Chip packaging substrate

Abstract

The utility model relates to the technical field of chip packaging, in particular to a chip packaging substrate, which comprises a substrate fixedly mounted on a circuit board, the top surface of the substrate is fixedly connected with a concentric-square-shaped frame, a sealing plate is rotatably connected to one side of the inside of the concentric-square-shaped frame, a first heat conducting plate is arranged between the sealing plate and the concentric-square-shaped frame, and a second heat conducting plate is arranged between the first heat conducting plate and the concentric-square-shaped frame. The top face of the first heat conduction plate is fixedly connected with a plurality of fins at equal intervals, the fins and the sealing plate slide in a penetrating mode, and a second heat conduction plate is fixedly connected between the top ends of the multiple fins. According to the utility model, the two ends of the metal pipe are respectively connected with the external water source and the water pump, water can circularly flow in the metal pipe through the work of the water pump, the heat dissipation of the chip is realized, and the fan can be arranged on the shell on which the circuit board is arranged, so that the whole body in the shell can be cooled; and the heat conducting plate I, the fins and the heat conducting plate II are arranged above the substrate, so that heat generated when other electronic elements on the circuit board work can be effectively prevented from being transferred to the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip packaging substrate. Background Art

[0002] Chip packaging is an important step in the semiconductor manufacturing process. It involves encapsulating the bare chip in a protective shell to facilitate the transportation, installation and use of the chip. The package not only protects the chip from physical damage and environmental influences, but also provides electrical connections to ensure that the chip can be properly connected and communicated with the external circuit. The packaging substrate is required for chip packaging.

[0003] Chinese patent publication number CN219759571U discloses a chip packaging substrate and a chip packaging structure. By setting a heat conducting plate, the heat transferred to the substrate during chip operation can be transferred to the heat dissipation fins through the heat conducting plate, and heat exchange is carried out between the heat conducting plate and the heat dissipation fins and the air to achieve heat dissipation. At the same time, by setting the heat dissipation fins, a certain amount of air can be left between the heat conducting plate and the mounting components of the device, facilitating air flow, thereby improving the heat dissipation effect and achieving the purpose of dissipating the heat generated by the chip operation, thereby preventing the chip from operating in a high temperature state for a long time and shortening the service life of the chip.

[0004] Although the above patent can dissipate heat from the chip, the heat sink fins are installed on the bottom surface of the substrate, and the packaged chip is usually installed on the circuit board through the substrate. Therefore, the distance between the heat sink fins and the circuit board is too small, resulting in poor air circulation. In addition, when other electronic components on the circuit board are working, heat will also be transferred to the circuit board, thereby reducing the heat dissipation effect of the chip. Utility Model Content

[0005] The purpose of the present invention is to provide a chip packaging substrate to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A chip packaging substrate, comprising:

[0008] A base plate is mounted and fixed on the circuit board, and a circular frame is fixedly connected to the top surface of the base plate;

[0009] The sealing plate is rotatably connected to the inner side of the circular frame;

[0010] A heat conducting plate 1 is provided between the sealing plate and the circular frame. A plurality of fins that slide through the sealing plate are fixedly connected to the top surface of the heat conducting plate 1 at equal intervals. A heat conducting plate 2 is fixedly connected between the top ends of the plurality of fins. A bent metal tube is embedded and fixed inside the heat conducting plate 2. Telescopic parts are fixedly connected to the four corners between the heat conducting plate 1 and the sealing plate.

[0011] The clamping mechanism is arranged on one side of the sealing plate and is used to fix the sealing plate in the circular frame.

[0012] Furthermore, the telescopic member includes a sleeve fixedly connected to the bottom surface of the sealing plate, the interior of the sleeve is slidably sleeved with a sleeve rod fixedly connected to the heat conducting plate 1, and a spring 1 is fixedly connected between the sleeve rod and the sleeve at the corresponding position.

[0013] Furthermore, the height of the fins is greater than the thickness of the sealing plate.

[0014] Furthermore, the two ends of one side of the circular frame are penetrated with insertion holes, the two ends of one side of the top surface of the sealing plate are penetrated with sliding holes, and the clamping mechanism includes:

[0015] Two symmetrical L-shaped plates slide through the sliding holes at corresponding positions, and a receiving groove is opened at one end of the top surface of the L-shaped plate;

[0016] The card block is slidably connected to the storage slot at the corresponding position;

[0017] The second spring is fixedly connected between the clamping block and the receiving slot at the corresponding position.

[0018] Furthermore, a fixing plate is fixedly connected to one end of the bottom surface of the sealing plate close to the sliding hole, a connecting plate is fixedly connected between the bottom ends of the two L-shaped plates, and a plurality of springs are fixedly connected at equal intervals between the connecting plate and the fixing plate.

