Air return device of reflow soldering furnace

Abstract

The air return device comprises a bottom frame, the upper surface of the bottom frame is fixedly connected with a top frame, the inner top wall of the top frame is fixedly connected with a glass plate, the inner bottom wall of the bottom frame is fixedly connected with a partition plate, and the inner wall of the upper surface of the top frame is fixedly connected with a hot air frame. According to the air return device of the reflow soldering furnace, a circuit board enters from one side of the first conveying belt, after it is observed that the circuit board reaches the position under the hot air frame through the glass plate, conveying is stopped, then the first draught fan and the heating wire in the hot air pipe are started, hot air is blown to the circuit board to melt soldering flux, and therefore the circuit board is heated to the position under the hot air frame. And then a servo motor is started to drive a rotating shaft to rotate, so that a baffle rotates upwards to open an opening, the conveyed circuit board enters a second conveying belt, cold air blown out by a cold air frame is condensed, after the circuit board passes through the baffle, the baffle rotates to the original position, and in the process, the next circuit board enters the first conveying belt.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering, in particular to an air return device of a reflow soldering furnace. Background Art

[0002] As is known to all, a reflow oven for electronic circuit boards is an auxiliary device used in the production and processing of electronic circuit boards to heat the circuit boards so that the solder of the electronic components melts and sticks to the circuit boards. It has been widely used in the field of reflow soldering technology. When the existing reflow oven for electronic circuit boards is used, the circuit board is placed in the soldering oven for heating so that the solder of the components on the circuit board melts and sticks to the circuit board.

[0003] After searching, it was found that in the Chinese Utility Model Patent Publication No. CN217618283U, a return air device for a reflow soldering furnace was disclosed. The return air device is convenient for maintenance and repair by being provided with an air exchange component and an isolation component, and is convenient for disassembly operation, so that its structure becomes simple and is conducive to disassembly and installation. The existing return air device does not distribute heating and condensation in two spaces. During continuous processing, after hot air is blown to the circuit board in the same space to melt the solder, cold air is blown out for condensation, so that the space continues to alternate between hot and cold, which makes the heating time longer, prolongs the solder melting time, and affects production efficiency. Utility Model Content

[0004] The main purpose of the utility model is to provide an air return device for a reflow soldering furnace, which can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A return air device for a reflow soldering furnace comprises a bottom frame, the upper surface of the bottom frame is fixedly connected to a top frame, the inner top wall of the top frame is fixedly connected to a glass plate, the inner bottom wall of the bottom frame is fixedly connected to a partition, the inner wall of the upper surface of the top frame is fixedly connected to a hot air frame, one side of the hot air frame is fixedly connected to a hot air pipe, one end of the hot air pipe is fixedly connected to a first fan, the inner wall of the upper surface of the top frame is fixedly connected to a cold air frame, and one side of the cold air frame is fixedly connected to the cold air pipe.

[0007] In order to provide power for the rotation of the shaft, as a return air device of a reflow soldering furnace of the present invention, a motor slot is opened on the back of the top frame, and a servo motor is fixedly connected to the back of the partition.

[0008] In order to achieve the effect of driving the baffle to rotate, as a return air device of a reflow soldering furnace of the utility model, the output end of the servo motor is fixedly connected to a rotating shaft, and the outer surface of the rotating shaft is fixedly connected to the baffle.

[0009] In order to achieve the effect of checking the situation of the solution tank, as a return air device of a reflow soldering furnace of the utility model, the inner wall of the partition is provided with a conveying roller, and the front side of the bottom frame is hinged with a door panel through a hinge.

[0010] In order to achieve the effect of conveying circuit boards, as a return air device of a reflow soldering furnace of the present invention, the inner wall of the bottom frame is sequentially provided with a first conveyor belt and a second conveyor belt from left to right, and a through hole is opened on the upper surface of the first conveyor belt.

