Cooling device and high-density server
By designing the cooling structure in the cooling device in direct contact with the assembly vest, and using parallel runners and multi-point liquid inlet and discharge structures, the problem of excessively long runners of the liquid-cooled plate is solved, and efficient and uniform cooling effect is achieved, improving the heat exchange performance and stability of the high-density server.
Patent Information
- Application Number
- CN202521440446.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-10
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2035-07-10
AI Technical Summary
The internal runner design of the liquid-cooled plate is relatively complicated, resulting in too long runners, affecting the cooling efficiency.
The cooling structure in the cooling device is used to directly contact the assembly vest, and a parallel runner and a multi-point liquid inlet and discharge structure are designed to form a complete circulation system, shorten the runner length and optimize the flow of the medium.
It improves cooling efficiency and uniformity, reduces thermal resistance, ensures smooth flow of cooling medium, and enhances heat exchange performance and system stability.
Smart Images
Figure CN223219382U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of servers, and in particular to a cooling device and a high-density server. Background Art
[0002] In server technology, the rapidly growing demand for data processing has led to the increasing importance of high-density server designs. These servers aim to minimize physical space while maximizing computing power and storage capacity, but this also presents a heat dissipation challenge. Traditional air cooling methods struggle with the concentrated heat sources found in high-density layouts. This is especially true when high-performance components such as CPUs, DIMMs (dynamic random access memory), and CPU VRs (voltage regulators) are densely packed. Air cooling often struggles to effectively remove the generated heat, impacting system stability and performance.
[0003] In the existing technology, liquid-cooled cold plate heat dissipation method is favored due to its high efficiency and stability, especially in the field of high-density servers. It directly cools the heat source through the forced circulation of liquid medium, significantly improving the heat dissipation efficiency.
[0004] However, in order to cover all high-power consumption components, the internal flow channels of liquid-cooled cold plates are usually designed to be very complex. Although this ensures that the cooling medium flows through all heat sources, the flow resistance increases as the total length of the flow channel increases, reducing the cooling efficiency. Utility Model Content
[0005] The present application provides a cooling device and a high-density server to at least solve the problem in the related art that the internal flow channel design of the liquid-cooled cold plate is relatively complex, resulting in an excessively long flow channel, thereby affecting the cooling efficiency.
[0006] The present application provides a cooling device, comprising: a machine base, having a first mounting part and a second mounting part, the first mounting part being used to mount an assembly vest, the assembly vest being mounted on a part to be cooled; a cooling assembly, comprising a liquid inlet structure, a cooling structure and a liquid discharge structure, the cooling structure being arranged on the second mounting part, the cooling structure having a circulation circuit, the liquid inlet structure being connected to the liquid discharge structure through the circulation circuit to transport a cooling medium into the circulation circuit; wherein, at least a portion of the cooling structure is in contact with the assembly vest to cool the part to be cooled.
[0007] Furthermore, the circulation circuit includes at least two first flow channels arranged parallel to each other, and every two adjacent first flow channels are connected to each other.
[0008] Furthermore, the liquid inlet structure has at least two liquid inlet parts, and there are at least two cooling structures, and the at least two liquid inlet parts are arranged in a one-to-one correspondence with the at least two cooling structures, and each liquid inlet part is connected to the circulation circuit of the corresponding cooling structure; the liquid discharge structure has at least two liquid discharge parts, and the at least two liquid discharge parts are arranged in a one-to-one correspondence with the at least two cooling structures, and each liquid discharge part is connected to the circulation circuit of the corresponding cooling structure.
[0009] Furthermore, the liquid inlet structure also has a liquid inlet and a second flow channel, and the liquid inlet is connected to each liquid inlet part through the second flow channel: wherein the first flow channel and the second flow channel are arranged at an angle.
[0010] Furthermore, at least two cooling structures are arranged parallel to each other; and / or the flow directions of the media in all circulation circuits are consistent.