[0019] Furthermore, a limiting plate is fixedly connected between the top ends of the two L-shaped plates, and both the limiting plate and the connecting plate are in contact with the sealing plate.

[0020] Furthermore, the top surface of the block is an arc-shaped structure.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. By connecting the two ends of the metal tube to the external water source and water pump respectively, the water can be circulated in the metal tube through the work of the water pump to achieve heat dissipation of the chip. In addition, a fan can be installed on the outer casing where the circuit board is installed to cool the entire shell. The first heat conducting plate, fins, and the second heat conducting plate are installed above the substrate, which can effectively prevent the heat generated by other electronic components on the circuit board from being transferred to the chip during operation.

[0023] 2. By passing the card block through the jack at the corresponding position, the sealing plate can be fixed. The sealing plate can be fixed to the chip through four telescopic parts and the heat conducting plate to prevent the welding between the chip and the substrate from breaking and causing the chip to be unstable, and it is convenient for the replacement of the chip later. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0025] Figure 2 It is a schematic diagram of the substrate in the utility model;

[0026] Figure 3 This is a schematic diagram of the sealing plate in the utility model;

[0027] Figure 4 This is a schematic diagram of heat conducting plate 1, heat conducting plate 2, and fins in the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of the clamping mechanism in the utility model;

[0029] Figure 6 It is an enlarged view of point A in the present utility model.

[0030] In the figure: 1. Base plate; 11. Reciprocating frame; 12. Insertion hole; 2. Closing plate; 21. Sliding hole; 22. Fixing plate; 3. Heat conducting plate 1; 31. Fin; 32. Heat conducting plate 2; 33. Metal tube; 34. Sleeve; 35. Sleeve rod; 4. Clamping mechanism; 41. L-shaped plate; 42. Storage slot; 43. Block; 44. Spring 2; 45. Connecting plate; 46. Spring 3; 47. Limiting plate. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] See also Figures 1 to 6In an embodiment of the present invention, a chip packaging substrate includes a substrate 1, a sealing plate 2, a heat conducting plate 3, and a clamping mechanism 4. The substrate 1 is installed and fixed on the circuit board. The top surface of the substrate 1 is fixedly connected to a circular frame 11. The sealing plate 2 is rotatably connected to one side of the inner side of the circular frame 11. The heat conducting plate 3 is arranged between the sealing plate 2 and the circular frame 11. The top surface of the heat conducting plate 3 is fixedly connected to a plurality of fins 31 that slide through the sealing plate 2 at equal intervals. A heat conducting plate 2 32 is fixedly connected between the top ends of the plurality of fins 31. A bent metal tube 33 is embedded and fixed in the interior of the heat conducting plate 2 32. The four corners between the heat conducting plate 3 and the sealing plate 2 are fixedly connected with telescopic parts. The clamping mechanism 4 is arranged on one side of the sealing plate 2 for fixing the sealing plate 2 in the circular frame 11.

[0033] Specifically, first place the chip into the circular frame 11, then cover the circular frame 11 with the sealing plate 2, and the heat conducting plate 1 3 is tightly attached to the chip through the telescopic parts, and then the substrate 1 is installed and fixed on the circuit board. By connecting the two ends of the metal tube 33 to the external water source and water pump respectively, the water can be circulated in the metal tube 33 through the operation of the water pump (similar to a water-cooled radiator) to achieve heat dissipation of the chip, and a fan can be installed on the outer shell where the circuit board is installed to cool the entire shell (similar to the fan on a computer case), and the heat conducting plate 1 3, fins 31, and heat conducting plate 2 32 are installed above the substrate 1, which can effectively prevent the heat generated by other electronic components on the circuit board from being transferred to the chip during operation.

[0034] Example 1

[0035] like Figure 3 and Figure 4 As shown, in this embodiment, the telescopic member includes a sleeve 34 fixedly connected to the bottom surface of the sealing plate 2, the internal sliding sleeve of the sleeve 34 is connected to a sleeve rod 35 fixedly connected to the heat conducting plate 3, and a spring 1 is fixedly connected between the sleeve rod 35 and the sleeve 34 at the corresponding position, and the height of the fin 31 is greater than the thickness of the sealing plate 2.

[0036] In this embodiment, the elastic action of spring one can keep heat conducting plate one 3 in contact with the chip at all times, so that the heat generated by the chip during operation can be effectively transferred to heat conducting plate two 32 through heat conducting plate one 3. The height of fin 31 is greater than the thickness of sealing plate 2, which facilitates the movement of heat conducting plate one 3 under the action of four springs one.

