Semiconductor device processing positioner

Abstract

The utility model is suitable for the technical field of semiconductor device processing, and provides a semiconductor device processing positioner which comprises a supporting box used for supporting semiconductor device materials. The supporting frame is fixedly arranged outside the supporting box in a sleeving manner; the plurality of electric telescopic rods are all mounted on the inner wall of the supporting frame; and the plurality of pressure sensors are respectively arranged on output rods of the plurality of electric telescopic rods. According to the semiconductor device processing positioner provided by the scheme, semiconductor materials can be adsorbed while being limited, the situation that the semiconductor materials easily vibrate up and down in the processing process to affect the processing effect is prevented, meanwhile, the limiting clamping force on the semiconductor materials can be adjusted, and the probability of material surface damage is effectively reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor device processing, and in particular relates to a semiconductor device processing positioner. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Currently, during the processing of existing semiconductor chips, the semiconductor chips need to be positioned and fixed. Directly using a clamp to fix the material will block the surface of the chip material, affecting the coverage processing of the chip surface. After processing, the unprocessed side needs to be cut off, increasing the workload. Directly limiting the movement direction of the chip material can make the chip surface completely exposed, but it is difficult to ensure that the chip material will not shake up and down during processing. Utility Model Content

[0003] The utility model provides a semiconductor device processing positioner, which aims to solve the problem proposed in the background art that directly using a clamp to fix the material will block the surface of the chip material and affect the covering processing of the chip surface.

[0004] To solve the above problems, the present invention is implemented as follows: a semiconductor device processing positioner includes: a support box, which is used to support semiconductor device materials; a support frame, which is fixedly sleeved outside the support box; a plurality of electric telescopic rods, which are all installed on the inner wall of the support frame; a plurality of pressure sensors, which are respectively arranged on the output rods of the plurality of electric telescopic rods; a plurality of limit plates, which are respectively installed on the plurality of pressure sensors, and the bottoms of the plurality of limit plates can contact the top of the support box, and the limit plates are used to clamp and stabilize the semiconductor device materials; a stabilizing component, which is arranged on the support box, and is used to stabilize the semiconductor device materials.

[0005] Preferably, the stabilization assembly includes an isolation plate, multiple silicone cylinders and a vacuum pump. The isolation plate is installed in the support box, and the multiple silicone cylinders are installed on the top of the support box. The vacuum pump is fixed in the support box and is located at the bottom of the isolation plate. The air inlet end of the vacuum pump extends to the top of the isolation plate. An opening for balancing the air pressure is provided on one side of the support box, and the opening is located below the isolation plate.

[0006] Preferably, a cylinder is installed at the bottom of the isolation plate, a spring is fixed in the cylinder, the cylinder extends to the top of the isolation plate, a piston plate is installed at the bottom of the spring, the piston plate is in sliding contact with the inner wall of the cylinder, a trigger button is installed at the bottom of the cylinder, and the piston plate can contact the trigger button.

[0007] Preferably, an air vent is provided at the bottom of the cylinder for balancing the air pressure, a pressure regulating pipe is installed on the isolation plate, and an electric valve is installed on the pressure regulating pipe.

[0008] Preferably, a dustproof part is provided in the opening, and the dustproof part includes a support ring and a dustproof net. A limit ring is fixed in the opening, and the support ring is detachably mounted on the limit ring by bolts, and the dustproof net is fixed in the support ring.

[0009] Preferably, a maintenance port is provided on one side of the support box, a support shaft is fixed to one side of the support box, a protective cover for closing the maintenance port is rotatably mounted on the support shaft, and an observation window is provided on the protective cover.

[0010] Preferably, an isolation net is provided in each of the plurality of silicone tubes, and an anti-slip pad is installed on the side where the plurality of limit plates are close to each other, and the anti-slip pad is made of rubber.

