Vapor chamber heat dissipation module

Abstract

The utility model relates to the technical field of temperature uniformizing plates, in particular to a temperature uniformizing plate heat dissipation module, which comprises a temperature uniformizing plate (100) and a heat dissipation module (200) arranged on the temperature uniformizing plate (100), the heat dissipation module (200) comprises a heat dissipation base (201) and a heat dissipation fin group (202) arranged on the heat dissipation base (201), a plurality of through holes (2012a) are formed in the heat dissipation base (201) along the length direction in a penetrating manner, and the heat dissipation fin group (202) is arranged on the heat dissipation base (201). A plurality of first radiating fins (2012b) are arranged at the bottoms of the through holes (2012a); the heat dissipation fin group (202) comprises a plurality of second heat dissipation fins (2021), and a plurality of heat dissipation protrusions (2022) are arranged on the same side faces of the second heat dissipation fins (2021). According to the utility model, the plurality of first heat dissipation fins are arranged in the heat dissipation base, and the plurality of heat dissipation bulges are arranged on the second heat dissipation fins on the heat dissipation base, so that the uniform temperature plate can rapidly dissipate heat, and the due heat conduction efficiency of the uniform temperature plate is maintained.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature averaging plates, in particular to a temperature averaging plate heat dissipation module. Background Art

[0002] With the rapid development of technology, computers are performing faster and faster. In particular, as the CPU's operating speed increases, the heat generated during operation also increases. To effectively dissipate this concentrated heat to the environment outside the host computer and maintain the CPU operating within an acceptable temperature, a heat sink is typically installed on the CPU to assist in dissipating heat from the CPU and increase heat dissipation capacity. However, as the CPU's operating speed increases, the heat generated also increases. Conventional heat sinks, if still composed of extruded aluminum heat sinks and cooling fans, are simply unable to cope with the CPU's heat dissipation requirements.

[0003] Common vapor chamber heat dissipation modules in the prior art, such as the one disclosed in Chinese Utility Model Patent Publication No. CN201115204Y, employ an improved heat pipe heat sink fin. The heat pipe is provided with heat sink fins around its circumference, with several protruding heat sinks integrally formed on the surface of the heat sink fins. The heat sinks are conical in shape and closely arranged in a matrix pattern on the surface of the heat sink fins. The heat pipe may be provided with heat sink fins around its circumference, each of which may have a bent or protruding fold, with multiple protruding heat sinks integrally formed and distributed on the surface of the fold. While the heat sink module utilizes U-shaped heat pipes for heat transfer, while capable of conducting high amounts of heat, the small diameter of the heat pipes results in point or line contact with the heat transfer base, resulting in poor single-point heat transfer efficiency. Furthermore, in high heat conditions, excessive heat can accumulate at the heat receiving end, preventing it from being transferred, thereby exceeding the maximum heat transfer capacity of the heat pipe and ultimately rendering the heat pipe incapable of performing its heat transfer function.

[0004] Therefore, the existing technology needs to be improved and enhanced. Utility Model Content

[0005] In view of the shortcomings of the prior art, the present invention aims to provide a vapor chamber heat dissipation module that can quickly dissipate heat and maintain the proper thermal conductivity of the vapor chamber.

[0006] The utility model achieves the above-mentioned purpose through the following technical means:

[0007] A heat dissipation module with a temperature equalizing plate includes a temperature equalizing plate and a heat dissipation module arranged on the temperature equalizing plate. The heat dissipation module includes a heat dissipation base and a heat dissipation fin group arranged on the heat dissipation base. A plurality of through holes are penetrated in the heat dissipation base along the length direction, and a plurality of first heat dissipation fins are arranged at the bottom of the through holes; the heat dissipation fin group includes a plurality of second heat dissipation fins, and a plurality of heat dissipation protrusions are arranged on the same side of the second heat dissipation fins.

