Heat dissipation structure and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of heat dissipation, and discloses a heat dissipation structure and electronic equipment. The heat dissipation structure comprises an electronic component and a heat dissipation film bag. The electronic component is provided with a heat dissipation surface; the heat dissipation film bag comprises an end part and a side part which are connected with each other, a containing cavity and an opening are defined by the end part and the side part, the opening is communicated with the containing cavity and is opposite to the end part, at least part of the electronic component is arranged in the containing cavity, and the cavity wall of the containing cavity is attached to at least part of the heat dissipation surface of the electronic component. The heat dissipation film bag is attached to the heat dissipation surface of the electronic component, on one hand, heat of the electronic component can be rapidly dissipated into air, and the heat dissipation efficiency of the electronic component is effectively improved; on the other hand, the occupied space in the electronic equipment can be reduced, the structure of the heat dissipation film bag can be suitable for electronic equipment of various sizes, and the application range is widened.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic equipment. Background Art

[0002] Electronic devices often contain circuit boards with several electronic components soldered onto them, enabling circuit control of other components within the device. These components generate heat during operation, which needs to be dissipated promptly. Otherwise, the components may overheat, affecting their performance and even damaging them.

[0003] The current practice is to install additional heat dissipation devices, such as fans, in electronic devices to dissipate heat from electronic components. However, adding additional heat dissipation devices will generate a lot of noise and take up space inside the electronic device, making them unsuitable for miniaturized electronic devices. Utility Model Content

[0004] The main technical problem solved by the embodiments of the present application is to provide a heat dissipation structure and electronic equipment, which can effectively solve the problems of high heat dissipation noise and space occupation, and effectively improve the heat dissipation efficiency of electronic components.

[0005] To address the aforementioned technical issues, the present invention employs a technical solution comprising: providing a heat dissipation structure comprising an electronic component and a heat dissipation film bag. The electronic component has a heat dissipation surface; the heat dissipation film bag comprises connected end portions and side portions, the end portions and side portions enclosing a receiving cavity and an opening, the opening communicating with the receiving cavity and disposed opposite the end portions. The electronic component is at least partially disposed within the receiving cavity, and the cavity wall of the receiving cavity is disposed in contact with at least a portion of the heat dissipation surface of the electronic component.

[0006] In some embodiments, the heat dissipation film bag further includes a locking portion, which is disposed at the opening and connected to the side portion, and is used to restrict the end portion and the side portion from being separated from the electronic component.

[0007] In some embodiments, a tightening portion is formed on the side away from the end, the tightening portion forms the opening and is partially fitted and connected to the electronic component, and the tightening portion is used to limit the end and the side from being separated from the electronic component.

[0008] In some embodiments, the heat dissipation film bag is provided with a through exhaust hole, the exhaust hole is communicated with the receiving cavity, and the exhaust hole is used to discharge the gas between the electronic components in the receiving cavity and the heat dissipation film bag.

[0009] In some embodiments, the heat dissipation film bag includes an adhesive layer, a gel layer and a breathable layer. The adhesive layer constitutes the cavity wall of the receiving cavity, the breathable layer constitutes the outer surface of the heat dissipation film bag, the gel layer is used to store moisture, and the breathable layer is used to allow water vapor to enter or discharge the gel layer.

[0010] In some embodiments, the electronic component is a square relay, which includes a top surface, a bottom surface, and four side surfaces connected between the top surface and the bottom surface; the end of the heat dissipation film bag is fitly connected to the top surface, and the side of the heat dissipation film bag includes a first part, a second part, a third part and a fourth part respectively connected to the edge of the end, and the first part, the second part, the third part and the fourth part are respectively fitly arranged on one of the side surfaces.

[0011] In some embodiments, the heat dissipation structure also includes a circuit board, the circuit board is provided with a welding hole, the electronic component has a bottom surface and pins extending from the bottom surface, the pins are passed through the welding hole and are electrically connected to the circuit board; the bottom surface is spaced apart from the circuit board, or the bottom surface is bonded to the circuit board.

