Heat dissipation system

Abstract

A heat dissipation system is used for solving the problem that an existing heat dissipation module is poor in heat dissipation efficiency for instant temperature rise of an electronic element. Comprising a heat dissipation module used for being combined with an electronic element; the liquid cooling heat dissipation piece is provided with a shell, the shell is in thermal contact with the heat dissipation module, the shell is provided with a liquid-tight space, the liquid-tight space is provided with working liquid, the liquid cooling heat dissipation piece is provided with at least one fluid driving piece, and the at least one fluid driving piece is located in the liquid-tight space. Therefore, the electronic component can be effectively cooled to a proper temperature.

Description

Technical Field

[0001] The utility model relates to a heat dissipation system, in particular to a heat dissipation system for dissipating heat from electronic components. Background Art

[0002] Generally speaking, when heat sources such as chips in electronic devices generate heat energy during operation, the heat energy is introduced into a heat dissipation module such as a cooling fan or cooling fins to discharge the heat energy through the cooling fan or the cooling fins. However, with the development of products in today's technology industry tending to be more sophisticated, and the operating speed has also increased significantly, the heat generated by heat sources such as chips during operation is also considerable. In particular, chips that perform AI calculations are more likely to produce high-efficiency operations and thus generate a large amount of heat instantly. Therefore, for high-power electronic heating elements, the heat dissipation effect achieved by existing heat dissipation modules such as cooling fans or cooling fins is limited, resulting in poor heat dissipation efficiency. Utility Model Content

[0003] In order to solve the above problems, the purpose of the present invention is to provide a heat dissipation system that can improve heat dissipation efficiency.

[0004] The directions or their approximate terms described throughout the present invention, such as "front", "rear", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer", "side", etc., are mainly referred to the directions of the accompanying drawings. Each direction or its approximate terms are only used to assist in explaining and understanding the various embodiments of the present invention and are not used to limit the present invention.

[0005] The quantifiers “a” or “an” used in the elements and components described throughout the present invention are only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, they should be interpreted as including one or at least one, and a single concept also includes multiple cases, unless it is obvious that it means otherwise.

[0006] Throughout the present invention, similar terms such as "combination", "assembly" or "assembly" mainly include forms in which the components can be separated without damaging them after connection, or in which the components cannot be separated after connection. Those skilled in the art can choose according to the materials of the components to be connected or the assembly requirements.

[0007] The heat dissipation system of the present invention includes: a heat dissipation module for combining with an electronic component; and a liquid-cooled heat dissipation element, the liquid-cooled heat dissipation element having a shell, the shell thermally contacting the heat dissipation module, the shell having a liquid-tight space, the liquid-tight space containing a working liquid, and the liquid-cooled heat dissipation element having at least one fluid driving element, the at least one fluid driving element being located in the liquid-tight space.

[0008] Therefore, the heat dissipation system of the present invention can thermally contact a heat dissipation module, such as a heat pipe or fins, through the liquid-tight space containing the working fluid. When the at least one fluid-driving element creates disturbances in the working fluid, the heat energy from the heat dissipation module can be transferred to the working fluid, thereby dissipating the heat energy to the outside world. Furthermore, when the electronic component is operating at high performance, such as when overclocking causes a transient temperature increase, the electronic component generates a large amount of heat in a short period of time, which can be further transferred to the liquid-cooled heat sink. After the peak operating period of the electronic component has passed, the liquid-cooled heat sink can transfer the heat energy to the heat dissipation module, effectively cooling the electronic component to an appropriate temperature.

[0009] The heat dissipation module is selected from at least one of a heat pipe, a fin and a heat conducting member. Thus, the liquid cooling heat dissipation member can dissipate heat from the heat dissipation module.

[0010] The heat dissipation module has a heat pipe, and the liquid cooling heat dissipation element is combined with the heat pipe. Thus, the liquid cooling heat dissipation element can dissipate heat from the heat pipe.