[0008] As a further solution of the present invention, the temperature uniform plate includes a first cover plate and a second cover plate arranged opposite to each other, a chamber is formed between the first cover plate and the second cover plate, the chamber is filled with coolant, the first cover plate includes a plurality of conical structural portions and a plurality of straight portions, and the conical structural portions and the straight portions are alternately arranged; a first capillary structure is provided on the side of the first cover plate facing the second cover plate, and a second capillary structure is provided on the side of the second cover plate facing the first cover plate, and a support column is provided between the straight portions and the second cover plate.

[0009] As a further solution of the present invention, the heat dissipation base includes a heat dissipation base body and a plurality of protrusions arranged on the heat dissipation base body, and the protrusions are adapted to a plurality of grooves formed on a side of the first cover plate opposite to the second cover plate.

[0010] As a further solution of the present invention, a through hole is passed through the protrusion along the length direction, and a plurality of first heat dissipation fins are provided at the bottom of the through hole.

[0011] As a further solution of the present invention, the heat dissipation protrusion is arc-shaped and is arranged on the side of the second heat dissipation fin. The heat dissipation protrusion is distributed in an equidistant array along the direction extending from the second heat dissipation fin away from the first cover plate.

[0012] As a further solution of the present invention, a plurality of capillary structures are provided on the end surface of the support column close to the first cover plate.

[0013] As a further solution of the present invention, the capillary structure is a strip-shaped groove, and the strip-shaped groove passes through the end surface of the support column close to the first cover plate in a horizontal direction.

[0014] As a further solution of the present invention, the end surfaces of the free ends of the second heat dissipating fins are on the same horizontal plane.

[0015] As a further solution of the present invention, both ends of the first cover plate and the second cover plate are connected together through an end plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] Due to the adoption of the above-mentioned structural design, i.e., a plurality of first heat dissipation fins are arranged in the heat dissipation base and a plurality of heat dissipation protrusions are arranged on the second heat dissipation fins on the heat dissipation base, the present application can dissipate heat quickly and maintain the proper heat conduction performance of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Attachment Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0019] Attachment Figure 2 This is a schematic structural diagram of a temperature equalizing plate according to an embodiment of the present invention;

[0020] Attachment Figure 3 This is a schematic structural diagram of a heat dissipation module according to an embodiment of the present utility model;

[0021] Attachment Figure 4 A top cross-sectional view of an embodiment of the present utility model;

[0022] Attachment Figure 5 This is a schematic diagram of an embodiment of the present invention when in use.

[0023] The numbers in the figure are:

[0024] 100-vapor chamber, 200-heat dissipation module;

[0025] 201- heat sink base, 202- heat sink fin assembly;

[0026] 2011-heat dissipation base body, 2012-protrusion;

[0027] 2012a-through hole, 2012b-first heat dissipation fin;

[0028] 2021-second heat sink fin, 2022-heat sink protrusion;

[0029] 101 - first cover plate, 102 - second cover plate, 103 - chamber, 104 - end plate, 105 - first capillary tissue, 106 - second capillary tissue, 107 - support column;

[0030] 1011-conical structure portion, 1012-straight portion, 1013-groove;

[0031] 1071-strip groove;

[0032] 1000-Electronic devices. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0036] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0037] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0039] Example:

[0040] like Figure 1-5 As shown, the present application provides a heat dissipation module for a temperature equalizing plate, comprising a temperature equalizing plate 100 and a heat dissipation module 200 arranged on the temperature equalizing plate, the temperature equalizing plate 100 comprising a first cover plate 101 and a second cover plate 102 arranged opposite to each other, the first cover plate 101 and the second cover plate 102 are both made of materials with high thermal conductivity, such as copper, aluminum, aluminum alloy, etc., when used, the second cover plate 102 is in contact with the heating surface of the electronic device 1000; both ends of the first cover plate 101 and the second cover plate 102 are connected together by an end plate 104; of course, the first cover plate and the second cover plate can also be connected in the following manner, the edge of the first cover plate is bent and extended toward the second cover plate to form a first folded edge, the edge of the second cover plate is bent and extended toward the first cover plate to form a second folded edge, and the ends of the first folded edge and the second folded edge are connected as one by welding.

