Heat dissipation piece and electronic equipment

Abstract

The utility model provides a heat dissipation piece and electronic equipment, the electronic equipment comprises a first electronic device and a second electronic device, the first electronic device comprises a first heating element, and the second electronic device comprises a second heating element; the projection of the heat dissipation piece in the first direction is at least partially overlapped with the first heating element, the projection of the heat dissipation piece in the first direction is at least partially overlapped with the second heating element, the heat dissipation piece comprises a first boss, the first boss protrudes towards the direction of the first electronic device, and the second boss protrudes towards the direction of the second electronic device. The projection of the first boss in the first direction is overlapped with at least part of the first heating element, and the first direction is perpendicular to the main plane of the heat dissipation piece. According to the heat dissipation piece and the electronic equipment provided by the invention, the heat dissipation performance of the heat dissipation piece can be improved.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular, to a heat sink and electronic equipment. Background Art

[0002] Electronic devices like mobile phones typically contain motherboards, sub-boards, batteries, cameras, and other electronic components. These components generate heat during operation. Excessive heat can easily affect the normal operation and thermal experience of these components. Therefore, electronic devices often incorporate heat dissipation components such as vacuum chambers (VCs). These components typically cover the heat source and transfer the heat generated by the heat source to a cooler area, thereby reducing the temperature at the heat source.

[0003] With the demand for improved heat dissipation capacity, the space required for heat dissipation components is getting larger and larger. However, the internal space of electronic equipment is limited, and the area and thickness of heat dissipation components are restricted, so that the heat dissipation performance is limited by the heat dissipation space. Utility Model Content

[0004] The present application provides a heat sink and an electronic device, which can improve the heat dissipation performance of the heat sink.

[0005] In a first aspect, an electronic device is provided, comprising: a first electronic device and a second electronic device, the first electronic device comprising a first heating element, the second electronic device comprising a second heating element; a heat sink, the projection of the heat sink along a first direction overlapping with at least a portion of the first heating element, and the projection of the heat sink along the first direction overlapping with at least a portion of the second heating element, the heat sink comprising a first boss, the first boss protruding toward the first electronic device, the projection of the first boss along the first direction overlapping with at least a portion of the first heating element, the first direction being perpendicular to a main plane of the heat sink.

[0006] In the embodiment provided in the present application, the projection of the heat sink along the first direction overlaps with at least part of the first heating element and the second heating element respectively, and can diffuse the heat generated by the first heating element and the second heating element to the cold zone. The heat sink includes a first boss, and the projection of the first boss along the first direction overlaps with at least part of the first heating element, which can shorten the distance between the heat sink and the first heating element, reduce the thermal resistance between the heat sink and the first electronic device, and further enhance the heat dissipation effect of the heat sink on the first electronic device, so that the electronic device can still maintain good heat dissipation performance in high power consumption scenarios.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the electronic device further includes a middle frame, the heat sink and the first electronic device are respectively located on both sides of the middle frame along the first direction, the middle frame includes a first recessed portion, and at least a portion of the first boss is accommodated in the first recessed portion; or, the middle frame includes a first through hole, and at least a portion of the first boss passes through the first through hole.

[0008] In the embodiments provided herein, the middle frame is provided with a first recessed portion, and at least a portion of the first boss is accommodated in the first recessed portion. This can shorten the distance between the heat sink and the heating element, reduce the thermal resistance between the heat sink and the heating element, improve heat dissipation performance, and ensure the structural rigidity of the middle frame. The middle frame includes a first through-hole, through which at least a portion of the first boss passes, further reducing the distance and thermal resistance between the heat sink and the heating element, thereby further improving the heat dissipation performance of the heat sink.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the first electronic device is a mainboard, the mainboard includes a shielding cover, the first heating element is arranged in a accommodating space surrounded by the shielding cover, the shielding cover includes a second recessed portion, and the projection of the first boss along the first direction overlaps with the second recessed portion; or, the shielding cover includes a second through hole, and at least a portion of the first boss passes through the second through hole.

[0010] In the embodiments provided herein, the motherboard shield includes a second recessed portion, and the projection of the first boss along a first direction overlaps the second recessed portion. This can reduce the distance and thermal resistance between the heat sink and a heat-generating component, such as a SOC, thereby further improving heat dissipation performance. The shield includes a second through-hole, and at least a portion of the first boss passes through the second through-hole. This can further reduce the distance and thermal resistance between the heat sink and a heat-generating component, such as a SOC, thereby further improving heat dissipation performance.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the electronic device also includes a third electronic device, which is arranged on a side of the second electronic device away from the first electronic device, and the third electronic device includes a third heating element, and the projection of the heat sink along the first direction overlaps with at least part of the third heating element.

[0012] In the embodiment provided in the present application, the electronic device includes a third electronic component, and the projection of the heat sink along the first direction overlaps with at least part of the third heating component, so that the heat sink can dissipate heat for the third electronic component, further improving the heat dissipation effect of the electronic device.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the electronic device also includes a first circuit board, which is arranged on a side of the heat sink close to the second electronic device, and the first circuit board is electrically connected to the first electronic device and the third electronic device, respectively; the heat sink includes a first area, which is located on a side of the heat sink close to the second electronic device, and the projection of the first area along the first direction overlaps with the first circuit board, and the first area is provided with a first groove, and the projection of the first groove along the first direction overlaps with at least part of the second electronic device.

[0014] In the embodiment provided in the present application, the first circuit board and the heat sink are generally connected by bonding, and the first area of the heat sink includes a first groove. At least a portion of the adhesive backing of the first circuit board can be accommodated in the first groove, thereby reducing the thickness space occupied by the adhesive backing of the first circuit board and reducing the overall thickness of the electronic device.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the electronic device further includes a second circuit board and a display screen, the second circuit board being electrically connected to the first electronic device and the display screen, respectively; the heat sink includes a second area, the second area being located on a side of the heat sink close to the second electronic device, and the projection of the second area along the first direction overlaps with the second circuit board, the second area being provided with a second groove, the projection of the second groove along the first direction overlapping with at least part of the second electronic device.

[0016] In the embodiment provided in the present application, the second circuit board and the heat sink are generally connected by bonding, and the second area of the heat sink includes a second groove. At least a portion of the adhesive backing of the second circuit board can be accommodated in the second groove, thereby reducing the thickness space occupied by the adhesive backing of the second circuit board and reducing the overall thickness of the electronic device.

[0017] In combination with the first aspect, in some implementations of the first aspect, the heat sink is further provided with a second boss, which protrudes toward the second electronic device, and the projection of the second boss along the first direction overlaps with at least a portion of the second heating element.

[0018] In the embodiment provided in the present application, the heat sink includes a second boss, and the projection of the second boss along the first direction overlaps with at least part of the second heating element, which can reduce the distance and thermal resistance between the heat sink and the second heating element and improve the heat dissipation performance.

[0019] In combination with the first aspect, in certain implementations of the first aspect, the heat sink is a temperature spreader, which includes a first cover plate and a second cover plate, the first cover plate and the second cover plate forming a sealed cavity, the first cover plate being the cover plate of the temperature spreader close to the first electronic device, the second cover plate being the cover plate of the temperature spreader away from the first electronic device, and the first boss being arranged on the first cover plate.