[0011] The heat dissipation module comprises a heat pipe and a heat conductive member. The heat pipe is coupled to the electronic component via the heat conductive member, and the liquid cooling heat sink is in thermal contact with the heat pipe and the heat conductive member. This allows heat energy from the heat pipe and the heat conductive member to be transferred to the liquid cooling heat sink, enabling the liquid cooling heat sink to absorb heat more efficiently.

[0012] The heat dissipation system of the present invention further includes a heat dissipation fan. The heat dissipation module includes the heat pipe and a fin. One end of the heat pipe is connected to the electronic component, and the other end of the heat pipe is connected to the fin. The heat pipe and / or the fin are located in the airflow path of the heat dissipation fan. In this way, the fan can dissipate heat from the heat dissipation module.

[0013] The heat conducting member is a temperature averaging plate or a heat conducting metal plate, so that the heat conducting member can effectively absorb the heat energy of the electronic components.

[0014] The at least one fluid driving component may be an impeller or a pump, so that the at least one fluid driving component can create a disturbance effect on the working fluid.

[0015] The housing has a heat-conducting portion, which is combined with a ring wall and a cover. The heat-conducting portion, the ring wall, and the cover together form the liquid-tight space. In this way, the heat-conducting portion can absorb the heat energy of the heat dissipation module and transfer the heat energy to the working liquid.

[0016] The housing has a groove located in the heat conducting portion for accommodating the heat dissipation module. When the heat conducting portion is coupled to the heat conducting element, the heat dissipation module on the heat conducting element can be located in the groove, thereby enabling heat energy from the heat dissipation module and the heat conducting element to be transferred to the liquid cooling element.

[0017] The at least one fluid driving member has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet being connected to the liquid-tight space, and a flow channel being defined between the liquid inlet and the liquid outlet. Thus, the working fluid enters the flow channel from the liquid inlet and is then discharged into the liquid-tight space from the liquid outlet, thereby achieving a circulating flow effect.

[0018] The heat dissipation system of the present invention further includes a positioning member having a first surface and a second surface. The housing is coupled to the first surface, and the second surface has a coupling groove for accommodating the heat dissipation module. Thus, the positioning member can be used to stably couple the liquid-cooled heat sink, enabling the liquid-cooled heat sink to absorb heat more efficiently.

[0019] The heat dissipation system of the present invention includes a heat dissipation module for coupling with an electronic component and a liquid cooling heat sink as described above, coupled to the heat dissipation module. Thus, when the electronic component is operating at high performance, the large amount of heat generated by the electronic component in a short period of time can be further dissipated by the liquid cooling heat sink, effectively cooling the electronic component to an appropriate temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 : An exploded perspective view of the first embodiment of the present invention;

[0021] Figure 2 : Combination diagram of the first embodiment of the utility model;

[0022] Figure 3 :along Figure 2 AA line cross-section diagram;

[0023] Figure 4 : An exploded perspective view of the second embodiment of the present invention;

[0024] Figure 5 :like Figure 4 The cross-sectional view shown;

[0025] Figure 6 : An exploded perspective view of a third embodiment of the present invention;

[0026] Figure 7 : A combined diagram of the third embodiment of the present utility model;

[0027] Figure 8 :along Figure 7 BB line cross-section diagram;

[0028] Figure 9 : A cross-sectional view of at least one fluid driving member of the third embodiment of the present invention used in the first embodiment.