[0011] Compared with related technologies, the semiconductor device processing positioner provided by the present invention has the following beneficial effects:

[0012] Compared with the existing technology, the semiconductor device processing positioner provided by this solution can limit the semiconductor device material by setting multiple electric telescopic rods and limit plates to prevent its position deviation from affecting processing. By setting a vacuum pump to adjust the air pressure inside the support box, the silicone tube can adsorb the semiconductor material, thereby further increasing the stability of the semiconductor material and preventing it from shaking up and down. By setting a cylinder, spring, piston plate and trigger button, the air pressure on the top of the isolation plate can be monitored, which is convenient for continuing to use the vacuum pump to evacuate air when the air pressure is high to ensure the adsorption effect of the semiconductor material. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the top view of a semiconductor device processing positioner provided by the utility model;

[0014] Figure 2 This is a schematic diagram of the main cross-sectional structure of the support box in the present utility model;

[0015] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of part A shown in FIG;

[0016] Figure 4This is a schematic diagram of the main structure of the support box in the utility model.

[0017] Figure numerals: 1. Support box; 2. Support frame; 3. Electric telescopic rod; 4. Pressure sensor; 5. Limit plate; 6. Isolation plate; 7. Silicone tube; 8. Vacuum pump; 9. Dust net; 10. Pressure regulating tube; 11. Cylinder; 12. Spring; 13. Piston plate; 14. Trigger button; 15. Air vent; 16. Limit ring; 17. Support ring; 18. Support shaft; 19. Protective cover; 20. Observation window. DETAILED DESCRIPTION

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein in the specification of the application are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the description of the above-mentioned drawings, as well as any variations thereof, are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order; the terms "inside", "outside", "left", and "right" indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention.

[0019] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] The present invention provides a semiconductor device processing positioner. Figure 1-4As shown, the semiconductor device processing locator includes: a support box 1, which is used to support semiconductor device materials; a support frame 2, which is fixedly mounted on the outside of the support box 1; a plurality of electric telescopic rods 3, which are all installed on the inner wall of the support frame 2; a plurality of pressure sensors 4, which are respectively arranged on the output rods of the plurality of electric telescopic rods 3; a plurality of limit plates 5, which are respectively installed on the plurality of pressure sensors 4, and the bottoms of the plurality of limit plates 5 can all contact the top of the support box 1, and the limit plates 5 are used to clamp and stabilize the semiconductor device materials; a stabilizing component, which is arranged on the support box 1, and is used to stabilize the semiconductor device materials.

[0021] In this embodiment, the support box 1 serves as the main structure of the entire positioner, and is used to support semiconductor device materials, providing a stable basic platform to ensure the stability of semiconductor devices during processing. Multiple electric telescopic rods 3 adjust the distance between the limit plate 5 and the semiconductor device through telescopic movement, thereby achieving precise positioning and clamping of the semiconductor device material. At the same time, the clamping force can be adjusted as needed, avoiding the obstruction problem that may be caused by traditional clamps. The pressure sensor 4 is used to monitor the pressure applied by the limit plate 5 to the semiconductor device. By real-time monitoring of the pressure value, it can be ensured that the clamping force of the limit plate 5 on the semiconductor device is moderate, which will not damage the chip and can ensure stability during processing.

[0022] In a further preferred embodiment of the present invention, the stabilizing assembly includes an isolation plate 6, multiple silicone tubes 7 and a vacuum pump 8. The isolation plate 6 is installed in the support box 1, and the multiple silicone tubes 7 are installed on the top of the support box 1. The vacuum pump 8 is fixed in the support box 1 and is located at the bottom of the isolation plate 6. The air inlet end of the vacuum pump 8 extends to the top of the isolation plate 6. An opening for balancing the air pressure is provided on one side of the support box 1, and the opening is located below the isolation plate 6.

[0023] In this embodiment, the isolation plate 6 serves as a partition layer in the internal space of the support box 1, separating the negative pressure area generated by the vacuum pump 8. The silicone tube 7 is in direct contact or close to the semiconductor device material, and is used to generate suction under the action of vacuum to further stabilize the semiconductor device material. The softness and sealing of the silicone tube 7 enable it to fit tightly to the surface of the semiconductor device material. The negative pressure generated by the vacuum pump 8 firmly adsorbs the semiconductor device on the top of the support box 1, effectively preventing shaking during the processing. In addition, the use of silicone material also reduces potential damage to the surface of the semiconductor device material. The vacuum pump 8 is the core component of the stabilizing component. The negative pressure environment generated by its operation enables the silicone tube 7 to generate a strong adsorption force on the semiconductor device material, thereby ensuring stability during the processing. The opening design is the key to air pressure balance. It ensures that the air pressure inside the support box 1 can remain stable when the vacuum pump 8 continues to work, avoiding adverse effects on the entire system caused by air pressure fluctuations.

