Cooling device and electronic equipment
By setting up misaligned shunts in the cooling channel to form a shunt branch, the problem of uneven flow rate of the coolant is solved, and the uniform flow of the coolant in each area is achieved and the risk of chip damage is reduced.
Patent Information
- Application Number
- CN202422493387.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-10-15
AI Technical Summary
The existing water-cooled plates have uneven flow rates of coolant in the runner, resulting in poor dead zones and heat exchange effects, and the chip temperature is prone to increase and damage.
Multiple splitters are arranged in the cooling flow channel, and adjacent splitters are opened in a dislocation to form multiple split branches to ensure that the flow rate of the coolant in each area is consistent and the runners are avoided dead zones.
The flow uniformity of the coolant in the cooling channel is improved, the heat exchange efficiency is enhanced, and the possibility of continuous increase in chip temperature is reduced.
Smart Images
Figure CN223218299U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic heat dissipation, in particular to a cooling device and an electronic device. Background Art
[0002] In the field of electronic devices, as the overall performance of chips improves, their power consumption also continues to increase. Therefore, whether the running chips can be efficiently cooled determines the operating quality of electronic devices.
[0003] In the prior art, a water-cooling plate is used as a cooling structure for a chip. As an efficient heat dissipation technology, the water-cooling plate conducts heat through the flow of internal coolant to achieve the effect of lowering the chip temperature.
[0004] However, the distribution of the coolant in the flow channel is affected by its own hydraulic pressure and the shape of the flow channel. In some areas of the flow channel, the coolant flow rate is faster and the heat dissipation efficiency is high; while in other areas, especially the right-angle bends or complex corners of the flow channel, the fluid flow rate is significantly reduced, and even dead zones appear. That is, the fluid almost stagnates in these areas and cannot effectively participate in the convective heat transfer process, resulting in poor heat transfer effect on the chip, causing the chip temperature to continue to rise and be damaged. Utility Model Content
[0005] The purpose of the utility model is to provide.
[0006] To achieve this purpose, the present invention adopts the following technical solutions:
[0007] In a first aspect, the present invention provides a cooling device comprising:
[0008] frame;
[0009] A water cooling assembly is provided in the frame, wherein the water cooling assembly has a cooling channel for supplying coolant flow, and a diverter assembly is provided in the cooling channel and at a position corresponding to the chip; the diverter assembly includes multiple groups of diverter parts spaced apart along the flow direction of the coolant, and multiple diverter ports are staggered on two adjacent diverter parts to form multiple diverter branches for supplying coolant flow between the multiple groups of diverter parts.
[0010] Optionally, each group of diverter elements includes:
[0011] A plurality of diverter portions are spaced apart along the first direction, and the diverter openings are formed between two adjacent diverter portions. In two adjacent groups of diverter elements, the diverter portions in one group of diverter elements correspond to the diverter openings in the other group of diverter elements.
[0012] Optionally, one end of the diverter portion along the flow direction of the coolant has a diverter tip.
[0013] Optionally, the horizontal cross-section of the diverter portion is rhombus-shaped, and the diverter port is formed between two opposite lateral tips of two adjacent diverter portions.
[0014] Optionally, a cooling groove is provided on a side of the water cooling component facing the chip and at a position corresponding to the chip, and a resistance coating is provided on a surface of the cooling groove facing the chip.
[0015] Optionally, a thermal pad is provided in the cooling groove, and the thermal pad is used to fit with the chip.
[0016] Optionally, the cooling groove is filled with a filling portion, and the filling portion abuts against the chip and the thermal pad to close the cooling groove.
[0017] Optionally, the cooling device further includes:
[0018] a heat sink, disposed on the frame and located on the same side of the frame as the water cooling assembly;
[0019] A heat conducting member has one end connected to the heat dissipation block and the other end connected to the water cooling assembly to transfer the heat of the heat dissipation block to the water cooling assembly.
[0020] Optionally, the heat conducting member is a heat pipe.
[0021] In a second aspect, the present invention further provides an electronic device, characterized in that it includes:
[0022] The cooling device and the circuit board with a chip as described in any of the above items, the circuit board is installed in the frame of the cooling device; the side of the circuit board with the chip is in contact with the water cooling component, so that the water cooling component cools the chip and the circuit board.