[0041] A chamber 103 is formed between the first cover plate 101 and the second cover plate 102, and the chamber 103 is filled with a coolant, which is water, or acetone, ethylene glycol, etc. The first cover plate 101 includes four conical structural portions 1011 and five straight portions 1012, and the conical structural portions 1011 and the straight portions 1012 are alternately arranged, and at the same time, five grooves 1013 are formed on the side of the first cover plate 101 relative to the second cover plate 102; due to the above structural design, the surface of the first cover plate 101 facing the second cover plate 102 not only increases the liquid cooling area, but also after the coolant vapor is cooled and liquefied, the conical structural portions 1011 of the conical structure help to increase the liquefaction speed and circulation speed of the coolant, so that the coolant circulation speed is greater than the heat flow transmission speed of the heat source, thereby ensuring the stability of the heat source performance.

[0042] A first capillary structure 105 is provided on the side of the first cover plate 101 facing the second cover plate 102, and the first capillary structure 105 is a 3D woven or 2D woven metal mesh, foam metal or metal powder; a second capillary structure 106 is provided on the side of the second cover plate 102 facing the first cover plate 101, and the second capillary structure 106 is a 3D woven or 2D woven metal mesh, foam metal or metal powder; it is used to achieve rapid reflux of the coolant and enhance the reflux ability of the coolant in actual use.

[0043] Support columns 107 are provided between the straight portions 1012 and the second cover plate 102 for supporting each other, so as to increase the strength of the device and prevent the first cover plate 101 from contacting the second cover plate 102 when the device is subjected to pressure, thereby ensuring smooth circulation of coolant in the first cover plate 101 and the second cover plate 102, thereby ensuring heat conduction efficiency.

[0044] Specifically, the heat dissipation module 200 includes a heat dissipation base 201 and a heat dissipation fin group 202 arranged on the heat dissipation base 201. The heat dissipation base 201 includes a heat dissipation base body 2011 and five protrusions 2012 arranged on the heat dissipation base body 2011. These protrusions 2012 are adapted to five grooves 1013 formed on the side of the first cover plate 101 relative to the second cover plate 102. By adapting the shape of the heat dissipation base body to the temperature equilibrium plate, the heat dissipation base body 2011 corresponds to the straight portion 1012, and the protrusions 2012 correspond to the grooves 1013, so that the heat of the temperature equilibrium plate can be maximized.

[0045] Specifically, a through hole 2012a is provided in the protrusion 2012 along the length direction, and three first heat dissipation fins 2012b are provided at the bottom of the through hole 2012a. By providing the through hole 2012a in the protrusion 2012 and the first heat dissipation fins 2012b in the through hole 2012a, the protrusion 2012 can quickly dissipate heat transferred from the straight portion and the tapered structure portion.

[0046] Specifically, the heat dissipation fin assembly 202 includes a plurality of second heat dissipation fins 2021. The second heat dissipation fins 2021 are provided with a plurality of heat dissipation protrusions 2022 on the same side surface. The heat dissipation protrusions 2022 are arc-shaped and provided on the side surface of the second heat dissipation fins 2021. The heat dissipation protrusions 2022 are distributed in an array with equal spacing along the direction extending from the second heat dissipation fins 2021 away from the first cover plate 101, thereby increasing the heat dissipation area of the second heat dissipation fins 2021, thereby quickly dissipating the heat transferred from the heat dissipation base body 2011. The end surfaces of the free ends of the second heat dissipation fins 2021 are on the same horizontal plane, thereby ensuring that heat is more evenly distributed to each fin and avoiding local overheating. At the same time, the flush end surfaces help form a smoother airflow path, reduce turbulence and resistance, and allow air to flow more smoothly through the heat dissipation fin assembly, thereby improving heat dissipation efficiency and taking into account both aesthetics and installation compatibility.

