Diaphragm valve mechanism controlled by electromagnetic valve and thin film deposition equipment thereof

Abstract

The utility model discloses a diaphragm valve mechanism controlled by an electromagnetic valve and thin film deposition equipment thereof, and the diaphragm valve mechanism comprises a bracket, an electromagnetic valve group connected to the top of the bracket, a diaphragm valve group connected to the middle part of the bracket, and a gas path branch block assembly connected to the bottom of the bracket, the electromagnetic valve group controls on-off of a gas path input to the diaphragm valve group so as to control opening and closing of the diaphragm valve group, and the diaphragm valve group controls on-off of a gas path of the gas path manifold block assembly; a heat insulation plate is further arranged between the electromagnetic valve set and the diaphragm valve set. According to the diaphragm valve mechanism controlled by the electromagnetic valve and the thin film deposition equipment thereof, the heat insulation plate is arranged between the electromagnetic valve group and the diaphragm valve group, so that on one hand, a gas path between the electromagnetic valve and the diaphragm valve can be shortened as much as possible, and on the other hand, the heat insulation plate can prevent heat generated by a gas path branch block from being conducted to the electromagnetic valve; and adverse effects on the electromagnetic valve are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of a diaphragm valve group control mechanism in semiconductor equipment, in particular to a diaphragm valve mechanism controlled by a solenoid valve and a thin film deposition device thereof. Background Art

[0002] In the existing semiconductor thin film deposition process, especially the atomic layer deposition process, diaphragm valves or ALD (atomic layer deposition) valves are often required to quickly switch various airflows. The switching speed will ultimately have a significant impact on the film formation effect. In order to save space and shorten the distance between valves, it is often necessary to make them in the form of gas path blocks and diaphragm valve groups. Diaphragm valves usually use the pneumatics of the solenoid valve to drive the internal diaphragm to rise and fall to seal the flow path, thereby opening and closing the valve. Therefore, the response speed of the solenoid valve causes the switching speed of the airflow to directly affect the opening and closing speed of the diaphragm valve.

[0003] The gas manifold is often heated to a temperature of over 100 degrees. If the solenoid valve is arranged too close to the ALD diaphragm valve, the solenoid coil and other structures of the solenoid valve are not resistant to high temperatures. In addition, the high-speed response solenoid valve itself generates a lot of internal heat when it moves quickly, so the temperature is relatively high. Therefore, if the solenoid valve is arranged too close to the ALD diaphragm valve, it is easy to burn out; if it is arranged too far away, the air pipe length will be too long, the response time will also be prolonged, affecting the process. Utility Model Content

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a diaphragm valve mechanism controlled by a solenoid valve and a thin film deposition device thereof, so as to solve the technical problem that the prior solenoid valve and diaphragm pump are both set too far or too close, each of which has its own disadvantages.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] In the first aspect, an embodiment of the present invention provides a diaphragm valve mechanism controlled by a solenoid valve, which includes: a bracket, a solenoid valve group connected to the top of the bracket, a diaphragm valve group connected to the middle of the bracket, and an air path block assembly connected to the bottom of the bracket, the solenoid valve group controls the air path input to the diaphragm valve group to control the opening and closing of the diaphragm valve group, and the diaphragm valve group controls the air path of the air path block assembly; wherein, a heat insulation plate is also provided between the solenoid valve group and the diaphragm valve group.

[0007] Wherein, the heat insulation plate is a stainless steel plate.

[0008] Wherein, the stainless steel plate is a single mirror stainless steel plate or a double mirror stainless steel plate.

[0009] The air outlet pipe of the solenoid valve group is passed through the heat insulation board, so that the solenoid valve group and the diaphragm pump group are connected in a straight line through the air outlet pipe.

[0010] The solenoid valve group includes: a plurality of solenoid valves, the air outlet pipe connected to the air outlet end of the solenoid valve, and a fixed sheet metal connected to the shell of the solenoid valve, and the fixed sheet metal is also connected to the bracket.

[0011] The diaphragm valve group includes a plurality of diaphragm valves, which are arranged vertically and closely adjacent to each other. The top ends of the diaphragm valves are connected to the air outlet pipe, and the bottom ends of the diaphragm valves are connected to the air path manifold assembly.

[0012] Wherein, the bracket includes: a vertical support part and a horizontal support part which is laterally bent from the top end of the vertical support part; the bottom of the vertical support part is connected to the air path block assembly; and the horizontal support part is connected to the fixed sheet metal.

[0013] Wherein, an air distribution block is further provided at the bottom of the heat insulation board, and an air distribution channel with one inlet and multiple outlets is provided in the air distribution block, and the outlet end of the air distribution channel is connected to the inlet end of the air outlet pipe.