[0011] Furthermore, the first mounting portion is a protrusion, and the assembly vest is overlapped on the protrusion to be connected to the protrusion through fasteners, or clamped, or bonded, or welded, or riveted; the second mounting portion is a groove, and the opening of the groove is set towards the assembly vest.
[0012] Furthermore, the cooling structure and the second mounting portion are welded or riveted.
[0013] Furthermore, the cooling structure is a first copper tube, the middle part of which is connected to both the liquid inlet and the liquid discharge part; the cooling assembly also includes: a sealing structure, which is arranged on at least one end of the first copper tube to seal the end.
[0014] Furthermore, the first copper tube has a first through hole; the liquid inlet structure is a second copper tube, the second copper tube has a second through hole, a first flange structure is provided at the second through hole, the first flange structure and the second through hole form a liquid inlet portion, the first flange structure extends into the first through hole to connect the first through hole with the second through hole; the liquid discharge structure is a third copper tube, the third copper tube has a third through hole, a second flange structure is provided at the third through hole, the second flange structure and the third through hole form a liquid discharge portion, the second flange structure extends into the first through hole to connect the first through hole with the third through hole.
[0015] The present application also provides a high-density server, including a memory structure, an assembly vest and a cooling device, wherein the memory structure is the part to be cooled; there is one cooling device; or, there are multiple cooling devices, and the multiple cooling structures are arranged at intervals along the length direction and / or width direction of the high-density server; wherein the cooling device is the above-mentioned cooling device.
[0016] By applying the technical solution of the present application, the cooling structure in the cooling assembly is in direct contact with the assembly vest, and the assembly vest is in close contact with the part to be cooled, thereby ensuring that heat can be directly transferred from the part to be cooled to the cooling medium, thereby improving the cooling efficiency. The circulation loop design of the cooling structure shortens the overall flow channel length while fully covering and contacting the part to be cooled, and can be directly or more quickly transferred to the cooling medium, reducing thermal resistance, improving the speed and efficiency of heat transfer, and ensuring that the cooling medium can flow smoothly during the entire cooling process, thereby improving the overall heat exchange performance, and thus solving the problem in the related art that the internal flow channel design of the liquid-cooled cold plate is relatively complex, resulting in an excessively long flow channel, thereby affecting the cooling efficiency. At the same time, the liquid inlet structure and the liquid discharge structure are connected through the circulation loop of the cooling structure to form a complete circulation system to ensure the continuous flow of the cooling medium. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0018] Figure 1 A schematic diagram of the three-dimensional structure of a cooling device provided in an embodiment of the present application;
[0019] Figure 2 Shown Figure 1 A schematic diagram of the three-dimensional structure of the base of the cooling device;
[0020] Figure 3 Shown Figure 1 A schematic diagram of the three-dimensional structure of the cooling structure of the cooling device in FIG.
[0021] Figure 4 Shown Figure 1 A schematic diagram of the three-dimensional structure of the liquid inlet structure of the cooling device;
[0022] Figure 5 A schematic diagram of the three-dimensional structure of a high-density server provided in an embodiment of the present application.
[0023] The above drawings include the following reference numerals:
[0024] 10. Machine base; 11. First mounting portion; 12. Second mounting portion;
[0025] 20. Assemble the vest;
[0026] 30. Cooling section;
[0027] 40. Cooling assembly; 41. Liquid inlet structure; 411. Liquid inlet portion; 412. Liquid inlet; 413. First flange structure; 42. Cooling structure; 421. First flow channel; 422. First through hole; 43. Liquid drainage structure;
[0028] 100. Cooling device. DETAILED DESCRIPTION
[0029] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0030] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0031] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0032] In order to solve the problem in the related art that the internal flow channel design of the liquid-cooled cold plate is relatively complex, resulting in an excessively long flow channel, which in turn affects the cooling efficiency, the present application provides a cooling device and a high-density server.
