SMT (Surface Mount Technology) carrier for USB (Universal Serial Bus)

Abstract

The utility model relates to the technical field of USB (Universal Serial Bus) connectors, in particular to an SMT (Surface Mount Technology) carrier for a USB, which comprises a body, the top of the body is provided with a first placing groove used for placing a PCB and a second placing groove used for placing a USB interface. The first placing groove is provided with a positioning pin used for fixing the PCB. The second placing groove is provided with a positioning stop block used for fixing the USB interface. A magnet is arranged at the position, corresponding to the second containing groove, of the bottom of the PCB. According to the utility model, the PCB is placed in the first placing groove of the body through the positioning pin, and the USB interface is fixed in the second placing groove through the magnet and the positioning stop block, so that the whole structure is stable and reliable, the PCB and the USB interface are prevented from loosening, a plurality of products can be welded at one time, and the working efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of USB connectors, in particular to a USB SMT mounting tool. Background Art

[0002] In the electronics manufacturing industry, surface mount technology (SMT) has become a key process for assembling electronic components. Due to its high density, miniaturization, and high degree of automation, SMT has been widely used in various electronic products. SMT is particularly indispensable for small, delicate electronic components like USB ports.

[0003] However, in practice, traditional SMT placement methods often suffer from low precision, inefficiency, and component damage when placing these delicate components. This is especially true for critical components like USB ports, where even the slightest deviation can lead to unstable connections or signal transmission issues, impacting overall product performance.

[0004] Existing SMT placement methods and carriers also exhibit some shortcomings when handling USB interfaces. For example, inaccurate positioning can lead to positional deviation during the placement process, thus affecting final product quality. Furthermore, the way traditional carriers secure USB components is not reliable. During high-speed placement, components may become loose or even fall off, increasing the defect rate during production, such as causing poor soldering and other issues, and thus reducing overall production efficiency. Utility Model Content

[0005] The purpose of the utility model is to provide a USB SMT mounting tool to address the above-mentioned deficiencies in the prior art.

[0006] The purpose of the utility model is achieved through the following technical solutions: A USB SMT mounting device, comprising a body; a first placement groove for placing a PCB board and a second placement groove for placing a USB interface are provided on the top of the body;

[0007] The first placement slot is provided with a positioning pin for fixing the PCB board; the second placement slot is provided with a positioning block for fixing the USB interface; and a magnet is provided at the bottom of the PCB board at a corresponding position of the second placement slot.

[0008] The present invention is further configured such that a second placement groove is provided at both ends of the first placement groove.

[0009] The present invention is further configured such that the depth of the second placement groove is greater than the depth of the first placement groove.

[0010] The present invention is further configured such that a plurality of reflow soldering through holes are provided through the first placement groove.

[0011] The present invention is further configured such that a tin melting notch is provided on a side wall of the reflow soldering through hole close to one end of the second placement groove.

[0012] The utility model is further configured such that a guiding inclined surface is provided on the top of the positioning block.

[0013] The present invention is further configured such that the second placement slot is provided with a through hole; and the magnet is arranged at the bottom of the through hole.

[0014] The present invention is further configured such that two sides of the body are provided with clearance notches; the depth of the clearance notches is greater than the depth of the first placement groove.

[0015] The present invention is further configured such that a plurality of fixing holes are provided through the body.

[0016] The utility model is further configured such that the magnet is a high temperature resistant strong magnet.

[0017] The beneficial effects of the utility model are as follows: the utility model places the PCB board in the first placement groove of the main body through the positioning pin, and fixes the USB interface in the second placement groove through the magnet and the positioning block, so that the overall structure is stable and reliable, prevents the PCB board and the USB interface from loosening, and can weld multiple products at one time, effectively improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without making any creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the utility model in cooperation with the PCB board and the USB interface;

[0020] Figure 2 This is a structural diagram of the present invention in cooperation with the PCB board and the USB interface from another perspective;

[0021] Figure 3 It is a structural diagram of the utility model;

[0022] Among them: 1. Main body; 2. First placement slot; 21. Positioning pin; 22. Reflow soldering through hole; 23. Tin melting notch; 3. Second placement slot; 31. Positioning block; 32. Guide slope; 4. Magnet; 41. Perforation; 5. Clearance notch; 6. Fixing hole; 7. PCB board; 8. USB interface. DETAILED DESCRIPTION

[0023] The present invention will be further described with reference to the following embodiments.

[0024] Depend on Figures 1 to 3 It can be seen that the USB SMT mounting tool described in this embodiment includes a body 1; the top of the body 1 is provided with a first placement groove 2 for placing a PCB board 7 and a second placement groove 3 for placing a USB interface 8;

[0025] The first placement groove 2 is provided with a positioning pin 21 for fixing the PCB board 7; the second placement groove 3 is provided with a positioning block 31 for fixing the USB interface 8; the bottom of the PCB board 7 is provided with a magnet 4 at the corresponding position of the second placement groove 3; the PCB board 7 is provided with a positioning hole that cooperates with the positioning pin 21.

