Efficient heat dissipation module assembly

Abstract

The utility model discloses an efficient heat radiation module assembly, which comprises a circuit assembly, a heat radiator, a heat conduction interface, a heat conduction buffer block and a base, the heat radiator and the base are spliced up and down, and the circuit assembly is fixedly arranged between the heat radiator and the base. The circuit assembly comprises a circuit board used for transmitting signals and heating devices, the heating devices are distributed and installed on the circuit board, a heat conduction interface and a heat conduction cache block are arranged between the radiator and the heating devices and are tightly stacked and connected, and an interface material with high heat conductivity is added in a heat conduction path. One side of the heat conduction interface material is attached to the radiator in a large area, the other side is attached to the heating body in a soft contact mode, heat of the heating body is rapidly conducted out and conducted to the radiator, and the rapid heat dissipation effect is achieved.

Description

Technical Field

[0001] The utility model relates to the field of communication equipment, and in particular to a high-efficiency heat dissipation module component. Background Art

[0002] With the continuous expansion of emerging Internet technologies such as big data, cloud computing, and artificial intelligence, data centers have become indispensable basic communications infrastructure. Electrical connectors, as a key medium for transmitting data between different data devices, offer the advantages of stable and reliable signal transmission and low cost. As data traffic increases, the demand for electrical connectors is also increasing. At the same time, the required communication speeds are also increasing, placing higher and higher demands on the transmission speeds of electrical connectors.

[0003] To achieve higher speeds (such as 800Gbps and 1.6Tbps), the circuits used in pluggable network interface (SFF) optical modules or electrical connectors in high-speed cable modules have become more complex, requiring a corresponding increase in the variety and number of components, significantly increasing circuit wiring density, and consequently, increasing total power consumption. This high power consumption generates a significant increase in heat, which in turn causes a sudden increase in heat generation in electrical connectors. This high heat can accelerate component aging and even failure, leading to unreliable and unstable signal transmission. The need for high-speed, reliable signal transmission and the associated high power consumption and high temperatures have become an unavoidable conflict that must be resolved urgently, making heat dissipation a particularly prominent issue. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a high-efficiency heat dissipation module assembly to solve the current pain points in this field.

[0005] The above technical objectives of the present invention are achieved through the following technical solutions:

[0006] A high-efficiency heat dissipation module assembly includes a circuit assembly, a heat sink, a thermal interface, a thermal buffer block, and a housing. The heat sink and the housing are assembled vertically, the circuit assembly is fixedly installed between the heat sink and the housing, the circuit assembly includes a circuit board for transmitting signals and a heating device, the heating device is distributed and installed on the circuit board, and a thermal interface and a thermal buffer block are provided between the heat sink and the heating device for close stacking and connection.

[0007] The thermally conductive interface is a large-area, high-thermal-conductivity interface material. A boss feature is provided on the thermally conductive interface. The convex surface of the boss feature is in close contact with the thermally conductive buffer block, and the thermally conductive buffer block is in close contact with the heating device.

[0008] It is further explained that a heat-conducting block is provided in the recess on the other side of the boss feature. The heat-conducting block is made of a material with high thermal conductivity, and the other side of the heat-conducting block is in close contact with the heat sink.

[0009] It is further explained that the radiator is an open radiator, which includes hard radiating fins and a radiating base. The hard radiating fins are distributed on the radiating base to form open contact with the outside world.

[0010] Preferably, the radiator is a closed radiator, and the radiator further comprises a hard closed cover plate, and the hard closed cover plate, the hard heat dissipation fins and the heat dissipation base form a cavity channel.

[0011] To sum up, the beneficial effects of the present invention compared with the prior art are: adding an interface material with high thermal conductivity in the heat conduction path, one side of the thermal interface material is bonded to the radiator over a large area, and the other side is in soft contact with the heating element, which quickly conducts the heat of the heating element to the radiator, thereby achieving a rapid heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other objects, features and advantages of the exemplary embodiments of the present invention will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, in which:

[0013] Figure 1 It is a structural diagram of a high-efficiency heat dissipation module component;

[0014] Figure 2 This is a schematic structural diagram of an embodiment of the present utility model;

[0015] Figure 3 This is a side structural diagram of an embodiment of the present utility model;

[0016] Figure 4 This is a structural diagram of another embodiment of the present utility model;

[0017] Figure 5 This is a side structural diagram of another embodiment of the present invention.