[0033] like Figures 1 to 5 As shown, the cooling device includes a base 10 and a cooling assembly 40. The base 10 has a first mounting portion 11 and a second mounting portion 12. The first mounting portion 11 is used to mount an assembly vest 20, which is mounted on the portion to be cooled 30. The cooling assembly 40 includes a liquid inlet structure 41, a cooling structure 42, and a liquid discharge structure 43. The cooling structure 42 is disposed on the second mounting portion 12. The cooling structure 42 has a circulation circuit. The liquid inlet structure 41 is connected to the liquid discharge structure 43 through the circulation circuit to transport cooling medium into the circulation circuit. At least a portion of the cooling structure 42 is in contact with the assembly vest 20 to cool the portion to be cooled 30.
[0034] By applying the technical solution of this embodiment, the cooling structure 42 in the cooling assembly 40 is in direct contact with the assembly vest 20, and the assembly vest 20 is in close contact with the part to be cooled 30, thereby ensuring that heat can be directly transferred from the part to be cooled 30 to the cooling medium, thereby improving the cooling efficiency. The circulation loop design of the cooling structure 42 shortens the overall flow channel length while fully covering and contacting the part to be cooled 30, and can be directly or more quickly transferred to the cooling medium, reducing thermal resistance, improving the speed and efficiency of heat transfer, and ensuring that the cooling medium can flow smoothly throughout the cooling process, thereby improving the overall heat exchange performance, and thus solving the problem in the related art that the internal flow channel design of the liquid-cooled cold plate is relatively complex, resulting in an excessively long flow channel, thereby affecting the cooling efficiency. At the same time, the liquid inlet structure 41 and the liquid discharge structure 43 are connected through the circulation loop of the cooling structure 42 to form a complete circulation system to ensure the continuous flow of the cooling medium.
[0035] Optionally, the circulation circuit includes at least two first flow channels 421 arranged parallel to each other, with each adjacent first flow channels 421 interconnected. Thus, the design of the parallel first flow channels 421 ensures uniform distribution of the cooling medium within the cold plate, avoiding the problem of insufficient local cooling due to uneven fluid pressure. Furthermore, the connection between adjacent flow channels further promotes uniform fluid flow, helping to improve the uniformity of the cooling effect and ensure that all parts to be cooled are adequately cooled.
[0036] In this embodiment, the circulation circuit includes two parallel first flow channels 421, with each adjacent pair of first flow channels 421 interconnected. Thus, the circulation circuit design comprising two parallel and interconnected first flow channels 421 can significantly improve the cooling uniformity, cooling efficiency, and system adaptability of the cooling device, while reducing flow resistance, maintenance difficulty, and material usage.
[0037] Optionally, the liquid inlet structure 41 has at least two liquid inlets 411, and there are at least two cooling structures 42. The at least two liquid inlets 411 are arranged in a one-to-one correspondence with the at least two cooling structures 42, and each liquid inlet 411 is connected to the circulation circuit of its corresponding cooling structure 42; the liquid discharge structure 43 has at least two liquid discharge parts, and the at least two liquid discharge parts are arranged in a one-to-one correspondence with the at least two cooling structures 42, and each liquid discharge part is connected to the circulation circuit of its corresponding cooling structure 42. In this way, since each cooling structure 42 has a pair of dedicated liquid inlets and discharge parts, this ensures that the cooling medium circulates independently in each cooling structure, avoiding uneven distribution of the fluid within the cooling system, making the cooling effect more uniform across all parts to be cooled, and reducing the risk of local overheating. At the same time, the independent liquid inlets and discharge parts reduce the flow pressure of the cooling medium in the entire system. Compared with the design of a single liquid inlet and discharge port, this multi-point entry and exit method reduces the pressure loss of the fluid through a narrow path and reduces the overall flow resistance.