[0012] In some embodiments, when the bottom surface of the electronic component is bonded to the circuit board, the circuit board includes a heat dissipation foil layer, the welding hole passes through the heat dissipation foil layer, the bottom surface of the electronic component abuts the heat dissipation foil layer, and the area of the heat dissipation foil layer is larger than the area of the bottom surface.

[0013] In some embodiments, the pins abut against the heat dissipation foil layer.

[0014] In order to solve the above technical problems, another technical solution adopted in the embodiment of the present application is: providing an electronic device including a heat dissipation structure.

[0015] The heat dissipation structure of the embodiment of the present application includes an electronic component and a heat dissipation film bag. The electronic component has a heat dissipation surface; the heat dissipation film bag includes an end portion and a side portion connected to each other, the end portion and the side portion enclose a receiving cavity and an opening, the opening is connected to the receiving cavity and is arranged opposite to the end portion, at least part of the electronic component is arranged in the receiving cavity, and the cavity wall of the receiving cavity is arranged to fit with at least part of the heat dissipation surface of the electronic component. By fitting the heat dissipation film bag on the heat dissipation surface of the electronic component, on the one hand, the heat of the electronic component can be quickly dissipated into the air, effectively improving the heat dissipation efficiency of the electronic component; on the other hand, it can reduce the space occupied inside the electronic device, so that the structure of the heat dissipation film bag can be applied to electronic devices of various sizes, expanding the scope of application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application, the following briefly introduces the drawings required for describing the specific embodiments. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0017] Figure 1 is a cross-sectional view of the heat dissipation structure of an embodiment of the present application;

[0018] Figure 2 is a schematic diagram of electronic components of the heat dissipation structure according to an embodiment of the present application;

[0019] Figure 3 Schematic diagram of a heat dissipation film bag of a heat dissipation structure according to an embodiment of the present application;

[0020] Figure 4 yes Figure 1 A magnified schematic diagram of part A in the middle;

[0021] Figure 5 This is a schematic diagram of the unfolded heat dissipation film bag of the heat dissipation structure of an embodiment of the present application;

[0022] Figure 6 is a cross-sectional view of a heat dissipation structure according to another embodiment of the present application;

[0023] Figure 7 This is a cross-sectional view of a heat dissipation structure according to another embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present application, the present application will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed on" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as being "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "upper", "lower", "inside", "outside", "vertical", "horizontal", etc. used in this specification indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0025] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0026] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0027] See also Figures 1 to 3 The embodiment of the present application provides a heat dissipation structure 100, which includes an electronic component 10 and a heat dissipation film bag 20. The electronic component 10 has a heat dissipation surface, and the heat dissipation surface is configured to exchange heat generated by the electronic component 10 during operation with the outside world through the heat dissipation surface. The heat dissipation film bag 20 has a receiving cavity 23, and at least a portion of the electronic component 10 is disposed within the receiving cavity 23. The heat dissipation film bag 20 and the electronic component 10 are disposed in close contact with each other, and the heat dissipation film bag 20 dissipates the heat generated by the electronic component 10 into the air to reduce the temperature of the electronic component 10. Specifically, the heat dissipation film bag 20 includes an end portion 21 and a side portion 22 connected to each other. The end portion 21 and the side portion 22 together enclose the receiving cavity 23 and an opening 24, wherein the opening 24 is connected to the receiving cavity 23 and is disposed opposite to the end portion 21. At least a portion of the electronic component 10 is disposed within the receiving cavity 23, and the cavity wall of the receiving cavity 23 is disposed in close contact with at least a portion of the heat dissipation surface of the electronic component 10. By fitting a heat dissipation film bag 20 on the heat dissipation surface of the electronic component 10, on the one hand, the heat of the electronic component 10 can be quickly dissipated into the air, effectively improving the heat dissipation efficiency of the electronic component 10, and no noise will be generated during this heat dissipation process, which can improve the use quality of the electronic device; on the other hand, compared with the existing additional heat dissipation device, the above-mentioned heat dissipation film bag 20 has a simple structure and can significantly reduce the space occupied inside the electronic device, so that the above-mentioned structure can be applied to electronic devices of various sizes, expanding the scope of application.