[0024] In a further preferred embodiment of the present invention, a cylinder 11 is installed at the bottom of the isolation plate 6, a spring 12 is fixed inside the cylinder 11, the cylinder 11 extends to the top of the isolation plate 6, a piston plate 13 is installed at the bottom of the spring 12, the piston plate 13 is in sliding contact with the inner wall of the cylinder 11, and a trigger button 14 is installed at the bottom of the cylinder 11, and the piston plate 13 can contact the trigger button 14.

[0025] In this embodiment, the interior of the cylinder 11 is used to install a spring 12 and a piston plate 13. The spring 12 is in a compressed state and applies a downward force to the piston plate 13 under normal air pressure. When the air pressure on the top of the isolation plate 6 decreases, the piston plate 13 rises, and the spring 12 is compressed. The introduction of the trigger button 14 enables the system to perform corresponding actions or send signals according to the position change of the piston plate 13. This design increases the intelligence and automation of the system, allowing the system to automatically make adjustments or alarms when encountering specific situations.

[0026] In a further preferred embodiment of the present invention, a vent hole 15 for balancing air pressure is provided at the bottom of the cylinder 11, a pressure regulating pipe 10 is installed on the isolation plate 6, and an electric valve is installed on the pressure regulating pipe 10.

[0027] In this embodiment, the introduction of the air vent 15 ensures that the piston plate 13 can move up and down normally, and its internal air pressure can quickly reach equilibrium with the external air pressure, avoiding damage to the cylinder 11 or other parts of the system due to excessive air pressure difference. The combined use of the pressure regulating tube 10 and the electric valve provides the system with a more flexible air pressure regulation method. During the processing, the electric valve can be opened or closed as needed to adjust the air pressure environment inside the support box 1, thereby achieving more precise control of the semiconductor device material. For example, when it is necessary to enhance the adsorption force of the silicone tube 7 on the semiconductor device material, the air pressure inside the support box 1 can be appropriately reduced. Conversely, when it is necessary to release the semiconductor device material, the air pressure inside the support box 1 can be increased. This design improves the adaptability and flexibility of the system.

[0028] In a further preferred embodiment of the present invention, a dustproof part is provided in the opening, and the dustproof part includes a support ring 17 and a dustproof net 9. A limit ring 16 is fixed in the opening, and the support ring 17 is detachably mounted on the limit ring 16 by bolts, and the dustproof net 9 is fixed in the support ring 17.

[0029] In this embodiment, the dustproof part is used to prevent external dust, impurities, etc. from entering the interior of the support box 1 through the opening, protecting internal components and semiconductor device materials from contamination. The design of the support ring 17 enables the dustproof net 9 to be firmly installed at the opening. At the same time, its detachability facilitates the cleaning and replacement of the dustproof net 9, ensuring the continuous effectiveness of the dustproof effect. The design of the limiting ring 16 ensures that the support ring 17 and the dustproof net 9 can be accurately and firmly installed at the opening to prevent the dustproof effect from being affected by loosening or displacement.

[0030] In a further preferred embodiment of the present invention, a maintenance port is provided on one side of the support box 1, a support shaft 18 is fixed to one side of the support box 1, a protective cover 19 for closing the maintenance port is rotatably mounted on the support shaft 18, and an observation window 20 is provided on the protective cover 19.

[0031] In this embodiment, the maintenance port facilitates maintenance personnel to enter the interior of the support box 1 for inspection or maintenance work, thereby improving the maintainability and service life of the equipment. The design of the support shaft 18 enables the protective cover 19 to rotate smoothly and stably, thereby conveniently opening or closing the maintenance port. The design of the protective cover 19 not only ensures the closure of the maintenance port when not in use, but also makes the opening and closing operations more convenient through its rotating installation method. The introduction of the observation window 20 allows maintenance personnel to make a preliminary judgment on the working status of the internal components through the observation window 20 without entering the interior of the support box 1, thereby improving the efficiency of inspection and maintenance.