[0020] In the embodiment provided in the present application, the first boss is provided on the first cover plate of the temperature homogenizing plate, which can simplify the processing steps of the first boss and make the heat sink easy to produce and process.

[0021] In combination with the first aspect, in certain implementations of the first aspect, the temperature equilibrium plate further includes a capillary structure, which includes a first part and a second part, the first part being the part where the projection of the capillary structure along the first direction overlaps with the first boss, the second part being the part where the projection of the capillary structure along the first direction does not overlap with the first boss, and the size of the first part in the first direction is greater than or equal to the size of the second part in the first direction.

[0022] In the embodiments provided herein, the capillary structure includes a first portion and a second portion. The first portion has a dimension in the first direction that is greater than or equal to the dimension in the first direction of the second portion. This structure can increase the vapor passage at the first boss location, enhance the capillary force at the first boss location, and improve the heat dissipation limit of the heat sink, enabling the electronic device to maintain good heat dissipation performance even in high-power consumption scenarios. When the first heating element is a SOC 261 on a motherboard, this can improve the overclocking performance of the SOC 261.

[0023] In combination with the first aspect, in certain implementations of the first aspect, the material of the first cover plate and / or the second cover plate is any one of the following: stainless steel, stainless steel / copper composite material, titanium, titanium alloy, titanium / copper composite material.

[0024] In the embodiments provided in the present application, the material of the first cover plate and / or the second cover plate is any one of the above-mentioned materials, which can enable the first cover plate and / or the second cover plate to have high strength, and the heat sink and the middle frame can jointly serve as the bearing structure of the electronic device to improve the structural rigidity of the electronic device.

[0025] In combination with the first aspect, in some implementations of the first aspect, the middle frame includes a hollow area, the second electronic device is disposed in the hollow area, and a projection of the heat sink along the first direction overlaps with the hollow area.

[0026] In the embodiment provided in the present application, the middle frame includes a hollowed-out area, and the second electronic device is arranged in the hollowed-out area, which can reduce the thickness of the electronic device. The projection of the heat sink along the first direction overlaps with the hollowed-out area. The heat sink can serve as a bearing structure together with the middle frame, reducing the impact of the hollowing of the middle frame on the structural stiffness.

[0027] In combination with the first aspect, in some implementations of the first aspect, the second electronic component is a battery, and the third electronic component is a small board.

[0028] In a second aspect, a heat sink is provided for use in an electronic device, the electronic device comprising a first electronic device and a second electronic device, the first electronic device comprising a first heating element, the second electronic device comprising a second heating element; a projection of the heat sink along a first direction overlaps with at least a portion of the first heating element, and a projection of the heat sink along the first direction overlaps with at least a portion of the second heating element; the heat sink comprises a first boss, the first boss protrudes toward the first electronic device, the projection of the first boss along the first direction overlaps with at least a portion of the first heating element, and the first direction is perpendicular to a main plane of the heat sink.

[0029] In combination with the second aspect, in certain implementations of the second aspect, the electronic device further includes a middle frame, the heat sink and the first electronic device are respectively located on both sides of the middle frame along the first direction, the middle frame includes a first recessed portion, and at least a portion of the first boss is accommodated in the first recessed portion; or, the middle frame includes a first through hole, and at least a portion of the first boss passes through the first through hole.

[0030] In combination with the second aspect, in certain implementations of the second aspect, the first electronic device is a mainboard, the mainboard includes a shielding cover, the first heating element is arranged in the accommodating space surrounded by the shielding cover, the shielding cover includes a second recessed portion, and the projection of the first boss along the first direction overlaps with the second recessed portion; or, the shielding cover includes a second through hole, and at least a portion of the first boss passes through the second through hole.

[0031] In combination with the second aspect, in certain implementations of the second aspect, the electronic device also includes a third electronic device, which is arranged on a side of the second electronic device away from the first electronic device, and the third electronic device includes a third heating element, and the projection of the heat sink along the first direction overlaps with at least part of the third heating element.

[0032] In combination with the second aspect, in certain implementations of the second aspect, the electronic device also includes a first circuit board, which is arranged on a side of the heat sink close to the second electronic device, and the first circuit board is electrically connected to the first electronic device and the third electronic device, respectively; the heat sink includes a first area, which is located on a side of the heat sink close to the second electronic device, and the projection of the first area along the first direction overlaps with the first circuit board, and the first area is provided with a first groove, and the projection of the first groove along the first direction overlaps with at least part of the second electronic device.

[0033] In combination with the second aspect, in certain implementations of the second aspect, the electronic device further includes a second circuit board and a display screen, the second circuit board being electrically connected to the first electronic device and the display screen, respectively; the heat sink includes a second area, the second area being located on a side of the heat sink close to the second electronic device, and the projection of the second area along the first direction overlaps with the second circuit board, the second area being provided with a second groove, the projection of the second groove along the first direction overlapping with at least part of the second electronic device.

[0034] In combination with the second aspect, in some implementations of the second aspect, the heat sink is further provided with a second boss, which protrudes toward the second electronic device, and the projection of the second boss along the first direction overlaps with at least a portion of the second heating element.

[0035] In combination with the second aspect, in certain implementations of the second aspect, the heat sink is a temperature spreader, which includes a first cover plate and a second cover plate, the first cover plate and the second cover plate forming a sealed cavity, the first cover plate being the cover plate of the temperature spreader close to the first electronic device, the second cover plate being the cover plate of the temperature spreader away from the first electronic device, and the first boss being arranged on the first cover plate.

[0036] In combination with the second aspect, in certain implementations of the second aspect, the temperature equilibrium plate further includes a capillary structure, which includes a first part and a second part, the first part being the part where the projection of the capillary structure along the first direction overlaps with the first boss, and the second part being the part where the projection of the capillary structure along the first direction does not overlap with the first boss, and the size of the first part in the first direction is greater than or equal to the size of the second part in the first direction.

[0037] In combination with the second aspect, in certain implementations of the second aspect, the material of the first cover plate and / or the second cover plate is any one of the following: stainless steel, stainless steel / copper composite material, titanium, titanium alloy, titanium / copper composite material.

[0038] In combination with the second aspect, in some implementations of the second aspect, the middle frame includes a hollow area, the second electronic device is disposed in the hollow area, and a projection of the heat sink along the first direction overlaps with the hollow area. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the cross-sectional structure of an electronic device;

[0040] Figure 2 This is a schematic diagram of the internal structure of an electronic device provided in an embodiment of the present application;

[0041] Figure 3 This is a schematic diagram of an exploded structure of an electronic device provided in an embodiment of the present application;

[0042] Figure 4 is a schematic cross-sectional structural diagram of an electronic device provided in an embodiment of the present application;

[0043] Figure 5 This is a schematic diagram of an exploded structure of a heat sink provided in an embodiment of the present application;

[0044] Figure 6 This is a partially enlarged structural diagram of a boss structure provided in an embodiment of the present application;

[0045] Figure 7 and Figure 8 is a schematic cross-sectional structural diagram of a heat sink provided in an embodiment of the present application;

[0046] Figure 9 and Figure 10 is a schematic cross-sectional structural diagram of an electronic device provided in an embodiment of the present application;

[0047] Figure 11 is a bottom view of the heat sink provided in an embodiment of the present application;

[0048] Figure 12 This is a partially enlarged structural diagram of a groove structure provided in an embodiment of the present application;

[0049] Figure 13 This is a schematic diagram of the cross-sectional structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0050] The technical solution in this application will be described below with reference to the accompanying drawings.

