Water cooling plate, heat dissipation assembly and power supply device

Abstract

The utility model provides a water cooling plate, a heat dissipation assembly and a power supply device, the water cooling plate is provided with an installation side and a heat dissipation side which are back to back, the installation side is used for installing an electric appliance element, the water cooling plate is provided with an air inlet and an air outlet, the air inlet and the air outlet penetrate through the water cooling plate in the thickness direction of the water cooling plate, and the heat dissipation side is used for heat dissipation of the water cooling plate. The heat dissipation side is provided with a cooling air duct, and the cooling air duct is communicated with the air inlet and the air outlet. The heat dissipation efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation structures, and in particular to a water cooling plate, a heat dissipation component and a power supply device. Background Art

[0002] As the performance of electronic devices continues to improve, the heat generated during operation is increasing dramatically. Therefore, efficient heat dissipation has become one of the key factors in ensuring stable system operation.

[0003] In water-cooling systems, a cold plate is typically used as a core component, and its design directly impacts the overall system's heat dissipation performance. Because traditional cold plates rely solely on liquid circulation to remove heat, the outer portion of the plate, where it's not directly exposed to the liquid, often suffers from poor heat dissipation. Utility Model Content

[0004] The present application provides a water-cooling plate, a heat dissipation component and a power supply device to solve the technical problem of low heat dissipation efficiency of existing water-cooling plates, heat dissipation components and power supply devices.

[0005] In the first aspect, the present application provides a water-cooling plate, which has an installation side and a heat dissipation side opposite to each other, the installation side is used to install electrical components, the water-cooling plate is provided with an air inlet and an air outlet, the air inlet and the air outlet pass through the water-cooling plate along the thickness direction of the water-cooling plate, and the heat dissipation side is provided with a cooling air duct, which is connected to the air inlet and the air outlet.

[0006] A further technical solution is that the water-cooled plate is provided with a plurality of heat dissipation fins located in the cooling air duct on the side facing away from the heat dissipation, the plurality of heat dissipation fins are arranged in sequence along the width direction of the cooling air duct, and each heat dissipation fin extends along the length direction of the cooling air duct.

[0007] A further technical solution is that the water-cooling plate is provided with a water inlet, a water outlet and a cooling water channel, and the water inlet and the water outlet are connected to the cooling water channel.

[0008] A further technical solution is that the water cooling plate includes a top cover, a bottom cover and side walls;

[0009] The top cover and the bottom cover are opposite and spaced apart, the side wall is connected between the top cover and the bottom cover, the water inlet and the water outlet are located on the side wall, and the top cover, the bottom cover and the side wall together enclose the cooling water channel.

[0010] In the second aspect, the present application provides a heat dissipation component, which is applied to a power supply device, and the heat dissipation component includes a housing, a fan and a water-cooling plate as described above; the housing and the water-cooling plate together enclose a accommodating cavity, which is used to accommodate the power supply body of the power supply device and is located on the installation side, and the fan is installed in the accommodating cavity, which is used to flow the hot air in the accommodating cavity to the cooling air duct through the air inlet; or to flow the cold air in the cooling air duct back to the accommodating cavity through the air outlet.

[0011] A further technical solution is that the fan is an exhaust fan, which is located at the air outlet and is used to flow the cold air in the cooling air duct back to the accommodating cavity through the air outlet.

[0012] A further technical solution is that the fan is a hair dryer, and the hair dryer is used to flow the hot air in the accommodating cavity to the cooling air duct through the air inlet.

[0013] A further technical solution is that the heat dissipation assembly also includes multiple temperature averaging plates, which are located in the accommodating cavity and abut against the installation side of the water-cooling plate, and are arranged in sequence along the length or width direction of the water-cooling plate.

[0014] A further technical solution is that a thermal conductive silicone grease layer is provided on the side of the temperature equalizing plate facing away from the water cooling plate.

[0015] In a third aspect, the present application provides a power supply device, which includes a power supply body and any one of the above-mentioned heat dissipation components: the power supply body is installed in the accommodating cavity.

[0016] The beneficial effect of the present application is that, different from the prior art, the present application designs an air inlet and an air outlet in the thickness direction of the water-cooled plate and provides a cooling air duct connected to the air inlet and the air outlet on the heat dissipation side, so as to utilize air to further dissipate heat, that is, adopts a heat dissipation method combining water cooling and air cooling, which can improve the heat dissipation efficiency of the water-cooled plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. Among them:

[0018] Figure 1 A schematic structural diagram of the bottom surface of the water-cooling plate provided in an embodiment of the present application;

[0019] Figure 2A schematic diagram of the internal structure of the heat dissipation assembly provided in an embodiment of the present application;

[0020] Figure 3 for Figure 2 Schematic diagram of part of the structure;

[0021] Figure 4 A schematic diagram of the structure of a power supply device according to one embodiment of the present application;

[0022] Figure 5 This is a schematic diagram of the structure of a power supply device in another direction provided by an embodiment of the present application. DETAILED DESCRIPTION

[0023] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.

