Triangular LED packaging structure
Through the design of the triangular LED packaging structure, the problem of special-shaped screen matching is solved, the luminous efficiency and brightness uniformity is improved, the finished product size is reduced and the cost is reduced, and the lightweight needs of electronic products are adapted to the lightweight and thinner needs.
Patent Information
- Application Number
- CN202421999685.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-08-19
AI Technical Summary
The existing square and rectangular LED packaging structures are difficult to match with the special-shaped screen, resulting in poor display effects and increased finished product size, and additional line connections increase costs and light occlusion affect luminous efficiency.
The LED packaging design adopts a triangular structure. The positive common electrode pad and the back common electrode pad are connected by conductive columns. The angle between the RGB wafers is 120°, and there is no need for additional line connection. It is protected by an epoxy resin packaging layer. The substrate is made of glass.
It achieves perfect matching with the special-shaped screen, improves luminous efficiency and brightness uniformity, reduces the finished product size, reduces the line cost, and adapts to the lightweight and thinning trend of electronic products.
Smart Images
Figure CN223219428U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED packaging, and relates to a triangular LED packaging structure. Background Art
[0002] In the current field of LED packaging technology, the commonly used packaging structures are mainly square and rectangular. However, with the continuous development of display technology and the increasing diversification of application scenarios, this traditional packaging structure has gradually exposed many significant limitations and shortcomings.
[0003] In modern display devices, demand for custom-shaped screens is growing. Custom-shaped screens feature unique shapes and designs, catering to a variety of innovative applications. However, existing square and rectangular LED packaging structures often struggle to perfectly adapt to custom-shaped screens. This is because their regular shapes cannot flexibly adapt to the screen's contours. Consequently, when used on custom-shaped screens, the packaging structure often mismatches the screen shape, impacting both the display quality and overall aesthetics.
[0004] In addition, from the perspective of internal structure, in existing LED packaging structures, the three RGB chips are usually arranged side by side. Moreover, each chip's pad requires two solder pads, which means that a separate connection point needs to be provided for each chip. In order to achieve the connection of the common pole parts of the three chips, additional circuits are required. However, due to the limited space inside the packaging structure and the small spacing between the chips, it is easy for the light to be blocked and affect each other. When a chip emits light, its light may be blocked or interfered with by the adjacent chip, thereby reducing the luminous efficiency and color purity of the LED.
[0005] Furthermore, the additional wiring in the common electrode area not only increases production costs but also increases the size of the finished product. This is undoubtedly a significant drawback in the electronics market, which is pursuing thinner, lighter, and smaller products. The additional wiring requires more materials and a more complex manufacturing process, increasing production costs. Furthermore, the increased size of the finished product limits its application in space-constrained devices.
[0006] Therefore, it is necessary to improve the existing technology to overcome the defects in the existing technology. Utility Model Content
[0007] The purpose of the present utility model is to provide a triangular LED packaging structure, which solves at least one problem in the background technology by improving its internal structure.
[0008] The purpose of this utility model is achieved through the following technical solutions:
[0009] A triangular LED packaging structure includes a triangular substrate, a positive common-pole pad being centrally arranged on the front side of the substrate, three front pads being arranged on the front side of the substrate surrounding the positive common-pole pad, each front pad and the positive common-pole pad being respectively connected to two electrodes of a chip; a back common-pole pad corresponding to the positive common-pole pad being arranged on the back side of the substrate, the positive common-pole pad and the back common-pole pad being connected via independent conductive columns; three back pads being arranged on the back side of the substrate, each front pad corresponding to a back pad and the two being connected via independent conductive columns; and a packaging adhesive layer covering the positive common-pole pad, the front pad and the chip being arranged on the front side of the substrate.
[0010] As a further improvement of an embodiment of the present invention, the substrate is in an equilateral triangle structure.
[0011] As a further improvement of an embodiment of the present invention, the angle between the three wafers is 120°.
[0012] As a further improvement of an embodiment of the present invention, the positive common electrode pad has a protrusion for identifying the direction.