[0051] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0052] In the various embodiments of this application, the terms "first," "second," and so on are merely used to indicate that multiple objects are distinct. For example, the terms "first boss" and "second boss" are merely used to indicate different bosses. These terms should not affect the bosses themselves or their number. The terms "first," "second," and so on should not limit the embodiments of this application in any way.

[0053] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship remains unchanged after the connection. "Rotational connection" means that the two are connected to each other and can rotate relative to each other after the connection. "Sliding connection" means that the two are connected to each other and can slide relative to each other after the connection. The directional terms mentioned in the embodiments of the present application, such as "up", "down", "left", "right", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0054] The terms "include", "comprising", "having" and variations thereof mean "including but not limited to", unless specifically emphasized otherwise.

[0055] Figure 1 This is a typical cross-sectional structural diagram of an electronic device, such as Figure 1 As shown in (a) of FIG. 1 , the electronic device includes a middle frame 101, a display module 102, and a back cover 103. The middle frame 101 is located between the display module 102 and the back cover 103 and is connected to the display module 102 and the back cover 103. For example, the middle frame 101 can be fixedly connected to the display module 102 and the back cover 103 by bonding. The middle frame 101 can be used to support and fix the internal electronic components of the electronic device, such as the main board 108, the small board 106, and the battery 107.

[0056] The main board 108 and the sub-board 106 are electrically connected via a flexible printed circuit (FPC) 109. The display module 102 and the main board 108 are also electrically connected via the FPC 109. The FPC 109 can be bonded to the middle frame 101 using adhesive, and the FPC 109 can be located between the battery 107 and the middle frame 101. The adhesive can also be called an adhesive.

[0057] The electronic device may also include a VC 104, which may be disposed in the slot 1011 of the middle frame 101. In electronic devices, the motherboard 108 typically integrates heat-generating components such as a system on chip (SOC), a wireless fidelity (WiFi) module, and a power amplifier (PA). The motherboard 108 is one of the primary heat-generating components in the electronic device. The SOC may also be referred to as the main chip. The battery 107 also tends to generate heat during the charging and discharging process, causing heating. Therefore, the VC 104 may overlie the battery 107 and the motherboard 108. That is, the projection of the VC 104 along the z-axis at least partially overlaps with the motherboard 108, and the projection of the VC 104 along the z-axis at least partially overlaps with the battery 107. This allows heat generated by the battery 107 and motherboard 108 to be transferred to the VC 104, and then transferred through the VC 104 to a cooler area, such as the display module 102, to alleviate heating of the battery 107 and motherboard 108. The projection of VC 104 along the z-axis direction at least partially overlaps with the mainboard 108. This means that the projection of VC 104 along the z-axis direction at least partially overlaps with the heating element on the mainboard 108. The z-axis direction may also be referred to as a first direction.

[0058] In some examples, some heating components may be integrated on the small board. For example, when the main board has limited space and some heating components are placed on the small board, the VC may also cover the small board. In other words, the projection of the VC 104 along the z-axis overlaps at least partially with the small board 106.

[0059] Figure 1 In the structure shown in (a), the VC 104 is stacked on the middle frame 101. Both the VC 104 and the middle frame 101 need to occupy thickness space, which easily leads to a larger thickness of the electronic device.

[0060] Figure 1In the structure shown in (b), the area of the middle frame 101 corresponding to the battery 107 includes an opening 1012, the VC104 covers the opening 1012, and the VC104 extends from the area where the battery 107 is located to the area where the motherboard 108 is located, that is, the projection of the VC104 along the z-axis direction overlaps with at least part of the battery 107, and the projection of the VC104 along the z-axis direction overlaps with at least part of the motherboard 108.

[0061] In this architecture, the opening 1012 easily affects the structural rigidity of the middle frame 101 , thereby limiting the area of the VC 104 and limiting the improvement of the heat dissipation performance of the entire electronic device.

[0062] Therefore, the embodiments of the present application provide a heat dissipation assembly, which enables the electronic device to meet the requirements of being lightweight and thin while having excellent heat dissipation performance.

[0063] Figure 2 This is a schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application, and may be a schematic diagram of the overall structure of a partial structure in the electronic device. Figure 3 yes Figure 2 The exploded structure diagram of the electronic equipment shown, Figure 4 It is a schematic diagram of the cross-sectional structure of the electronic device along the AA direction. Figure 2 In this paper, the heat dissipation structure in the electronic device is introduced by taking the mobile phone as an example. The electronic device can also be a tablet computer, a laptop computer, a wearable device, etc. This application does not limit this. In order to facilitate the reflection of the structural characteristics of the heat dissipation component in the electronic device, Figure 2 and Figure 3 The electronic components containing heat sources in the electronic equipment are not shown. Figure 4 A schematic illustration is given in the following.

[0064] See also Figures 2 to 4 In the structure shown, the electronic device may include a first electronic device 260 and a second electronic device 270. The first electronic device 260 may include a first heating element, and the second electronic device 270 may include a second heating element. The projection of the heat sink 220 along a first direction overlaps at least partially with the first heating element, and the projection of the heat sink 220 along the first direction overlaps at least partially with the second heating element. The first direction may be perpendicular to the principal plane of the heat sink 220, which may be the surface of the heat sink 220 with the largest planar area. The first direction may be the z-axis direction shown in the figure, that is, the thickness direction of the electronic device.

[0065] For example, the first electronic device 260 may be a motherboard, which may be a core circuit board inside an electronic device, and on which the main electronic components and circuit systems of the electronic device are integrated. Figure 4 As shown, the motherboard may include a shielding cover 262. The shielding cover 262 can be used to prevent electromagnetic interference, for example, to prevent electromagnetic radiation generated by the internal circuits of the motherboard from leaking out. It can also be used to prevent electromagnetic interference outside the motherboard from affecting the normal operation of the internal circuits of the motherboard. The shielding cover 262 can also protect the motherboard from collisions. The motherboard may also include a system on chip (SOC) 261. The SOC 261 may be a core component of the motherboard, implementing tasks such as data processing on the motherboard. The SOC 261 is one of the main heat-generating components in the motherboard. The SOC 261 can be disposed in the accommodation space surrounded by the shielding cover 262. The SOC 261 can be disposed on a printed circuit board (PCB) 266. The PCB 266 provides electrical signals to the SOC 261. At least a portion of the PCB 266 can be disposed within the shielding cover 262. The motherboard may further include a power management unit (PMU) 264, which is used to manage power distribution, voltage regulation, and power control of the electronic device. The PMU 264 may be disposed within the shielding cover 262 and may be electrically connected to the PCB 266. The motherboard may further include a thermal interface material (TIM) 263, which may fill the gap between the SOC 261 and the shielding cover 262, or may fill the entire or partial shielding cover to enclose the heat-generating device. The TIM 263 may also be disposed on the outside of the shielding cover 262. The TIM 263 may reduce the thermal resistance of the motherboard and more efficiently transfer the heat generated by the SOC 261 and other heat-generating components to the heat sink 220. The motherboard may further include a motherboard bracket 265, on which the shielding cover 262 may be supported.

