Flip chip packaging structure pasted with heat dissipation cover
By attaching the L-shaped ring around the substrate and combining the design of the heat dissipation cover, the problem of warping and insufficient heat dissipation of the chip package structure at high temperatures is solved, and a more effective heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422356795.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-26
AI Technical Summary
The existing chip packaging structure is prone to warping at the high temperature stage, resulting in layering of the thermally conductive medium and insufficient heat dissipation.
The L-ring is mounted around the substrate, and the L-ring is coated with heat conduction medium and adhesive, combined with the bonding of the heat dissipation cover, forming a packaging structure to improve warping and heat dissipation effects.
Through the combined design of the L-shaped ring and the heat dissipation cover, the layering of the heat conduction medium is reduced, the heat dissipation performance of the packaging structure is improved, and the thermal conductivity effect is increased through the copper wire.
Smart Images
Figure CN223218297U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, and more particularly to a flip chip packaging structure with a heat dissipation cover. Background Art
[0002] In chip packaging, chips and electronic components are integrated into a compact structure. As functionality increases, thermal issues associated with these packages become more severe. Prior art has proposed adding a heat dissipation cover to direct generated heat to the outer surface of the package structure, thereby improving the chip's heat dissipation capabilities.
[0003] The existing process for mounting a heat sink cover is as follows: Step 1: Mount the flip chip on the substrate; Step 2: Apply adhesive to the substrate and cover the back of the chip with a layer of thermal conductive medium; Step 3: Attach the heat sink cover, with the inside of the heat sink cover bonding to the thermal conductive medium and the edge of the heat sink cover bonding to the adhesive on the substrate.
[0004] During use, it was found that during the high temperature stage, the packaged product would warp, causing delamination in the area covered by the thermal conductive medium, resulting in insufficient heat conduction to the outside. Utility Model Content
[0005] In order to solve the above problems, the utility model provides a novel flip chip packaging structure with a heat dissipation cover, in which L-shaped rings are mounted around the substrate to improve the warping of the packaged product, reduce the problem of thermal conductive medium stratification, and improve the heat dissipation effect.
[0006] According to one aspect of the present invention, a flip-chip packaging structure with a heat dissipation cover is provided, which includes a substrate and a chip flipped on the substrate. The substrate is provided with an L-shaped ring around the periphery, and the L-shaped ring covers the upper part of the four peripheral edges of the substrate and the outside of the four side walls of the substrate. The back of the chip is coated with a second heat-conducting medium. The chip outer cover is provided with a heat dissipation cover, the inner side of the heat dissipation cover is bonded to the second heat-conducting medium, and the bottom edge of the heat dissipation cover is bonded to the upper surface of the L-shaped ring.
[0007] In some embodiments, copper blocks are provided on the four edges of the substrate, and the L-shaped ring is bonded to the four side walls of the substrate via a heat-conducting medium.
[0008] In some embodiments, a filling material layer is formed between the chip and the substrate by bottom filling.
[0009] In some embodiments, the L-shaped ring is bonded to the upper sides of the four edges of the substrate by adhesive 1, and the bottom edge of the heat dissipation cover is bonded to the upper surface of the L-shaped ring by adhesive 2.
[0010] In some embodiments, the packaging structure further includes an electronic component mounted on the substrate, and the electronic component cover is disposed in the heat dissipation cover.
[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the flip-chip packaging structure with a heat dissipation cover provided by the present invention is that the chip is flipped onto the substrate and then the bottom is filled, adhesive one is applied above the four edges of the substrate, thermal conductive medium one is applied on the vertical inner wall of the L-shaped ring, the L-shaped ring is attached to the product and cured, adhesive two is applied to the upper surface of the L-shaped ring, thermal conductive medium two is applied on the back of the chip, the heat dissipation cover is attached to the product and cured, and heat dissipation on all sides of the product can be achieved through the L-shaped ring, the warping of the packaged product is improved, the delamination problem of thermal conductive medium two is reduced, and the defect of insufficient heat dissipation of the product is overcome. In addition, when the substrate is produced, copper blocks are left around the substrate to lead out the copper wire, which can further increase heat conductivity and improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a structural diagram of an embodiment of a flip-chip packaging structure with a heat dissipation cover attached to the present invention;
[0013] Figure 2 The present invention is a schematic diagram of a packaging process of an embodiment of a flip chip packaging structure with a heat dissipation cover. DETAILED DESCRIPTION
[0014] The present invention will be further described below in conjunction with specific implementation methods.
[0015] like Figure 1 As shown, an embodiment of the present invention is a flip-chip packaging structure with a heat dissipation cover, which includes a substrate 1 and a chip 2 flipped on the substrate 1, a filling material layer 21 is formed between the chip 2 and the substrate 1 by bottom filling, an electronic component 9 is mounted on the substrate 1, and an L-shaped ring 3 with an "L"-shaped cross-section is mounted around the four sides of the substrate 1, and the L-shaped ring 3 covers the four peripheral edges and the outside of the four side walls of the substrate 1, the back of the chip 2 is coated with a heat conductive medium 4, and a heat dissipation cover 5 is mounted, and the heat dissipation cover 5 is arranged outside the chip 2 and the electronic component 9, the inner side of the heat dissipation cover 5 is bonded to the heat conductive medium 4, and the bottom edge of the heat dissipation cover 5 is bonded to the upper surface of the L-shaped ring 3.