[0023] Beneficial effects of the utility model:
[0024] On the one hand, by arranging multiple groups of diversion parts in the cooling channel of the water-cooling component, diversion ports are staggered between two adjacent diversion parts, and multiple diversion branches for the flow of coolant are formed between the multiple groups of diversion parts, so that the coolant is diverted multiple times when entering the cooling channel, and the coolant passing through multiple diversion ports will enter the corresponding diversion branches and flow along the diversion branches to the next diversion port, so that the coolant flows along multiple diversion branches, and multiple diversion branches can guide the coolant in different directions, thereby ensuring that the coolant in each area of the cooling channel can flow at the same speed. Therefore, when the cooling device is in use, it can divert and guide the cold zone liquid in the cooling channel multiple times, ensuring that the coolant can fill the cooling channel, and can ensure that the flow rate of the coolant in each area of the cooling channel remains consistent, reducing the influence of the shape of the cooling channel itself on the coolant flow channel speed, thereby reducing the possibility of dead zones in the cooling channel, ensuring that the coolant can effectively participate in the convective heat transfer process, thereby improving the heat exchange efficiency and reducing the possibility of damage to the chip due to continuous increase in temperature.
[0025] Secondly, when the electronic device is in use, by injecting coolant into the cooling channel of the cooling device, the coolant can flow fully in the cooling channel without forming a dead zone, ensuring continuous and efficient heat dissipation for the chip and circuit board, and reducing the possibility of damage to the chip and circuit board due to continuous temperature increase. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a structural diagram of the cooling device in the utility model;
[0027] Figure 2 This is a schematic structural diagram of the cooling channel and cooling components of the cooling device of the utility model;
[0028] Figure 3 It is a partially enlarged schematic diagram of the cooling channel and cooling components of the cooling device of the utility model;
[0029] Figure 4 This is a cross-sectional view of a chip and a cooling groove of a cooling device of an electronic device according to the present invention;
[0030] Figure 5 yes Figure 4 An enlarged view of section A in the illustrated implementation;
[0031] Figure 6 It is a structural diagram of the electronic equipment in the utility model;
[0032] Figure 7 It is a structural schematic diagram of the heat dissipation block and heat conducting member of the electronic module in the utility model.
[0033] In the picture:
[0034] 1. Water cooling assembly; 11. Cooling channel; 12. Base plate; 13. Mounting plate; 14. Cooling trough; 15. Thermal pad; 16. Filling part; 2. Diverter assembly; 21. Diverter port; 22. Diverter part; 3. Heat sink; 4. Thermal conductor; 5. Chip; 7. Circuit board. DETAILED DESCRIPTION
[0035] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.
[0036] In the description of this utility model, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0037] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0038] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0039] The embodiment of the present utility model discloses a cooling device and an electronic device. The electronic device at least comprises a cooling device and a circuit board 7 provided with a chip 5. The cooling device is used to cool the chip 5 and the circuit board 7.
[0040] Reference Figures 1 to 3 The cooling device includes a frame and a water-cooling assembly 1 disposed within the frame. The water-cooling assembly 1 has a cooling channel 11 for the flow of coolant. A diverter assembly 2 is disposed within the cooling channel 11 at a position corresponding to the chip 5. The diverter assembly 2 includes multiple groups of diverter elements spaced apart along the flow direction of the coolant. Multiple diverter ports 21 are staggered between adjacent diverter elements to form multiple diverter branches for the flow of coolant between the multiple groups of diverter elements.
[0041] Specifically, the water cooling assembly 1 includes a base plate 12 and a mounting plate 13. A flow channel is provided in the base plate 12, and the flow channel is connected to the coolant circulation equipment through a pipeline. A heat exchange groove is provided on the top wall of the base plate 12, and the heat exchange groove is connected to the flow channel, so that the coolant in the flow channel can continuously flow into the heat exchange groove. The mounting plate 13 is fixed on the base plate 12 and closes the heat exchange groove, so that a cooling channel 11 is formed between the mounting plate 13 and the base plate 12. A cooling groove 14 for accommodating the chip 5 can be provided at a corresponding position on the mounting plate 13 according to layout requirements. The mounting plate 13 can be made of a material with a high thermal conductivity, such as metal, to ensure that the mounting plate 13 can successfully complete heat exchange with the coolant. The shunt assembly 2 is fixed to the bottom wall or top wall of the cooling channel 11, and can also be fixedly connected to the top and bottom walls of the cooling channel 11 at the same time. A plurality of shunt assemblies 2 can be distributed at intervals, specifically according to the circuit board 7 (refer to Figure 6 ) is designed based on the layout position of the chip 5 on the PCB. The present invention does not limit the number and spacing of the shunt components 2.
