Preforming welding ring suitable for welding connector pin and blind hole of printed board

Abstract

The utility model relates to a preformed welding ring suitable for welding a connector pin and a blind hole of a printed board, which comprises a welding ring main body, the welding ring main body is arranged between the connector pin and the blind hole on the printed board, a connector outer conductor is arranged above the connector pin, and the welding ring main body is arranged on the blind hole. The connector pin and the connector outer conductor are both located in the connector body above the blind holes, the connector pin is fixedly connected with the connector outer conductor, the welding ring body is arranged on the connector pin in a sleeving mode, the connector pin penetrates into the corresponding blind hole in the welding process, the welding ring body is made of tin-lead solder, and the welding ring body is made of tin-lead solder. The printed board is provided with a solder resist ink coating distributed around the blind hole, the solder resist ink coating is located below the welding ring main body, and the outer diameter of the welding ring main body is smaller than that of the solder resist ink coating, so that the welding ring has the advantages of being convenient to install, high in filling rate of soldering tin in the blind hole, not prone to short circuit and good in welding consistency.

Description

Technical Field

[0001] The utility model belongs to the technical field of radio frequency product assembly, and in particular relates to a preformed welding ring suitable for welding connector pins and blind holes of a printed circuit board. Background Art

[0002] The assembly process of RF products often requires drilling holes in printed circuit boards and subsequent soldering of the holes. Common types of holes in printed circuit boards include through-holes, blind vias, and buried vias. Blind vias are electroplated holes that connect the outermost circuit layer to the adjacent inner layer. Currently, through-hole soldering technology is mainly used to connect connector pins to PCB through-holes. However, with the development of electronic products, in some RF products, there is a large demand for reliable soldering of connector pins and PCB blind vias. Blind-hole soldering can achieve higher product reliability and better RF performance, and its application is becoming more and more frequent.

[0003] Currently, the key to soldering connector pins to blind holes on printed circuit boards lies in how to achieve precise solder application. Common methods in the industry include pre-placing solder balls in general blind holes, pre-placing solder columns in blind holes, and injecting solder paste into blind holes. However, the solder application method of pre-placing solder balls in blind holes has the disadvantages of insufficient solder volume (generally only 30%-50% can be achieved), easy loss of solder, inconvenient connector installation, and blind hole squeezing. The solder application method of pre-placing solder columns in blind holes has the disadvantages of insufficient solder volume, inconvenient connector installation, and blind hole squeezing. The solder application method of injecting solder paste into blind holes has the disadvantages of insufficient solder volume and difficulty in solder paste injection.

[0004] Therefore, there is an urgent need for a preformed solder ring suitable for soldering connector pins to blind holes on printed circuit boards, which can be used for soldering blind holes on printed circuit boards to solve the existing shortcomings of insufficient solder, inconvenient connector installation, extrusion of blind holes and difficulty in operation. Utility Model Content

[0005] In view of this, the utility model proposes a preformed solder ring suitable for soldering connector pins and blind holes of printed circuit boards, which is applied to the field of radio frequency product assembly technology. It can solve the technical problems of insufficient solder amount, inconvenient connector installation, extrusion of blind holes and difficult operation in the existing solder application method during the soldering process of connector pins and blind holes of printed circuit boards.

[0006] In order to achieve the above technical objectives, the specific technical solutions adopted by this utility model are:

[0007] A preformed solder ring suitable for soldering connector pins and blind holes in printed circuit boards, comprising a solder ring body, the solder ring body being arranged between the connector pin and the blind hole on the printed circuit board, a connector outer conductor being arranged above the connector pin, the connector pin and the connector outer conductor being both located inside the connector body arranged above the blind hole, the connector pin being fixedly connected to the connector outer conductor, the solder ring body being sleeved on the connector pin, the connector pin penetrating into the corresponding blind hole during the soldering process, the solder ring body being made of tin-lead solder, a solder resist ink coating being arranged on the printed circuit board and distributed around the blind hole, the solder resist ink coating being located below the solder ring body, and the outer diameter of the solder ring body being smaller than the outer diameter of the solder resist ink coating.

[0008] Furthermore, the diameter of the blind hole is set to D, the depth of the blind hole is set to H, the diameter of the connector pin is set to d, the diameter of the connector outer conductor is set to d1, the length of the connector pin is set to h, the empirical coefficient is set to μ, the safety distance coefficient is set to λ, the outer diameter of the solder ring body is λ times d1, and the thickness of the solder ring body is The inner diameter of the welding ring body is d1+0.02mm.