[0025] As the performance of electronic devices continues to improve, the heat generated during operation is increasing dramatically. Therefore, efficient heat dissipation has become one of the key factors in ensuring stable system operation.

[0026] In water-cooling systems, a cold plate is typically used as a core component, and its design directly impacts the overall system's heat dissipation performance. Because traditional cold plates rely solely on liquid circulation to remove heat, the outer portion of the plate, where it's not directly exposed to the liquid, often suffers from poor heat dissipation.

[0027] Therefore, in order to solve the technical problem of low heat dissipation efficiency of the existing water-cooling plate, the present application provides a water-cooling plate, which can improve the heat dissipation efficiency of the water-cooling plate. Please refer to the following embodiment 1 for details.

[0028] See Figure 1 and Figure 2The water-cooling plate 220 provided in the present application has an installation side and a heat dissipation side opposite to each other. The installation side is used to install electrical components. The water-cooling plate 220 is provided with an air inlet 221 and an air outlet 222. The air inlet 221 and the air outlet 222 pass through the water-cooling plate 220 along the thickness direction of the water-cooling plate 220. The heat dissipation side is provided with a cooling air duct 223, and the cooling air duct 223 is connected to the air inlet 221 and the air outlet 222.

[0029] By designing an air inlet 221 and an air outlet 222 in the thickness direction of the water-cooled plate 220 and providing a cooling air duct 223 connected to the air inlet 221 and the air outlet 222 on the heat dissipation side, air can be used to further dissipate heat, that is, a heat dissipation method combining water cooling and air cooling is adopted, which can improve the heat dissipation efficiency of the water-cooled plate.

[0030] like Figure 1-Figure 2 As shown, in some embodiments, the water-cooled plate 220 is provided with a plurality of heat dissipation fins 224 on the side facing away from the heat dissipation, and the plurality of heat dissipation fins 224 are arranged in sequence along the width direction of the cooling air duct 223 , and each of the heat dissipation fins 224 extends along the length direction of the cooling air duct 223 .

[0031] The provision of heat dissipation fins 224 increases the heat dissipation area, significantly improving heat exchange efficiency. This allows hot air to flow through cooling duct 223 and through heat dissipation fins 224. The hot air is fully contacted with the heat dissipation fins 224 for cooling. The air, having dissipated heat through the fins, is then carried out of power supply device 10 by exhaust fan 300, effectively reducing the operating temperature within power supply device 10.

[0032] Furthermore, the heat dissipating fins 224 are arranged at intervals along the width of the cooling duct 223, fully utilizing the space within the cooling duct 223. This facilitates uniform airflow through each heat dissipating fin 224, avoids the occurrence of local hot spots, and ensures uniform heat dissipation. Furthermore, because the heat dissipating fins 224 extend along the length of the cooling duct 223, they are able to make greater contact with the water-cooled plate 220. Heat absorbed by the water-cooled plate 220 is quickly dispersed to the fins and dissipated through air cooling, further improving heat dissipation performance.

[0033] like Figure 1-Figure 2 As shown, in some embodiments, the water-cooled plate 220 is provided with a water inlet 225 , a water outlet 226 and a cooling water channel, and the water inlet 225 and the water outlet 226 are connected to the cooling water channel.

[0034] The water inlet 225 and the water outlet 226 are quick-connect connectors for easy installation and maintenance.

[0035] like Figure 1-Figure 2As shown, in some embodiments, the water-cooling plate 220 includes a top cover 227 , a bottom cover 228 and a side wall 229 .

[0036] The top cover 227 and the bottom cover 228 are opposite and spaced apart, the side wall 229 is connected between the top cover 227 and the bottom cover 228, the water inlet 225 and the water outlet 226 are located on the side wall 229, and the top cover 227, the bottom cover 228 and the side wall 229 together enclose the cooling water channel.

[0037] Based on the water-cooling plate 220 mentioned in the above embodiment, the present application further provides a heat dissipation component for use in a power supply device to improve the heat dissipation efficiency of the heat dissipation component.