[0042] The diversion assembly 2 includes multiple groups of diversion parts, which can be evenly spaced along the flow direction of the coolant, and each diversion part has multiple diversion ports 21, so that when the coolant flows through each diversion part, the multiple diversion ports 21 can divert the coolant, so that the coolant can effectively fill the entire cooling channel 11. If the diversion ports 21 on two adjacent diversion parts are staggered, an inclined diversion branch can be formed between the diversion ports 21 of the two adjacent groups of diversion parts, and the multiple diversion ports 21 of the multiple groups of diversion parts can form multiple diversion branches, and the extension direction of all diversion branches can be multiple directions or only two directions, so that when the coolant flows in the diversion branch, it is ensured that the coolant can effectively flow in various areas within the cooling channel 11.
[0043] By arranging multiple groups of diversion parts in the cooling channel 11 of the water-cooling component 1, multiple diversion ports 21 are arranged on each group of diversion parts, and the multiple diversion ports 21 are staggered to form multiple inclined diversion branches, so that the coolant is diverted multiple times when entering the cooling channel 11, and the coolant passing through the multiple diversion ports 21 will enter the corresponding diversion branches and flow along the diversion branches to the next diversion port 21, so that the coolant flows along the multiple diversion branches, and the multiple diversion branches can guide the coolant in different directions, thereby ensuring that the coolant in each area of the cooling channel 11 can flow at the same speed. In this way, when the cooling device is in use, it can divert and guide the cold zone liquid in the cooling channel 11 multiple times, ensuring that the coolant can fill the cooling channel 11, and can ensure that the flow rate of the coolant in each area of the cooling channel 11 remains consistent, reducing the influence of the shape of the cooling channel 11 itself on the coolant flow channel speed, thereby reducing the possibility of dead zones in the cooling channel 11, ensuring that the coolant can effectively participate in the convective heat exchange process, so as to improve the heat exchange efficiency and reduce the possibility of damage to the chip 5 due to continuous temperature increase.
[0044] Optionally, each group of diverter elements includes a plurality of diverter portions 22. The plurality of diverter portions 22 are spaced apart along the first direction, and a diverter opening 21 is formed between two adjacent diverter portions 22. In two adjacent groups of diverter elements, the diverter portion 22 in one group of diverter elements corresponds to the diverter opening 21 in the other group of diverter elements.
[0045] Specifically, the first direction can be perpendicular to the direction of coolant flow. The diverter portions 22 in a set of diverter elements are evenly spaced along the first direction, thereby forming multiple diverter openings 21 with equal interconnected areas. The diverter portions 22 correspond to the diverter openings 21 in adjacent diverter elements, thereby creating an inclined branch path between the diverter openings 21 of the two sets of diverter elements. It should be understood that the intersection of the first direction and the coolant flow direction ensures that the coolant can flow through each set of diverter elements during the flow process, and is not limited to the perpendicular direction in the above example.
[0046] By providing a plurality of diversion portions 22 spaced apart along the first direction, on the one hand, a plurality of diversion openings 21 can be smoothly formed, so that the coolant can be separated when encountering the diversion portion 22 and enter the diversion openings 21 on both sides of the diversion portion 22, thereby allowing the coolant to flow into different diversion branches through the plurality of diversion openings 21. On the other hand, the provision of the diversion portion 22 can also increase the contact area between the coolant and the water-cooling component 1, thereby improving the heat exchange efficiency of the coolant during the flow process and improving the overall cooling effect of the cooling device.
[0047] Optionally, each of the flow dividing portions 22 has a flow dividing tip along the flow direction of the coolant.
[0048] Specifically, the horizontal projection shape of the diverter portion 22 can be polygonal or elliptical, both of which can form a diverter tip at one end along the flow direction of the coolant. In other embodiments, the diverter portion 22 can also be set to a cylindrical shape to utilize its arc-shaped side surface to achieve a diverter effect.
[0049] By providing the diversion tip, when the coolant contacts the diversion portion 22 , the diversion tip can smoothly separate the coolant so that the coolant can pass through different diversion ports 21 , thereby realizing diversion of the coolant.
[0050] Optionally, the horizontal cross-section of the diverter portion 22 is rhombus-shaped, and a diverter port 21 is formed between two opposite transverse tips of two adjacent diverter portions 22 . The transverse tips of each diverter portion 22 in each group of diverters are arranged along the first direction.
[0051] Specifically, the diverter portion 22 is in the shape of a square column, and its horizontal cross-section is in the shape of a diamond. One of its tips serves as a diverter tip facing the diverter port 21 of the adjacent diverter member, while the adjacent tip serves as a lateral tip and is opposite to the lateral tip of the adjacent diverter portion 22 to form the diverter port 21.