[0029] Description of reference numerals:

[0030] 1: Housing

[0031] 11: Heat transfer part

[0032] 11a: Joint surface

[0033] 12: Ring Wall

[0034] 13: Cover

[0035] 14: Slot

[0036] 2: Fluid drive components

[0037] 2a: Liquid inlet

[0038] 2b: Liquid outlet

[0039] 2c: Runner

[0040] 21: Impeller

[0041] 3: Positioning piece

[0042] 3a: First surface

[0043] 3b: Second surface

[0044] 31: Binding slot

[0045] M: Liquid cooling radiator

[0046] S: Liquid-tight space

[0047] L: working fluid

[0048] E: Electronic components

[0049] T: Heat pipe

[0050] I: Thermal Conductor

[0051] F: Cooling fan

[0052] F1: Air outlet

[0053] J: Fin

[0054] K: Heat dissipation module

[0055] G: Cooling system. DETAILED DESCRIPTION

[0056] In order to make the above and other objects, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are specifically cited below and described in detail with reference to the accompanying drawings; in addition, the same symbols in different drawings are regarded as the same and their descriptions are omitted.

[0057] Please refer to Figure 1 、 Figure 3 As shown, it is a first embodiment of the heat dissipation system G of the present invention, including a liquid-cooled heat sink M, which has a shell 1 and at least one fluid driving component 2. The at least one fluid driving component 2 is located in the shell 1, and the liquid-cooled heat sink M is in thermal contact with a heat dissipation module K.

[0058] The shell 1 can be made of a highly thermally conductive metal material such as copper, aluminum or iron. The shell 1 has a liquid-tight space S, and the liquid-tight space S has a working liquid L. Furthermore, the liquid-tight space S can be a closed space, and the working liquid L can only be located in the liquid-tight space S and will not be discharged. The working liquid L can be water or a non-conductive liquid. The shell 1 can be used to contact the heat dissipation module K, and the heat energy of the heat dissipation module K can be transferred to the working liquid L of the shell 1, thereby dissipating the heat of the heat dissipation module K. It is worth noting that the heat dissipation module K can be, for example, selected from at least one of a heat pipe, a fin and a heat conducting member, and the heat dissipation module K can absorb the heat energy generated by the operation of an electronic component E. In this way, the shell 1 can further transfer the heat energy of the above-mentioned heat dissipation module K to the working liquid L. In this embodiment, the shell 1 has a heat-conducting portion 11, which can absorb the heat energy of the heat dissipation module K. The heat-conducting portion 11 can be combined with a ring wall 12 and a cover 13. The heat-conducting portion 11, the ring wall 12 and the cover 13 can together form the liquid-tight space S.

[0059] Please refer to Figure 1 、 Figure 2 、 Figure 3 As shown, the at least one fluid driving component 2 is located in the liquid-tight space S. The at least one fluid driving component 2 is used to drive the flow of the working liquid L so that the heat transferred from the heat-conducting part 11 to the working liquid L can be evenly transferred to the entire working liquid L, thereby allowing the heat to be easily dissipated. For example, the at least one fluid driving component 2 can be one or more, and an appropriate number of fluid driving components 2 can be set according to the heat dissipation requirements or the size of the liquid-tight space S. The at least one fluid driving component 2 can have an impeller 21, and the rotation of the impeller 21 disturbs the working liquid L, so that the heat can be evenly transferred. In this embodiment, the at least one fluid driving component 2 can be located in the cover 13, and the cover 13 can be detachably connected to the ring wall 12 by, for example, screw locking. In this way, the at least one fluid driving component 2 can be easily repaired or replaced.

[0060] Please continue to refer to Figure 1 、 Figure 3 As shown, when the electronic component E needs to dissipate heat, the heat dissipation module K may include at least one heat pipe T to dissipate heat from the electronic component E through the at least one heat pipe T. For example, the at least one heat pipe T may be in direct contact with the electronic component E to absorb the heat energy generated by the electronic component E. Alternatively, the heat dissipation module K may include a heat conducting member I, such as a temperature vapor chamber or a heat-conducting metal plate, and the at least one heat pipe T may absorb the heat energy generated by the electronic component E by coupling with the heat conducting member I. Furthermore, the at least one heat pipe T may be connected to, for example, a fin J, absorbing the heat energy from the electronic component E and then transferring the heat energy to the fin J. In this embodiment, the heat dissipation system G may further include a cooling fan F. One end of the at least one heat pipe T may be in thermal contact with the heat conducting member I or the electronic component E, and the other end of the at least one heat pipe T may be coupled to the fin J, so that the at least one heat pipe T and / or the fin J are located in the airflow path of the cooling fan F. For example, when the cooling fan F introduces or extracts air through the air port F1 (such as an air inlet or an air outlet), the other end of the at least one heat pipe T can be adjacent to the air port F1, so that the air flow can pass through the other end of the at least one heat pipe T.