[0028] In some embodiments, see Figure 1 and Figure 4 The heat dissipation film bag 20 includes an adhesive layer 20a, a gel layer 20b, and a breathable layer 20c. The adhesive layer 20a forms the cavity wall of the receiving cavity 23 and is used to adhere to the heat dissipation surface of the electronic component 10. The breathable layer 20c forms the outer surface of the heat dissipation film bag 20. The breathable layer 20c has a plurality of breathable holes. The gel layer 20b is used to store water, and the breathable layer 20c is used to allow water vapor to enter or exit the gel layer 20b. The working principle of the heat dissipation film bag 20 is as follows: Figure 4As shown in the middle path B, when the electronic component 10 generates heat during operation, the heat on the electronic component 10 is transferred to the gel layer 20b through the adhesive layer 20a. The water stored in the gel layer 20b is heated and evaporated to form water vapor. The water vapor is discharged into the outside air through the air holes on the breathable layer 20c, thereby transferring the heat in the gel layer 20b to the outside. Figure 4 As shown by path C, when electronic component 10 stops working and returns to normal temperature, water vapor in the air can enter gel layer 20b through the pores in breathable layer 20c and be absorbed by gel layer 20b, replenishing the moisture within gel layer 20b. This allows the water vapor to evaporate and remove heat when electronic component 10 resumes operation. Through this structure, heat dissipation film bag 20 can achieve a cycle of water evaporation and water absorption. This effectively improves the heat dissipation efficiency of electronic component 10 by utilizing the heat absorption characteristic of water evaporation. It also effectively extends the service life of heat dissipation film bag 20, thereby reducing the frequency of replacement of heat dissipation film bag 20 and lowering costs.

[0029] It is understood that the heat dissipation film bag 20 can be a one-piece structure having a receiving cavity 23 and an opening 24, or it can be a planar structure formed by folding several sections to form a structure having a receiving cavity 23 and an opening 24. When the heat dissipation film bag 20 is manufactured as a single piece, the opening 24 is used to allow the electronic component 10 to enter the receiving cavity 23. That is, during assembly, the heat dissipation film bag 20 is placed around the electronic component 10 through the opening 24. When the heat dissipation film bag 20 is a structure composed of several folded sections, each section of the heat dissipation film bag 20 can be attached to the heat dissipation surface of the electronic component 10 in sequence.

[0030] As an example, see Figure 2 and Figure 5 The electronic component 10 is a square relay comprising a top surface 11, a bottom surface 12, and four side surfaces 13 connected between the top surface 11 and the bottom surface 12. The end 21 of the heat dissipation film bag 20 is bonded to the top surface 11. Initially, the heat dissipation film bag 20 is a flat plate-shaped structure. The side 22 of the heat dissipation film bag 20 comprises a first portion 221, a second portion 222, a third portion 223, and a fourth portion 224, respectively connected to the edges of the end 21. During installation, the end 21 of the heat dissipation film bag 20 is bonded to the top surface 11 of the square relay. The first portion 221, second portion 222, third portion 223, and fourth portion 224 are then bent and bonded to one of the side surfaces 13 of the square relay. In other examples, the electronic component 10 may include a resistor, a capacitor, an inductor, a diode, a transistor, etc., and the shape of the electronic component 10 may be spherical, cylindrical, elliptical, etc.

[0031] In some embodiments, see Figure 1 and Figure 3 The heat dissipation film bag 20 further includes a locking portion 25, which is disposed at the opening 24 and connected to the side portion 22 of the heat dissipation film bag 20. The locking portion 25 is configured to abut against a portion of the electronic component 10, thereby securing the electronic component 10 within the receiving cavity 23 and preventing the end portion 21 and the side portion 22 of the heat dissipation film bag 20 from separating from the electronic component 10. As an example, the locking portion 25 is bonded to the side portion 22 of the heat dissipation film bag 20.