[0052] By configuring the horizontal cross-section of the diverter 22 to be diamond-shaped, the tip of the diverter 22 itself can serve as the diverter tip, eliminating the need for further machining of the diverter 22 and effectively reducing the difficulty of manufacturing the diverter 22. Furthermore, the side surfaces of the diverter 22 extend in an inclined manner to guide the flow of the coolant, ensuring that the coolant, after being diverted by the diverter tip, can flow smoothly to the diverter port 21.
[0053] Reference Figure 4 and Figure 5 Optionally, a cooling groove 14 is provided on the side of the water cooling component 1 facing the chip 5 and at a position corresponding to the chip 5 , and the surface of the cooling groove 14 facing the chip 5 is paved with an impedance coating.
[0054] Specifically, a plurality of cooling grooves 14 are provided on the top wall of the mounting plate 13. Each cooling groove 14 can accommodate a chip 5. The depth of the cooling groove 14 is less than the thickness of the chip 5. An impedance coating is uniformly provided on the surface of each cooling groove 14 facing the chip 5 to ensure that the impedance of the water-cooled plate meets the requirements. The impedance coating can be a thickened oxide coating. The conventional thickness of the coating is 6-8 μm, while the thickness of the oxide coating in this embodiment is 10-15 μm. The corners of the cooling groove 14 are rounded to ensure that the impedance coating can completely cover the groove wall of the cooling groove 14.
[0055] The provision of the cooling groove 14 not only provides sufficient space for the installation of the chip 5, but also ensures a larger contact area between the chip 5 and the water-cooling assembly 1, thereby improving the heat exchange efficiency between the chip 5 and the water-cooling assembly 1. The provision of the impedance coating also ensures a safe installation environment for the chip 5, which is conducive to improving the operational stability of the chip 5.
[0056] Optionally, a thermal pad 15 is provided in the cooling groove 14 , and the thermal pad 15 is used to fit with the chip 5 .
[0057] Specifically, a thermal pad 15 is disposed on the bottom wall of the cooling slot 14. The bottom wall of the thermal pad 15 is in contact with the bottom wall of the cooling slot 14, and the top wall of the thermal pad 15 is in contact with the bottom wall of the chip 5. The thermal pad 15 is made of a material with a high thermal conductivity coefficient, such as graphene. The top and bottom walls of the thermal pad 15 can be coated with a thermally conductive adhesive or other structure to further improve heat exchange efficiency while also enabling fixed installation.
[0058] By providing the thermal pad 15 , the heat exchange efficiency between the chip 5 and the water-cooling plate can be further improved, thereby improving the heat dissipation effect of the chip 5 .
[0059] Optionally, the cooling groove 14 is filled with a filling portion 16 , and the filling portion 16 abuts against the chip 5 and the thermal pad 15 to close the cooling groove 14 .
[0060] Specifically, a filling portion 16 is provided between the side wall of the cooling groove 14 and the chip 5. The filling portion 16 may be foam. The filling portion 16 can fill the gap between the thermal pad 15 and the chip 5 in the cooling groove 14 and form abutment between the chip 5 and the thermal pad 15, thereby realizing a closed cooling groove 14.
[0061] By providing the filling portion 16, the thermal pad 15 can be completely enclosed within the cooling groove 14, preventing debris generated by the graphene thermal pad 15 from escaping from the cooling groove 14, thereby ensuring a safe and stable operating environment for the chip 5. Furthermore, the use of foam as the filling portion 16 can also utilize the foam's insulating properties to eliminate the risk of electrical conduction. Furthermore, the foam's good flexibility allows it to fully fill gaps, generating minimal stress and preventing any impact on the installation of the chip 5.
[0062] Reference Figure 6 and Figure 7 Optionally, the cooling device further includes a heat sink 3 and a heat conductor 4. The heat sink 3 is provided on the frame and is located on the same side of the frame as the water cooling assembly 1. The heat sink 3 corresponds to the circuit board 7. One end of the heat conductor 4 is connected to the heat sink 3, and the other end is connected to the water cooling assembly 1 to transfer heat from the heat sink 3 to the water cooling assembly 1.
[0063] Specifically, the heat sink 3 can be made of aluminum, with one side corresponding to the circuit board 7 and the other side provided with a heat conductor 4. The heat conductor 4 is partially attached to the heat sink 3 and the other part is connected to the water cooling assembly 1. The heat conductor 4 can be a metal heat conducting plate or a heat pipe with a circulating flow channel for coolant.