[0066] In this example, the first heating element can be the SOC261 in the motherboard, and the projection of the heat sink 220 along the first direction can overlap with at least part of the SOC261 to shorten the distance between the heat sink 220 and the heat source, so that the heat generated by the SOC261 can be transferred to the cold area through the heat sink 220, thereby improving the heat dissipation performance of the heat sink 220 on the motherboard.

[0067] It should be understood that the PMU 264 and the SOC 261 can be located on either side of the PCB 266, or on the same side of the PCB 266. The SOC 261 can be located in the center of the motherboard, or to the left or right of the shielding cover 262. This application does not limit the location of the various components on the motherboard. Figure 4 The figure only schematically shows that the mainboard includes SOC261 and PMU264. The mainboard may also include other components, and heating components may also be included in the other components included in the mainboard. For example, the mainboard may also include a storage component, and the storage component may be arranged in the same shielding cover 262 as the SOC261, or in a different shielding cover 262. That is to say, the number of shielding covers 262 of the mainboard may also be multiple.

[0068] For example, the second electronic device 270 may be a battery, which may include components such as a cell, a protection circuit, and a housing (not shown). The cell is the energy storage component of the battery, used to store and release energy. The protection circuit is the safety management component of the battery, used to ensure that the battery operates within a safe range. The housing protects internal components from damage. The battery may also include other components, such as a temperature sensor, to enhance battery safety.

[0069] In this example, the battery cell is the main heating element in the battery, that is, the second heating element can be the battery cell in the battery, and the projection of the heat sink 220 along the first direction overlaps with at least part of the battery cell, which can facilitate the transfer of heat generated when the battery is working to the cold area, thereby achieving heat dissipation of the battery.

[0070] The battery can be connected to the heat sink 220 via an adhesive 250 , and the adhesive 250 can be disposed on an area of the battery outside the first circuit board 241 and the second circuit board 242 .

[0071] In some embodiments, the projection of the heat sink 220 along the first direction may overlap with the first heating element. In other words, the heat sink 220 may cover the entire first heating element, for example, the entire SOC 261, to further improve the heat dissipation effect on the motherboard.

[0072] In some embodiments, the projection of the heat sink 220 along the first direction can overlap with the second electronic device 270. In other words, the heat sink 220 can cover the entire second electronic device 270, that is, it can cover the entire battery to further enhance the heat dissipation effect on the battery.

[0073] The heat sink 220 may include a first boss 2221 on a side proximate to the first electronic device 260. The projection of the first boss 2221 along a first direction overlaps at least partially with the first heating element. The inclusion of the first boss 2221 on the side proximate to the first electronic device 260 reduces the distance between the heat sink 220 and the first electronic device, lowering the thermal resistance between the heat sink 220 and the first electronic device and improving the heat dissipation effect of the heat sink 220 on the first electronic device.

[0074] In some embodiments, the heat dissipation element 220 may be a VC. Figure 5 This is the explosion structure diagram of the VC. Figure 6 This is an enlarged view of the local structure of the VC.

[0075] like Figure 5 or Figure 6 As shown, the VC may include a first cover plate 222 and a second cover plate 221. The first cover plate 222 may be the lower cover plate of the VC, that is, the cover plate in the VC close to the first electronic device 260, and the second cover plate 221 may be the upper cover plate of the VC, that is, the cover plate in the VC away from the first electronic device 260. The first cover plate 222 and the second cover plate 221 may be connected to each other, and a sealed cavity may be formed between the first cover plate 222 and the second cover plate 221. A working medium may be encapsulated in the sealed cavity. The heat sink 220 may achieve heat transfer through a series of phase change heat transfer processes such as evaporation, diffusion, condensation, and reflow of the working medium.

[0076] As an example, Figure 6 As shown, the first boss 2221 may be provided on the first cover plate 222 , and the first boss 2221 protrudes toward the first electronic device 260 , while the second cover plate 221 may not be provided with a boss structure.

[0077] As another example, Figure 7 As shown, both the first cover plate 222 and the second cover plate 221 may be provided with a boss structure. The boss 2211 on the second cover plate 221 may protrude toward the first cover plate 222. The boss 2211 on the first cover plate 222 may correspond to the first boss 2221 on the second cover plate 221, or may be offset. The planar dimensions of the boss 2211 may be greater than the planar dimensions of the first boss 2221, or may be less than or equal to the planar dimensions of the first boss 2221.

[0078] In some embodiments, the boss 2211 can also be used to adjust the surface flatness of the VC.

[0079] See also Figure 8As shown in the schematic diagram of the VC cross-section structure, the VC may also include a capillary structure 223. This capillary structure 223 may be disposed between the first cover plate 222 and the second cover plate 221 and may be housed in the sealed cavity formed by the first and second cover plates 222 and 221. This capillary structure 223 may be used to guide the flow direction of the working medium within the vacuum cavity, enabling the working medium to form a continuous heat conduction cycle within the vacuum cavity. For example, this capillary structure 223 may be a structure such as copper foil, copper mesh, or copper powder with microgrooves or micropores.

[0080] When the VC includes a first boss 2221, a capillary structure 223 may be disposed in the first boss 2221. The capillary structure 223 may include a first portion 2231 and a second portion 2232. The first portion 2231 may be the portion where the projection of the capillary structure 223 along the first direction overlaps with the first boss 2221, while the second portion 2232 may be the portion where the projection of the capillary structure 223 along the first direction does not overlap with the first boss 2221. In some embodiments, the thickness of the first portion 2231 may be greater than the thickness of the second portion 2232, or in other words, the dimension of the first portion 2231 in the first direction may be greater than the dimension of the second portion 2232 in the first direction.

[0081] As an example, Figure 8 As shown in (a), the second portion 2232 may include a layer of capillary structure, and the first portion may include multiple layers of capillary structure, and the sum of the thicknesses of the multiple layers of capillary structure may be greater than the thickness of the single layer of capillary structure.

[0082] As another example, Figure 8 As shown in (b) , the first portion 2231 and the second portion 2232 may both include only one layer of capillary structure, and the capillary structure thickness of the first portion 2231 is greater than the capillary structure thickness of the second portion 2232 .

[0083] In some embodiments, the thickness of the first portion 2231 may also be the same as the thickness of the second portion 2232. Figure 8As shown in (c), the first portion 2231 and the second portion 2232 may each be provided with only one layer of the capillary structure, and the first portion 2231 and the second portion 2232 are continuous structures. The first portion 2231 and the second portion 2232 are arranged at an angle, so that the first portion 2231 is accommodated in the first boss 2221, or in other words, the first portion 2231 protrudes toward the first electronic device 260. In this example, the size of the first portion 2231 in the first direction and the size of the second portion 2232 in the first direction may mean that the size of the capillary structure of the first portion 2231 arranged parallel to the second portion 2232 in the first direction is the same as the size of the second portion 2232 in the first direction.