[0032] In some embodiments, see Figure 6 A tightening portion 26 is formed on the side portion 22 of the heat dissipation film bag 20, away from the end portion 21. The tightening portion 26 forms the opening 24 of the receiving cavity 23 and is partially in contact with the electronic component 10. The diameter of the tightening portion 26 is smaller than that of the side portion 22, so that the tightening portion 26 can abut against the electronic component 10, thereby preventing the end portion 21 and the side portion 22 of the heat dissipation film bag 20 from separating from the electronic component 10. As an example, after the heat dissipation film bag 20 is placed around the periphery of the electronic component 10, the tightening portion 26 can be formed by partially shrinking the side portion 22 through secondary processing, such as thermal processing.

[0033] It can be understood that the above-mentioned locking portion 25 and tightening portion 26 can both be used to prevent the heat dissipation film bag 20 from detaching from the electronic component 10. Therefore, according to the shape, structure or installation position of the electronic component 10 itself and the circuit board 30, at least one of the locking portion 25 and the tightening portion 26 can be selected. For example, the heat dissipation film bag 20 is only provided with the locking portion 25, or the heat dissipation film bag 20 is only provided with the tightening portion 26, or the heat dissipation film bag 20 is provided with both the locking portion 25 and the tightening portion 26.

[0034] In some embodiments, see Figure 1 The heat dissipation film bag 20 is provided with a through-hole vent 27, which is in communication with the receiving cavity 23. The vent vent 27 is used to exhaust the gas between the electronic component 10 in the receiving cavity 23 and the heat dissipation film bag 20. Specifically, when the heat dissipation film bag 20 is placed outside the electronic component 10, there may be air bubbles between the two. Therefore, the through-hole vent 27 can be provided to exhaust the air bubbles through the vent vent 27. In this way, the end 21 and side 22 of the heat dissipation film bag 20 can be placed in close contact with the heat dissipation surface of the electronic component 10, effectively improving the efficiency of heat conduction and accelerating the heat dissipation speed.

[0035] In some embodiments, see Figure 7The heat dissipation structure 100 further includes a circuit board 30, which is provided with solder holes 31. The electronic component 10 has a bottom surface 12 and pins 14 extending from the bottom surface 12. The pins 14 are inserted into the solder holes 31 and are electrically connected to the circuit board 30. It is understood that there are multiple electronic components 10 on the circuit board 30, and the types of the multiple electronic components 10 are different. Therefore, depending on different connection requirements, the installation positions of the electronic components 10 and the circuit board 30 may also be different. For example, the bottom surfaces 12 of some electronic components 10 may be spaced apart from the circuit board 30, or the bottom surfaces 12 of some electronic components 10 may be placed in contact with the circuit board 30.

[0036] In some embodiments, see Figure 7 When the bottom surface 12 of the electronic component 10 is attached to the circuit board 30, the circuit board 30 includes a heat dissipation foil layer 32. The solder holes 31 on the circuit board 30 penetrate the heat dissipation foil layer 32, and the bottom surface 12 of the electronic component 10 abuts against the heat dissipation foil layer 32. This allows heat transfer between the bottom surface 12 of the electronic component 10 and the heat dissipation foil layer 32, dissipating heat from the electronic component 10 into the air through the heat dissipation foil layer 32. Furthermore, the area of the heat dissipation foil layer 32 is larger than the area of the bottom surface 12 of the electronic component 10. That is, a portion of the surface of the heat dissipation foil layer 32 is not covered by the electronic component 10. This allows the surface of the heat dissipation foil layer 32 to be directly exposed to the air, accelerating heat transfer with the air.

[0037] In some embodiments, see Figure 7 Because the pins 14 in the electronic component 10 are metal and are responsible for transmitting electrical signals, the temperature of the pins 14 is also very high when the electronic component 10 is in operation. By connecting the pins 14 to the heat dissipation foil layer 32 in contact, the heat from the pins 14 can be directly transferred to the heat dissipation foil layer 32 and dissipated into the air through the heat dissipation foil layer 32. In this way, the electronic component 10 has two channels for heat dissipation: the heat dissipation film bag 20 and the heat dissipation foil layer 32, greatly improving the heat dissipation efficiency of the electronic component 10.