[0032] In a further preferred embodiment of the present invention, isolation nets are provided in the plurality of silicone tubes 7 , and anti-slip pads are installed on the sides of the plurality of limit plates 5 close to each other, and the anti-slip pads are made of rubber.

[0033] In this embodiment, the introduction of the isolation net can effectively prevent foreign objects from easily entering the support box 1. The rubber anti-slip pad has good anti-slip properties, which can ensure that the semiconductor device material is not easy to slide or shift. This not only improves the stability during the processing, but also avoids processing errors or damage caused by material sliding. In addition, the rubber anti-slip pad also has a certain buffering effect, which can reduce the damage to the semiconductor device material when it is impacted by external force.

[0034] To sum up, compared with the relevant technology, this device can limit the semiconductor device material by setting multiple electric telescopic rods 3 in conjunction with the limit plate 5 to prevent its position deviation from affecting processing. By setting the vacuum pump 8 to adjust the internal air pressure of the support box 1, the silicone tube 7 can adsorb the semiconductor material, thereby further increasing the stability of the semiconductor material and preventing it from shaking up and down. By setting the cylinder 11, spring 12, piston plate 13 and trigger button 14, the air pressure at the top of the isolation plate 6 can be monitored, which is convenient for continuing to use the vacuum pump 8 to evacuate air when the air pressure is high to ensure the adsorption effect of the semiconductor material.

[0035] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.

[0036] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope to be protected by the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making any creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope to be protected by the present invention.

Claims

1. A semiconductor device processing positioner, characterized in that: include: A support box, the support box being used to support semiconductor device materials; A support frame, the support frame is fixedly sleeved outside the support box; A plurality of electric telescopic rods, each of which is mounted on the inner wall of the support frame; A plurality of pressure sensors, wherein the plurality of pressure sensors are respectively arranged on the output rods of the plurality of electric telescopic rods; A plurality of limiting plates, each of which is mounted on the plurality of pressure sensors, wherein the bottoms of the plurality of limiting plates can contact the top of the support box, and the limiting plates are used to clamp and stabilize semiconductor device materials; A stabilizing component is provided on the supporting box and is used for stabilizing semiconductor device materials.

2. The semiconductor device processing positioner according to claim 1, wherein The stabilization assembly includes an isolation plate, multiple silicone cylinders and a vacuum pump. The isolation plate is installed in the support box. The multiple silicone cylinders are installed on the top of the support box. The vacuum pump is fixed in the support box and is located at the bottom of the isolation plate. The air inlet end of the vacuum pump extends to the top of the isolation plate. An opening for balancing the air pressure is provided on one side of the support box, and the opening is located below the isolation plate.

3. The semiconductor device processing positioner according to claim 2, wherein: A cylinder is installed at the bottom of the isolation plate, a spring is fixed in the cylinder, the cylinder extends to the top of the isolation plate, a piston plate is installed at the bottom of the spring, the piston plate is in sliding contact with the inner wall of the cylinder, a trigger button is installed at the bottom of the cylinder, and the piston plate can contact the trigger button.

4. The semiconductor device processing positioner according to claim 3, wherein: The bottom of the cylinder is provided with an air vent for balancing the air pressure, a pressure regulating pipe is installed on the isolation plate, and an electric valve is installed on the pressure regulating pipe.

5. The semiconductor device processing positioner according to claim 2, wherein: A dustproof part is provided in the opening, and the dustproof part includes a support ring and a dustproof net. A limiting ring is fixed in the opening, and the support ring is detachably mounted on the limiting ring by bolts, and the dustproof net is fixed in the support ring.

6. The semiconductor device processing positioner according to claim 1, wherein: A maintenance port is provided on one side of the support box. A support shaft is fixed on one side of the support box. A protective cover for closing the maintenance port is rotatably mounted on the support shaft. An observation window is provided on the protective cover.

7. The semiconductor device processing positioner according to claim 2, wherein: Isolation nets are provided in the plurality of silicone tubes, and anti-slip pads are installed on the sides of the plurality of limit plates close to each other, and the anti-slip pads are made of rubber.

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