[0084] In the embodiment provided in the present application, the VC includes a first boss 2221, and a capillary structure 223 is provided in the first boss 2221, which can increase the steam channel in the first boss 2221, increase the thickness and capillary force of the capillary structure, and improve the heat dissipation limit of the VC. The heat dissipation limit can be increased by more than 1W (watt), so that the electronic device can still maintain good heat dissipation performance in high power consumption scenarios. The heat dissipation performance of the chip is improved, and the overclocking performance of the chip can also be effectively improved. The overclocking performance of the chip can refer to the ability to improve the chip performance by adjusting the operating frequency of the chip.

[0085] It should be noted that Figure 8 In the illustrated capillary structure 223, the connection between the first portion 2231 and the second portion 2232 forms a right angle. The angle between the connection between the first portion 2231 and the second portion 2232 can also be an obtuse angle to achieve a smoother connection between the first portion 2231 and the second portion 2232. Similarly, the illustrated first boss 2221 has a square cross-sectional structure. The cross-sectional structure of the first boss 2221 can also be a trapezoidal, semi-elliptical, or other structure to achieve a smoother structure. This application does not limit the specific shapes of the first boss 2221 and the capillary structure 223.

[0086] In some embodiments, the VC may further include a support column 224, which may be supported between the capillary structure 223 and the second cover plate 221. The support column 224 may be used to improve the structural strength of the VC and prevent deformation of the VC under the action of external force, which may cause the steam channel and the capillary structure to be flattened and cause the VC to fail.

[0087] The number of the first boss 2221 shown in the figure is one, but the number of the first boss 2221 may also be multiple.

[0088] As an example, when there are multiple first bosses 2221, the multiple first bosses 2221 can be adjacently arranged along the x-axis direction or the y-axis direction shown in the figure, and the projections of the multiple first bosses 2221 along the first direction can overlap with the same heating element.

[0089] As another example, the motherboard may include multiple heat-generating components, and the multiple first bosses 2221 may correspond to different heat-generating components. For example, in addition to the SOC 261, the motherboard may also include other heat-generating components such as a memory element. The projection of at least one of the multiple first bosses 2221 along the first direction may overlap at least partially with the SOC 261, and the projection of at least one of the multiple first bosses 2221 along the first direction may overlap at least partially with the memory element.

[0090] In some embodiments, the projection of the first boss 2221 along the first direction can overlap with the first heating element. In this example, the planar area of the first boss 2221 along the xy plane can be larger than the planar area of the first heating element along the xy plane, so that the first boss 2221 can cover the first heating element.

[0091] In some embodiments, the material of the first cover plate 222 and the second cover plate 221 of the VC can be any one of the following materials: stainless steel, stainless steel / copper composite material, titanium, titanium alloy, titanium / copper composite material. The materials of the first cover plate 222 and the second cover plate 221 are the above materials. The VC and the middle frame can jointly serve as the load-bearing structure of the electronic device to improve the structural rigidity of the electronic device. The materials of the first cover plate 222 and the second cover plate 221 can also be other high-strength materials, such as metal-based composite materials, which are not limited in this application.

[0092] Continue to see Figures 2 to 4 In the structure shown, in some embodiments, the electronic device may include a middle frame 210, the middle frame 210 may include a hollowed-out area 213, the second electronic component may be disposed in the hollowed-out area 213, and the projection of the heat sink 220 along the first direction may overlap with the hollowed-out area 213. In other words, the size of the heat sink 220 along the x-axis may be greater than or equal to the size of the hollowed-out area 213 along the x-axis, and the size of the heat sink 220 along the y-axis may be greater than or equal to the size of the hollowed-out area 213 along the y-axis. The middle frame 210 includes the hollowed-out area 213, and the second electronic component is disposed in the hollowed-out area 213, which can reduce the overall thickness of the electronic device. The projection of the heat sink 220 along the first direction overlaps with the hollowed-out area 213. The heat sink 220 and the middle frame 210 can jointly serve as a load-bearing structure, reducing the impact of the hollowing of the middle frame 210 on the structural rigidity of the electronic device.

[0093] When the heat sink 220 is a VC, the overlap of the projection of the heat sink 220 along the first direction with the hollowed-out area 213 may mean that the projection of the first cover plate 222 along the first direction overlaps with the hollowed-out area 213. For example, the size of the second cover plate 221 in the y-axis direction may be smaller than the size of the first cover plate 222 in the y-axis direction, and the size of the second cover plate 221 in the x-axis direction may also be smaller than the size of the first cover plate 222 in the x-axis direction. The first cover plate 222 may cover the hollowed-out area 213, while the second cover plate 221 may not cover the hollowed-out area 213. Alternatively, the overlap of the projection of the heat sink 220 along the first direction with the hollowed-out area 213 may mean that the projections of both the first cover plate 222 and the second cover plate 221 along the first direction overlap with the hollowed-out area 213. For example, the size of the second cover plate 221 in the y-axis direction may be the same as the size of the first cover plate 222 in the y-axis direction, and the size of the second cover plate 221 in the x-axis direction may also be the same as the size of the first cover plate 222 in the x-axis direction. Both the first cover plate 222 and the second cover plate 221 may cover the hollow area 213. Alternatively, the projection of the heat sink 220 along the first direction may overlap with the hollow area 213, or both the projections of the second cover plate 221 along the first direction may overlap with the hollow area 213. For example, the size of the second cover plate 221 in the y-axis direction may be greater than the size of the first cover plate 222 in the y-axis direction, and the size of the second cover plate 221 in the x-axis direction may also be greater than the size of the first cover plate 222 in the x-axis direction. The second cover plate 221 may cover the hollow area 213, while the first cover plate 222 may not cover the hollow area 213.

[0094] Continue to see Figures 2 to 4 In the structure shown, in some embodiments, the heat sink 220 and the middle frame 210 may include a first recessed portion 214, and at least a portion of the first boss 2221 may be accommodated in the first recessed portion 214. Specifically, the size of the first recessed portion 214 on the xy plane may be greater than or equal to the size of the first boss 2221 on the xy plane. For example, the size of the first recessed portion 214 along the y-axis direction may be greater than or equal to the size of the first boss 2221 along the y-axis direction, and the size of the first recessed portion 214 along the x-axis direction may be greater than or equal to the size of the first boss 2221 along the x-axis direction, so that the first boss 2221 can be accommodated in the first recessed portion 214. The size of the first recessed portion 214 along the first direction may be greater than the size of the first boss 2221 along the first direction, or may be less than or equal to the size of the first boss 2221 along the first direction. The cross-sectional shape of the first recessed portion 214 along the xy plane may be the same as or different from the cross-sectional shape of the first boss 2221 along the xy plane.

[0095] The middle frame 210 includes a first recessed portion 214 , and the first boss 2221 is accommodated in the first recessed portion 214 , which can not only improve the heat dissipation performance of the heat sink 220 but also ensure the structural rigidity of the middle frame 210 .

[0096] In some embodiments, see Figure 9 As shown in the cross-sectional structural diagram, the middle frame 210 may include a first through-hole 215, through which at least a portion of the first boss 2221 may pass. Similar to the structure of the first groove 2222, the size of the first through-hole 215 in the xy plane may be greater than or equal to the size of the first boss 2221 in the xy plane, so that the first boss 2221 can pass through the first through-hole 215. The shape of the first through-hole 215 may be the same as or different from the cross-sectional shape of the first boss 2221 along the xy plane.