[0038] like Figure 1-Figure 5 As shown, the heat dissipation assembly includes a shell 210, a fan and a water-cooling plate 220 as described in any one of the above items; the shell 210 and the water-cooling plate 220 together enclose a housing 230, the housing 230 is used to accommodate the power supply body of the power supply device and is located on the installation side, the fan is installed in the housing 230, and is used to flow the hot air in the housing 230 to the cooling air duct 223 through the air inlet 221; or to flow the cold air in the cooling air duct 223 back to the housing 230 through the air outlet 222.

[0039] The housing 210 is made of aluminum plate, which has good heat dissipation effect.

[0040] The fan may be a hair dryer 500 or an exhaust fan 300 , and details may refer to the description of the following embodiments.

[0041] In addition, the number of fans can also be multiple, such as setting 2 hair dryers or 2 exhaust fans, etc., or setting 1 hair dryer and 1 exhaust fan, etc., which can be selected and set according to actual conditions.

[0042] Exemplarily, the fan is an exhaust fan 300 , which is located at the air outlet 222 and is used to flow the cold air in the cooling air duct 223 back to the accommodating cavity 230 via the air outlet 222 .

[0043] Specifically, the exhaust fan 300 is installed in the accommodating cavity 230 and connected to the air outlet 222 to drive the air in the accommodating cavity 230 to flow from the air outlet to the cooling air duct 223 and then from the air outlet 222 to the accommodating cavity 230 .

[0044] That is, the hot air in the accommodating chamber 230 flows through the cooling air duct 223 through the air inlet 221, and the hot air is further cooled through the cooling air duct 223. Then the exhaust fan 300 draws the cooled air out through the air outlet 222 and returns it to the accommodating chamber 230. This cycle is repeated to further reduce the temperature of the accommodating chamber 230.

[0045] Exemplarily, the fan is a blower 500 , and the blower 500 is used to flow the hot air in the accommodating cavity 230 to the cooling air duct 223 through the air inlet 221 .

[0046] The blower 500 blows air from left to right to blow the heat generated by the heating element, ie, the power supply body, toward the air inlet 221 , thereby increasing the flow of air in the accommodating cavity 230 .

[0047] The hair dryer 500 may also be arranged close to the air inlet 221 , and the specific setting is selected according to the actual situation.

[0048] In some embodiments, the heat dissipation assembly further includes a plurality of temperature averaging plates 400 , which are located in the accommodating cavity 230 and abut against the water-cooling plate 220 , and are arranged in sequence along the length or width direction of the water-cooling plate 220 .

[0049] The temperature homogenizing plate 400 is an aluminum substrate.

[0050] Since the aluminum substrate is heated evenly and has good thermal conductivity, the heat dissipation performance of the heat dissipation component can be improved, and the aluminum substrate is easy to install.

[0051] In some embodiments, a thermal grease layer is provided on the side of the temperature homogenizing plate 400 facing away from the water cooling plate 220 .

[0052] The thermal grease layer can quickly transfer the heat of the electrical components installed on the water-cooling plate 220 to the bottom water-cooling plate 220 through the temperature homogenizing plate 400 .

[0053] In the heat dissipation assembly provided above, the general flow direction of the water channel in the water cooling plate 220 is as follows:

[0054] The coolant enters the water cooling plate 220 from the water inlet 225, passes through the installation position of the heating device, and finally flows out from the water outlet 226. Figure 2 The arrow in the .

[0055] The heat dissipation assembly provided in the present application combines water cooling and air cooling to flow the hot air from the accommodating cavity to the cooling air duct through the air inlet; or flows the cold air in the cooling air duct back to the accommodating cavity through the air outlet, thereby further enhancing the heat dissipation effect, reducing the overall module size, controlling costs, and overcoming the limitations of traditional air cooling solutions at high power density.

[0056] Furthermore, with the rapid advancement of technology and the growing demand for clean energy, hydrogen production equipment is becoming increasingly important in the energy sector. However, heat dissipation issues within the power module, a core component of hydrogen production equipment, have become a key technical bottleneck restricting its performance and reliability under high-power operating conditions. High-power density power modules are typically cooled with air, but these typically require large heat sinks and high-power blowers. This not only significantly increases the size and weight of the equipment but also hinders cost control and a compact system layout.

[0057] In addition, since the heat dissipation effect of air cooling is directly affected by environmental conditions such as temperature and humidity, its heat dissipation performance is unstable and it is difficult to meet the requirements for continuous and efficient heat dissipation of power supply devices.

[0058] Therefore, in order to solve the technical problems of poor heat dissipation performance and large size of the air cooling module in the existing air cooling heat dissipation method, the present application also provides a power supply device that can be applied to high-power equipment, such as hydrogen production equipment, which can achieve efficient heat dissipation in a smaller size and reduce costs. Please refer to the following embodiments for details.