[0026] Specifically, when using the USB SMT mounting tool described in this embodiment, the PCB board 7 is placed in the first placement slot 2 of the main body 1 using the positioning pins 21, and the USB interface 8 is accurately placed in the second placement slot 3 of the main body 1 using the placement machine's visual positioning system. It is then clamped by the positioning block 31. In addition, the magnet 4 will firmly adsorb the USB interface 8 in the second placement slot 3 of the main body 1, so that the pins of the USB interface 8 and the pads of the PCB board 7 are perfectly aligned. After the PCB board 7 and the USB interface 8 are placed, the main body 1 is soldered through reflow soldering, and the product can be removed after completion.

[0027] In this embodiment, the PCB board 7 is placed in the first placement groove 2 of the main body 1 through the positioning pin 21, and the USB interface 8 is fixed in the second placement groove 3 through the magnet 4 and the positioning block 31, so that the overall structure is stable and reliable, and the PCB board 7 and the USB interface 8 are prevented from loosening. It is also possible to weld multiple products at one time, effectively improving work efficiency.

[0028] In the USB SMT mounting tool described in this embodiment, second placement slots 3 are provided at both ends of the first placement slot 2. Specifically, this arrangement allows a full sheet of PCBs 7 to be placed in the first placement slots 2, and then multiple USB ports 8 to be soldered to both ends of the full sheet of PCBs 7. After soldering is complete, the multiple PCBs 7 can be separated, thereby greatly improving work efficiency.

[0029] In the USB SMT mounting tool described in this embodiment, the depth of the second placement groove 3 is greater than the depth of the first placement groove 2. This arrangement ensures that the pins of the USB interface 8 fit perfectly with the pads of the PCB board 7.

[0030] In the USB SMT mounting fixture described in this embodiment, the first placement groove 2 is provided with a plurality of reflow soldering through holes 22. Specifically, the above arrangement facilitates reflow soldering of the PCB board 7 and the USB interface 8 at the bottom of the body 1.

[0031] In the USB SMT mounting fixture described in this embodiment, a tin melting notch 23 is provided on the sidewall of the reflow soldering through-hole 22 near one end of the second placement slot 3. Specifically, a via hole (not shown) is provided through the PCB board 7 at the solder pad location. This allows reflow soldering of the PCB board 7 and the USB port 8 at the bottom of the body 1 through the reflow soldering through-hole 22. Furthermore, the provision of the tin melting notch 23 facilitates tin melting during the reflow soldering process.

[0032] In the SMT mounting tool for USB described in this embodiment, a guiding slope 32 is provided on the top of the positioning block 31. The above arrangement can play a guiding role when the USB interface 8 is placed in the second placement slot 3.

[0033] In the USB SMT mounting device described in this embodiment, the second placement slot 3 is provided with a through hole 41, and the magnet 4 is provided at the bottom of the through hole 41. This arrangement enables the magnet 4 to effectively attract the USB port 8 to the second placement slot 3.

[0034] In the USB SMT mounting tool described in this embodiment, clearance notches 5 are provided on both sides of the body 1. The depth of the clearance notches 5 is greater than the depth of the first placement slot 2. This arrangement facilitates removal of the entire PCB 7 from the first placement slot 2 through the clearance notches 5 after reflow soldering.

[0035] In the USB SMT mounting device described in this embodiment, the main body 1 is provided with a plurality of fixing holes 6. This arrangement facilitates fixing the main body 1 to the reflow soldering equipment.

[0036] In the USB SMT mounting device described in this embodiment, the magnet 4 is a high-temperature resistant strong magnet. This configuration can prevent damage to the magnet 4 during the reflow soldering process and can effectively fix the USB port 8.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the scope of protection of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A USB SMT mounting tool, characterized by: It comprises a body (1); a first placement groove (2) for placing a PCB board (7) and a second placement groove (3) for placing a USB interface (8) are provided on the top of the body (1); The first placement slot (2) is provided with a positioning pin (21) for fixing the PCB board (7); the second placement slot (3) is provided with a positioning block (31) for fixing the USB interface (8); and a magnet (4) is provided at a corresponding position of the second placement slot (3) at the bottom of the PCB board (7).

2. The USB SMT mounting device according to claim 1, characterized in that: Second placement grooves (3) are provided at both ends of the first placement groove (2).

3. The USB SMT mounting device according to claim 2, wherein: The depth of the second placement groove (3) is greater than the depth of the first placement groove (2).

4. The USB SMT mounting device according to claim 2, wherein: The first placement groove (2) is provided with a plurality of reflow soldering through holes (22) running through it.

5. The USB SMT mounting device according to claim 4, characterized in that: A tin melting notch (23) is provided on the side wall of the reflow soldering through hole (22) close to one end of the second placement groove (3).

6. The USB SMT mounting device according to claim 1, characterized in that: A guiding inclined surface (32) is provided on the top of the positioning block (31).

7. The USB SMT mounting device according to claim 1, wherein: The second placement groove (3) is provided with a through hole (41) running through it; the magnet (4) is arranged at the bottom of the through hole (41).

8. The USB SMT mounting device according to claim 1, characterized in that: Both sides of the body (1) are provided with clearance notches (5); the depth of the clearance notches (5) is greater than the depth of the first placement groove (2).

9. The USB SMT mounting device according to claim 1, characterized in that: The body (1) is provided with a plurality of fixing holes (6) running through it.

10. The USB SMT mounting device according to claim 1, characterized in that: The magnet (4) is a high-temperature resistant strong magnet.

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