[0016] Specific mounting of the L-shaped ring 3: There are copper blocks 11 on the four edges of the substrate 1 to lead out the copper wires of the substrate 1. The L-shaped ring 3 is bonded to the four side walls of the substrate 1 through a heat conductive medium 6, and the L-shaped ring 3 is bonded to the four edges of the substrate 1 through an adhesive 7.
[0017] Specific mounting of the heat dissipation cover 5: the bottom edge of the heat dissipation cover 5 is bonded to the upper surface of the L-shaped ring 3 via an adhesive 8, and the inner side of the heat dissipation cover 5 is bonded to the chip 2 via a heat conducting medium 4.
[0018] Combine Figure 2 The packaging process of the flip chip packaging structure with heat dissipation cover described in this application is specifically described, and the steps are as follows:
[0019] Step 1: If Figure 2 As shown in FIG2A , a substrate 1 is prepared. When the substrate 1 is produced, copper blocks 11 are left around the substrate 1 , and copper wires are led out around the substrate 1 to prepare for increased heat conduction during subsequent use.
[0020] Step 2: Flip the chip 2 onto the substrate 1, and fill the chip 2 on the surface of the substrate 1 with the bottom filling to encapsulate the chip 2 to form a filling material layer 21; if other electronic components 9 need to be mounted, mount the electronic components 9 on the substrate 1, such as Figure 2 As shown in Figure 2B.
[0021] Step 3: If Figure 2 As shown in FIG. 2C , adhesive 7 is applied to the upper surface of the four edges of the substrate 1 .
[0022] Step 4: Apply the heat-conducting medium 6 to the vertical inner wall of the L-shaped ring 3, and then attach the L-shaped ring 3 coated with the heat-conducting medium 6 to the product (ie, the substrate 1) and solidify it. Figure 2 As shown in Figure 2D, the copper wires around the substrate 1 are drawn out to increase heat conduction, and the heat conducting medium 6 outside the substrate 1 is non-conductive and can increase heat dissipation.
[0023] Step 5: Apply adhesive 8 on the upper surface of the L-shaped ring 3, apply thermal conductive medium 4 on the chip 2, and then attach the heat dissipation cover 5 to the product and cure it to obtain the following Figure 2 The package structure shown in 2E.
[0024] The flip-chip packaging structure with a heat dissipation cover provided by the present invention first flips the chip 2 onto the substrate 1 and then fills the bottom. Then, glue 7 is applied to the four edges of the substrate 1, and a heat-conducting medium 6 is applied to the vertical inner wall of the L-shaped ring 3. The L-shaped ring 3 is attached to the product and cured. Finally, glue 8 is applied to the upper surface of the L-shaped ring 3, and a heat-conducting medium 4 is applied to the back of the chip 2. The heat dissipation cover 5 is attached to the product and cured. The L-shaped ring 3 can achieve heat dissipation on all sides of the product, improve the warping of the packaged product, reduce the delamination problem of the heat-conducting medium 4, and overcome the defect of insufficient heat dissipation of the product. In addition, when the substrate 1 is produced, copper blocks 11 are left around the substrate 1 to lead out the copper wire, which can further increase heat conduction, improve the heat dissipation effect, and further prevent the delamination of the heat-conducting medium.
[0025] The above are only some embodiments of the present invention. It should be pointed out that for ordinary technicians in this field, other variations and improvements can be made without departing from the creative concept of the present invention, and these all fall within the scope of protection of the present invention.
Claims
1. A flip chip packaging structure with a heat dissipation cover, comprising a substrate (1) and a chip (2) flipped onto the substrate (1), characterized in that: The substrate (1) is provided with an L-shaped ring (3) around the four edges of the substrate (1), and the L-shaped ring (3) covers the upper part of the four edges of the substrate (1) and the outside of the four side walls of the substrate (1). The back of the chip (2) is coated with a second heat-conducting medium (4). The chip (2) is covered with a heat dissipation cover (5). The inner side of the heat dissipation cover (5) is bonded to the second heat-conducting medium (4), and the bottom edge of the heat dissipation cover (5) is bonded to the upper surface of the L-shaped ring (3).
2. The flip chip packaging structure with heat dissipation cover according to claim 1, characterized in that: Copper blocks (11) are provided on the four edges of the base plate (1), and the L-shaped ring (3) is bonded to the four side walls of the base plate (1) via a heat-conducting medium (6).
3. The flip chip packaging structure with heat dissipation cover according to claim 1, characterized in that: A filling material layer (21) is formed between the chip (2) and the substrate (1) through bottom filling.
4. The flip chip packaging structure with heat dissipation cover according to claim 1, characterized in that: The L-shaped ring (3) is bonded to the four peripheral edges of the base plate (1) by adhesive 1 (7), and the bottom edge of the heat dissipation cover (5) is bonded to the upper surface of the L-shaped ring (3) by adhesive 2 (8).
5. The flip chip packaging structure with heat dissipation cover according to claim 1, characterized in that: The packaging structure further comprises an electronic component (9) mounted on the substrate (1), and the electronic component (9) is housed in the heat dissipation cover (5).