Air channel structure for sputter coating and physical vapor deposition equipment with same

Abstract

The utility model provides an air channel structure for sputter coating and physical vapor deposition equipment with the air channel structure, and belongs to the technical field of physical vapor deposition equipment. The gas channel structure for the injection coating film is arranged in a deposition chamber of physical vapor deposition equipment for sputter coating, and comprises a gas inlet loop, a gas outlet loop and a gas outlet loop, each sinking pipeline comprises at least one connecting pipeline and an air outlet pipeline, the two ends of each connecting pipeline are communicated with the air inlet loop and the air outlet pipeline respectively, a plurality of air outlets which are uniformly distributed are formed in the bottom of each air outlet pipeline, each air outlet pipeline comprises an air outlet loop, and each air outlet loop is communicated with the corresponding connecting pipeline. The air outlet loops are concentrically arranged at intervals, and the height difference between each air outlet pipeline and the deposition base in the deposition chamber is not larger than a preset value. The air channel structure for sputter coating disclosed by the utility model is better in air inlet uniformity.

Description

Technical Field

[0001] The present application relates to the technical field of physical vapor deposition equipment, and in particular to an air duct structure for sputtering coating and a physical vapor deposition equipment having the same. Background Art

[0002] Physical vapor deposition (PVD) is a common method for producing oxide thin films and a key step in semiconductor chip manufacturing. For example, vanadium oxide thin films exhibit unique reversible phase transition properties, making them easily modulatable in terms of their optoelectronic properties, leading to their widespread application in storage devices, switching devices, and other fields. Vanadium oxide thin films are typically deposited on the wafer surface by sputtering to generate metal plasma, which reacts with a reactive gas.

[0003] In the above preparation process, the gas intake method will directly affect the uniformity of the film, especially the uniformity of gas distribution, which will affect the performance and yield of the product by acting on the film thickness, component composition and resistance uniformity, etc.

[0004] In the prior art, multiple independent straight cylindrical gas nozzles are usually used for gas outlet. This method still leads to uneven gas distribution, thereby causing poor uniformity of the prepared film. Utility Model Content

[0005] One object of the first aspect of the present invention is to provide an air duct structure for sputtering coating with better air intake uniformity.

[0006] Another object of the present invention is to ensure an optimal air outlet height.

[0007] An object of the second aspect of the present invention is to provide a physical vapor deposition device comprising the above-mentioned gas channel structure for sputtering coating.

[0008] An embodiment of the present utility model provides an air duct structure for sputtering coating, which is arranged in a deposition chamber of a physical vapor deposition device for sputtering coating, and the air duct structure includes:

[0009] An air inlet loop, provided with at least one air inlet for introducing a reaction gas;

[0010] Multiple sinking pipelines, each of the sinking pipelines includes at least one connecting pipeline and an air outlet pipeline, the two ends of the connecting pipeline are respectively connected to the air inlet loop and the air outlet pipeline, and the bottom of each air outlet pipeline is provided with multiple evenly arranged air outlets, each air outlet pipeline includes an air outlet loop, and the air outlet loops are concentrically arranged at intervals, and the height difference between each air outlet pipeline and the deposition base in the deposition chamber is not greater than a preset value.

[0011] Furthermore, the plurality of air outlets are provided at the bottom of the air outlet loop and are evenly arranged along the circumference of the air outlet loop.

[0012] Furthermore, each of the air outlet pipelines also includes a plurality of radial pipes extending radially along the air outlet loop, one end of the radial pipe is connected to the air outlet loop, and a plurality of the air outlets are provided at the bottom of the radial pipe.

[0013] Furthermore, the plurality of radial pipes are evenly arranged along the circumference of the air outlet loop.

[0014] Furthermore, the multiple air outlets of each radial pipe are evenly arranged along its own length direction.

[0015] Furthermore, the number of the connecting pipelines of each sinking pipeline is multiple and they are evenly arranged along the circumference of the intake loop.

