Aluminum-inlaid-copper type heat dissipation plate for heating module
Through the design of aluminum-inlaid copper heat dissipation plate, the thermally conductive copper plate is embedded in the aluminum mounting frame and fixed with thermal glue, which solves the problem of unbalanced material of the heat dissipation plate and achieves the effect of low cost and good thermal conductivity.
Patent Information
- Application Number
- CN202422428396.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-10-09
AI Technical Summary
The different materials of existing heat dissipation boards lead to unbalanced heat dissipation effect and cost. The aluminum heat dissipation board has poor thermal conductivity and is cheap, while the copper heat dissipation board has good thermal conductivity but is expensive.
The aluminum-inlaid copper-type heat dissipation plate is designed, and the thermally conductive copper plate is embedded in the aluminum mounting frame and is fixed by thermally conductive glue. The thermally conductive glue is an organic silicone base material, which has good thermal conductivity and electrical insulation properties and increases the heat dissipation area.
The cost of the heat dissipation plate is reduced, while the thermal conductivity and heat dissipation effect of the aluminum heat dissipation plate is improved, achieving a cost-effective balance.
Smart Images
Figure CN223231490U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation plates, in particular to an aluminum-inlaid copper heat dissipation plate for a heating module. Background Art
[0002] During device operation, the modules within the device generate a certain amount of heat, which is normal. However, excessive or abnormal module heat generation may affect the device's performance and lifespan. Therefore, it is important to ensure that the module's operating temperature is within the normal range. Therefore, it is particularly important to implement appropriate heat dissipation measures based on the device's operating environment and requirements.
[0003] Existing modules typically dissipate heat by attaching a heat sink. This heat sink is a device used to dissipate heat from heat-prone electronic components within an appliance. It's typically made of aluminum alloy, brass, or bronze in the form of plates, sheets, or multiple sheets. However, due to the varying materials used, the heat dissipation performance varies. For example, aluminum heat sinks, while inexpensive, have poor thermal conductivity; copper heat sinks, while excellent, are relatively expensive. In summary, existing heat sinks present the following challenges:
[0004] Although aluminum heat sinks are cheap, they have poor thermal conductivity. Although copper heat sinks have good thermal conductivity, they are relatively expensive. Therefore, heat sinks formed by combining aluminum and copper are particularly important. Utility Model Content
[0005] The main purpose of the utility model is to provide an aluminum-inlaid copper heat sink for a heating module, which can effectively solve the problems in the background technology.
[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0007] An aluminum-inlaid copper heat sink for a heating module includes a mounting frame, a heat conducting device is fixedly installed on the front end of the mounting frame, a No. 1 mounting plate is fixedly installed on the left end of the mounting frame, and a No. 2 mounting plate is fixed on the right end of the mounting frame, and a group of mounting screws are installed on the front ends of the No. 1 mounting plate and the No. 2 mounting plate.
[0008] Preferably, the mounting frame has a mounting slot at the front end, a clamping block is fixedly mounted in the middle of the left and right inner walls of the mounting frame, and a plurality of fixing slots are formed on the inner wall behind the mounting slot, wherein auxiliary heat conducting plates are fixedly mounted in the plurality of fixing slots. The mounting frame and the auxiliary heat conducting plates are both made of aluminum, and the thermally conductive copper plate is embedded in the mounting frame, which not only reduces the cost of the heat sink but also improves the thermal conductivity of the aluminum heat sink. In addition, the design of the plurality of auxiliary heat conducting plates on the mounting frame further increases the heat dissipation area of the mounting frame, thereby improving the heat dissipation effect of the device.
[0009] Preferably, the heat-conducting device includes a heat-conducting copper plate, each having a slot formed in the middle of the left end and the middle of the right end of the heat-conducting copper plate. Thermally conductive adhesive is installed at the rear end of the heat-conducting copper plate, and the heat-conducting copper plate is installed in the installation slot via the thermally conductive adhesive. The heat-conducting copper plate is bonded to the mounting frame by the thermally conductive adhesive. The thermally conductive adhesive is a silicone rubber primarily composed of organic silicone, with fillers, heat-conducting materials, and other polymer materials added, and the silicone rubber has excellent thermal conductivity and electrical insulation properties. Therefore, the heat-conducting copper plate can not only be installed relatively stably in the mounting frame, but the thermally conductive adhesive can also fill the gap between the heat-conducting copper plate and the mounting frame, allowing the heat-conducting copper plate to better transfer heat to the mounting frame.