[0061] The liquid-cooled heat sink M can be combined with the at least one heat-conducting tube T to absorb the heat energy of the at least one heat-conducting tube T, so that the heat energy absorbed by the at least one heat-conducting tube T can be further transferred to the liquid-cooled heat sink M. Furthermore, the liquid-cooled heat sink M can directly contact the at least one heat-conducting tube T through the heat-conducting portion 11, or, in this embodiment, the liquid-cooled heat sink M is combined with the at least one heat-conducting tube T through a positioning member 3. The positioning member 3 can have a first surface 3a and a second surface 3b, and the second surface 3b and the first surface 3a can be respectively located on two opposite surfaces of the positioning member 3. The positioning member 3 has a coupling groove 31, which is located on the second surface 3b. The coupling groove 31 can be formed by being recessed in the second surface 3b, and the coupling groove 31 is used to accommodate the at least one heat-conducting tube T. In this way, the positioning member 3 can be coupled to the heat-conducting member I via the second surface 3b, and the at least one heat-conducting tube T on the heat-conducting member I can be located in the coupling groove 31. The first surface 3a can be used for stable coupling with the heat-conducting portion 11 of the liquid-cooled heat sink M. The heat energy of the at least one heat-conducting tube T and the heat-conducting member I can be evenly transferred to the first surface 3a, which has the effect of enabling the liquid-cooled heat sink M to absorb heat energy more efficiently. Therefore, when the electronic component E is operating at high efficiency, the large amount of heat energy generated by the electronic component E in a short period of time can not only be dissipated through the at least one heat-conducting tube T, but can also be further absorbed by the liquid-cooled heat sink M, thereby effectively reducing the electronic component E to an appropriate temperature.

[0062] Please refer to Figure 4 、 Figure 5 As shown, it is a second embodiment of the heat dissipation system G of the present invention. This embodiment is generally similar to the first embodiment described above. In this embodiment, the heat conducting portion 11 has a bonding surface 11a, which is used to couple with the heat conducting member I. The housing 1 of the liquid-cooled heat sink M may have a groove 14, which is located on the bonding surface 11a. The groove 14 may be formed by a depression in the bonding surface 11a, and the groove 14 may be used to accommodate the at least one heat pipe T. In this way, the liquid-cooled heat sink M is coupled to the heat conducting member I via the bonding surface 11a of the heat conducting portion 11, and the at least one heat pipe T on the heat conducting member I can be located in the groove 14, so that the heat energy of the at least one heat pipe T and the heat conducting member I can be transferred to the liquid-cooled heat sink M, which has the effect of enabling the liquid-cooled heat sink M to absorb heat energy more efficiently.

[0063] Please refer to Figure 6 、 Figure 7 、 Figure 8As shown, it is the third embodiment of the heat dissipation system G of the present invention. This embodiment is roughly the same as the second embodiment mentioned above. In this embodiment, the at least one fluid driving component 2 can be a pump. The at least one fluid driving component 2 can have a liquid inlet 2a and a liquid outlet 2b. The liquid inlet 2a and the liquid outlet 2b are connected to the liquid-tight space S, and a flow channel 2c is provided between the liquid inlet 2a and the liquid outlet 2b. Through the rotation of the impeller 21, the working liquid L can be driven from the liquid inlet 2a into the flow channel 2c, and then discharged to the liquid-tight space S through the liquid outlet 2b. Preferably, the liquid-tight space S can also have flow channels corresponding to the liquid inlet 2a and the liquid outlet 2b, so that the working liquid L can circulate easily. In this way, the at least one fluid driving component 2 can drive the working liquid L to circulate, which has the effect of allowing heat to be transferred to the working liquid L more evenly. It is worth mentioning that the at least one fluid driving element 2 disclosed in the first embodiment can also be replaced by the pump of the third embodiment (such as Figure 9 As shown), the at least one fluid driving component 2 is not limited to the form disclosed in the drawings of the various embodiments.