[0016] Furthermore, each of the gas outlet pipelines is located at the same height and directly above the deposition base.

[0017] Furthermore, the air inlet loop is located inside the side wall of the deposition chamber, and the connecting pipeline connected to the air outlet pipeline with the largest diameter is an L-shaped pipeline, and the L-shaped pipeline includes a connected horizontal pipeline and a vertical pipeline, and the end of the horizontal pipeline away from the vertical pipeline is connected to the outside of the air outlet pipeline, and the end of the vertical pipeline away from the horizontal pipeline is connected to the air inlet loop, and the vertical pipeline is located inside the side wall of the deposition chamber.

[0018] Furthermore, the connecting pipelines to which the air outlet pipelines other than the air outlet pipeline with the largest diameter are connected are inclined pipelines.

[0019] In particular, an embodiment of the present invention further provides a physical vapor deposition device, comprising any of the above-mentioned gas channel structures for sputtering coating.

[0020] According to the first aspect of the utility model, a plurality of sinking pipelines are arranged below the air inlet loop, each sinking pipeline includes a connecting pipeline and an air outlet pipeline, and a plurality of evenly arranged air outlets are arranged on the bottom connecting pipeline of the air outlet pipeline. The arrangement of the connecting pipeline enables the air outlet pipeline to be in a suitable position closer to the deposition base, thereby ensuring uniform air outlet while allowing the gas to reach the deposition base more effectively, thereby ensuring the deposition effect and preparing a thin film with better uniformity.

[0021] Furthermore, the length of the connecting pipeline can be determined according to the target outlet position, so that the outlet height is always maintained at a suitable position on the top of the deposition base, and no longer depends on the height of the original air inlet loop. Therefore, this form of airway structure can be flexibly adjusted according to the height of the deposition chamber air inlet to ensure the optimal outlet height.

[0022] Furthermore, by arranging the various gas outlet pipes at the same height, the heights of the various gas outlets can be ensured to be consistent, that is, the height differences from the various gas outlets to the deposition base are controlled to remain consistent, thereby further ensuring the uniformity of the gas outlet.

[0023] Furthermore, by configuring the outermost outlet pipe's connecting line into an L-shape, with the vertical line embedded within the sidewall of the deposition chamber and at least part of the horizontal line also located within the sidewall, the airway structure can be minimized in the deposition chamber's volume. Configuring the connecting lines of the other outlet pipes as inclined, straight lines can reduce pipe length and can be directly cut from straight pipes, simplifying the manufacturing process.

[0024] According to the second aspect of the present invention, multiple radial pipelines are evenly arranged along the circumference of the air outlet loop, and multiple air outlets are evenly distributed on each radial pipeline, so that multiple sinking pipelines form evenly distributed air outlets with a larger area, making the air outlet more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of the air channel structure in the deposition chamber according to the first embodiment of the present utility model;

[0026] Figure 2 for Figure 1 A top view of the airway structure of the embodiment;

[0027] Figure 3 for Figure 1 A bottom view of the sinking pipeline of the airway structure of the embodiment;

[0028] Figure 4 for Figure 1 Schematic diagram of the arrangement of the airway structure in the deposition chamber of the embodiment;

[0029] Figure 5 A bottom view of a sinking pipeline of an airway structure according to a second embodiment of the present utility model;

[0030] Figure 6 A bottom view of a sinking pipeline of an airway structure according to a third embodiment of the present utility model;

[0031] Reference numerals:

[0032] 100-airway structure, 10-air inlet loop, 101-air inlet, 20-sinking pipeline, 21-connecting pipeline, 211-L-shaped pipeline, 2111-horizontal pipeline, 2112-vertical pipeline, 212-inclined pipeline, 22-air outlet pipeline, 201-air outlet, 221-air outlet loop, 222-radial pipeline, 200-deposition chamber, 210-exhaust port, 300-deposition base. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0035] In addition, numerous specific details are provided in the following detailed description to better illustrate the present invention. Those skilled in the art will appreciate that the present invention can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art are not described in detail in order to highlight the main points of the present disclosure.

