Wafer heating disc

Abstract

The utility model relates to a wafer heating plate, which comprises a base plate, a heating plate and a heating assembly, the heating assembly comprises pins and a heating pipe, the base plate and the heating plate form a heating cavity, the heating pipe is arranged in the heating cavity, the pins are arranged on the outer wall of the base plate, the pins are connected with the heating pipe, and the heating pipe is arranged in the heating cavity. The number of the heating pipes is at least four groups, the number of the pins is the same as that of the heating pipes, the pins are externally connected with a power supply, the power supply heats the heating pipes through the pins, the heating pipes abut against the bottom of the heating disc, at least four groups of heating pipes are arranged at the bottom of the heating disc, and the pins are arranged in the heating disc. Therefore, the heating disc can be heated by the at least four subareas, the subarea heating can be individually controlled according to the processing requirements of different areas, and the heating time and temperature of the different areas can be adjusted according to the process requirements.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a wafer heating plate. Background Art

[0002] A heating plate primarily consists of a base, electric heating tubes, and a heating plate. The heating tubes heat up when powered on and are typically used as a uniform heating platform to evenly heat objects. Wafer processing requires multiple steps, and some processes require heating the wafer using a heating plate before proceeding to further processing.

[0003] At present, the Chinese utility model patent with the patent number "202323375079.X" and the name "An Electric-Controlled Wafer Heating Plate" discloses a chassis with a circular groove on the top and a heating plate in the circular groove.

[0004] The inventor believes that although this heating plate can achieve the heating effect and is easy to disassemble, in the actual use of the wafer, the overall heating method cannot ensure uniform temperature distribution, and it is very likely that a temperature gradient will be too large, resulting in poor product consistency. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a wafer heating plate.

[0006] The utility model provides a wafer heating plate adopting the following technical solutions:

[0007] A wafer heating plate comprises a chassis, a heating plate and a heating component, the heating component comprises pins and a heating tube, the chassis and the heating plate form a heating cavity, the heating tube is arranged in the heating cavity, the pins are arranged on the outer wall of the chassis, the pins are connected to the heating tube, the heating tube, the heating tube is provided with at least four groups, the number of the pins is the same as the number of the heating tubes, the pins are connected to an external power supply, the power supply heats the heating tube through the pins, and the heating tube abuts the bottom of the heating plate.

[0008] Optionally, the heating pipe is configured to be hollow, and the heating assembly further includes a water inlet pipe and a water outlet pipe, the water inlet pipe and the water outlet pipe are both connected to the heating pipe, and the water inlet pipe and the water outlet pipe are each provided with at least four groups.

[0009] Optionally, a connection kit is provided between the water inlet pipe and the water outlet pipe.

[0010] Optionally, a groove adapted to the heating tube is provided at the bottom of the heating plate, and the heating tube is embedded in the inner wall of the groove.

[0011] Optionally, the outer ring of the heating plate is provided with a convex ring, and the convex ring completely covers the pins.

[0012] Optionally, the heating plate is a ceramic plate.

[0013] In summary, the present invention has at least one of the following beneficial technical effects:

[0014] 1. At least four groups of heating tubes are set at the bottom of the heating plate, so that the heating plate can be heated in at least four zones. The zone heating can be individually controlled according to the processing requirements of different zones. The heating time and temperature of different zones can be adjusted according to the process requirements, thereby optimizing the processing process and improving the processing efficiency. It can also ensure a more uniform temperature distribution in different zones. The heating systems in different zones are independently controlled, and precise temperature adjustment can be performed for each zone to avoid excessive temperature gradients.

[0015] 2. A groove is provided at the bottom of the heating plate to match the heating tube. The heating tube is embedded in the inner wall of the groove. A convex ring is provided on the outer ring of the heating plate, which completely covers the pins. The heating plate is specifically a ceramic plate. Through this design, the heating plate is placed in the groove, which can effectively increase the contact area with the heating plate and improve heating efficiency.