[0097] The middle frame 210 includes a first through hole 215, and at least a portion of the first boss 2221 passes through the first through hole 215, which can further reduce the distance between the first boss 2221 and the first electronic device 260, reduce the thermal resistance between the heat sink 220 and the first heating element, improve the heat dissipation performance of the heat sink 220, and reduce the thickness of the electronic device.

[0098] Continue to see Figure 4 As shown in the cross-sectional structural diagram, in some embodiments, the shielding cover 262 of the mainboard may include a second recessed portion 2621 , and the projection of the first boss 2221 along the first direction overlaps with the second recessed portion 2621 .

[0099] When the middle frame 210 includes the first recessed portion 214, the size of the second recessed portion 2621 on the xy plane can be greater than or equal to the size of the first recessed portion 214 on the xy plane, so that the first recessed portion 214 can be accommodated in the second recessed portion 2621. The cross-sectional shape of the second recessed portion 2621 along the xy plane can be the same as or different from the cross-sectional shape of the first recessed portion 214 and the first boss 2221 along the xy plane. In this example, the first boss 2221 and the first recessed portion 214 can be accommodated together in the second recessed portion 2621.

[0100] When the middle frame 210 includes the first through hole 215, the size of the second recessed portion 2621 on the xy plane can be greater than or equal to the size of the first boss 2221 on the xy plane, so that the first boss 2221 can be accommodated in the second recessed portion 2621. The cross-sectional shape of the second recessed portion 2621 along the xy plane can be the same as or different from the cross-sectional shape of the first boss 2221 along the xy plane and the shape of the first through hole 215.

[0101] The shielding cover 262 of the mainboard includes a second recessed portion 2621 , which can reduce the distance between the heat sink 220 and the mainboard and ensure the shielding performance of the shielding cover 262 .

[0102] In some embodiments, see Figure 10 As shown in the cross-sectional structural diagram, the shielding cover 262 of the mainboard may include a second through hole 2622 , and at least a portion of the first boss 2221 may pass through the second through hole 2622 .

[0103] When the middle frame 210 includes the first recessed portion 214, the size of the second through hole 2622 on the xy plane can be greater than or equal to the size of the first recessed portion 214 on the xy plane, and the first boss 2221 and the first recessed portion 214 can both pass through the second through hole 2622 (not shown in the figure). The cross-sectional shape of the second through hole 2622 on the xy plane can be the same as or different from the cross-sectional shapes of the first recessed portion 214 and the first boss 2221 on the xy plane.

[0104] When the middle frame 210 includes the first through hole 215, the size of the second through hole 2622 on the xy plane can be greater than or equal to the size of the first boss 2221 on the xy plane, so that the first boss 2221 can pass through the second through hole 2622. The shape of the first through hole 215 can be the same as or different from the cross-sectional shape of the first boss 2221 on the xy plane.

[0105] The shielding cover 262 of the mainboard includes a second through hole 2622 , which can further reduce the distance between the heat sink 220 and the heating element in the mainboard, reduce the thermal resistance between the heat sink 220 and the heat source, and improve the heat dissipation performance of the heat sink 220 .

[0106] It should be noted that the middle frame may also include both the first recessed portion 214 and the first through hole 215, such as Figure 3 As shown in the exploded structural diagram in FIG, the SOC 261 can be disposed below the first recessed portion 214, or the SOC 261 can also be disposed below the first through-hole 215. For example, when the thickness of the SOC 261 is relatively large, the SOC 261 can be disposed below the first through-hole 215, and other electronic components of the motherboard, such as a memory module, can be disposed below the first recessed portion 214. When the thickness of the SOC 261 is relatively small, the SOC 261 can be disposed below the first recessed portion 214.

[0107] Continue to see Figures 2 to 4In the structure shown, in some embodiments, the electronic device also includes a third electronic device 280, which can be arranged on a side of the second electronic device 270 away from the first electronic device 260, and the third electronic device 280 includes a third heating element, and the projection of the heat sink 220 along the first direction overlaps with at least part of the third heating element.

[0108] For example, the third electronic device 280 may be a small board, which may be an auxiliary circuit board within an electronic device and may be used to expand or assist the functions of a main board. The small board may include a heating element such as an audio amplifier, and the third heating element may be the audio amplifier. The projection of the heat sink 220 along the first direction may overlap at least partially with the audio amplifier.

[0109] When the third electronic device 280 is arranged on the side of the second electronic device 270 away from the first electronic device 260, the first electronic device 260, the second electronic device 270 and the third electronic device 280 can be arranged in sequence along the length direction of the electronic device, that is, they can be arranged in sequence along the y-axis direction shown in the figure, and the first electronic device 260 and the third electronic device 280 can be arranged on the same side of the middle frame 210. When the first electronic device 260 is a motherboard, the motherboard can be arranged at the end of the electronic device close to the camera. Figure 2 In the electronic device structure shown, the main board can be arranged on the left side of the hollow area 213 and can be located on the side of the first recessed portion 214 away from the display screen 211. When the third electronic device 280 is a small board, the small board can be arranged at one end of the electronic device close to the under-screen fingerprint area. Figure 2 In the electronic device structure shown in FIG, the small board can be arranged on the right side of the hollow area 213. When the second electronic device 270 is a battery, the battery is arranged in the area between the small board and the main board. Figure 2 In the electronic device structure shown, the battery can be disposed in the hollowed-out area 213. In this example, the projection of the heat sink 220 along the first direction can overlap with the second electronic device 270, or in other words, the heat sink 220 can cover the entire second electronic device 270. The heat sink 220 has a large heat dissipation area, which can effectively improve the heat dissipation effect of the heat sink 220.

[0110] Continue to see Figure 3 The exploded structure diagram shown or Figure 4 、 Figure 9 and Figure 10As shown in the schematic diagram of the cross-sectional structure, when the electronic device includes a main board and a small board, the electronic device may further include a first circuit board 241, which is used to electrically connect the main board and the small board. The first circuit board 241 may be an FPC. For example, a board-to-board (BTB) connector may be provided at each end of the first circuit board 241, and the first circuit board 241 may be connected to the main board and the small board via the BTB connector. In the electronic device, the main board and the small board may be respectively arranged on both sides of the battery. The first circuit board 241 may connect the main board and the small board across the battery area, and the first circuit board 241 may be arranged between the heat sink 220 and the battery. The first circuit board 241 and the heat sink 220 and the middle frame 210 may be connected by bonding so that the first circuit board 241 can stably play an electrical connection role. For example, the first circuit board 241 is connected to the heat sink 220 by a backing adhesive 243, and the backing adhesive 243 may be provided between the first circuit board 241 and the heat sink 220.

[0111] In some embodiments, the heat sink 220 may include a first area, which may be arranged on a side of the heat sink 220 close to the battery, and the projection of the first area along the first direction may overlap with the first circuit board 241, and the first area may include a first groove 2222, and the projection of the first groove 2222 along the first direction may overlap with at least part of the first circuit board 241.