[0014] The gas path manifold assembly includes: a gas path manifold, a heating rod and a temperature sensor embedded in the gas path manifold, and a plurality of gas distribution joints connected to the gas distribution holes of the gas path manifold.

[0015] In a second aspect, an embodiment of the present invention further provides a thin film deposition device, which includes a diaphragm valve mechanism controlled by a solenoid valve as described in any one of the above.

[0016] The utility model discloses a diaphragm valve mechanism controlled by a solenoid valve and a thin film deposition device thereof, which, by arranging a heat insulation plate between the solenoid valve group and the diaphragm valve group, can shorten the air path between the solenoid valve and the diaphragm valve as much as possible, and at the same time, the heat insulation plate can block the heat generated by the air path block, thereby reducing the adverse effects on the solenoid valve.

[0017] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figures 1 to 4 Schematic diagram of the overall structure of the diaphragm valve mechanism controlled by the solenoid valve according to the embodiment of the present invention from different angles.

[0019] Figures 5 to 7 This is a schematic structural diagram of the diaphragm valve mechanism controlled by the solenoid valve according to an embodiment of the utility model, with the middle diaphragm valve group removed from different angles.

[0020] Figure 8 This is a schematic structural diagram of the bracket portion of the diaphragm valve mechanism controlled by the solenoid valve according to an embodiment of the present utility model.

[0021] Figure 9 This is a schematic structural diagram of the heat insulation plate portion of the diaphragm valve mechanism controlled by the solenoid valve according to an embodiment of the present utility model.

[0022] Figure 10 This is a schematic structural diagram of the gas distribution block portion of the diaphragm valve mechanism controlled by the solenoid valve according to an embodiment of the present utility model.

[0023] Figure 11 This is a partial structural diagram of the air path block assembly of the diaphragm valve mechanism controlled by the solenoid valve according to an embodiment of the present invention.

[0024] Description of reference numerals:

[0025] The diaphragm valve mechanism 100 controlled by the solenoid valve, the bracket 1, the horizontal support part 12, the vertical support part 11, the diaphragm valve assembly 2, the diaphragm valve 21, the air path branch block assembly 3, the air path branch block 31, the heating rod 3 temperature sensor 33, the air distribution joint 34, the heat insulation board 4, the heat insulation board body 41, the through hole 411, the connecting plate 42, the solenoid valve group 5, the solenoid valve unit 51, the solenoid valve 511, the fixed sheet metal 512, the quick connector 513, the air outlet pipe 514, the air distribution block 6, the air distribution block body 61, the total air inlet joint 62, and the air distribution joint 63. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0030] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can mean connected, detachably connected, or integrated; they can mean mechanically connected or electrically connected; they can mean directly connected or indirectly connected through an intermediate medium; they can mean internal communication between two components or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0031] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0032] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. Throughout this specification, the schematic representations of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0033] In a diaphragm pump mechanism controlled by a solenoid valve, the gas manifold often heats up to over 100 degrees Celsius. If the solenoid valve is placed too close to the ALD diaphragm valve, the solenoid coil and other structures are not resistant to high temperatures. Furthermore, the high-speed response of the solenoid valve itself generates significant internal heat during rapid operation, leading to high temperatures. Therefore, placing the solenoid valve too close to the ALD diaphragm valve can easily burn it out. Placing the solenoid valve too far away from the valve increases the gas pipe length and response time, affecting the process. To address these requirements, this embodiment discloses a diaphragm valve mechanism 100 controlled by a solenoid valve.

[0034] See also Figures 1 to 11 This embodiment discloses a solenoid-valve-controlled diaphragm valve mechanism 100, comprising: a bracket 1, a solenoid valve assembly 5 connected to the top of the bracket 1, a diaphragm valve assembly 2 connected to the middle of the bracket 1, and an air path manifold assembly 3 connected to the bottom of the bracket 1. The solenoid valve assembly 5 controls the air path input to the diaphragm valve assembly 2 to control the opening and closing of the diaphragm valve assembly 2, and the diaphragm valve assembly 2 controls the air path opening and closing of the air path manifold assembly 3. The solenoid valve assembly 5 includes at least one solenoid valve, the diaphragm valve assembly 2 includes at least one diaphragm valve, and the air path manifold assembly 3 has at least one air flow channel. The solenoid valve controls the connection and disconnection between an external air source and the diaphragm valve, thereby controlling the opening and closing state of the valve disc within the diaphragm valve. The opening and closing state of the valve disc of the diaphragm valve correspondingly controls the opening and closing of the air flow channel within the air path manifold assembly 3.