[0010] Preferably, the mounting frame and the auxiliary heat conducting plate are made of aluminum.
[0011] Preferably, a plurality of the auxiliary heat conducting sheets are installed on the mounting frame at equal distances from left to right.
[0012] Preferably, the card slot and the card block have the same size and corresponding positions front to back.
[0013] Compared with the prior art, the present invention has the following beneficial effects:
[0014] 1. Align the card slots on the thermally conductive copper plate on the heat-conducting device with the card blocks so that the thermally conductive copper plate can be aligned with the mounting slots and pushed into the mounting frame. The thermally conductive copper plate is bonded to the mounting frame by thermally conductive adhesive. The thermally conductive adhesive is mainly composed of organic silicone, with fillers, thermal conductive materials and other polymer materials added. The silicone is mixed and has good thermal conductivity and electrical insulation properties. Therefore, the thermally conductive copper plate can not only be installed more firmly in the mounting frame, but the thermally conductive adhesive can also fill the gap between the thermally conductive copper plate and the mounting frame, so that the thermally conductive copper plate can better transfer heat to the mounting frame.
[0015] 2. The mounting frame and auxiliary heat conducting plates are both made of aluminum. The heat conducting copper plate is embedded in the mounting frame, which not only reduces the cost of the heat sink, but also improves the thermal conductivity of the aluminum heat sink. In addition, the design of several auxiliary heat conducting plates on the mounting frame further increases the heat dissipation area of the mounting frame and improves the heat dissipation effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the overall structure of an aluminum-inlaid copper heat sink for a heating module of the present invention;
[0017] Figure 2 This is a schematic diagram of the overall structure of a mounting frame for an aluminum-inlaid copper heat sink for a heating module according to the present invention;
[0018] Figure 3This is a schematic diagram of the overall structure of a heat conduction device for an aluminum-inlaid copper heat sink for a heating module according to the present invention;
[0019] Figure 4 This is a schematic diagram of the overall structure of the back of an aluminum-inlaid copper heat sink for a heating module according to the present invention.
[0020] In the figure: 1. Mounting frame; 2. Heat conduction device; 3. Mounting plate No. 1; 4. Mounting plate No. 2; 5. Mounting screws; 10. Mounting slot; 11. Clamping block; 12. Fixing slot; 13. Auxiliary heat conduction sheet; 20. Heat conduction copper plate; 21. Clamping slot; 22. Thermal adhesive. DETAILED DESCRIPTION
[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.
[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0024] like Figure 1-4 As shown, an aluminum-inlaid copper heat sink for a heating module includes a mounting frame 1, a heat-conducting device 2 is fixedly installed on the front end of the mounting frame 1, a No. 1 mounting plate 3 is fixedly installed on the left end of the mounting frame 1, and a No. 2 mounting plate 4 is fixed on the right end of the mounting frame 1, and a group of mounting screws 5 are installed on the front ends of the No. 1 mounting plate 3 and the No. 2 mounting plate 4.
[0025] The mounting frame 1 has a mounting slot 10 at the front end. Clamps 11 are fixedly mounted in the middle of the left and right inner walls of the mounting frame 1. Several fixing slots 12 are formed on the inner wall behind the mounting slot 10. Auxiliary heat conducting plates 13 are fixedly mounted in each of the fixing slots 12. The mounting frame 1 and the auxiliary heat conducting plates 13 are made of aluminum. The auxiliary heat conducting plates 13 are installed on the mounting frame 1 at equal distances from left to right. The mounting frame 1 and the auxiliary heat conducting plates 13 are both made of aluminum. A thermally conductive copper plate 20 is embedded in the mounting frame 1, which not only reduces the cost of the heat sink but also improves the thermal conductivity of the aluminum heat sink. Furthermore, the design of the auxiliary heat conducting plates 13 on the mounting frame 1 further increases the heat dissipation area of the mounting frame 1, thereby improving the heat dissipation effect of the device.