[0038] In this embodiment, the liquid inlet structure 41 has two liquid inlet portions 411, and there are two cooling structures 42. The two liquid inlet portions 411 are provided in a one-to-one correspondence with the two cooling structures 42, and each liquid inlet portion 411 is connected to the circulation circuit of its corresponding cooling structure 42. The liquid discharge structure 43 has two liquid discharge portions, which are provided in a one-to-one correspondence with the two cooling structures 42, and each liquid discharge portion is connected to the circulation circuit of its corresponding cooling structure 42. In this way, the above arrangement can provide more uniform cooling, reduce flow resistance, improve cooling efficiency and system reliability, and optimize fluid management, providing a more efficient and stable cooling solution for high-density servers and high-performance computing equipment, while also facilitating system maintenance and expansion.
[0039] like Figure 4 As shown, the liquid inlet structure 41 further includes a liquid inlet 412 and a second flow channel, with the liquid inlet 412 communicating with each liquid inlet portion 411 via the second flow channel. The first flow channel 421 is arranged at an angle to the second flow channel. This arrangement of the second flow channel allows the cooling medium entering from the liquid inlet 412 to be evenly distributed to each liquid inlet portion 411 and then to the corresponding cooling structure 42, thereby avoiding uneven distribution of the fluid before entering the cooling structure, ensuring a relatively consistent flow of the cooling medium in each cooling structure, and improving the uniformity and effectiveness of cooling.
[0040] In this embodiment, by setting the angle between the liquid inlet 412 in the liquid inlet structure 41, the second flow channel and the first flow channel 421 in the cooling structure 42 and optimizing the fluid distribution, the distribution uniformity of the cooling medium can be improved, the fluid resistance can be reduced, the cooling efficiency can be enhanced, the system stability can be improved, and the maintenance cost can be reduced.
[0041] Optionally, the first flow channel 421 and the second flow channel are arranged perpendicular to each other.
[0042] Optionally, at least two cooling structures 42 are arranged parallel to each other; and / or the medium flow direction within all circulation circuits is consistent. Thus, when the cooling structures 42 are arranged parallel to each other and the medium flow direction within the circulation circuits is consistent, all components to be cooled can receive the same cooling effect. This consistency helps reduce temperature differences between different components, avoids local overheating, and improves the thermal stability and reliability of the entire system or device. Furthermore, this arrangement can enhance cooling consistency and efficiency, reduce system complexity and manufacturing costs, improve system redundancy and reliability, and simplify maintenance procedures.
[0043] In this embodiment, the two cooling structures 42 are arranged parallel to each other, and the flow directions of the media in all circulation circuits are consistent.
[0044] Optionally, the first mounting portion 11 is a protrusion, and the assembly vest 20 is overlapped on the protrusion to be connected to the protrusion by fasteners, or clamping, or bonding, or welding, or riveting. In this way, the protrusion, as the first mounting portion 11, can provide additional mechanical support to ensure that the assembly vest 20 is firmly fixed on the cold plate or other substrate. Through fasteners, clamping, bonding, welding or riveting and other connection methods, the mechanical connection between the components is strengthened and the stability of the structure is improved. At the same time, the above-mentioned arrangement makes the connection method between the assembly vest 20 and the protrusion more diverse to meet different usage requirements and working conditions, and also improves the processing flexibility of the staff.
[0045] In this embodiment, the first mounting portion 11 is a protrusion, and the assembly vest 20 is overlapped on the protrusion and connected to the protrusion through fasteners, so that the assembly vest 20 and the first mounting portion 11 can be assembled and disassembled more easily and simply, thereby reducing the difficulty of assembly and disassembly of the two.
[0046] Optionally, the second mounting portion 12 is a groove, with the opening of the groove facing the assembly vest 20. This arrangement of the groove allows the assembly vest 20 to more closely contact the first mounting portion 11 of the cold plate or other substrate, increasing the contact surface area and helping to improve the efficiency of heat transfer from the portion to be cooled to the cooling medium, thereby enhancing the cooling effect. Furthermore, by orienting the opening of the groove toward the assembly vest 20, the cooling structure 42 mounted within the groove can directly contact the assembly vest 20, thereby cooling the assembly vest 20.