[0035] The gas manifold assembly 3 typically needs to be heated to a relatively high temperature during operation. High temperatures significantly affect the efficiency of the solenoid valve, and the solenoid valve itself also generates heat during operation. Therefore, it is necessary to minimize the impact of the heat generated by the gas manifold on the solenoid valve. In this embodiment, a heat shield 4 is provided between the solenoid valve assembly 5 and the diaphragm valve assembly 2. This shield 4 prevents heat generated by the gas manifold assembly 3 from being transferred to the solenoid valve, thereby reducing its adverse effects on the solenoid valve's operation.

[0036] The heat shield 4 is a stainless steel plate. It can be a single-mirror stainless steel plate or a double-mirror stainless steel plate. The mirrored stainless steel plate can reflect heat conducted from the gas path manifold assembly 3, thereby reducing its adverse effects on the solenoid valve. It is understood that in other embodiments, the heat shield 4 can also be made of other plate-like materials with excellent heat reflection and heat isolation properties.

[0037] In this embodiment, the structure of the thermal insulation plate 4 also minimizes the length of the air path between the solenoid valve assembly 5 and the diaphragm valve assembly 2. The shorter the air path, the faster the control of the diaphragm valve assembly 2. The thermal insulation plate 4 isolates the diaphragm valve assembly 2 and the solenoid valve assembly 5. Furthermore, the outlet of the solenoid valve of the solenoid valve assembly 5 is located adjacent to the inlet of the diaphragm valve of the diaphragm valve assembly 2, and the two are connected by the shortest straight line, which can achieve faster control response speed.

[0038] Specifically, the outlet pipe 514 of the solenoid valve assembly 5 passes through the heat insulation board 4, so that the solenoid valve assembly 5 and the diaphragm pump assembly 2 are connected in a straight line via the outlet pipe 514. In other words, each diaphragm valve of the diaphragm valve assembly 2 is connected to the corresponding solenoid valve of the solenoid valve assembly 5 via a straight pipe, minimizing the pipe length between the two and ensuring the fastest pneumatic response speed.

[0039] Please refer again Figure 2 and Figure 3 The solenoid valve assembly 5 includes several solenoid valve units 51, which are regularly arranged on the surface of the heat insulation board 4. One of the solenoid valve units 51 includes a solenoid valve 511, an outlet pipe 514 connected to the outlet end of the solenoid valve 511, and a fixing sheet metal 512 connected to the housing of the solenoid valve 511. The fixing sheet metal 512 is also connected to the bracket 1. The outlet pipe 514 and the solenoid valve 511 are connected using a quick connector 513.

[0040] The diaphragm valve group 2 includes a plurality of diaphragm valves 21 , which are arranged vertically and close to each other. The top end of the diaphragm valve 21 is connected to the air outlet pipe 514 , and the bottom end of the diaphragm valve 21 is connected to the air path block assembly 3 .

[0041] It should be noted that the number of the above-mentioned diaphragm valves 21 corresponds to the number of corresponding solenoid valve units 51. One solenoid valve unit 51 controls one diaphragm valve 21. Correspondingly, one diaphragm valve 21 controls the on-off of one of the air paths of the air path branch block assembly 3.

[0042] Furthermore, the solenoid valve-controlled diaphragm valve mechanism 100 of this embodiment also includes: a solenoid valve unit 51 controlling a diaphragm valve 21 and an air path control mechanism corresponding to an air path block. The heat insulation plate 4 is also arranged between the solenoid valve unit 51 and the diaphragm valve 21, and the two are still connected by a straight pipe.

[0043] Please refer again Figures 5 to 8 , the bracket 1 includes: a vertical support part 11 and a horizontal support part 12 that is laterally bent from the top of the vertical support part 11, the bottom of the vertical support part 11 is connected to the air path block assembly 3, and the horizontal support part 12 is connected to the fixed sheet metal 512. In this embodiment, while ensuring the supporting strength of the bracket 1, its structure and materials are simplified. The vertical support part 11 is a rectangular frame structure, and the horizontal support part 12 is at least one support plate that extends laterally from the top of the rectangular frame structure. The number of support plates is determined according to the number of solenoid valve units 51 that need to be supported. When multiple solenoid valve units 51 need to be integrated, multiple corresponding support plates are provided, and they are all arranged parallel to each other. It can be understood that the bracket 1 is preferably made of a heat-insulating or slow-heat-conducting material.

[0044] Please refer again Figure 4 and Figure 10 The bottom of the heat shield 4 is further provided with an air distributor block 6, which is provided with a single-inlet, multiple-outlet air distributor channel. The outlet end of the air distributor channel is connected to the air inlet end of the air outlet pipe 514. Specifically, the air distributor block 6 includes an air distributor block body 61. The single-inlet, multiple-outlet air distributor channel is provided within the air distributor block body 61. The air distributor block body 61 is further connected to a main air inlet connector 62 and a plurality of air distributor connectors 63. The main air inlet connector 62 is connected to an external air source via an air pipe. The air distributor connectors 63 are connected to the air inlet end of the air outlet pipe 514.