[0013] As a further improvement of an embodiment of the present invention, the center position of the positive common electrode pad is connected to the corresponding conductive column, and the center position of the front side pad is connected to the corresponding conductive column.
[0014] As a further improvement of an embodiment of the present invention, the front pad and the back pad are both circular structures, and the cross-section of the conductive column is a circular structure.
[0015] As a further improvement of an embodiment of the present invention, the side length of the substrate is 0.65 mm, the diameter of the positive common electrode pad and the back common electrode pad is 0.16 mm, the diameter of the front pad and the back pad is 0.1 mm, and the diameter of the conductive column is 0.04 mm.
[0016] As a further improvement of an embodiment of the present invention, the encapsulation adhesive layer is made of epoxy resin, and the substrate is a glass substrate.
[0017] The above technical solution has the following beneficial effects: the triangular packaging structure is used to better match the special-shaped screen; the angle between the RGB chips is 120°, and they will not block each other; the application of the positive common electrode pad does not require additional circuit connection, the common electrode saves circuit costs and reduces the size of the finished product. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely exemplary, and those skilled in the art can, without inventive effort, derive other implementation drawings based on the provided drawings.
[0019] The structures, proportions, sizes, etc. illustrated in this specification are intended solely to complement the contents disclosed herein and to facilitate understanding and reading by persons familiar with the art. They are not intended to limit the conditions under which the present invention may be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportions, or adjustments in size, without affecting the efficacy and objectives of the present invention, shall remain within the scope of the technical contents disclosed herein.
[0020] Figure 1 This is a top view schematic diagram of multiple LED packaging structures provided by the utility model.
[0021] Figure 2 This is a top view schematic diagram of a single LED packaging structure provided by the utility model.
[0022] Figure 3 This is a bottom view schematic diagram of a single LED packaging structure provided by the utility model.
[0023] Figure 4 This is a schematic diagram of the LED packaging structure provided by the utility model.
[0024] In the picture:
[0025] 1-Substrate;
[0026] 2-positive common electrode pad; 21-bump;
[0027] 3. 3-1, 3-2, 3-3-front solder pads;
[0028] 4, 4-1, 4-2, 4-3-chip;
[0029] 5- back common electrode pad;
[0030] 6, 6-1, 6-2, 6-3, 6-4 - conductive columns;
[0031] 7, 7-1, 7-2, 7-3 - back side pads;
[0032] Encapsulation glue layer. DETAILED DESCRIPTION
[0033] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0034] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.
[0035] In the present invention, unless otherwise specified, directional words such as "up, down, top, bottom" are usually used with reference to the directions shown in the drawings, or with reference to the components themselves in the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above directional words are not used to limit the present invention. Example
[0036] See also Figure 2-Figure 4 As shown, a triangular LED package structure includes a triangular substrate 1. A positive common electrode pad 2 is carefully positioned in the center of the front surface of the substrate 1. Surrounding this positive common electrode pad 2, three front surface pads 3-1, 3-2, and 3-3 are cleverly arranged on the front surface of the substrate 1. It should be noted that these three front surface pads 3-1, 3-2, and 3-3 together constitute the entire front surface pad 3.
[0037] At the same time, within this sophisticated layout, the two electrodes of each of the three RGB chips 4-1, 4-2, and 4-3 are precisely connected to the positive common pad 2 and the corresponding front pad. Simply put, each front pad is tightly connected to the positive common pad 2 and the two electrodes of a chip, forming an efficient circuit path. This connection ensures stable current transmission and normal operation of the chips, laying the foundation for the LED to emit bright, uniform, and colorful light. The three RGB chips 4-1, 4-2, and 4-3 are collectively referred to as chip 4.