[0064] In summary, the heat dissipation system of the present invention can thermally contact a heat dissipation module, such as a heat pipe or fin, through the liquid-tight space containing the working fluid. When the at least one fluid-driving element disturbs the working fluid, the heat energy from the heat dissipation module can be transferred to the working fluid, thereby dissipating the heat energy to the external space. Furthermore, when the electronic component is performing high-performance operation, such as when overclocking causes a transient temperature increase, the electronic component generates a large amount of heat in a short period of time, which can be further transferred to the liquid-cooled heat dissipation module. After the peak operating period of the electronic component has passed, the liquid-cooled heat dissipation module transfers the heat energy to the heat dissipation module, effectively cooling the electronic component to an appropriate temperature.

[0065] Although the present invention has been disclosed using the preferred embodiments described above, they are not intended to limit the present invention. Any modifications and variations made by persons skilled in the art without departing from the spirit and scope of the present invention are still within the technical scope protected by the present invention. Therefore, the scope of protection of the present invention shall include all variations within the meaning and equivalents of the appended claims. Furthermore, if the above-mentioned embodiments can be combined, the present invention includes any combination of these embodiments.

Claims

1. A heat dissipation system, characterized in that: include: a heat dissipation module for combining an electronic component; and A liquid-cooled heat sink has a shell, the shell is in thermal contact with the heat dissipation module, the shell has a liquid-tight space, the liquid-tight space has a working liquid, and the liquid-cooled heat sink has at least one fluid driving component, and the at least one fluid driving component is located in the liquid-tight space.

2. The heat dissipation system according to claim 1, wherein: The heat dissipation module is selected from at least one of a heat pipe, a fin and a heat conducting member.

3. The heat dissipation system according to claim 1, wherein: The heat dissipation module has a heat pipe, and the liquid cooling heat dissipation element is combined with the heat pipe.

4. The heat dissipation system according to claim 1, wherein: The heat dissipation module comprises a heat pipe and a heat conducting member. The heat pipe is connected to the electronic component through the heat conducting member. The liquid cooling heat dissipation member is in thermal contact with the heat pipe and the heat conducting member.

5. The heat dissipation system according to claim 3 or 4, characterized in that: It also includes a cooling fan. The cooling module has the heat pipe and a fin. One end of the heat pipe is connected to the electronic component, and the other end of the heat pipe is connected to the fin. The heat pipe and / or the fin are located in the air flow path of the cooling fan.

6. The heat dissipation system according to claim 4, wherein: The heat conducting member is a temperature averaging plate or a heat conducting metal plate.

7. The heat dissipation system according to claim 1, wherein: The at least one fluid driving element may be an impeller or a pump.

8. The heat dissipation system according to claim 1, wherein: The shell has a heat-conducting part, which is combined with a ring wall and a cover. The heat-conducting part, the ring wall and the cover together form the liquid-tight space.

9. The heat dissipation system according to claim 8, wherein: The shell has a groove, which is located in the heat-conducting portion and is used to accommodate the heat dissipation module.

10. The heat dissipation system according to claim 1, wherein: The at least one fluid driving component has a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are connected to the liquid-tight space. A flow channel is defined between the liquid inlet and the liquid outlet.

11. The heat dissipation system according to claim 1, wherein: The housing further comprises a positioning member having a first surface and a second surface. The housing is coupled to the first surface. The second surface has a coupling groove for accommodating the heat dissipation module.

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