[0045] Please refer again Figure 4 and Figure 11 The gas manifold assembly 3 includes: a gas manifold 31, a heating rod 32 and a temperature sensor 33 embedded in the gas manifold 31, and a plurality of gas distribution joints 34 connected to the gas distribution ports of the gas manifold 31. The gas distribution joints 34 are connected to the corresponding process gas pipelines that need to be controlled. The heating rod 32 is used to heat the gas manifold 31, and the temperature sensor 33 is used to detect the working temperature of the gas manifold 31 in real time. The top surface of the gas manifold 31 is provided with a plurality of gas distribution holes 311 controlled by the corresponding diaphragm valves 21.

[0046] like Figure 9As shown, the heat shield 4 includes a plate-shaped body 41, a through hole or slot 411 formed in the plate-shaped body 41, and the air outlet pipe 514 passes through the through hole or slot 411. A connecting plate 42 is bent on one side of the heat shield body 41, and the connecting plate 42 is fixedly connected to the bracket 1 by screws or welding.

[0047] This embodiment further discloses a thin film deposition device, in particular an ALD (atomic layer deposition) device, which includes the diaphragm valve mechanism 100 controlled by a solenoid valve according to the above embodiment.

[0048] The solenoid valve-controlled diaphragm valve mechanism and its thin film deposition equipment of this embodiment can shorten the air path between the solenoid valve and the diaphragm valve as much as possible by setting a heat insulation plate between the solenoid valve group and the diaphragm valve group. At the same time, the heat insulation plate can block the heat generated by the air path block, reducing the adverse effects on the solenoid valve.

[0049] The above examples are merely used to further illustrate the technical content of the present invention for easier understanding by the reader. However, they do not limit the implementation of the present invention to these examples. Any technical extension or reinvention based on the present invention is protected by the present invention. The scope of protection of the present invention shall be determined by the claims.

Claims

1. A diaphragm valve mechanism controlled by a solenoid valve, characterized in that: include: A bracket, a solenoid valve group connected to the top of the bracket, a diaphragm valve group connected to the middle of the bracket, and an air path block assembly connected to the bottom of the bracket, the solenoid valve group controls the air path input to the diaphragm valve group to control the opening and closing of the diaphragm valve group, and the diaphragm valve group controls the air path of the air path block assembly; wherein, a heat insulation plate is also provided between the solenoid valve group and the diaphragm valve group.

2. The solenoid valve-controlled diaphragm valve mechanism according to claim 1, characterized in that: The heat insulation plate is a stainless steel plate.

3. The solenoid-controlled diaphragm valve mechanism according to claim 2, characterized in that: The stainless steel plate is a single mirror stainless steel plate or a double mirror stainless steel plate.

4. The solenoid-controlled diaphragm valve mechanism according to claim 2, characterized in that: The air outlet pipe of the solenoid valve group is passed through the heat insulation board, so that the solenoid valve group and the diaphragm valve group are connected in a straight line through the air outlet pipe.

5. The solenoid-controlled diaphragm valve mechanism according to claim 4, characterized in that: The solenoid valve group includes: a plurality of solenoid valves, the air outlet pipe connected to the air outlet end of the solenoid valve, and a fixed sheet metal connected to the shell of the solenoid valve, and the fixed sheet metal is also connected to the bracket.

6. The solenoid-controlled diaphragm valve mechanism according to claim 5, characterized in that: The diaphragm valve group includes a plurality of diaphragm valves, which are arranged vertically and closely adjacent to each other. The top ends of the diaphragm valves are connected to the air outlet pipes, and the bottom ends of the diaphragm valves are connected to the air path manifold assembly.

7. The solenoid-controlled diaphragm valve mechanism according to claim 6, characterized in that: The bracket includes: a vertical support portion and a horizontal support portion that is laterally bent from the top end of the vertical support portion. The bottom of the vertical support portion is connected to the air path block assembly, and the horizontal support portion is connected to the fixed sheet metal.

8. The solenoid-controlled diaphragm valve mechanism according to any one of claims 4 to 7, characterized in that: An air distribution block is further provided at the bottom of the heat insulation board. An air distribution channel with one inlet and multiple outlets is provided in the air distribution block. The outlet end of the air distribution channel is connected to the inlet end of the air outlet pipe.

9. The solenoid-controlled diaphragm valve mechanism according to claim 8, characterized in that: The gas path manifold assembly includes: a gas path manifold, a heating rod and a temperature sensor embedded in the gas path manifold, and a plurality of gas distribution joints connected to the gas distribution holes of the gas path manifold.

10. A thin film deposition device, characterized in that: The thin film deposition apparatus comprises a solenoid valve-controlled diaphragm valve mechanism according to any one of claims 1 to 9.

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