[0059] like Figure 1-Figure 5 As shown, the power supply device 10 provided in the present application includes a power supply body and the above-mentioned heat dissipation assembly, and the power supply body is installed in the accommodating cavity 230.

[0060] Specifically, the power supply body is located in the accommodating cavity 230 and is installed on the water-cooling plate 220. The air inlet 221 and the air outlet 222 pass through the water-cooling plate 220 along the thickness direction of the water-cooling plate. A cooling air duct 223 is provided on the side of the water-cooling plate 220 facing away from the accommodating cavity 230. The cooling air duct 223 is connected to the air inlet 221 and the air outlet 222.

[0061] The fan is installed in the accommodating cavity 230 and is used to flow the hot air in the accommodating cavity 230 to the cooling air duct 223 through the air inlet 221 ; or to flow the cold air in the cooling air duct 223 back to the accommodating cavity 230 through the air outlet 222 .

[0062] Likewise, the fan may be a hair dryer or an exhaust fan.

[0063] The power supply body is located in the accommodating cavity 230 and is mounted on the water-cooling plate 220 . By directly contacting the water-cooling plate 220 , the heat generated by the power supply body can be directed to the water-cooling plate 220 , thereby achieving efficient heat dissipation.

[0064] This embodiment provides a heat dissipation component on the power supply device 10. Since the heat dissipation component includes a water-cooled plate 220, the power supply 50 body 100 can be installed on the water-cooled plate 220, that is, the heat source is directly in contact with the water-cooled plate 220, so that the heat generated by the power supply body can be taken away by the coolant inside the water-cooled plate 220, thereby improving the heat dissipation efficiency and enabling the power supply body to operate stably at a higher power density; and by designing a cooling air duct 223 on the water-cooled plate 220 and using an exhaust fan 300 to drive air to flow through the water-cooled plate 220, the heat dissipation effect is further enhanced. In addition, by combining water cooling and air cooling heat dissipation methods, the present application can not only reduce the overall module size, but also effectively control costs, effectively overcoming the limitations of traditional air cooling solutions at high power densities.

[0065] like Figure 3-Figure 5 As shown, in some embodiments, the power supply device 10 further includes a DC reactor 110, a transformer 120, an inductor and a diode. The DC reactor 110 and the inductor are respectively mounted and fixed in the aluminum shell cavity, and the middle is filled with a high thermal conductivity potting glue to ensure heat dissipation of the internal iron core and coil; similarly, high thermal conductivity silicone grease can be applied on the mounting surface to ensure that heat is quickly conducted to the bottom water cooling plate 220.

[0066] The temperature homogenizing plate 400 is arranged close to the DC reactor 110 and the transformer 120 to evenly transfer the heat generated by the DC reactor 110 and the transformer 120 to the water cooling plate 220 , and then remove the heat from the power supply device 10 through a water cooling cycle.

[0067] In some embodiments, the diode can be welded and fixed on an aluminum substrate, and high thermal conductivity silicone grease can be applied to the aluminum substrate to ensure uniform temperature of the single tube of the diode while also introducing heat into the water cooling plate 220 to reduce the temperature.

[0068] In some embodiments, the power supply body includes a transformer 120 and an output copper busbar 130 . The transformer 120 is disposed in the accommodating cavity 230 and mounted on the waterway plate. The output copper busbar 130 is fixedly connected to the transformer 120 via an insulating film 140 .

[0069] The transformer 120 may be encapsulated in the accommodating cavity 230 and mounted on the water-cooling plate 220 at the bottom to facilitate heat dissipation.

[0070] The insulating film 140 may be a high thermal conductivity insulating film 140 .

[0071] Since the output copper busbar 130 is an important carrier for current transmission, its good connection with the transformer 120 can ensure efficient and stable transmission of electrical energy, thereby improving the overall performance of the power supply device 10. Therefore, by providing an insulating film 140 between the transformer 120 and the output copper busbar 130, the present application can effectively prevent short circuits caused by high voltage electricity, ensure the safety of the power supply device 10 when operating at high voltage and high current, and avoid the occurrence of safety accidents.

[0072] Furthermore, the transformer 120 is directly connected to the output copper bus 130 through the insulating film 140 , eliminating redundant connectors and cables, making the internal layout of the power supply device 10 more compact and helping to reduce the overall volume.

[0073] In some embodiments, the number of the output copper busbars 130 is two, and the two output copper busbars 130 are both arranged along one end of the transformer 120 close to the exhaust fan 300 and are respectively connected to both sides of the transformer 120 .