[0011] In order to achieve the effect of purifying the gas after the solder melts, as a return air device of a reflow soldering furnace of the utility model, the inner bottom wall of the bottom frame is fixedly connected to a solution box, the upper surface of the solution box is fixedly connected to a second fan, and the inner wall of the upper surface of the solution box is fixedly connected to an air inlet pipe.

[0012] In order to achieve the effect of filtering and purifying the gas, as a return air device of a reflow soldering furnace of the utility model, a sealing plate is fixedly connected to the inner wall of one side of the solution tank, an outlet pipe is fixedly connected to one side of the sealing plate, and an activated carbon block is fixedly connected to the inner wall of the outlet pipe.

[0013] In order to facilitate gas outflow, as an air return device of a reflow soldering furnace of the present invention, the inner bottom wall of the bottom frame is fixedly connected with a side plate, and an air outlet is opened on one side of the side plate.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The return air device of the reflow oven is provided with a bottom frame, a top frame, a glass plate, a partition, a hot air frame, a hot air duct, a first fan, a cold air frame and a cold air duct. The circuit board enters from one side of the first conveyor belt. After the circuit board reaches the bottom of the hot air frame as observed through the glass plate, the conveying is stopped. Then the first fan and the heating wire in the hot air duct are started to blow hot air onto the circuit board to melt the solder. Then the servo motor is started to drive the rotating shaft to rotate, so that the baffle rotates upward to open the opening, so that the conveyed circuit board enters the second conveyor belt. The cold air blown out by the cold air frame is condensed. After the circuit board passes through the baffle, the baffle is returned to its original position. During this process, the next circuit board enters the first conveyor belt, thereby separating the heating space and the condensation space, ensuring that the temperatures in the two spaces do not change alternately, reducing the heating time, increasing the solder melting time, and ensuring production efficiency.

[0016] 2. The return air device of the reflow oven is provided with a solution box, a second fan, an air inlet pipe, a sealing plate, an outlet pipe and an activated carbon block. When the solder melts, the second fan is started to send the gas in the heating space into the solution box. The solution box contains purified liquid. The bottom end of the air inlet pipe is inserted into the liquid. The second fan sends the gas generated when the solder melts into the treated liquid through the air inlet pipe. The gas treated in the solution box flows out from the outlet pipe and is purified and dehumidified again through the activated carbon block, thereby avoiding the emission of harmful gases into the workshop and affecting the health of workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a return air device of a reflow soldering furnace according to embodiment 1 of the present utility model;

[0018] Figure 2 This is a schematic diagram of the rear axonometric structure of a return air device of a reflow soldering furnace according to embodiment 1 of the present invention;

[0019] Figure 3 This is a schematic diagram of the axonometric structure of a conveyor belt in a return air device of a reflow soldering furnace according to Example 1 of the utility model;

[0020] Figure 4 This is a schematic diagram of the axonometric structure of a top frame in a return air device of a reflow soldering furnace according to Example 1 of the utility model;

[0021] Figure 5 This is a schematic cross-sectional structural diagram of a return air device of a reflow soldering furnace in a front view according to embodiment 1 of the present utility model;

[0022] Figure 6 This is a schematic diagram of the isometric structure of a solution box in a return air device of a reflow soldering furnace according to Example 1 of the utility model;

[0023] Figure 7 This is a schematic diagram of the axonometric structure of a return air device of a reflow soldering furnace as viewed from the right side in Example 1 of the utility model;

[0024] Figure 8 This is a schematic diagram of the explosion structure of a baffle in a return air device of a reflow soldering furnace according to Example 1 of the present utility model.