[0038] On the back side of substrate 1, a back common pad 5 is provided, corresponding to the positive common pad 2. Positive common pad 2 and back common pad 5 are connected via an independent conductive post 6-1. This design not only ensures smooth current flow but also enhances the stability and reliability of the package structure. Furthermore, three back pads 7 (including back pads 7-1, 7-2, and 7-3) are provided on the back side of substrate 1. Back pad 7-1 is electrically connected to front pad 3-1 via a conductive post 6-2, back pad 7-2 is electrically connected to front pad 3-2 via a conductive post 6-3, and back pad 7-3 is electrically connected to front pad 3-3 via a conductive post 6-4. Each front pad corresponds to a back pad, and the two are connected via an independent conductive post. This design enables efficient current transfer between the front and back sides, improving the electrical performance of the package structure. Conductive posts 6-1, 6-2, 6-3, and 6-4 are collectively referred to as conductive posts 6.
[0039] To effectively protect and optically optimize the positive common electrode pad 2, front pads 3-1, 3-2, 3-3, and the three RGB chips 4-1, 4-2, and 4-3, an encapsulation layer 8 is provided on the front surface of the substrate 1. This encapsulation layer is made of epoxy resin material, which has excellent insulation, corrosion resistance, and sealing properties. The epoxy resin material can effectively prevent moisture, dust, and other harmful substances in the external environment from damaging the components within the package structure, thereby extending the service life of the LED. At the same time, the epoxy resin material also has good light transmittance, allowing light emitted by the chip to pass smoothly, thereby improving the luminous efficiency of the LED.
[0040] In addition, substrate 1 uses a glass substrate, which has good flatness, thermal stability and insulation performance, and can provide a solid foundation and a stable working environment for the entire packaging structure, ensuring that the LED maintains stable performance and reliable working state during long-term use.
[0041] Furthermore, substrate 1 exhibits a unique equilateral triangle structure, which offers numerous advantages for the overall package. Within this structure, the three chips 4-1, 4-2, and 4-3 are positioned at an angle of exactly 120°. This precise angle ensures they operate in harmony, preventing any interference from each other and maximizing performance.
[0042] Specifically, the side length H of the substrate 1 is 0.65mm. This size has been carefully calculated and designed to meet performance requirements while adapting to different application scenarios. The diameter D1 of the positive common electrode pad 2 and the back common electrode pad 5 are both 0.16mm. This size ensures the stability of current transmission without taking up too much space. The diameter D2 of the front pad 3 and the back pad 7 is 0.1mm. This moderate size design ensures a good connection with the chip electrode. The diameter D3 of the conductive column 6 is 0.04mm. Although it seems small, it plays an indispensable role in current conduction.
[0043] Through the meticulous and rigorous structural design described above, this triangular package structure exhibits significant advantages. First, it better accommodates the needs of custom-shaped displays. In today's display market, which pursues personalization and diversity, custom-shaped displays are increasingly common. Traditional packaging structures often struggle to adapt to these unique shapes, resulting in poor display quality. However, this triangular package structure perfectly accommodates these shapes, providing excellent display quality. Second, the three chips 4-1, 4-2, and 4-3 do not block each other, allowing each to fully receive and transmit light, thereby improving the luminous efficiency and brightness uniformity of the entire LED package. Furthermore, the use of the positive common electrode pad is crucial. It eliminates the need for additional wiring connections, not only saving wiring costs but also reducing the size of the finished product. This offers significant competitive advantages in the increasingly lightweight, thin, and miniaturized electronic products, bringing greater flexibility and convenience to the design and manufacturing of related products.
[0044] In this embodiment, the center of the positive common electrode pad 2 is precisely connected to the corresponding conductive pillar 6-1. This centered connection ensures stable and balanced current transmission. Similarly, the center of the front pads 3-1, 3-2, and 3-3 are also connected to the corresponding conductive pillars 6-2, 6-3, and 6-4, respectively, further ensuring efficient circuit operation.
[0045] It is worth mentioning that the formation of the conductive pillars 6 is not completed overnight, but is achieved by providing corresponding conductive holes on the substrate 1 and then filling the holes with electroplated copper. This sophisticated manufacturing process ensures the compactness and good conductivity of the internal structure of the conductive pillars 6, thus providing a reliable guarantee for the smooth conduction of current.