[0016] 3. The water pump can pump external cooling water into the heating tube to adjust the temperature of the heating tube. Rapid cooling can promote the rapid solidification of the material, thereby forming the required crystal structure and performance. In addition, through rapid cooling, the morphology and size of the grains and grain boundaries can be controlled, and the mechanical, electrical and optical properties of the material can be adjusted. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a wafer heating plate.

[0018] Figure 2 It is the front view of the heating plate.

[0019] Figure 3 yes Figure 2 Sectional view along line AA.

[0020] Explanation of the accompanying drawings: 1. chassis; 2. heating plate; 3. heating assembly; 31. heating tube; 32. pin; 33. water inlet pipe; 34. water outlet pipe; 35. connection kit; 4. groove. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In addition, “several” means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] The embodiment of the utility model discloses a wafer heating plate. Figure 1-3 The 32nd heat exchanger 31 is connected to the heat exchanger 31 through the heat exchanger 32. The heat exchanger 31 is connected to the heat exchanger 31 through the heat exchanger 32.

[0025] A groove 4 is provided at the bottom of the heating plate 2 to match the heating tube 31. The heating tube 31 is embedded in the inner wall of the groove 4. A convex ring is provided on the outer ring of the heating plate 2, and the convex ring completely covers the pin 32. The heating plate 2 is specifically a ceramic plate. Through this design, the heating plate 2 is set in the groove 4, which can effectively increase the contact area with the heating plate 2 and improve the heating efficiency.

[0026] The heating assembly 3 also includes a water inlet pipe 33 and a water outlet pipe 34. The water inlet pipe 33 and the water outlet pipe 34 are both connected to the heating pipe 31. There are at least four groups of water inlet pipes 33 and water outlet pipes 34. A connecting kit 35 is provided between the water inlet pipe 33 and the water outlet pipe 34. The setting of the connecting kit 35 can ensure that when the power supply heats the heating pipe 31 through the pin 32, the heating pipe 31 can form a loop. The water inlet pipe 33 is externally connected to a water pump, which can pump external cooling water into the heating pipe 31 to adjust the temperature of the heating pipe 31. Rapid cooling can promote rapid solidification of the material, thereby forming the desired crystal structure and properties. In addition, through rapid cooling, the morphology and size of the grains and grain boundaries can be controlled, and the mechanical, electrical and optical properties of the material can be adjusted.

[0027] The above are all preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer heating plate, characterized in that: The invention comprises a chassis (1), a heating plate (2) and a heating assembly (3), wherein the heating assembly (3) comprises pins (32) and a heating tube (31), wherein the chassis (1) and the heating plate (2) form a heating cavity, wherein the heating tube (31) is arranged in the heating cavity, wherein the pins (32) are arranged on the outer wall of the chassis (1), wherein the pins (32) are connected to the heating tube (31), wherein the heating tube (31) is provided with at least four groups, wherein the number of the pins (32) is the same as the number of the heating tubes (31), wherein the pins (32) are externally connected to a power source, wherein the power source heats the heating tube (31) through the pins (32), and wherein the heating tube (31) abuts against the bottom of the heating plate (2).

2. The wafer heating plate according to claim 1, characterized in that: The heating pipe (31) is configured to be hollow, and the heating assembly (3) further comprises a water inlet pipe (33) and a water outlet pipe (34). Both the water inlet pipe (33) and the water outlet pipe (34) are in communication with the heating pipe (31), and at least four groups of the water inlet pipe (33) and the water outlet pipe (34) are provided.

3. The wafer heating plate according to claim 2, characterized in that: A connection kit (35) is provided between the water inlet pipe (33) and the water outlet pipe (34).

4. The wafer heating plate according to claim 1, wherein: A groove (4) adapted to the heating tube (31) is provided at the bottom of the heating plate (2), and the heating tube (31) is embedded in the inner wall of the groove (4).

5. The wafer heating plate according to claim 1, characterized in that: The outer ring of the heating plate (2) is provided with a convex ring, and the convex ring completely covers the pin (32).

6. The wafer heating plate according to claim 1, characterized in that: The heating plate (2) is specifically a ceramic plate.

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