[0036] It should be understood that the term "and / or" as used herein simply describes an association between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " as used herein indicates that the related objects are in an "or" relationship.

[0037] In the embodiments of the present invention, the term "multiple" refers to two or more. The terms "first," "second," and so on, appearing in the embodiments of the present invention are for illustrative purposes only and are intended to distinguish the objects being described. They are not in any particular order and do not represent a specific limit on the number of objects in the embodiments of the present invention. They do not constitute any limitation on the embodiments of the present invention.

[0038] Figure 1 FIG. 1 is a schematic structural diagram of the air channel structure 100 in the deposition chamber 200 according to the first embodiment of the present invention. Figure 2 for Figure 1 A top view of the airway structure 100 of the embodiment in FIG. Figure 3 for Figure 1 FIG. 2 is a bottom view of the sinking pipe 20 of the airway structure 100 of the embodiment. Figure 4 for Figure 1 Schematic diagram of the arrangement of the airway structure 100 in the deposition chamber 200 of the embodiment. Figure 1As shown, in one embodiment, a sputtering gas passage structure 100 is provided in a deposition chamber 200 of a physical vapor deposition apparatus for sputtering, and the gas passage structure 100 includes an air inlet loop 10 and a plurality of downpipes 20. The air inlet loop 10 is provided with at least one air inlet 101 for introducing a reaction gas, for example Figure 1 In the embodiment shown, the number of air inlets 101 is 2. In other embodiments not shown, the number of air inlets 101 may be 1 or more, and is not limited here. Each sinking pipeline 20 includes at least one connecting pipeline 21 and an air outlet pipeline 22. The number of connecting pipelines 21 may be multiple, for example Figure 1 The two symmetrical arrangements shown in the figure can also be other numbers of more than two. In order to ensure the stable connection of the outlet pipe 22, the number of connecting pipes 21 is preferably not less than 2. The two ends of the connecting pipe 21 are respectively connected to the intake loop 10 and the outlet pipe 22. Figure 2 As shown, each outlet pipe 22 includes an outlet loop 221, and each outlet loop 221 is concentrically spaced. Figure 4 As shown, the height difference between each outlet pipe 22 and the deposition base 300 in the deposition chamber 200 is not greater than a preset value. The deposition base 300 is used to place the wafer, and the surface of the wafer is used to deposit the oxide film. This preset value can be set based on experience or experiments, as long as it is ensured that each outlet pipe 22 is not too high from the deposition base 300. The bottom of each outlet pipe 22 is provided with a plurality of evenly arranged outlet ports 201, such as Figure 3 As shown, each air outlet 201 is provided at the bottom of the air outlet loop 221, that is, multiple air outlets 201 are provided at the bottom of the air outlet loop 221 and are evenly arranged along the circumference of the air outlet loop 221. When the air outlet pipeline 22 includes other structures, the air outlet 201 can also be provided at other positions. The position of the air outlet 201 is not limited here. Figure 4 As shown, an exhaust port 210 is provided at the bottom of the side wall of the deposition chamber 200 to discharge the gas flow.

[0039] The present application sets a plurality of sinking pipes 20 below the air inlet loop 10, each sinking pipe 20 includes a connecting pipe 21 and an air outlet pipe 22, and the bottom connecting pipe 21 of the air outlet pipe 22 is provided with a plurality of evenly arranged air outlets 201. The setting of the connecting pipe 21 makes the air outlet pipe 22 be located in a suitable position closer to the deposition base 300, thereby ensuring uniform air outlet while allowing the gas to reach the deposition base 300 more effectively, thereby ensuring the deposition effect and preparing a film with better uniformity.

[0040] Furthermore, the length of the connecting pipe 21 can be determined according to the target gas outlet position, so that the height of the gas outlet 201 is always maintained at a suitable position on the top of the deposition base 300, and no longer depends on the height of the original gas inlet loop 10. Therefore, this form of airway structure 100 can be flexibly adjusted according to the height of the gas inlet 101 of the deposition chamber 200 to ensure the optimal gas outlet 201 height.