[0038] The present application further provides an embodiment of an electronic device, which includes the above-mentioned heat dissipation structure 100. The specific structure and function of the heat dissipation structure 100 can be found in the above-mentioned embodiment and will not be described in detail here.

[0039] The heat dissipation structure 100 of the embodiment of the present application includes an electronic component 10 and a heat dissipation film bag 20. The electronic component 10 has a heat dissipation surface; the heat dissipation film bag 20 includes an end portion 21 and a side portion 22 connected to each other. The end portion 21 and the side portion 22 enclose a receiving cavity 23 and an opening 24. The opening 24 is connected to the receiving cavity 23 and is arranged opposite to the end portion 21. At least a portion of the electronic component 10 is arranged in the receiving cavity 23, and the cavity wall of the receiving cavity 23 is arranged in contact with at least a portion of the heat dissipation surface of the electronic component 10. By attaching the heat dissipation film bag 20 to the heat dissipation surface of the electronic component 10, on the one hand, the heat of the electronic component 10 can be quickly dissipated into the air, effectively improving the heat dissipation efficiency of the electronic component 10; on the other hand, it can reduce the space occupied inside the electronic device, so that the structure of the heat dissipation film bag 20 can be applied to electronic devices of various sizes, expanding the scope of application.

[0040] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation structure, characterized in that: include: Electronic components with heat dissipation surfaces; A heat dissipation film bag includes connected ends and sides, wherein the ends and sides enclose a receiving cavity and an opening, the opening is connected to the receiving cavity and is arranged opposite to the end, at least part of the electronic component is arranged in the receiving cavity, and the cavity wall of the receiving cavity is arranged in contact with at least part of the heat dissipation surface of the electronic component.

2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation film bag further includes a locking portion, which is disposed at the opening and connected to the side portion, and is used to restrict the end portion and the side portion from being separated from the electronic component.

3. The heat dissipation structure according to claim 2, characterized in that: A tightening portion is formed on a portion of the side away from the end portion, the tightening portion forms the opening and is partially fitted and connected to the electronic component, and is used to limit the end portion and the side portion from being separated from the electronic component.

4. The heat dissipation structure according to claim 3, characterized in that: The heat dissipation film bag is provided with a through exhaust hole, the exhaust hole is communicated with the receiving cavity, and the exhaust hole is used to discharge the gas between the electronic components in the receiving cavity and the heat dissipation film bag.

5. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation film bag includes an adhesive layer, a gel layer and a breathable layer. The adhesive layer constitutes the cavity wall of the receiving cavity, the breathable layer constitutes the outer surface of the heat dissipation film bag, the gel layer is used to store moisture, and the breathable layer is used to allow water vapor to enter or discharge the gel layer.

6. The heat dissipation structure according to claim 1, characterized in that: The electronic component is a square relay, and the square relay includes a top surface, a bottom surface, and four side surfaces connected between the top surface and the bottom surface; The end of the heat dissipation film bag is fitted and connected to the top surface, and the side of the heat dissipation film bag includes a first part, a second part, a third part and a fourth part respectively connected to the edge of the end, and the first part, the second part, the third part and the fourth part are respectively fitted and arranged on one of the side surfaces.

7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The heat dissipation structure also includes a circuit board, which is provided with a welding hole. The electronic component has a bottom surface and pins extending from the bottom surface. The pins are inserted into the welding hole and are electrically connected to the circuit board. The bottom surface is spaced apart from the circuit board, or the bottom surface is bonded to the circuit board.

8. The heat dissipation structure according to claim 7, characterized in that: When the bottom surface of the electronic component is bonded to the circuit board, the circuit board includes a heat dissipation foil layer, the welding hole passes through the heat dissipation foil layer, the bottom surface of the electronic component abuts against the heat dissipation foil layer, and the area of the heat dissipation foil layer is larger than the area of the bottom surface.

9. The heat dissipation structure according to claim 8, characterized in that: The pins abut against the heat dissipation foil layer.

10. An electronic device, characterized in that: The heat dissipation structure comprises the heat dissipation structure according to any one of claims 1 to 9.

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