[0018] Explanation of the accompanying drawings: 1. Circuit assembly; 11. Circuit board; 12. Heat-generating device; 2. Radiator; 21. Hard heat-dissipating fins; 22. Heat-dissipating base; 23. Hard closed cover; 3. Thermal interface; 31. Thermal block; 311. Boss feature; 4. Thermal buffer block; 5. Housing. DETAILED DESCRIPTION

[0019] The utility model is further described in detail below with reference to the accompanying drawings.

[0020] The following embodiment is a high-efficiency heat dissipation module assembly, including a circuit assembly 1, a heat sink 2, a thermal interface 3, a thermal buffer block 4, and a shell 5. The heat sink 2 and the shell 5 are spliced together up and down, and the circuit assembly 1 is fixedly installed between the heat sink 2 and the shell 5. The circuit assembly 1 includes a circuit board 11 and a heating device 12 for transmitting signals. The heating device 12 is distributed and installed on the circuit board 11. A thermal interface 3 and a thermal buffer block 4 are tightly stacked and connected between the heat sink 2 and the heating device 12.

[0021] The thermal interface 3 is a large-area, high-thermal-conductivity interface material, such as copper / graphite / VC heat spreader, etc. A boss feature 311 is provided on the thermal interface 3, and the convex surface of the boss feature 311 is in close contact with the thermal buffer block 4, and the thermal buffer block 4 is in close contact with the heating device 12. A thermal block 31 is provided in the depression on the other side of the boss feature 311, and the thermal block 31 is made of a high-thermal-conductivity material such as copper / graphite / VC heat spreader / heat pad / heat grease / heat mud, etc. The other side of the thermal block 31 is in close contact with the radiator 2, which can transfer heat from the main heating area to the radiator 2 more quickly.

[0022] The radiator 2 is an open radiator, and includes hard radiating fins 21 and a radiating base 22. The hard radiating fins 21 are distributed on the radiating base 22 to form an open contact with the outside world, making it easier for air to circulate and remove heat.

[0023] In another embodiment, the radiator 2 is a closed radiator, and the radiator 2 further includes a hard closed cover 23. The hard closed cover 23, the hard heat dissipation fins 21 and the heat dissipation base 22 form a cavity channel to facilitate air circulation to remove heat.

[0024] In the heat propagation path, heat is emitted from the heating device 12 area, and the heat is quickly transmitted to the thermal interface 3 through the thermal buffer block 4. After the heat is conducted to the thermal interface 3, it is quickly dispersed over a large area and is tightly connected to the radiator 2 over a large area through the thermal interface 3. After the heat is conducted to the radiator 2, heat exchange is formed with the external environment, thereby achieving an efficient heat dissipation effect.

[0025] The above description is merely an exemplary embodiment of the present invention and is not intended to limit the scope of protection of the present invention. The scope of protection of the present invention is determined by the appended claims.

Claims

1. A high-efficiency heat dissipation module assembly, characterized by: The invention comprises a circuit assembly (1), a heat sink (2), a heat conduction interface (3), a heat conduction buffer block (4), and a shell (5). The heat sink (2) and the shell (5) are assembled up and down. The circuit assembly (1) is fixedly installed between the heat sink (2) and the shell (5). The circuit assembly (1) comprises a circuit board (11) for transmitting signals and a heating device (12). The heating device (12) is distributed and installed on the circuit board (11). A heat conduction interface (3) and a heat conduction buffer block are arranged between the heat sink (2) and the heating device (12) and are tightly stacked and connected. The heat conduction interface (3) is a large-area, high-thermal-conductivity interface material. A boss feature (311) is arranged on the heat conduction interface (3). The convex surface of the boss feature (311) is in tight contact with the heat conduction buffer block (4). The heat conduction buffer block (4) is in tight contact with the heating device (12).

2. The high-efficiency heat dissipation module assembly according to claim 1, characterized in that: A heat conducting block (31) is provided in the recess on the other side of the boss feature (311). The heat conducting block (31) is made of a material with high thermal conductivity. The other side of the heat conducting block (31) is in close contact with the heat sink (2).

3. The high-efficiency heat dissipation module assembly according to claim 1, characterized in that: The radiator (2) is an open radiator (2), comprising hard radiating fins (21) and a radiating base (22), wherein the hard radiating fins (21) are distributed on the radiating base (22) to form open contact with the outside world.

4. The high-efficiency heat dissipation module assembly according to claim 3, characterized in that: The radiator (2) is a closed radiator (2), and the radiator (2) further comprises a hard closed cover plate (23), wherein the hard closed cover plate (23), the hard heat dissipation fins (21) and the heat dissipation base (22) form a cavity channel.

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