor body, the resistor body being arranged on the front surface of the substrate;

[0007] A first protective layer is provided on the back side of the substrate.

[0008] In a possible embodiment, the total light transmittance of the first protective layer is less than 95%.

[0009] In a possible embodiment, the thickness of the first protective layer is less than 50 um.

[0010] In a possible embodiment, the device further includes: a second protective layer, wherein the second protective layer is disposed on a peripheral side of the substrate.

[0011] In a possible embodiment, the second protection layer at least covers a portion of the sidewall of the substrate.

[0012] In a possible embodiment, the second protection layer completely covers the sidewalls of the substrate.

[0013] In a possible embodiment, the second protection layer is disposed on at least one sidewall of a plurality of sidewalls of the substrate.

[0014] In a possible embodiment, the thickness of the second protective layer is less than 10 um.

[0015] In a possible embodiment, the total light transmittance of the second protective layer is less than 95%.

[0016] In a possible embodiment, the material of the first protective layer and / or the second protective layer is one or more of SiO 2 and SiN x .

[0017] Beneficial effects:

[0018] The present application provides a resistor element, which provides a first protective layer on the back side of a substrate, thereby utilizing the first protective layer to protect the substrate, thereby effectively reducing the possibility of appearance damage to the resistor during the manufacturing process and significantly improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic cross-sectional view of a resistor element provided in one embodiment of the present application;

[0020] Figure 2 A schematic cross-sectional view of a resistor element provided in another embodiment of the present application;

[0021] Figure 3 This is a schematic cross-sectional structure diagram of a resistor element provided in yet another embodiment of the present application.

[0022] Reference numerals: 100 - resistor element; 110 - substrate; 130 - resistor body; 150 - first protective layer; 170 - second protective layer. DETAILED DESCRIPTION

[0023] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0024] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be used to implement. The serial numbers of the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in the present application include direct and indirect connections (couplings) unless otherwise specified. The directional terms mentioned in the present application, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections; they can refer to direct connections, indirect connections through an intermediary, or internal connections between two components. A person of ordinary skill in the art will understand the specific meanings of these terms in this application based on the specific circumstances. It should be noted that the terms "first," "second," and so on, in the specification, claims, and drawings of this application are used to distinguish between different objects, not to describe a specific order. Furthermore, the terms "include," "may include," "comprise," or "may include" as used in this application indicate the presence of the corresponding functions, operations, components, etc. disclosed, and do not limit the presence or absence of one or more additional functions, operations, components, etc. Furthermore, the terms "include" or "comprising" indicate the presence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, and do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusions.

[0026] like Figure 1 As shown, this embodiment provides a resistor element. The resistor element 100 includes a substrate 110 , a resistor body 130 and a first protective layer 150 .

[0027] The substrate 110 is a glass fiber substrate.

[0028] Optionally, the resistor body 130 is disposed on the front side of the substrate 110 .

[0029] As an embodiment, the resistor body 130 includes a resistor alloy layer, and the resistivity of the resistor alloy layer is less than or equal to 2 μΩ*m.

[0030] As another embodiment, the resistor body 130 includes an adhesive layer and a resistor alloy layer, and the adhesive layer is disposed between the resistor alloy layer and the substrate 110 .

[0031] Optionally, the first protection layer 150 is disposed on the back side of the substrate 110 .

[0032] As an embodiment, the first protection layer 150 can be formed on the substrate 110 by chemical vapor deposition, physical sputtering, dipping, spin coating, spraying, etc.

[0033] It should be understood that the above-mentioned formation method of the first protection layer 150 is only an example and not a limitation.

[0034] Optionally, the total light transmittance of the first protective layer 150 is less than 95%.

[0035] Optionally, the thickness of the first protective layer 150 is less than 50 μm.

[0036] Optionally, the first protective layer 150 may be patterned or unpatterned, which is not particularly limited herein.

[0037] Optionally, the material of the first protective layer 150 is one or more of SiO 2 and SiN x .

[0038] Optionally, the first protective layer 150 may be a metal film layer or a metal oxide film layer. For example, the first protective layer 150 may be an ITO (indium tin oxide) film or a copper film, which is not specifically limited herein.

[0039] like Figure 2 As shown in FIG3 , in a possible embodiment, the resistor element 100 further includes a second protective layer 170 . The second protective layer 170 is formed on a peripheral side of the substrate 110 .

[0040] As an implementation method, Figure 2 As shown, the second protection layer 170 at least covers a portion of the sidewall of the substrate 110 .

[0041] As another embodiment, Figure 3 As shown, the second protection layer 170 completely covers the sidewalls of the substrate 110 .

[0042] As another embodiment, the second protection layer 170 is disposed on at least one sidewall of the plurality of sidewalls of the substrate 110 .

[0043] Optionally, the thickness of the second protective layer 170 is less than 10 um.

[0044] Optionally, the total light transmittance of the second protective layer 170 is less than 95%.

[0045] Optionally, the material of the second protective layer 170 is SiO 2 , SiN x , or a mixed ratio of the materials.

[0046] Optionally, the second protective layer 170 may be a metal film layer or a metal oxide film layer. For example, the second protective layer 170 may be an ITO (indium tin oxide) film or a copper film, which is not specifically limited herein.

[0047] In a possible embodiment, the first protective layer 150 and the second protective layer 170 may be laminated at the same time, which is not specifically limited herein.

[0048] In summary, the resistor element provided in this embodiment provides a first protective layer on the back of the substrate, thereby utilizing the first protective layer to protect the substrate, thereby effectively reducing the possibility of appearance damage to the resistor during the manufacturing process and significantly improving product yield.

[0049] It should be understood that the terms "first," "second," etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the embodiments of this application, "plurality" means two or more, unless otherwise specifically defined.

[0050] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0051] It should be understood that the application of this application is not limited to the above examples. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the scope of protection of the claims appended to this application. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments and making equivalent changes in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A resistor element, characterized in that: include: substrate; A resistor body, the resistor body being arranged on the front surface of the substrate; A first protective layer is provided on the back side of the substrate.

2. The resistor element according to claim 1, wherein The total light transmittance of the first protective layer is less than 95%.

3. The resistor element according to claim 1 or 2, characterized in that The thickness of the first protective layer is less than 50 μm.

4. The resistor element according to claim 1, wherein Also includes: A second protective layer is provided on a peripheral side of the substrate.

5. The resistor element according to claim 4, wherein: The second protection layer at least covers a portion of the sidewall of the substrate.

6. The resistor element according to claim 4, wherein: The second protection layer completely covers the sidewalls of the substrate.

7. The resistor element according to claim 4, wherein: The second protection layer is disposed on at least one sidewall of a plurality of sidewalls of the substrate.

8. The resistor element according to claim 4, wherein: The thickness of the second protective layer is less than 10 μm.

9. The resistor element according to claim 4, wherein: The total light transmittance of the second protective layer is less than 95%.

Images