[0074] The two output copper bars 130 are respectively a positive output copper bar 130 and a negative output copper bar 130 .

[0075] Since the two output copper bars 130 are arranged along one end of the transformer 120 close to the exhaust fan 300, the wiring and connection of the power output port are facilitated, and the two output copper bars 130 are respectively connected to both sides of the transformer 120, which can make the structure of the power supply device 10 more compact.

[0076] like Figure 4-Figure 5 As shown, in some embodiments, the power supply device 10 further includes an insulating plate 600 , and the output copper bus 130 is connected to the housing 210 via the insulating plate 600 .

[0077] Likewise, the insulating plate 600 may be an insulating plate 600 with high thermal conductivity.

[0078] By providing an insulating plate 600 between the housing 210 and the output copper bus 130 , short circuits caused by high voltage electricity can be effectively prevented, thereby ensuring the safety of the power supply device 10 when operating at high voltage and high current, and avoiding the occurrence of safety accidents.

[0079] In some embodiments, in order to realize functions such as convenient transportation, network communication and electrical connection, the housing 210 may also be provided with the following Figure 4 The handle 201, network port 202, terminal interface 203, incoming terminal 204, etc. are shown.

[0080] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of this embodiment.

[0081] It should be understood that the terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a," "an," and "" may also be intended to include the plural forms. The terms "comprise," "include," "contain," and "have" are inclusive and, thus, specify the presence of the stated features, steps, operations, elements, and / or parts, but do not preclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof.

[0082] The above are merely specific embodiments of the present invention, intended to enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein, but is intended to conform to the broadest scope consistent with the principles and novel features claimed herein.

Claims

1. A water cooling plate, characterized in that: The water-cooling plate has an installation side and a heat dissipation side opposite to each other, the installation side is used to install electrical components, the water-cooling plate is provided with an air inlet and an air outlet, the air inlet and the air outlet pass through the water-cooling plate along the thickness direction of the water-cooling plate, the heat dissipation side is provided with a cooling air duct, and the cooling air duct is connected to the air inlet and the air outlet.

2. The water cooling plate according to claim 1, characterized in that: The water-cooling plate is provided with a plurality of heat dissipation fins located in the cooling air duct on the side away from the heat dissipation. The plurality of heat dissipation fins are arranged in sequence and spaced apart along the width direction of the cooling air duct, and each heat dissipation fin extends along the length direction of the cooling air duct.

3. The water cooling plate according to claim 1, characterized in that: The water cooling plate is provided with a water inlet, a water outlet and a cooling water channel, and the water inlet and the water outlet are connected to the cooling water channel.

4. The water cooling plate according to claim 3, characterized in that: The water-cooling plate includes a top cover, a bottom cover and side walls; The top cover and the bottom cover are opposite and spaced apart, the side wall is connected between the top cover and the bottom cover, the water inlet and the water outlet are located on the side wall, and the top cover, the bottom cover and the side wall together enclose the cooling water channel.

5. A heat dissipation component, applied to a power supply device, characterized in that: The heat dissipation assembly includes a shell, a fan and a water-cooling plate according to any one of claims 1 to 4; the shell and the water-cooling plate together enclose a housing cavity, the housing cavity is used to accommodate the power supply body of the power supply device and is located on the installation side, the fan is installed in the housing cavity, and is used to flow the hot air in the housing cavity to the cooling air duct through the air inlet; or to flow the cold air in the cooling air duct back to the housing cavity through the air outlet.

6. The heat dissipation assembly according to claim 5, characterized in that: The fan is an exhaust fan, which is located at the air outlet and is used to flow the cold air in the cooling air duct back to the accommodating cavity through the air outlet.

7. The heat dissipation assembly according to claim 5, characterized in that: The fan is a hair dryer, and the hair dryer is used to flow the hot air of the accommodating cavity to the cooling air duct through the air inlet.

8. The heat dissipation assembly according to claim 5, wherein: The heat dissipation assembly further includes a plurality of temperature averaging plates, which are located in the accommodating cavity and abut against the installation side of the water-cooling plate. The plurality of temperature averaging plates are sequentially spaced apart along the length direction or the width direction of the water-cooling plate.

9. The heat dissipation assembly according to claim 8, wherein: A thermal conductive silicone grease layer is provided on the side of the temperature homogenizing plate facing away from the water cooling plate.

10. A power supply device, characterized in that: The power supply device includes a power supply body and a heat dissipation assembly according to any one of claims 5 to 9: the power supply body is installed in the accommodating cavity.

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