[0026] The heat-conducting device 2 includes a heat-conducting copper plate 20 with slots 21 defined in the middle of both the left and right ends. Thermal adhesive 22 is installed at the rear end of the heat-conducting copper plate 20, securing the heat-conducting copper plate 20 within the mounting slot 10. The slots 21 are the same size as the retaining block 11 and their positions correspond front to back. The heat-conducting copper plate 20 is bonded to the mounting frame 1 by the thermal adhesive 22, which has excellent thermal conductivity and electrical insulation properties. This ensures that the heat-conducting copper plate 20 is not only securely mounted within the mounting frame 1 but also fills the gap between the heat-conducting copper plate 20 and the mounting frame 1, enabling the heat-conducting copper plate 20 to better transfer heat to the mounting frame 1.
[0027] It should be noted that the present invention is an aluminum-inlaid copper heat sink for a heating module. The card slot 21 on the heat-conducting copper plate 20 on the heat-conducting device 2 is aligned with the card block 11, so that the heat-conducting copper plate 20 can be aligned with the mounting slot 10 and pushed into the mounting frame 1. The heat-conducting copper plate 20 is bonded to the mounting frame 1 by a heat-conducting adhesive 22. The heat-conducting adhesive 22 is a silicone rubber with a main body, a filler, a heat-conducting material and other polymer materials added, and a mixture thereof. The silicone rubber has good thermal conductivity and electrical insulation properties. Therefore, the heat-conducting copper plate 20 can not only be relatively stable, but also can be placed on the heat-conducting plate 20. It is installed in the mounting frame 1, and the thermally conductive adhesive 22 can fill the gap between the thermally conductive copper plate 20 and the mounting frame 1, so that the thermally conductive copper plate 20 can better transfer heat to the mounting frame 1, and the mounting frame 1 and the auxiliary thermal conductive sheet 13 are both made of aluminum. The thermally conductive copper plate 20 is embedded in the mounting frame 1, which not only reduces the cost of the heat sink, but also improves the thermal conductivity of the aluminum heat sink. In addition, the design of several auxiliary thermal conductive sheets 13 on the mounting frame 1 further increases the heat dissipation area of the mounting frame 1 and improves the heat dissipation effect of the device.
[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.
Claims
1. An aluminum-copper-inlaid heat sink for a heating module, comprising a mounting frame (1), characterized in that: A heat conducting device (2) is fixedly installed through the front end of the mounting frame (1), a No. 1 mounting plate (3) is fixedly installed on the left end of the mounting frame (1), and a No. 2 mounting plate (4) is fixed on the right end of the mounting frame (1), and a set of mounting screws (5) are installed on the front ends of the No. 1 mounting plate (3) and the No. 2 mounting plate (4).
2. The aluminum-inlaid copper heat sink for the heating module according to claim 1, characterized in that: The front end of the mounting frame (1) is provided with a mounting groove (10), the middle of the left inner wall and the middle of the right inner wall of the mounting frame (1) are fixedly provided with a clamping block (11), the rear inner wall of the mounting groove (10) is provided with a plurality of fixing grooves (12), and auxiliary heat conducting plates (13) are fixedly provided in the plurality of fixing grooves (12).
3. The aluminum-inlaid copper heat sink for the heating module according to claim 2, characterized in that: The heat-conducting device (2) comprises a heat-conducting copper plate (20), wherein a slot (21) is provided at the middle of the left end and the middle of the right end of the heat-conducting copper plate (20), a heat-conducting adhesive (22) is installed at the rear end of the heat-conducting copper plate (20), and the heat-conducting copper plate (20) is installed in the installation slot (10) via the heat-conducting adhesive (22).
4. The aluminum-inlaid copper heat sink for a heating module according to claim 2, characterized in that: The mounting frame (1) and the auxiliary heat conducting plate (13) are made of aluminum.
5. The aluminum-inlaid copper heat sink for a heating module according to claim 2, characterized in that: A plurality of auxiliary heat conducting sheets (13) are installed on the mounting frame (1) at equal distances from left to right.
6. The aluminum-inlaid copper heat sink for a heating module according to claim 3, characterized in that: The card slot (21) and the card block (11) have the same size and corresponding positions front to back.