[0009] Furthermore, an annular ring is provided inside the solder resist ink coating and surrounds the blind hole. The annular ring is located on the upper surface of the prefabricated printed circuit board, and the inner diameter of the annular ring is the same as the outer diameter of the blind hole.

[0010] Furthermore, the difference between the outer diameter of the annular ring and the inner diameter of the annular ring is in the range of 0.1 mm to 0.2 mm.

[0011] By adopting the above technical solution, the utility model can also bring the following beneficial effects:

[0012] 1. The present invention discloses a preformed solder ring suitable for soldering connector pins and blind holes of printed circuit boards. The solder ring body is pre-inserted into the connector pins and then soldered, which does not affect the installation of the connector. It can solve the problem that the solder application method of pre-setting solder balls or solder columns in the blind holes causes interference with the installation of the connector. At the same time, it can prevent the blind holes of the printed circuit boards from being squeezed, and has the effect of protecting the printed circuit boards. Moreover, the solder volume of the solder ring body can be adjusted as needed, thereby solving the disadvantage of insufficient solder filling rate of the pins after soldering in other solder application methods.

[0013] 2. The utility model mentions a preformed solder ring suitable for welding connector pins and blind holes on printed circuit boards, in which the blind holes can achieve 90% solder filling, and the welding effect far exceeds other welding methods. It has the advantages of easy installation, high solder filling rate inside the blind holes, not easy to short circuit and good welding consistency. In addition, it has a simple structure and is easy to use. It can be widely used for welding connector pins and blind holes on printed circuit boards in various electronic products, and has very good promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 This is a schematic diagram of the connection structure of the connector pins and blind hole welding process in a specific embodiment of the present invention;

[0016] Figure 2 This is a structural diagram of the connector body in a specific embodiment of the present utility model;

[0017] Figure 3 This is a structural diagram of the welding ring body in a specific embodiment of the present utility model;

[0018] Figure 4 This is a schematic diagram of the connection structure between the blind via and the printed circuit board in a specific embodiment of the present utility model;

[0019] Figure 5 This is a schematic diagram of the connection structure between the annular ring and the solder resist ink coating in a specific embodiment of the present invention;

[0020] Among them: 1. Connector body; 2. Solder ring body; 3. Printed circuit board; 4. Solder resist ink coating; 5. Connector pin; 6. Connector outer conductor; 7. Blind hole; 8. Angle ring. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] The following describes the implementation of the present invention through specific concrete examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The present invention can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present invention, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement an apparatus and / or practice a method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this apparatus and / or practice this method.

[0024] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention. The illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0025] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples. However, one skilled in the art will appreciate that the aspects described can be practiced without these specific details.

[0026] In one embodiment of the present invention, Figures 1 to 5 As shown, a preformed solder ring suitable for soldering connector pins and blind holes in printed circuit boards includes a solder ring body 2, which is arranged between a connector pin 5 and a blind hole 7 on a printed circuit board 3. A connector outer conductor 6 is arranged above the connector pin 5. The connector pin 5 and the connector outer conductor 6 are both located inside the connector body 1 arranged above the blind hole 7. The connector pin 5 is fixedly connected to the connector outer conductor 6. The solder ring body 2 is sleeved on the connector pin 5. The connector pin 5 penetrates into the corresponding blind hole 7 during the soldering process. The solder ring body 2 is made of tin-lead solder. A solder resist ink coating 4 is distributed around the blind hole 7 on the printed circuit board 3. The solder resist ink coating 4 is located below the solder ring body 2. The outer diameter of the solder ring body 2 is smaller than the outer diameter of the solder resist ink coating 4.

[0027] The diameter of the blind hole 7 is set to D, the depth of the blind hole 7 is set to H, the diameter of the connector pin 5 is set to d, the diameter of the connector outer conductor 6 is set to d1, the length of the connector pin 5 is set to h, the empirical coefficient is set to, the safety distance coefficient is set to, the outer diameter of the solder ring body 2 is times d1, the thickness of the solder ring body 2 is, and the inner diameter of the solder ring body 2 is d1+0.02mm.

[0028] The specific calculation process of the inner diameter, outer diameter and thickness of the welding ring body 2 is as follows:

[0029] Based on the diameter (D) and depth (H) of the blind via 7, the diameter (d) and length (h) of the connector pin 5, and an empirical coefficient, the required solder volume (V) can be calculated using the following formula:

[0030]

[0031] Based on the diameter (d) of connector pin 5, the inner diameter d2 of the preformed solder ring can be calculated as follows:

[0032] d2=d+0.02

[0033] Based on the diameter of the connector outer conductor 6 (d1) and the safety distance factor (λ), the outer diameter of the preformed solder ring (d3) can be calculated using the following formula:

[0034] d3=λd1

[0035] Based on the solder volume (V), the outer diameter of the preformed solder ring (d3), and the inner diameter of the preformed solder ring (d2), the thickness of the preformed solder ring (h1) can be calculated using the following formula:

[0036]

[0037] Finally, the calculation of the inner diameter, outer diameter and thickness of the welding ring body 2 is completed.