[0064] By setting up a heat dissipation block 3, the heat generated by the circuit board 7 during operation is transferred to the heat dissipation block 3 through heat exchange, and the heat from the heat dissipation hole is transferred to the water-cooled plate through the heat conductive member 4. In this way, through the cooperation between the heat dissipation block 3 and the heat conductive member 4, continuous heat dissipation of the circuit board 7 is achieved, thereby improving the cooling efficiency of the circuit board 7.
[0065] Optionally, the heat conducting member 4 is a heat pipe.
[0066] Specifically, the heat conducting member 4 is a heat pipe, which occupies a small space. Therefore, multiple heat conducting members 4 can be distributed at intervals. In this embodiment, there can be four heat pipes. In other embodiments, the number and layout of the heat pipes can be designed according to the actual size and shape of the heat sink 3, and the present invention does not limit this.
[0067] The electronic device includes a circuit board 7 with a chip 5 and a cooling device as in the above embodiment, which is used to cool the chip 5 and the circuit board 7; the circuit board 7 is mounted on the frame of the cooling device, and the side of the circuit board 7 with the chip 5 is in contact with the water cooling component 1 for cooling, and the circuit board 7 is in contact with the heat sink 3 in the water cooling component 1 to achieve a heat dissipation effect.
[0068] When the electronic device is in use, by injecting coolant into the cooling channel 11 of the cooling device, the coolant can flow fully in the cooling channel 11 without forming a flow dead zone, ensuring continuous and efficient heat dissipation for the chip 5 and the circuit board 7, and reducing the possibility of damage to the chip 5 and the circuit board 7 due to continuous temperature increase.
[0069] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. A cooling device, characterized in that: include: frame; A water cooling assembly (1) is provided in the frame, wherein the water cooling assembly (1) has a cooling channel (11) for supplying cooling liquid, and a diversion assembly (2) is provided in the cooling channel (11) at a position corresponding to the chip (5); the diversion assembly (2) includes a plurality of diversion pieces spaced apart along the flow direction of the cooling liquid, and a plurality of diversion openings (21) are staggeredly provided on two adjacent diversion pieces to form a plurality of diversion branches for supplying cooling liquid between the plurality of diversion pieces.
2. The cooling device according to claim 1, characterized in that Each group of diverter components includes: A plurality of diverter portions (22) are spaced apart and distributed along a first direction, and the diverter opening (21) is formed between two adjacent diverter portions (22). In addition, in two adjacent groups of diverter elements, the diverter portion (22) in one group of diverter elements corresponds to the diverter opening (21) in the other group of diverter elements.
3. The cooling device according to claim 2, characterized in that One end of the flow dividing portion (22) along the flow direction of the cooling liquid has a flow dividing tip.
4. The cooling device according to claim 2, characterized in that The horizontal cross-section of the diverter portion (22) is in a rhombus shape, and the diverter port (21) is formed between two opposite transverse tips of two adjacent diverter portions (22).
5. The cooling device according to claim 1, characterized in that A cooling groove (14) is provided on a side of the water cooling component (1) facing the chip (5) and at a position corresponding to the chip (5), and a resistance coating is provided on a surface of the cooling groove (14) facing the chip (5).
6. The cooling device according to claim 5, characterized in that A thermal pad (15) is provided in the cooling groove (14), and the thermal pad (15) is used for bonding with the chip (5).
7. The cooling device according to claim 6, characterized in that The cooling groove (14) is filled with a filling portion (16), and the filling portion (16) abuts against the chip (5) and the thermal pad (15) to close the cooling groove (14).
8. The cooling device according to any one of claims 1 to 7, characterized in that The cooling device further comprises: A heat sink (3) is provided on the frame and is located on the same side of the frame as the water cooling assembly (1); A heat conducting member (4) has one end connected to the heat dissipation block (3) and the other end connected to the water cooling assembly (1) to transfer heat from the heat dissipation block (3) to the water cooling assembly (1).
9. The cooling device according to claim 8, characterized in that The heat conducting member (4) is a heat pipe.
10. An electronic device, characterized in that include: A cooling device and a circuit board (7) provided with a chip (5) according to any one of claims 1 to 9, wherein the circuit board (7) is mounted on a frame of the cooling device; a side of the circuit board provided with the chip (5) is in contact with the water cooling assembly (1), so that the water cooling assembly (1) cools the chip (5) and the circuit board (7).