[0047] As a preferred embodiment of this embodiment, a plurality of capillary structures are provided on the end face of the support column 107 close to the first cover plate 101. The capillary structure is a strip groove 1071. The strip groove 1071 runs through the end face of the support column 107 close to the first cover plate 101 in a horizontal direction. By providing a plurality of strip grooves 1071 on the end face of the support column 107 close to the first cover plate 101, the reflux of the cooling liquid is further facilitated.

[0048] In summary, the present invention solves the deficiencies in the prior art through the above-mentioned structural design, and has the characteristics of reasonable structure and high heat dissipation efficiency.

[0049] As a further solution of the present invention, the technical features of the above-mentioned embodiments can be arbitrarily combined. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heat dissipation module for a temperature-vaporizing plate, comprising a temperature-vaporizing plate (100) and a heat dissipation module (200) arranged on the temperature-vaporizing plate (100), characterized in that: The heat dissipation module (200) comprises a heat dissipation base (201) and a heat dissipation fin group (202) arranged on the heat dissipation base (201); a plurality of through holes (2012a) are penetrated in the heat dissipation base (201) along the length direction; a plurality of first heat dissipation fins (2012b) are arranged at the bottom of the through holes (2012a); the heat dissipation fin group (202) comprises a plurality of second heat dissipation fins (2021); a plurality of heat dissipation protrusions (2022) are arranged on the same side surface of the second heat dissipation fins (2021).

2. The vapor chamber heat dissipation module according to claim 1, characterized in that: The temperature equalizing plate (100) comprises a first cover plate (101) and a second cover plate (102) which are arranged opposite to each other, a chamber (103) is formed between the first cover plate (101) and the second cover plate (102), the chamber (103) is filled with a cooling liquid, the first cover plate (101) comprises a plurality of conical structural parts (1011) and a plurality of straight parts (1012), the conical structural parts (1011) and the straight parts (1012) are arranged alternately; a first capillary structure (105) is provided on the side of the first cover plate (101) facing the second cover plate (102), a second capillary structure (106) is provided on the side of the second cover plate (102) facing the first cover plate (101), and a support column (107) is provided between the straight parts (1012) and the second cover plate (102).

3. The vapor chamber heat dissipation module according to claim 2, characterized in that: The heat dissipation base (201) comprises a heat dissipation base body (2011) and a plurality of protrusions (2012) arranged on the heat dissipation base body (2011), wherein the protrusions (2012) are adapted to a plurality of grooves (1013) formed on a side of the first cover plate (101) opposite to the second cover plate (102).

4. The vapor chamber heat dissipation module according to claim 3, characterized in that: A through hole (2012a) is formed in the protrusion (2012) along its length, and a plurality of first heat dissipation fins (2012b) are provided at the bottom of the through hole (2012a).

5. The vapor chamber heat dissipation module according to claim 4, characterized in that: The heat dissipation protrusion (2022) is arc-shaped and is arranged on the side of the second heat dissipation fin (2021), and the heat dissipation protrusion (2022) is distributed in an array with equal spacing along the direction extending from the second heat dissipation fin (2021) away from the first cover plate (101).

6. The vapor chamber heat dissipation module according to claim 5, characterized in that: A plurality of capillary structures are provided on the end surface of the support column (107) close to the first cover plate (101).

7. The vapor chamber heat dissipation module according to claim 6, characterized in that: The capillary structure is a strip-shaped groove (1071), and the strip-shaped groove (1071) runs through the end surface of the support column (107) close to the first cover plate (101) in the horizontal direction.

8. The vapor chamber heat dissipation module according to claim 7, characterized in that: The end surfaces of the free ends of the second heat dissipation fins (2021) are on the same horizontal plane.

9. The vapor chamber heat dissipation module according to claim 8, characterized in that: Both ends of the first cover plate (101) and the second cover plate (102) are connected together via an end plate (104).

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