[0047] Optionally, the cooling structure 42 is welded or riveted to the second mounting portion 12. Thus, the above arrangement improves the connection stability between the cooling structure 42 and the second mounting portion 12, and prevents the two from being separated from each other and affecting the overall structural stability of the cooling device.
[0048] In this embodiment, the cooling structure 42 and the second mounting portion 12 are separate structures and are welded together.
[0049] Optionally, the cooling structure 42 is a first copper tube, and the middle part of the first copper tube is connected to both the liquid inlet part 411 and the liquid discharge part. The cooling assembly 40 also includes a sealing structure, which is arranged on at least one end of the first copper tube to seal the end. In this way, the first copper tube serves as the cooling structure 42. Due to the high thermal conductivity of copper, it can quickly and effectively transfer heat from the part to be cooled to the cooling medium, thereby improving the heat exchange efficiency and accelerating the cooling process. At the same time, the middle part of the first copper tube is directly connected to the liquid inlet part 411 and the liquid discharge part, forming a direct cooling medium circulation path, thereby reducing the path length and the number of turns of the fluid flow, reducing the fluid resistance, ensuring the smooth flow of the cooling medium, and improving the circulation efficiency of the cooling device.
[0050] In this embodiment, there are two blocking structures, which are respectively provided at both ends of the first copper tube to block the open ends of the first copper tube.
[0051] Optionally, the sealing structure is a rubber plug.
[0052] Optionally, the first copper tube has a first through hole 422; the liquid inlet structure 41 is a second copper tube, the second copper tube has a second through hole, a first flange structure 413 is provided at the second through hole, the first flange structure 413 and the second through hole form a liquid inlet portion 411, the first flange structure 413 extends into the first through hole 422 to connect the first through hole 422 with the second through hole. The drainage structure 43 is a third copper tube, the third copper tube has a third through hole, a second flange structure is provided at the third through hole, the second flange structure and the third through hole form a drainage portion, the second flange structure extends into the first through hole 422 to connect the first through hole 422 with the third through hole. In this way, the copper tube directly connects the first through hole 422 of the first copper tube with the liquid inlet portion 411 formed by the second copper tube and the drainage portion formed by the third copper tube, thereby achieving a high degree of integration of the internal structure of the cooling device, reducing the number of connectors, simplifying the system design, and improving the compactness and integration of the entire cooling device.
[0053] In this embodiment, both the first flange structure and the second flange structure extend into the first through hole 422 to prevent the cooling medium from leaking at the connection.
[0054] like Figure 5 As shown, the present application also provides a high-density server, including a memory structure, an assembly vest 20, and a cooling device 100. The memory structure is a portion to be cooled 30; there is one cooling device 100; or there are multiple cooling devices 100, and multiple cooling structures 42 are spaced apart along the length direction and / or width direction of the high-density server. The cooling device 100 is the above-mentioned cooling device.
[0055] Specifically, when there are multiple cooling devices 100, the interval setting of the multiple cooling devices 100 can optimize the distribution and flow of the fluid, reduce local flow resistance, ensure the uniform circulation of the cooling medium inside the server, avoid the formation of hot spots, and improve the thermal balance performance of the high-density server.
[0056] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:
[0057] The cooling structure in the cooling assembly is in direct contact with the assembly vest, which is in close contact with the part to be cooled, thereby ensuring that heat can be directly transferred from the part to be cooled to the cooling medium, thereby improving the cooling efficiency. The circulation loop design of the cooling structure shortens the overall flow channel length while fully covering and contacting the part to be cooled. It can be transferred directly or more quickly to the cooling medium, reducing thermal resistance, improving the speed and efficiency of heat transfer, and ensuring that the cooling medium can flow smoothly throughout the cooling process, thereby improving the overall heat exchange performance, thereby solving the problem in the related art that the internal flow channel design of the liquid-cooled cold plate is relatively complex, resulting in an excessively long flow channel, thereby affecting the cooling efficiency. At the same time, the liquid inlet structure and the liquid discharge structure are connected through the circulation loop of the cooling structure to form a complete circulation system to ensure the continuous flow of the cooling medium.