[0046] Furthermore, the positive common electrode pad 2, front pad 3, back common electrode pad 5, and back pad 7 are all made of nickel-gold. Nickel-gold has excellent conductivity, corrosion resistance, and oxidation resistance, maintaining stable performance over long-term use and effectively extending the life of the entire package structure.
[0047] From a structural point of view, the cross-section of the conductive column 6 is a circular structure. This design is conducive to the uniform distribution and transmission of current, reducing local overheating and loss caused by current concentration. The front pad 3, the back pad 7, and the back common pad 5 are all circular structures. This regular shape facilitates processing and manufacturing and connection with other components. The positive common pad 2 is also a circular structure as a whole, and there is a protrusion 21 on the positive common pad 2 for identifying the direction. This protrusion 21 serves as a mark point and plays an important identification role in the production and assembly process, helping to improve production efficiency and accuracy, and avoiding circuit failures and performance degradation caused by incorrect directions.
[0048] When using this triangular LED package structure, solder paste is first applied to the positive common electrode pad 2 and the front pad 3 on the front of substrate 1. It is worth noting that a relatively large amount of solder is applied to the positive common electrode pad 2 to ensure a more stable and reliable connection during the subsequent soldering process.
[0049] After the solder paste is applied, the die is bonded and then soldered using reflow soldering to achieve a secure connection between the die and the pad.
[0050] For the external structure, epoxy resin is used as the encapsulant, and injection molding is performed through compression molding. This method effectively encapsulates the internal circuit components and chips, providing excellent protection and insulation. After injection molding, the encapsulant is baked to remove moisture and volatile substances, enhancing its stability and durability. Finally, the individual finished products are cut and formed.
[0051] As shown in Figure 1, a single-piece board features multiple LED package structures. This batch production method improves production efficiency and reduces costs. After initial manufacturing, a precise cutting process separates the board into several individual finished products. Each finished product features a complete, high-performance triangular LED package structure, ready for use in a variety of applications.
[0052] Obviously, the embodiments described above are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0053] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, tasks, devices, components and / or combinations thereof.
[0054] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.
[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A triangular LED package structure, characterized by: A substrate with a triangular structure is provided, wherein a positive common-pole pad is centrally arranged on the front side of the substrate, and three front pads are arranged on the front side of the substrate around the positive common-pole pad, and each front pad and the positive common pad are respectively connected to two electrodes of a chip; a back common-pole pad corresponding to the positive common-pole pad is provided on the back side of the substrate, and the positive common-pole pad and the back common-pole pad are connected through an independent conductive column; three back pads are provided on the back side of the substrate, and each front pad corresponds to a back pad and the two are connected through an independent conductive column; and a packaging adhesive layer covering the positive common pad, the front pad and the chip is provided on the front side of the substrate.
2. The LED packaging structure according to claim 1, wherein: The substrate is in an equilateral triangle structure.
3. The LED packaging structure according to claim 2, wherein: The angle between the three wafers is 120°.
4. The LED package structure according to any one of claims 1 to 3, wherein: The positive common electrode pad has a protrusion for identifying a direction.
5. The LED packaging structure according to claim 4, wherein: The center position of the positive common electrode pad is connected to the corresponding conductive column, and the center position of the front side pad is connected to the corresponding conductive column.
6. The LED packaging structure according to claim 5, wherein: The front pad and the back pad are both circular structures, and the cross section of the conductive column is a circular structure.
7. The LED packaging structure according to claim 2, wherein: The side length of the substrate is 0.65 mm, the diameters of the positive common electrode pad and the back common electrode pad are 0.16 mm, the diameters of the front pad and the back pad are 0.1 mm, and the diameter of the conductive column is 0.04 mm.
8. The LED packaging structure according to claim 1, wherein: The packaging adhesive layer is made of epoxy resin, and the substrate is a glass substrate.