[0112] Figure 11 for Figure 2 In the electronic device shown, the bottom view of VC is shown, wherein: Figure 11 (a) is a schematic diagram of the structure when the first circuit board 241 is not provided on the VC surface. Figure 11 (b) is a schematic diagram of the structure when the first circuit board 241 is provided on the surface of the VC. The first area is the area where the first circuit board 241 is laid on the surface of the heat sink 220. The first groove 2222 can be recessed in the direction away from the battery. Figure 12 The enlarged view of the structure of the first groove 2222 is shown. When the heat sink 220 is a VC, the first groove 2222 can be provided on the first cover plate 222 of the VC and can be recessed toward the second cover plate 221. The second cover plate 221 does not need to be provided with a groove structure. As described above, the first circuit board 241 can be connected to the heat sink 220 by bonding. When the heat sink 220 includes the first groove 2222, and the projection of the first groove 2222 along the first direction overlaps at least partially with the first circuit board 241, the adhesive backing of the first circuit board 241 can be accommodated in the first groove 2222, thereby reducing the structural space occupied by the adhesive layer between the first circuit board 241 and the heat sink 220, further reducing the thickness of the electronic device.

[0113] The number of first grooves 2222 can be one or more. When there is only one first groove 2222, the first groove 2222 can have a larger planar area. For example, the first groove 2222 can extend from the end of the first region near the main board to the end near the sub-board. When there are multiple first grooves 2222, the multiple first grooves 2222 can be dispersed anywhere on the first region, and the shapes and sizes of the multiple first grooves 2222 can be the same or different. The planar shape of the first groove 2222 shown in the figure is rectangular, but the first groove 2222 can also have other shapes such as circular, elliptical, or a special-shaped structure, which is not limited in this application.

[0114] Continue to see Figure 3 The exploded structure diagram shown or Figure 11 In the VC structure shown in , in some embodiments, the electronic device may further include a second circuit board 242, which is used to electrically connect the mainboard and the display screen. The heat sink 220 may include a second area, which may be arranged on a side of the heat sink 220 close to the battery. The projection of the second area along the first direction may overlap with the second circuit board 242. The second area may include a second groove 2223, and the projection of the second groove 2223 along the first direction may overlap with at least part of the battery.

[0115] The second circuit board 242 may be an FPC (Flexible Printed Circuit Board), also known as a screen FPC. The second region, namely the area on the side of the heat sink 220 closest to the battery, where the second circuit board 242 is located. Since the motherboard and display screen are positioned on either side of the heat sink 220 along the first direction, the heat sink 220 may include a third through-hole 2212. At least a portion of the second circuit board 242 may pass through this third through-hole 2212, enabling electrical connection between one end of the heat sink 220 and the motherboard and the other end of the heat sink 220 and the display screen 211. If the heat sink 220 is a VC, the first cover plate 222 of the VC may be provided with a through-hole 2212-1, and the second cover plate 221 may be provided with a through-hole 2212-2. When the first cover plate 222 and the second cover plate 221 are connected, the through-hole 2212-1 and the through-hole 2212-2 correspond in position to each other, forming the third through-hole 2212.

[0116] Similar to the above-mentioned first circuit board 241, the second circuit board 242 can also be connected to the heat sink 220 by bonding. The second area of the heat sink 220 includes a second groove 2223. The back glue of the second circuit board 242 can be accommodated in the second groove 2223, thereby reducing the structural space occupied by the back glue and reducing the overall thickness of the electronic device. Figure 4 、 Figure 9 and Figure 10 The cross-sectional structure shown schematically illustrates the cross-sectional structure at the position of the first circuit board 241 , and the cross-sectional structure at the position of the second circuit board 242 is similar thereto.

[0117] The number of the second groove 2223 can be one or more. The second groove 2223 can extend from the end of the second area close to the main board to the end close to the third through hole, or multiple second grooves 2223 can also be dispersed at any position in the second area.

[0118] See also Figure 13 As shown in the cross-sectional structural diagram, in some embodiments, the heat sink 220 may further include a second boss 2225, which may protrude toward the battery, and the projection of the second boss 2225 along the first direction may overlap with at least part of the battery.

[0119] As an example, the second boss 2225 can be arranged at other positions of the heat sink 220 other than the above-mentioned first area and second area. For example, the second boss 2225 can be arranged between the first area and the second area, or the second boss 2225 can be arranged on the side of the first area away from the second area, or the second boss 2225 can also be arranged on the side of the second area away from the first area.

[0120] As another example, the second boss 2225 may also be disposed in the first region and / or the second region.

[0121] Similar to the structure of the first boss 2221 described above, the number of the second bosses 2225 can be one or more. When the heat sink 220 is a VC, both the first cover plate 222 and the second cover plate 221 of the VC can be provided with boss structures, together forming the second bosses 2225. Alternatively, the second bosses can be provided only on the first cover plate 222, while the second cover plate 221 may not be provided with a boss structure. Furthermore, a capillary structure can be provided within the second boss 2225, and the thickness of the capillary structure within the second boss 2225 can be greater than or equal to the thickness of the capillary structure corresponding to the position of the VC without a boss structure.

[0122] The heat sink 220 includes a second boss 2225 , and a capillary structure is provided in the second boss 2225 , which can increase the steam channel in the heat sink 220 , enhance the capillary force, and improve the heat dissipation performance of the heat sink 220 .

[0123] Continue to see Figures 2 to 4 、 Figure 9 as well as Figure 10In some embodiments, the electronic device may further include a graphite sheet 231. This graphite sheet 231 may be disposed on the side of the VC near the display screen 211, that is, on the surface of the second cover plate 221. This graphite sheet 231, also referred to as a first graphite sheet, can further diffuse heat transferred to the VC to further improve the heat dissipation performance of the electronic device. The planar dimensions of this first graphite sheet may be greater than, or less than or equal to, the planar dimensions of the VC.

[0124] Continue to see Figure 4 、 Figure 9 as well as Figure 10 In the structure shown, in some embodiments, a graphite sheet 232 may be provided on the side of the first electronic device 260, the second electronic device 270, and the third electronic device 280 that is away from the VC. In other words, a graphite sheet 232 may be provided on the surface of the back cover 212 of the electronic device. This graphite sheet 232 may also be referred to as a second graphite sheet. This second graphite sheet may also be used to dissipate heat for the electronic devices. At least a portion of the projection of the second graphite sheet along the first direction may overlap with the first electronic device 260, at least a portion of the projection of the second graphite sheet along the first direction may overlap with the second electronic device 270, and at least a portion of the projection of the second graphite sheet along the first direction may also overlap with the third electronic device 280.

[0125] It should be noted that, in the embodiment of the present application, the structure of the heat sink 220 in the electronic device is introduced by taking the first electronic device 260 as a main board, the second electronic device 270 as a battery, and the third electronic device 280 as a small board as an example. The first electronic device 260, the second electronic device 270, and the third electronic device 280 may also be other heating devices. For example, the functions of the main board and the small board may be integrated on an L-shaped circuit board, the first electronic device 260 may be the L-shaped circuit board, the second electronic device 270 may be a battery, and the heat sink 220 may be used to dissipate heat for the L-shaped circuit board and the battery. For another example, the first electronic device 260 may also be a display screen, and the heat sink 220 may also be used to dissipate heat for the display screen. The present application does not limit the specific type of electronic devices.