[0037] Example 2

[0038] like Figure 5 and Figure 6As shown, in this embodiment, both ends of one side of the circular frame 11 are penetrated with an insertion hole 12, and both ends of one side of the top surface of the sealing plate 2 are penetrated with a sliding hole 21, and the clamping mechanism 4 includes two symmetrical L-shaped plates 41 that slide through the sliding holes 21 at corresponding positions, and one end of the top surface of the L-shaped plate 41 is provided with a receiving groove 42, and the clamping block 43 is slidably connected to the receiving groove 42 at the corresponding position, and the spring second 44 is fixedly connected between the clamping block 43 and the receiving groove 42 at the corresponding position. The bottom surface of the sealing plate 2 is fixedly connected to the fixing plate 22 at one end near the sliding hole 21, and a connecting plate 45 is fixedly connected between the bottom ends of the two L-shaped plates 41, and multiple springs three 46 are fixedly connected between the connecting plate 45 and the fixing plate 22 at equal intervals. A limiting plate 47 is fixedly connected between the top ends of the two L-shaped plates 41, and the limiting plate 47 and the connecting plate 45 are both in contact with the sealing plate 2, and the top surface of the clamping block 43 is an arc structure.

[0039] In this embodiment, when it is necessary to use the sealing plate 2 to cover the circular frame 11, the limiting plate 47 is moved backward so that the connecting plate 45 compresses the multiple springs 46. When the end of the L-shaped plate 41 is aligned with the socket 12 at the corresponding position, the limiting plate 47 is moved forward so that the block 43 passes through the socket 12 at the corresponding position. At this time, the sealing plate 2 can be fixed. The fixing of the sealing plate 2 can be achieved by four telescopic parts and the heat conducting plate 3 to fix the chip, thereby preventing the welding between the chip and the substrate 1 from breaking and causing the chip to be unstable, and facilitating the replacement of the chip at a later time.

[0040] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0041] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A chip packaging substrate, characterized in that: include: A base plate (1) is mounted and fixed on the circuit board, and a circular frame (11) is fixedly connected to the top surface of the base plate (1); A sealing plate (2) is rotatably connected to an inner side of the circular frame (11); A heat conducting plate (3) is arranged between the sealing plate (2) and the circular frame (11); a plurality of fins (31) which penetrate and slide through the sealing plate (2) are fixedly connected to the top surface of the heat conducting plate (3) at equal intervals; a heat conducting plate (32) is fixedly connected between the top ends of the plurality of fins (31); a bent metal tube (33) is embedded and fixed inside the heat conducting plate (32); and telescopic parts are fixedly connected to the four corners between the heat conducting plate (3) and the sealing plate (2); The clamping mechanism (4) is arranged on one side of the sealing plate (2) and is used to fix the sealing plate (2) in the circular frame (11).

2. The chip packaging substrate according to claim 1, wherein: The telescopic member comprises a sleeve (34) fixedly connected to the bottom surface of the sealing plate (2); a sleeve rod (35) fixedly connected to the heat conducting plate (3) is slidably sleeved inside the sleeve (34); and a spring (1) is fixedly connected between the sleeve rod (35) and the sleeve (34) at a corresponding position.

3. The chip packaging substrate according to claim 1, wherein: The height of the fin (31) is greater than the thickness of the sealing plate (2).

4. The chip packaging substrate according to claim 1, wherein: Insertion holes (12) are provided at both ends of one side of the circular frame (11), and sliding holes (21) are provided at both ends of one side of the top surface of the sealing plate (2). The clamping mechanism (4) includes: Two symmetrical L-shaped plates (41) are slidably inserted into the sliding holes (21) at corresponding positions, and a receiving groove (42) is provided at one end of the top surface of the L-shaped plate (41); A card block (43) is slidably connected to the receiving slot (42) at a corresponding position; The second spring (44) is fixedly connected between the clamping block (43) and the receiving groove (42) at the corresponding position.

5. The chip packaging substrate according to claim 4, wherein: A fixing plate (22) is fixedly connected to one end of the bottom surface of the sealing plate (2) close to the sliding hole (21), a connecting plate (45) is fixedly connected between the bottom ends of the two L-shaped plates (41), and a plurality of springs (46) are fixedly connected at equal intervals between the connecting plate (45) and the fixing plate (22).

6. The chip packaging substrate according to claim 5, wherein: A limiting plate (47) is fixedly connected between the top ends of the two L-shaped plates (41), and the limiting plate (47) and the connecting plate (45) are both in contact with the sealing plate (2).

7. The chip packaging substrate according to claim 6, wherein: The top surface of the clamping block (43) is an arc-shaped structure.

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