[0041] In a further embodiment, Figure 4 As shown, each outlet pipe 22 is located at the same height and directly above the deposition base. The air inlet loop 10 is located inside the side wall of the deposition chamber 200, and the connecting pipe 21 connected to the outlet pipe 22 with the largest diameter is an L-shaped pipe 211. The L-shaped pipe 211 includes a connected horizontal pipe 2111 and a vertical pipe 2112. The end of the horizontal pipe 2111 away from the vertical pipe 2112 is connected to the outside of the outlet pipe 22, and the end of the vertical pipe 2112 away from the horizontal pipe 2111 is connected to the air inlet loop 10. The vertical pipe 2112 is located inside the side wall of the deposition chamber 200. The connecting pipe 21 connected to the outlet pipes 22 other than the outlet pipe 22 with the largest diameter is an inclined pipe 212.

[0042] The present application ensures that the heights of the gas outlets 201 are consistent by setting the gas outlet pipes 22 at the same height, that is, the height difference from the gas outlets 201 to the deposition base 300 is controlled to remain consistent, thereby further ensuring the uniformity of gas outlet.

[0043] Furthermore, by configuring the connecting pipe 21 of the outermost outlet pipe 22 into an L-shape, wherein the vertical pipe 2112 of the connecting pipe 21 is disposed within the side wall of the deposition chamber 200, and at least part of the horizontal pipe 2111 is also located within the side wall of the deposition chamber 200, it is possible to ensure that the airway structure 100 occupies less space in the cavity of the deposition chamber 200. Configuring the connecting pipes 21 of the other outlet pipes 22 as inclined straight pipes can save pipe length and can be directly cut and formed from straight pipes, thereby simplifying the manufacturing process.

[0044] In one embodiment, the positions of each air inlet 101 on the air intake loop 10 can be evenly distributed on the air intake loop 10. Furthermore, the distance between each air inlet 101 and the upper end of the connecting pipe 21 can be set to be uniform, for example, set at the midpoint of the arc formed by the upper ends of two adjacent connecting pipes 21 on the air intake loop 10. This can ensure that the air pressure of the air inlet 101 entering each connecting pipe 21 is basically equal, so that the gas enters each sinking pipe 20 evenly.

[0045] Figure 5 FIG2 is a bottom view of the sinking pipe 20 of the airway structure 100 according to the second embodiment of the present invention. Figure 5As shown, in another embodiment, the number of connecting pipes 21 of each sinking pipe 20 is three. Of course, in other embodiments not shown, the number of connecting pipes 21 can also be other numbers, such as four or five, without limitation. The connecting pipes 21 of each sinking pipe 20 are evenly arranged along the circumference of the intake loop 10. Furthermore, all connecting pipes 21 of all sinking pipes 20 are also evenly arranged along the circumference of the intake loop 10. By providing a larger number of evenly arranged connecting pipes 21, the uniformity of the intake air can be further improved.

[0046] Figure 6 FIG. 2 is a bottom view of the sinking pipe 20 of the airway structure 100 according to the third embodiment of the present invention. Figure 6 As shown, in another embodiment, each air outlet pipeline 22 further includes a plurality of radial pipes 222 extending radially along the air outlet loop 221, one end of the radial pipe 222 is connected to the air outlet loop 221, and a plurality of air outlets 201 are provided at the bottom of the radial pipe 222. The plurality of radial pipes 222 are evenly arranged along the circumference of the air outlet loop 221. The plurality of air outlets 201 of each radial pipe 222 are evenly arranged along its own length direction. All radial pipes of each sinking pipe 20 can be arranged in a staggered manner. For example, when the airway structure 100 includes two sinking pipes 20, the radial pipes of the two sinking pipes 20 are not aligned with each other in the radial direction, and the density of the air outlets 201 on the radial pipes of the two sinking pipes 20 can be set to be the same or different, which is not limited here.