[0058] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the method and core ideas of this application. It should be noted that for those skilled in the art, without departing from the principles of this application, various improvements and modifications can be made to this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.
Claims
1. A cooling device, characterized in that: include: A machine base (10) has a first mounting portion (11) and a second mounting portion (12), wherein the first mounting portion (11) is used to mount an assembly vest (20), and the assembly vest (20) is mounted on the portion to be cooled (30); A cooling assembly (40) comprising a liquid inlet structure (41), a cooling structure (42), and a liquid discharge structure (43), wherein the cooling structure (42) is disposed on the second mounting portion (12), the cooling structure (42) having a circulation circuit, and the liquid inlet structure (41) is connected to the liquid discharge structure (43) via the circulation circuit to transport a cooling medium into the circulation circuit; Wherein, at least a portion of the cooling structure (42) is in contact with the assembled vest (20) to cool the portion to be cooled (30).
2. The cooling device according to claim 1, characterized in that The circulation circuit comprises at least two first flow channels (421) arranged in parallel with each other, and every two adjacent first flow channels (421) are connected to each other.
3. The cooling device according to claim 2, characterized in that The liquid inlet structure (41) has at least two liquid inlet parts (411), and there are at least two cooling structures (42). The at least two liquid inlet parts (411) are arranged in a one-to-one correspondence with the at least two cooling structures (42), and each liquid inlet part (411) is connected to the circulation circuit of the corresponding cooling structure (42); the liquid discharge structure (43) has at least two liquid discharge parts, and the at least two liquid discharge parts are arranged in a one-to-one correspondence with the at least two cooling structures (42), and each liquid discharge part is connected to the circulation circuit of the corresponding cooling structure (42).
4. The cooling device according to claim 3, characterized in that The liquid inlet structure (41) further comprises a liquid inlet (412) and a second flow channel, wherein the liquid inlet (412) is connected to each of the liquid inlet portions (411) via the second flow channel, wherein the first flow channel (421) and the second flow channel are arranged at an angle.
5. The cooling device according to claim 1, characterized in that At least two cooling structures (42) are arranged parallel to each other; and / or the flow directions of the media in all the circulation circuits are consistent.
6. The cooling device according to claim 1, characterized in that The first mounting portion (11) is a protrusion, and the assembly vest (20) is overlapped on the protrusion to be connected to the protrusion through fasteners, or clamped, or bonded, or welded, or riveted; the second mounting portion (12) is a groove, and the opening of the groove is arranged toward the assembly vest (20).
7. The cooling device according to claim 1, characterized in that The cooling structure (42) and the second mounting portion (12) are welded or riveted.
8. The cooling device according to claim 3, characterized in that The cooling structure (42) is a first copper tube, the middle portion of which is in communication with both the liquid inlet portion (411) and the liquid outlet portion; the cooling assembly (40) further comprises: A blocking structure is provided on at least one end of the first copper tube to block the end.
9. The cooling device according to claim 8, characterized in that The first copper tube has a first through hole (422); the liquid inlet structure (41) is a second copper tube, the second copper tube has a second through hole, a first flange structure (413) is provided at the second through hole, the first flange structure (413) and the second through hole form the liquid inlet portion (411), the first flange structure (413) extends into the first through hole (422) so that the first through hole (422) and the second through hole are connected; the liquid discharge structure (43) is a third copper tube, the third copper tube has a third through hole, a second flange structure is provided at the third through hole, the second flange structure and the third through hole form the liquid discharge portion, the second flange structure extends into the first through hole (422) so that the first through hole (422) and the third through hole are connected.
10. A high-density server, characterized in that: The invention comprises a memory structure, an assembly vest (20) and a cooling device (100), wherein the memory structure is a portion to be cooled (30); the cooling device (100) is one; or, the cooling device (100) is multiple, and the multiple cooling structures (42) are arranged at intervals along the length direction and / or width direction of the high-density server; wherein the cooling device (100) is the cooling device according to any one of claims 1 to 9.