[0126] It should be noted that in the cross-sectional structural diagram shown in the figure, the first circuit board 241 and the second circuit board 242 are arranged on the side of the battery close to the display screen. The first circuit board 241 and the second circuit board 242 can also be arranged on the side of the battery close to the back cover (not shown in the figure), for example, they can be arranged between the graphite sheet 232 and the battery. When the first circuit board 241 and the second circuit board 242 are arranged on the side of the battery close to the back cover, the side of the heat sink 220 close to the battery can also be provided with a groove structure, and the groove structure can be used to accommodate the battery adhesive to reduce the thickness space occupied by the battery adhesive and reduce the thickness of the electronic device. The groove structure can be provided at any position on the side of the heat sink 220 close to the battery, and the groove structure can be one or more. In this example, the side of the heat sink 220 close to the battery may also not be provided with a groove structure.

[0127] In the embodiments described above, the structure of the heat sink is limited by taking VC as an example. The heat sink may also be other types of heat dissipation structures. For example, the heat sink may also be a heat dissipation structure such as a liquid cooling system or a heat pipe. A boss structure may be provided on the side of the liquid cooling system or the heat pipe close to the heat source, and a groove may be provided at the adhesive position.

[0128] The electronic device may be a candy bar device, that is, a device that cannot be folded, or may be a foldable electronic device. When the electronic device is a foldable electronic device, the electronic device may include a hinge mechanism, and the electronic device may be folded or unfolded around the hinge mechanism, and the heat sink may be disposed on one side of the hinge.

[0129] It should be noted that in the embodiments of the present application, "same" does not mean absolutely same. Those skilled in the art can understand that since those skilled in the art can appropriately adjust the dimensions of the structural parts according to design requirements, the "same" dimensions of two structural parts allow deviations within a certain range, such as a difference of 0.1mm-0.5mm.

[0130] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: A first electronic device (260) and a second electronic device (270), wherein the first electronic device (260) includes a first heating element, and the second electronic device (270) includes a second heating element; A heat sink (220), wherein a projection of the heat sink (220) along a first direction overlaps at least partially with the first heating element, and a projection of the heat sink (220) along the first direction overlaps at least partially with the second heating element, the heat sink (220) comprising a first boss (2221), the first boss (2221) protruding toward the first electronic device (260), a projection of the first boss (2221) along the first direction overlaps at least partially with the first heating element, and the first direction is perpendicular to a main plane of the heat sink (220).

2. The electronic device according to claim 1, wherein The electronic device further comprises a middle frame (210), the heat sink (220) and the first electronic device (260) are respectively located on two sides of the middle frame (210) along the first direction, the middle frame (210) comprises a first recessed portion (214), and at least a portion of the first boss (2221) is accommodated in the first recessed portion (214); or, The middle frame (210) comprises a first through hole (215), and at least a portion of the first boss (2221) passes through the first through hole (215).

3. The electronic device according to claim 1 or 2, characterized in that: The first electronic device (260) is a mainboard, the mainboard includes a shielding cover (262), the first heating element is arranged in a receiving space surrounded by the shielding cover (262), the shielding cover (262) includes a second recessed portion (2621), and the projection of the first boss (2221) along the first direction overlaps with the second recessed portion (2621); or, The shielding cover (262) includes a second through hole (2622), and at least a portion of the first boss (2221) passes through the second through hole (2622).

4. The electronic device according to claim 1 or 2, characterized in that: The electronic device further comprises a third electronic device (280), the third electronic device (280) being arranged on a side of the second electronic device (270) away from the first electronic device (260), the third electronic device (280) comprising a third heating element, and a projection of the heat sink (220) along the first direction at least partially overlapping with the third heating element.

5. The electronic device according to claim 4, characterized in that The electronic device further comprises a first circuit board (241), the first circuit board (241) being arranged on a side of the heat sink (220) close to the second electronic device (270), and the first circuit board (241) being electrically connected to the first electronic device (260) and the third electronic device (280) respectively; The heat sink (220) comprises a first region, the first region being located on a side of the heat sink (220) close to the second electronic device (270), and a projection of the first region along the first direction overlapping with the first circuit board (241), and a first groove (2222) being provided in the first region, and a projection of the first groove (2222) along the first direction overlapping with at least a portion of the second electronic device (270).

6. The electronic device according to claim 1 or 2, characterized in that: The electronic device further comprises a second circuit board (242) and a display screen, wherein the second circuit board (242) is electrically connected to the first electronic device (260) and the display screen respectively; The heat sink (220) further includes a second region, the second region being located on a side of the heat sink (220) close to the second electronic device (270), and a projection of the second region along a first direction overlapping with the second circuit board (242), and a second groove (2223) being provided in the second region, and a projection of the second groove (2223) along the first direction overlapping with at least a portion of the second electronic device (270).

7. The electronic device according to claim 1 or 2, characterized in that: The heat sink (220) is further provided with a second boss (2225), the second boss (2225) protruding toward the second electronic device (270), and the projection of the second boss (2225) along the first direction overlaps at least partially with the second heating element.

8. The electronic device according to claim 1 or 2, characterized in that: The heat sink (220) is a temperature balancing plate, and the temperature balancing plate includes a first cover plate (222) and a second cover plate (221). The first cover plate (222) and the second cover plate (221) form a sealed cavity. The first cover plate (222) is the cover plate of the temperature balancing plate close to the first electronic device (260), and the second cover plate (221) is the cover plate of the temperature balancing plate away from the first electronic device (260). The first boss (2221) is arranged on the first cover plate (222).

9. The electronic device according to claim 8, wherein: The temperature equalizing plate also includes a capillary structure (223), and the capillary structure (223) includes a first part (2231) and a second part (2232), wherein the first part (2231) is a part of the projection of the capillary structure (223) along the first direction that overlaps with the first boss (2221), and the second part (2232) is a part of the projection of the capillary structure (223) along the first direction that does not overlap with the first boss (2221), and the size of the first part (2231) in the first direction is greater than or equal to the size of the second part (2232) in the first direction.

10. The electronic device according to claim 8, wherein The material of the first cover plate (222) and / or the second cover plate (221) is any one of the following: Stainless steel, stainless steel / copper composite, titanium, titanium alloy, titanium / copper composite.

11. The electronic device according to claim 1 or 2, characterized in that: The electronic device further comprises a middle frame (210), the middle frame (210) comprises a hollowed-out area (213), the second electronic device (270) is arranged in the hollowed-out area (213), The projection of the heat dissipation element (220) along the first direction overlaps with the hollowed-out area (213).

12. The electronic device according to claim 4, wherein: The second electronic component (270) is a battery, and the third electronic component (280) is a small board.

13. A heat sink (220) applied to an electronic device, the electronic device comprising a first electronic device (260) and a second electronic device (270), the first electronic device (260) comprising a first heating element, the second electronic device (270) comprising a second heating element, characterized in that: The projection of the heat sink (220) along a first direction overlaps at least partially with the first heating element, and the projection of the heat sink (220) along the first direction overlaps at least partially with the second heating element. A side of the heat sink (220) close to the first electronic device (260) includes a first boss (2221), the first boss (2221) protrudes toward the first electronic device (260), and the projection of the first boss (2221) along the first direction overlaps at least partially with the first heating element. The first direction is perpendicular to the main plane of the heat sink (220).

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