[0047] The air duct structure 100 evenly arranges multiple radial pipelines along the circumference of the air outlet loop 221, and each radial pipeline evenly distributes multiple air outlets 201, so that the multiple sinking pipelines 20 form evenly distributed air outlets 201 with a larger area, thereby making the air outlet more uniform.

[0048] In a further embodiment, the air outlets 201 are evenly distributed on the air outlet loop 221 and the radial pipeline of the sinking pipeline 20, so that the air outlets 201 are evenly distributed in the circumferential direction and the radial direction, further improving the uniformity of the air outlet.

[0049] During deposition, the reaction gas enters the air inlet loop 10 from each air inlet 101, then passes through multiple connecting pipes 21 into the connected air outlet loop 221 and radial pipes, and flows into the deposition chamber 200 through the air outlet loop 221 and each air outlet 201 at the bottom of the radial pipes, so as to be deposited on the deposition base.

[0050] The present application also provides a physical vapor deposition device, such as Figure 4 As shown, the apparatus includes a deposition chamber 200, a deposition base located in the deposition chamber 200, and the gas channel structure 100 for sputtering coating in any of the above embodiments.

[0051] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. An air duct structure for sputtering coating, arranged in a deposition chamber of a physical vapor deposition device for sputtering coating, characterized in that: The airway structure comprises: An air inlet loop, provided with at least one air inlet for introducing a reaction gas; Multiple sinking pipelines, each of the sinking pipelines includes at least one connecting pipeline and an air outlet pipeline, the two ends of the connecting pipeline are respectively connected to the air inlet loop and the air outlet pipeline, and the bottom of each air outlet pipeline is provided with multiple evenly arranged air outlets, each air outlet pipeline includes an air outlet loop, and the air outlet loops are concentrically arranged at intervals, and the height difference between each air outlet pipeline and the deposition base in the deposition chamber is not greater than a preset value.

2. The air channel structure for sputtering coating according to claim 1, characterized in that: The plurality of air outlets are provided at the bottom of the air outlet loop and are evenly arranged along the circumference of the air outlet loop.

3. The air channel structure for sputtering coating according to claim 1 or 2, characterized in that: Each of the air outlet pipelines further includes a plurality of radial pipes extending radially along the air outlet loop, one end of the radial pipe is communicated with the air outlet loop, and a plurality of the air outlets are provided at the bottom of the radial pipe.

4. The air channel structure for sputtering coating according to claim 3, characterized in that: The plurality of radial pipes are evenly arranged along the circumference of the air outlet loop.

5. The air duct structure for sputtering coating according to claim 4, characterized in that: The multiple air outlets of each radial pipe are evenly arranged along its own length direction.

6. The air channel structure for sputtering coating according to claim 1, characterized in that: The number of the connecting pipelines of each sinking pipeline is multiple and they are evenly arranged along the circumference of the intake loop.

7. The air channel structure for sputtering coating according to claim 1, characterized in that: The gas outlet pipelines are located at the same height and directly above the deposition base.

8. The air channel structure for sputtering coating according to claim 1, characterized in that: The air inlet loop is located inside the side wall of the deposition chamber, and the connecting pipeline connected to the air outlet pipeline with the largest diameter is an L-shaped pipeline. The L-shaped pipeline includes a connected horizontal pipeline and a vertical pipeline. The end of the horizontal pipeline away from the vertical pipeline is connected to the outside of the air outlet pipeline, and the end of the vertical pipeline away from the horizontal pipeline is connected to the air inlet loop. The vertical pipeline is located inside the side wall of the deposition chamber.

9. The air channel structure for sputtering coating according to claim 8, characterized in that: The connecting pipelines connected to the air outlet pipelines other than the air outlet pipeline with the largest diameter are inclined pipelines.

10. A physical vapor deposition device, characterized in that: The invention comprises the air duct structure for sputtering coating according to any one of claims 1 to 9.

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