[0038] In this example, the blind hole 7 has a diameter of (D=0.6mm), a depth of (H=2.6mm), a connector pin 5 has a diameter of (d=0.38mm), a connector pin 5 has a length of (h=1.5mm), an empirical coefficient of =0.9, a safety factor λ=0.7, and a diameter of the connector outer conductor 6 of (d1=2.5). According to the above steps, the inner diameter of the solder ring body 2 is calculated to be d2=0.38mm+0.02mm=0.4mm, the outer diameter of the solder ring body 2 is d3=0.7×2.5mm=1.75mm, and the thickness of the solder ring body 2 is h1=0.22mm.

[0039] A hole ring 8 is provided inside the solder resist ink coating 4 around the blind hole 7. The hole ring 8 is located on the upper surface of the prefabricated printed circuit board 3. The inner diameter of the hole ring 8 is the same as the outer diameter of the blind hole 7. The difference between the outer diameter of the hole ring 8 and the inner diameter of the hole ring 8 is in the range of 0.1 mm.

[0040] During use, the present invention first places the connector pin 5 upward in the tray, clamps the solder ring body 2 with tweezers, then puts the solder ring body 2 on the connector pin 5, and then applies flux on the solder resist ink coating 4, and then installs the connector pin 5 with the solder ring body 2 into the blind hole 7 on the printed circuit board 3, and presses the connector outer conductor 6 with a welding tool to prevent the connector pin 5 from moving during the welding process; in the preparation process for welding, it is also necessary to use a temperature measuring board to measure the temperature, and then set the corresponding welding temperature curve. Before the solder melts, the temperature of the blind hole 7 on the printed circuit board 3 and the connector pin should be basically close, so that the solder can flow into the blind hole 7 and weld. In short, the present invention has the advantages of convenient installation, high solder filling rate inside the blind hole, not easy to short circuit and good welding consistency.

[0041] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A preformed solder ring suitable for soldering connector pins and blind holes in printed circuit boards, characterized by: The invention comprises a solder ring body (2), wherein the solder ring body (2) is arranged between a connector pin (5) and a blind hole (7) located on a printed circuit board (3), a connector outer conductor (6) is arranged above the connector pin (5), the connector pin (5) and the connector outer conductor (6) are both located inside the connector body (1) located above the blind hole (7), the connector pin (5) and the connector outer conductor (6) are fixedly connected, the solder ring body (2) is sleeved on the connector pin (5), and the connector pin (5) penetrates into the corresponding blind hole (7) during the soldering process, the solder ring body (2) is made of tin-lead solder, a solder resist ink coating (4) distributed around the blind hole (7) is arranged on the printed circuit board (3), the solder resist ink coating (4) is located below the solder ring body (2), and the outer diameter of the solder ring body (2) is smaller than the outer diameter of the solder resist ink coating (4).

2. A preformed solder ring suitable for soldering connector pins and blind holes in printed circuit boards as claimed in claim 1, characterized in that: The diameter of the blind hole (7) is set to D, the depth of the blind hole (7) is set to H, the diameter of the connector pin (5) is set to d, the diameter of the connector outer conductor (6) is set to d1, the length of the connector pin (5) is set to h, the empirical coefficient is set to μ, the safety distance coefficient is set to λ, the outer diameter of the solder ring body (2) is times d1, and the thickness of the solder ring body (2) is The inner diameter of the welding ring body (2) is d1+0.02 mm.

3. A preformed solder ring suitable for soldering connector pins and blind holes in printed circuit boards as claimed in claim 2, characterized in that: The solder resist ink coating (4) is provided with an annular ring (8) arranged around the blind hole (7), the annular ring (8) is located on the upper surface of the prefabricated printed board (3), and the inner diameter of the annular ring (8) is the same as the outer diameter of the blind hole (7).

4. A preformed solder ring suitable for soldering connector pins and blind holes in printed circuit boards as claimed in claim 3, characterized in that: The difference between the outer diameter of the hole ring (8) and the inner diameter of the hole ring (8) is in the range of 0.1 mm to 0.2 mm.

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