[0025] In the figure: 1. Bottom frame; 2. Top frame; 3. Glass plate; 4. Partition; 5. Hot air frame; 6. Hot air duct; 7. First fan; 8. Cold air frame; 9. Cold air duct; 10. Motor slot; 11. Servo motor; 12. Rotating shaft; 13. Baffle; 14. Conveyor roller; 15. Door panel; 16. First conveyor belt; 17. Second conveyor belt; 18. Through hole; 19. Solution tank; 20. Second fan; 21. Air inlet pipe; 22. Sealing plate; 23. Outlet pipe; 24. Activated carbon block; 25. Side panel; 26. Air outlet. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example 1

[0027] like Figure 1-8 As shown, a return air device of a reflow oven includes a bottom frame 1, a top frame 2 is fixedly connected to the upper surface of the bottom frame 1, a glass plate 3 is fixedly connected to the inner top wall of the top frame 2, a partition 4 is fixedly connected to the inner bottom wall of the bottom frame 1, a hot air frame 5 is fixedly connected to the inner wall of the upper surface of the top frame 2, a hot air pipe 6 is fixedly connected to one side of the hot air frame 5, a first fan 7 is fixedly connected to one end of the hot air pipe 6, a cold air frame 8 is fixedly connected to the inner wall of the upper surface of the top frame 2, and a cold air pipe 9 is fixedly connected to one side of the cold air frame 8.

[0028] When in use, a production space is formed between the bottom frame 1, the top frame 2, the glass plate 3, the partition 4, the hot air frame 5, the hot air pipe 6, the first fan 7, the cold air frame 8 and the cold air pipe 9. The partition 4 divides the production space into two. One space is the first conveyor belt 16, and the other space is the second conveyor belt 17. The space where the first conveyor belt 16 is located is the heating space, and the space where the second conveyor belt 17 is located is the condensing space. There are three groups of heating wires in the hot air pipe 6, which can heat the air to enter the hot air frame 5. The cold air pipe 9 is connected to the external air conditioner to send the cold air into the cold air frame 8. When the device is in use, the circuit board enters from the side of the first conveyor belt 16 and passes through the glass Board 3 observes that after the circuit board reaches the bottom of the hot air frame 5, it stops conveying, and then starts the first fan 7 and the heating wire in the hot air pipe 6, so that the hot air blows on the circuit board to melt the solder, and then starts the servo motor 11 to drive the rotating shaft 12 to rotate, so that the baffle 13 rotates upward to open the opening, so that the conveyed circuit board enters the second conveyor belt 17, and the cold air blown out by the cold air frame 8 is condensed. After the circuit board passes through the baffle 13, the baffle 13 is turned back to its original position. In this process, the next circuit board enters the first conveyor belt 16, thereby separating the heating space and the condensation space, ensuring that the temperatures in the two spaces do not change alternately, reducing the heating time, increasing the solder melting time, and ensuring production efficiency.

[0029] In this embodiment, a motor slot 10 is formed on the back of the top frame 2 , and a servo motor 11 is fixedly connected to the back of the partition 4 .

[0030] During specific use, the servo motor 11 is provided to provide power for the rotation of the rotating shaft 12 .

[0031] In this embodiment, the output end of the servo motor 11 is fixedly connected to a rotating shaft 12 , and the outer surface of the rotating shaft 12 is fixedly connected to a baffle 13 .

[0032] During specific use, the baffle 13 is driven to rotate by the setting of the rotating shaft 12 .

[0033] In this embodiment, a conveying roller 14 is provided on the inner wall of the partition 4, and a door panel 15 is hinged to the front of the bottom frame 1 through a hinge.

[0034] During specific use, the door panel 15 is provided to facilitate checking the situation of the solution tank 19 .

[0035] In this embodiment, a first conveyor belt 16 and a second conveyor belt 17 are sequentially provided on the inner wall of the bottom frame 1 from left to right, and a through hole 18 is opened on the upper surface of the first conveyor belt 16 .

[0036] During specific use, the circuit board is conveyed by the first conveyor belt 16 and the second conveyor belt 17 .

[0037] In this embodiment, a solution tank 19 is fixedly connected to the inner bottom wall of the bottom frame 1 , a second fan 20 is fixedly connected to the upper surface of the solution tank 19 , and an air inlet pipe 21 is fixedly connected to the inner wall of the upper surface of the solution tank 19 .

[0038] During specific use, the solution tank 19 is provided to purify the gas after the solder is melted.

[0039] In this embodiment, a sealing plate 22 is fixedly connected to the inner wall of one side of the solution tank 19 , an outlet pipe 23 is fixedly connected to one side of the sealing plate 22 , and an activated carbon block 24 is fixedly connected to the inner wall of the outlet pipe 23 .

[0040] During specific use, the activated carbon block 24 is provided to filter and purify the gas.

[0041] In this embodiment, a side panel 25 is fixedly connected to the inner bottom wall of the bottom frame 1 , and an air outlet 26 is formed on one side of the side panel 25 .

[0042] During specific use, the gas outlet 26 is provided to facilitate gas outflow.

[0043] Working principle: When the device is in use, the circuit board enters from the side of the first conveyor belt 16. After the circuit board reaches the bottom of the hot air frame 5 through the glass plate 3, the conveying is stopped, and then the first fan 7 and the heating wire in the hot air pipe 6 are started, so that the hot air blows on the circuit board to melt the solder. Then the servo motor 11 is started to drive the rotating shaft 12 to rotate, so that the baffle 13 rotates upward to open the opening, so that the conveyed circuit board enters the second conveyor belt 17, and the cold air blown out by the cold air frame 8 is condensed. After the circuit board passes the baffle 13, the baffle 13 is rotated back to its original position. In this process, the next circuit board enters the first conveyor belt 16; when the solder melts, the second fan 20 is started, and the second fan 20 sends the gas generated when the solder melts into the treatment liquid through the air inlet pipe 21. The gas treated in the solution tank 19 flows out from the outlet pipe 23 and is purified and dehumidified again through the activated carbon block 24.

[0044] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A return air device for a reflow oven, comprising a bottom frame (1), characterized in that: The upper surface of the bottom frame (1) is fixedly connected to the top frame (2), the inner top wall of the top frame (2) is fixedly connected to the glass plate (3), the inner bottom wall of the bottom frame (1) is fixedly connected to the partition (4), the inner wall of the upper surface of the top frame (2) is fixedly connected to the hot air frame (5), one side of the hot air frame (5) is fixedly connected to the hot air pipe (6), one end of the hot air pipe (6) is fixedly connected to the first fan (7), the inner wall of the upper surface of the top frame (2) is fixedly connected to the cold air frame (8), and one side of the cold air frame (8) is fixedly connected to the cold air pipe (9).

2. The air return device of a reflow oven according to claim 1, characterized in that: A motor slot (10) is provided on the back of the top frame (2), and a servo motor (11) is fixedly connected to the back of the partition (4).

3. The air return device of a reflow oven according to claim 2, characterized in that: The output end of the servo motor (11) is fixedly connected to a rotating shaft (12), and the outer surface of the rotating shaft (12) is fixedly connected to a baffle (13).

4. The air return device of a reflow oven according to claim 1, characterized in that: The inner wall of the partition (4) is provided with a conveying roller (14), and the front surface of the bottom frame (1) is hinged with a door panel (15) via a hinge.

5. The air return device of a reflow soldering furnace according to claim 1, characterized in that: A first conveyor belt (16) and a second conveyor belt (17) are sequentially provided on the inner wall of the bottom frame (1) from left to right, and a through hole (18) is provided on the upper surface of the first conveyor belt (16).

6. The air return device of a reflow oven according to claim 1, characterized in that: The inner bottom wall of the bottom frame (1) is fixedly connected to a solution box (19), the upper surface of the solution box (19) is fixedly connected to a second fan (20), and the inner wall of the upper surface of the solution box (19) is fixedly connected to an air intake pipe (21).

7. The air return device of a reflow oven according to claim 6, characterized in that: A sealing plate (22) is fixedly connected to the inner wall of one side of the solution tank (19), an outlet pipe (23) is fixedly connected to one side of the sealing plate (22), and an activated carbon block (24) is fixedly connected to the inner wall of the outlet pipe (23).

8. The air return device of a reflow oven according to claim 1, characterized in that: A side plate (25) is fixedly connected to the inner bottom wall of the bottom frame (1), and an air outlet (26) is provided on one side of the side plate (25).

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